CN219321339U

CN219321339U - Portable semiconductor outer frame convenient to reliably fix

Info

Publication number: CN219321339U
Application number: CN202222827626.2U
Authority: CN
Inventors: 徐逸冰; 谈敏立; 徐剑
Original assignee: Changzhou Sirui Intelligent Technology Co ltd
Current assignee: Changzhou Sirui Intelligent Technology Co ltd
Priority date: 2022-10-26
Filing date: 2022-10-26
Publication date: 2023-07-07
Anticipated expiration: 2032-10-26

Abstract

The utility model discloses a movable semiconductor outer frame convenient to reliably fix, which relates to the technical field of semiconductors and comprises a base, wherein an L-shaped chute is formed in the top of the base, outer frame bodies are arranged above the L-shaped chute, two groups of outer frame bodies are arranged, and the two groups of outer frame bodies are linearly distributed on the base. According to the utility model, the L-shaped sliding grooves, the L-shaped sliding blocks, the fixed blocks, the threaded rods and the second threaded holes are arranged, the threaded rods are sequentially inserted into the two groups of fixed blocks and then are connected with the second threaded holes on the base, so that the two groups of outer frame bodies can be firmly fixed on the base, and the firmness of frame body installation is enhanced; the L-shaped sliding grooves and the L-shaped sliding blocks are matched with each other, so that the two groups of outer frame main bodies can be conveniently detached or moved from the base, and the semiconductor chips in the outer frame main bodies can be conveniently maintained or replaced; through setting up the heat dissipation groove, can dispel the heat that the semiconductor chip during operation produced, improved radiating effect.

Description

Portable semiconductor outer frame convenient to reliably fix

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a movable semiconductor outer frame convenient to fix reliably.

Background

Such as the patent: the utility model provides a semiconductor package frame fixing device (application number: CN 202022184757.4) includes clamp plate, cushion, base and air connector, the one end of clamp plate is articulated with the base, the top at the base is fixed to the cushion, the air connector is fixed on the lateral wall of base, evenly offered a plurality of gas pockets on the cushion, the inside of base is hollow structure, a plurality of the gas pocket and air connector intercommunication. According to the fixing device for the semiconductor packaging frame, vacuum is added to the cushion block of the chip loading equipment, so that the frame can not bulge during chip loading, and position drift caused by poor lamination is avoided.

The existing semiconductor packaging frame fixing device can play a role in fixing a semiconductor, but the semiconductor outer frame of the scheme is difficult to detach or mount after being fixed, so that the semiconductor core inside the frame is inconvenient to repair or replace, and the working efficiency is greatly reduced. Therefore, it is necessary to invent a mobile semiconductor outer frame that is convenient for reliable fixation to solve the above-mentioned problems.

Disclosure of Invention

The utility model aims to provide a movable semiconductor outer frame which is convenient to fix reliably, so as to solve the problem that the outer frame is difficult to disassemble or assemble in the background art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a portable semiconductor outer frame convenient to reliable fixed, includes the base, L type spout has been seted up at the top of base, the top of L type spout is provided with outer frame main part, outer frame main part has two sets of, two sets of outer frame main part is linear distribution on the base, L type slider is installed to the bottom of outer frame main part, the external diameter size of L type slider is the same with the internal diameter size of L type spout, L type slider and L type spout sliding connection, the fixed block is installed to one side of outer frame main part, the inside of fixed block is provided with the threaded rod, and wherein the threaded rod inserts in two sets of fixed blocks in proper order, is connected with the second screw hole on the base again, makes two sets of outer frame main parts can firmly be fixed on the base like this, has strengthened the fastness that the framework was installed; the L-shaped sliding groove and the L-shaped sliding block are matched with each other, so that the two groups of outer frame main bodies can be conveniently detached or moved from the base, and the semiconductor chip in the outer frame main bodies can be conveniently maintained or replaced.

Preferably, the top of outer frame main part has seted up the heat dissipation groove, the heat dissipation groove has three groups, and three groups the heat dissipation groove is linear distribution in outer frame main part, and wherein the heat dissipation groove can dispel the heat that the semiconductor chip during operation produced, has improved radiating effect.

Preferably, a first inner groove is arranged at one side of the heat dissipation groove, multiple groups of the first inner grooves are linearly distributed on the outer frame main body, and the first inner grooves enable pins to pass through the inner grooves.

Preferably, the inside of fixed block has seted up first screw hole, the internal diameter size of first screw hole is the same with the external diameter size of threaded rod, first screw hole and threaded rod threaded connection, wherein first screw hole plays the effect of connecting the threaded rod.

Preferably, the fixed ring is installed to the one end of threaded rod, the threaded rod is kept away from the one end of fixed ring is provided with the second screw hole, the internal diameter size of second screw hole is the same with the external diameter size of threaded rod, second screw hole and threaded rod threaded connection, and wherein fixed ring plays the effect of fixed threaded rod, and the second screw hole plays the effect of connecting the threaded rod.

Preferably, a mounting base is fixed above the base, a second inner groove is formed in the mounting base, a semiconductor chip is arranged in the second inner groove, and the mounting base plays a role in mounting the semiconductor chip.

Preferably, the connecting seat is installed at the top of semiconductor chip, the inside of connecting seat is fixed with the gold thread, the one end of gold thread is connected with the pin, the external diameter size of pin is the same with the internal diameter size of first inside groove, pin and first inside groove sliding connection, and wherein the gold thread plays the effect of connecting seat and pin.

The utility model has the technical effects and advantages that:

1. through setting up L type spout, L type slider, fixed block, threaded rod, second screw hole, the threaded rod inserts in two sets of fixed blocks in proper order, is connected with the second screw hole on the base again, makes two sets of outer frame bodies can firmly be fixed on the base like this, has strengthened the fastness of framework installation; the L-shaped sliding grooves and the L-shaped sliding blocks are matched with each other, so that the two groups of outer frame main bodies can be conveniently detached or moved from the base, and the semiconductor chips in the outer frame main bodies can be conveniently maintained or replaced;

2. through setting up the heat dissipation groove, can dispel the heat that the semiconductor chip during operation produced, improved radiating effect.

Drawings

Fig. 1 is a schematic front view of a movable semiconductor outer frame for reliable fixing according to the present utility model.

Fig. 2 is a schematic diagram showing a structure of the present utility model, in which a movable semiconductor outer frame is easily detached for reliable fixing.

Fig. 3 is a schematic top view of a movable semiconductor outer frame for reliable fixing according to the present utility model.

Fig. 4 is a schematic side view of a movable semiconductor outer frame for reliable fixing according to the present utility model.

In the figure: 1. a base; 2. an L-shaped chute; 3. an outer frame main body; 4. an L-shaped sliding block; 5. a heat sink; 6. a first inner tank; 7. a fixed block; 8. a first threaded hole; 9. a threaded rod; 10. a fixing ring; 11. a second threaded hole; 12. a mounting base; 13. a second inner tank; 14. a semiconductor chip; 15. a connecting seat; 16. gold wires; 17. pins.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The utility model provides a movable semiconductor outer frame convenient to fix reliably, which is shown in figures 1-4, and comprises a base 1, wherein an L-shaped chute 2 is formed in the top of the base 1, an outer frame main body 3 is arranged above the L-shaped chute 2, two groups of outer frame main bodies 3 are linearly distributed on the base 1, an L-shaped sliding block 4 is arranged at the bottom of the outer frame main body 3, the outer diameter size of the L-shaped sliding block 4 is the same as the inner diameter size of the L-shaped chute 2, the L-shaped sliding block 4 is in sliding connection with the L-shaped chute 2, a fixing block 7 is arranged at one side of the outer frame main body 3, a threaded rod 9 is arranged in the fixing block 7, the threaded rod 9 is sequentially inserted into the two groups of fixing blocks 7 and then is connected with a second threaded hole 11 on the base 1, so that the two groups of outer frame main bodies 3 can be firmly fixed on the base 1, and the firmness of frame body installation is enhanced; the L-shaped sliding groove 2 and the L-shaped sliding block 4 are matched with each other, so that the two groups of outer frame bodies 3 can be conveniently detached or moved from the base 1, and the semiconductor chips 14 in the outer frame bodies 3 can be conveniently maintained or replaced.

The top of outer frame main part 3 has seted up heat dissipation groove 5, and heat dissipation groove 5 has three group, and three group's heat dissipation groove 5 are linear distribution on outer frame main part 3, and wherein heat dissipation groove 5 can dispel the heat that the semiconductor chip 14 during operation produced, has improved radiating effect.

One side of the heat dissipation groove 5 is provided with a first inner groove 6, a plurality of groups of the first inner grooves 6 are arranged on the outer frame main body 3, and the plurality of groups of the first inner grooves 6 are linearly distributed, wherein the first inner grooves 6 enable pins 17 to pass through the inner parts of the first inner grooves.

The inside of fixed block 7 has seted up first screw hole 8, and the internal diameter size of first screw hole 8 is the same with the external diameter size of threaded rod 9, and first screw hole 8 and threaded rod 9 threaded connection, wherein first screw hole 8 play the effect of connecting threaded rod 9.

The fixed ring 10 is installed to the one end of threaded rod 9, and the one end that threaded rod 9 kept away from fixed ring 10 is provided with second screw hole 11, and the internal diameter size of second screw hole 11 is the same with the external diameter size of threaded rod 9, and second screw hole 11 and threaded rod 9 threaded connection, wherein fixed ring 10 plays the effect of fixed threaded rod 9, and second screw hole 11 plays the effect of connecting threaded rod 9.

A mounting base 12 is fixed above the base 1, a second inner groove 13 is formed in the mounting base 12, and a semiconductor chip 14 is arranged in the second inner groove 13, wherein the mounting base 12 plays a role in mounting the semiconductor chip 14.

The connecting seat 15 is installed at the top of semiconductor chip 14, and the inside of connecting seat 15 is fixed with gold thread 16, and the one end of gold thread 16 is connected with pin 17, and the external diameter size of pin 17 is the same with the internal diameter size of first inside groove 6, pin 17 and first inside groove 6 sliding connection, and wherein gold thread 16 plays the effect of connecting seat 15 and pin 17.

Working principle: when the semiconductor chip 14 needs to be maintained or replaced, the threaded rod 9 provided with the fixing ring 10 is rotated from the second threaded hole 11, and then is rotated from the two groups of fixing blocks 7, so that the two groups of outer frame main bodies 3 are separated, then the two groups of outer frame main bodies 3 are moved in opposite directions, and the L-shaped sliding blocks 4 slide in the L-shaped sliding grooves 2, so that the two groups of outer frame main bodies 3 can be detached from the base 1, and the effect of convenience in detachment is achieved; when the semiconductor chip 14 works, heat is generated, the heat dissipation groove 5 plays a role in heat dissipation, and the first inner groove 6 plays a role in inserting pins 17, so that the function of the movable semiconductor outer frame which is convenient to reliably fix and convenient to detach or install is realized.

Claims

1. The utility model provides a portable semiconductor outer frame convenient to reliably fix, includes base (1), its characterized in that: the utility model discloses a novel structure of a mobile phone, including base (1), L type spout (2) have been seted up at the top of base (1), the top of L type spout (2) is provided with outer frame main part (3), outer frame main part (3) have two sets of, two sets of outer frame main part (3) are linear distribution on base (1), L type slider (4) are installed to the bottom of outer frame main part (3), the external diameter size of L type slider (4) is the same with the internal diameter size of L type spout (2), L type slider (4) and L type spout (2) sliding connection, fixed block (7) are installed to one side of outer frame main part (3), the inside of fixed block (7) is provided with threaded rod (9).

2. A portable semiconductor outer frame for facilitating reliable fixation as set forth in claim 1, wherein: the top of outer frame main part (3) has seted up radiating groove (5), radiating groove (5) have three group, and three group radiating groove (5) are linear distribution on outer frame main part (3).

3. A portable semiconductor outer frame for facilitating reliable fixation as set forth in claim 2, wherein: one side of the heat dissipation groove (5) is provided with a first inner groove (6), a plurality of groups of the first inner grooves (6) are arranged on the outer frame main body (3), and the first inner grooves (6) are linearly distributed.

4. A portable semiconductor outer frame for facilitating reliable fixation as set forth in claim 1, wherein: the inside of fixed block (7) has seted up first screw hole (8), the internal diameter size of first screw hole (8) is the same with the external diameter size of threaded rod (9), first screw hole (8) and threaded rod (9) threaded connection.

5. The portable semiconductor outer frame for facilitating reliable fixation of claim 4, wherein: the fixed ring (10) is installed to the one end of threaded rod (9), threaded rod (9) are kept away from the one end of fixed ring (10) is provided with second screw hole (11), the internal diameter size of second screw hole (11) is the same with the external diameter size of threaded rod (9), second screw hole (11) and threaded rod (9) threaded connection.

6. A portable semiconductor outer frame for facilitating reliable fixation as set forth in claim 1, wherein: the semiconductor device is characterized in that a mounting base (12) is fixed above the base (1), a second inner groove (13) is formed in the mounting base (12), and a semiconductor chip (14) is arranged in the second inner groove (13).

7. The portable semiconductor outer frame for facilitating reliable fixation of claim 6, wherein: the semiconductor chip comprises a semiconductor chip body, and is characterized in that a connecting seat (15) is arranged at the top of the semiconductor chip body (14), a gold thread (16) is fixed in the connecting seat (15), one end of the gold thread (16) is connected with a pin (17), the outer diameter of the pin (17) is identical to the inner diameter of the first inner groove (6), and the pin (17) is slidably connected with the first inner groove (6).