CN219303618U - Process liquid supply system and single wafer processing apparatus - Google Patents
Process liquid supply system and single wafer processing apparatus Download PDFInfo
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- CN219303618U CN219303618U CN202320189239.2U CN202320189239U CN219303618U CN 219303618 U CN219303618 U CN 219303618U CN 202320189239 U CN202320189239 U CN 202320189239U CN 219303618 U CN219303618 U CN 219303618U
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Abstract
The application discloses a process liquid supply system and single wafer processing equipment. The process liquid supply system includes: a liquid supply source, a pipeline group and a liquid supply device. The liquid supply is configured to provide a process liquid having at least two different flows. A piping set is connected to the liquid supply and configured to control the delivery of the process liquid at the at least two different flows, respectively. A liquid supply is connected to the piping set and configured to output the process liquid from the piping set at a corresponding flow rate. The method can prevent the process liquid from dripping on the surface of the wafer when the process is stopped.
Description
Technical Field
The present application relates to the field of semiconductors, and more particularly, to a process liquid supply system and single wafer processing apparatus.
Background
In the cleaning or etching process of the single crystal wafer, the chemical liquid is pressurized and conveyed to a nozzle through a pipeline by a chemical tank, and then the chemical liquid is sprayed from the nozzle towards the surface of the wafer. Because the liquid medicine is conveyed to have a certain flow value, the liquid medicine conveyed at the moment when the process is stopped still has a certain inertia force, the liquid medicine remained in the nozzle is easy to drop from the nozzle to the surface of the wafer, so that the problem that the residual liquid medicine pollutes the wafer when the cleaning process is performed, and the problem that the residual liquid medicine (such as acid liquor) excessively etches the surface of the wafer when the etching process is performed can occur.
In view of the foregoing, it is desirable to provide a process liquid supply system and a single wafer processing apparatus that address the above-described issues.
Disclosure of Invention
To solve the above-described problems of the prior art, an object of the present application is to provide a process liquid supply system and a single wafer processing apparatus capable of preventing process liquid from dripping on the surface of a wafer when the process is stopped.
In a first aspect, the present application provides a process liquid supply system comprising: a liquid supply configured to provide a process liquid having at least two different flows; a piping set, coupled to the liquid supply, configured to control the transfer of the process liquid at the at least two different flows, respectively; and a liquid supply device connected to the pipe group and configured to output the process liquid from the pipe group with a corresponding flow rate.
In some embodiments, the liquid supply includes: a first supply configured to output the process liquid having a first flow rate; and a second supply configured to output the process liquid having a second flow rate, wherein the first flow rate is greater than the second flow rate.
In some embodiments, the tubing set comprises: a first valve configured to control the delivery of the process liquid having the first flow rate; and a second valve configured to control the transfer of the process liquid having the second flow rate, wherein the liquid supply device outputs the process liquid having a corresponding flow rate according to the opening and closing of the first valve and the second valve.
In some embodiments, the tubing set further comprises: the device comprises a first pipeline, a second pipeline, a third pipeline and a connecting point, wherein the first pipeline is connected between the first supply source and the connecting point, the second pipeline is connected between the second supply source and the connecting point, the third pipeline is connected between the connecting point and the liquid supply device, the first valve is arranged on the first pipeline, and the second valve is arranged on the second pipeline.
In some embodiments, the liquid supply device comprises: a supply pipe, one end of which is communicated with the pipeline group, and the other end of which is an output port; and a surface tension adjuster, provided at the output port of the supply pipe, configured to increase an adhesion force between the process liquid and the liquid supply device.
In some embodiments, the surface tension adjuster includes an internally threaded surface that abuts the output port.
In a second aspect, the present application also provides a process liquid supply system comprising: a liquid supply configured to output a process liquid; a piping set, coupled to the liquid supply, configured to transport the process liquid; and a liquid supply device connected to the pipe group and configured to output the process liquid from the pipe group. The liquid supply device includes: a supply pipe, one end of which is communicated with the pipeline group, and the other end of which is an output port; and a surface tension adjuster, provided at the output port of the supply pipe, configured to increase an adhesion force between the process liquid and the liquid supply device.
In some embodiments, the surface tension adjuster includes an internally threaded surface that abuts the output port.
In some embodiments, the liquid supply includes: a first supply configured to output the process liquid having a first flow rate; and a second supply configured to output the process liquid having a second flow rate, wherein the first flow rate is greater than the second flow rate.
In some embodiments, the tubing set comprises: a first valve configured to control the delivery of the process liquid having the first flow rate; and a second valve configured to control the transfer of the process liquid having the second flow rate, wherein the liquid supply device outputs the process liquid having a corresponding flow rate according to the opening and closing of the first valve and the second valve.
In some embodiments, the tubing set further comprises: the device comprises a first pipeline, a second pipeline, a third pipeline and a connecting point, wherein the first pipeline is connected between the first supply source and the connecting point, the second pipeline is connected between the second supply source and the connecting point, the third pipeline is connected between the connecting point and the liquid supply device, the first valve is arranged on the first pipeline, and the second valve is arranged on the second pipeline.
In a third aspect, the present application also provides a single wafer processing apparatus, comprising: a carrier table and a process liquid supply system as described above. The carrier is configured to carry a wafer thereon. The liquid supply is configured to apply the process liquid on the wafer.
Compared with the prior art, the application provides a process liquid supply system and single wafer processing equipment, which control the flow rate of the process liquid output by a liquid supply device through a pipeline group so as to reduce the inertia force of the liquid flow in a pipe at a proper time point and avoid the pollution or overetching of the wafer caused by the process liquid dropping on the wafer when the process is stopped. In addition, the surface tension regulator is arranged to increase the adhesive force between the process liquid and the supply pipe of the liquid supply device, so as to regulate the surface tension value between the process liquid and the output port, and further prevent the residual liquid flowing due to the inertia force from dripping on the surface of the wafer.
Drawings
Technical solutions and other advantageous effects of the present application will be made apparent from the following detailed description of specific embodiments of the present application with reference to the accompanying drawings.
Fig. 1 shows a schematic diagram of a single wafer processing apparatus according to an embodiment of the present application.
Fig. 2 shows an enlarged partial cross-sectional view of the liquid supply device.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
Referring to fig. 1, a schematic diagram of a single wafer processing apparatus according to an embodiment of the present application is shown. The single wafer processing apparatus 1 includes a process liquid supply system 10 and a carrier 20. The process liquid supply system 10 is used to provide a process liquid on a carrier 20. Specifically, the carrier 20 is used to carry the wafer 2 thereon. Alternatively, the carrier 20 is designed to be pivotable and can be vacuum-sucked, clamped, or the like to hold the wafer 2 thereon. The process liquid supply system 10 applies a process liquid to the surface of the wafer 2 placed on the stage 20 to perform cleaning, etching, etc. of the wafer 2.
As shown in fig. 1, the process liquid supply system 10 includes a liquid supply source 11, a pipe set 12, and a liquid supply device 13. The pipe group 12 is connected between the liquid supply source 11 and the liquid supply device 13. The liquid supply 11 is configured to provide a process liquid having at least two different flows. The piping sets 12 are configured to control the delivery of process liquids having at least two different flows, respectively. The liquid supply 13 is configured to output a process liquid from the pipe set 12 with a corresponding flow rate. It should be appreciated that the liquid supply 11 provides the same type of process liquid but at different flow rates.
Specifically, as shown in fig. 1, the liquid supply source 11 includes a first supply source 111 and a second supply source 112. The first supply 111 is configured to output a process liquid having a first flow rate. The second supply 112 is configured to output a process liquid having a second flow rate. It should be noted that the first flow rate is different from the second flow rate. For example, in the present embodiment, the first flow rate is greater than the second flow rate.
As shown in fig. 1, the piping group 12 includes a first piping 121, a second piping 122, a third piping 123, a connection point 124, a first valve 125, and a second valve 126. A first conduit 121 is connected between the first supply 111 and the connection point 124, and a second conduit 122 is connected between the second supply 112 and the connection point 124. That is, one end of each of the first pipe 121 and the second pipe 122 is communicated at a connection point 124 such that the process liquids transferred through the first pipe 121 and the second pipe 122 are gathered together. A third line 123 is connected between the connection point 124 and the liquid supply 13. A first valve 125 is disposed on the first conduit 121 and a second valve 126 is disposed on the second conduit 122. Thus, the first valve 125 may control the transfer of the process liquid having the first flow rate and the second valve 126 may control the transfer of the process liquid having the second flow rate.
In this application, the liquid supply device 13 outputs the process liquid having a corresponding flow rate according to the opening and closing of the first valve 125 and the second valve 126. For example, when the first valve 125 and the second valve 126 are opened, the liquid supply device 13 outputs the process liquid having the first flow rate plus the second flow rate. When the first valve 125 is closed and the second valve 126 is opened, the liquid supply device 13 outputs the process liquid having the second flow rate. When the first valve 125 is opened and the second valve 126 is closed, the liquid supply device 13 outputs the process liquid having the first flow rate. When the first valve 125 and the second valve 126 are closed, the liquid supply device 13 stops outputting the process liquid.
It will be appreciated that in the present application, the flow rate of the outputted process liquid can be effectively controlled by controlling the opening and closing of the first valve 125 and the second valve 126 in different process time periods, so as to reduce the inertia force of the liquid flow in the tube at an appropriate time point, and avoid the pollution or overetching of the wafer 2 caused by the process liquid dropping on the wafer 2 when the process is stopped. The specific control of the process liquid supply system 10 of the present application will be described in detail below.
As shown in fig. 1, the liquid supply device 13 includes a column 131 and a supply tube 132. One end of the supply pipe 132 is fixed to the column 131 and communicates with the pipe group 12. The other end of the supply tube 132 is an output port configured to output a process liquid. Alternatively, the upright 131 is designed to be pivotable or liftable. The supply tube 132 is driven to move along a specific path over the wafer 2 by controlling the rotation of the column 131 around the axis, thereby applying the process liquid to different positions on the surface of the wafer 2. In addition, by controlling the vertical column 131 to lift, the supply pipe 132 can be prevented from interfering with the mechanism of the pick-and-place device for the wafer 2.
In some embodiments of the present application, the liquid supply 13 further comprises a surface tension adjuster 133. Specifically, referring to fig. 2, an enlarged partial cross-sectional view of the liquid supply device is shown. The surface tension adjuster 133 is installed at the output port of the supply pipe 132. The surface tension adjuster 133 includes an internally threaded surface 1331, the internally threaded surface 1331 being contiguous with the output port 1321 of the supply tube 132. That is, the internally threaded surface 1331 abuts and forms a continuous surface with the inner tube wall of the supply tube 132.
It should be appreciated that when the single wafer processing apparatus 1 is at the moment of stopping the supply of process liquid, the local liquid within the conduit may still move towards the output port of the supply pipe 132 due to the inertial force of the fluid. In this application, the surface tension adjuster 133 can increase the adhesion between the process liquid and the supply tube 132 of the liquid supply device 13 to adjust the surface tension between the process liquid and the output port 1321 (the port of the surface tension adjuster 133), so as to prevent the residual liquid flowing due to the inertia force from dripping on the surface of the wafer 2.
In the present application, the surface tension adjuster 133 can be made to exhibit an optimal surface tension value by adjusting its characteristic parameters. As shown in fig. 2, the weight of the liquid that can be absorbed by the surface tension adjuster 133 is 2pi r λh, where r is the radius of the opening of the surface tension adjuster 133, λ is the surface tension coefficient of the material of the surface tension adjuster 133, and H is the outlet height of the surface tension adjuster 133. Thus, by varying the design of the internal thread surface 1331 (e.g., increasing the density of threads), the surface area of the internal thread surface that is in contact with a liquid can be increased to increase its surface tension value. In addition, the surface tension value can be effectively increased by adjusting the outlet height H of the surface tension adjuster 133, selecting a material having a higher surface tension coefficient λ matching the process liquid, and the like.
It should be appreciated that the material, dimensions, and shape of the internal threaded surface 1331 of the surface tension adjuster 133 may be selected to adjust the amount of surface tension that it can produce based on different process fluids, thereby ensuring that the process fluids remaining in the supply tube 132 at the time of process shut-down will effectively adhere to the ports of the surface tension adjuster 133.
The present application also provides a control method of the process liquid supply system, which is performed by the above process liquid supply system 10, wherein the structure of the process liquid supply system 10 is as described above, and the description thereof is omitted herein. In addition, the process liquid supply system 10 may also include a host computer that is communicatively coupled to the various components of the process liquid supply system 10. The host includes a processor and a memory electrically connected. It should be understood that the host may also include one or more of the following: circuit boards, power supply circuits, etc. The processor and the memory are disposed on the circuit board. The memory is configured to store executable program code. The processor executes programs corresponding to executable program codes stored in the memory by reading the executable program codes to execute the control method of the present application. Specifically, the control method of the present application includes: first, as shown in fig. 1, a control liquid supply 11 provides a process liquid having at least two different flow rates. The transfer of process liquids having at least two different flows is then controlled separately by the piping set 12. Finally, the control liquid supply device 13 outputs the process liquid from the pipe group 12 with a corresponding flow rate.
In this embodiment, the processor is generally configured to control the overall operation of the host. The processor may include one or more processors to execute instructions to perform actions in all or part of the steps in the operation of the process liquid supply system 10 described above. Further, the processor may include one or more modules that facilitate interactions between the processor and other components. For example, the processor may include a communication module to facilitate interaction between the communication component and the processor. The memory is configured to store various types of data to support operation of the host. Examples of such data include instructions for any application or method operating on a host. The memory may be implemented using any type of volatile or non-volatile memory device or combination thereof. The power circuit supplies power to various components of the host. The power circuit may include a power management system, one or more power supplies, and any other components associated with the generation, management, and distribution of power by the host. In an exemplary embodiment, the host may be implemented by a stand-alone terminal device or electronic components such as a controller, microcontroller, etc. integrated into the process liquid supply system 10.
In the control method of the present application, the step of controlling the liquid supply source 11 to provide the process liquid having at least two different flow rates specifically includes: the first supply 111 is controlled to output a process liquid having a first flow rate and the second supply 112 is controlled to output a process liquid having a second flow rate. It should be noted that the first flow rate is different from the second flow rate. For example, in the present embodiment, the first flow rate is greater than the second flow rate.
In the control method of the present application, the step of controlling the transfer of the process liquids having at least two different flow rates through the pipe group 12 includes: the transfer of process liquid having a first flow rate is controlled by a first valve 125 and the transfer of process liquid having a second flow rate is controlled by a second valve 126. Accordingly, the liquid supply device 13 outputs the process liquid having a corresponding flow rate according to the opening and closing of the first valve 125 and the second valve 126.
It should be noted that the control method of the present application includes consecutive first, second and third periods. During a first time period, the single wafer processing apparatus 1 performs a wet processing operation of the wafer 2, i.e., the process liquid supply system 10 applies a process liquid to the wafer 2. During the second period of time, the single wafer processing apparatus 1 will cease performing wet processing operations on the wafer 2, i.e., the process liquid supply system 10 continues to supply process liquid but will cease applying process liquid to the wafer 2. During the third period of time, the single wafer processing apparatus 1 stops performing the wet processing operation of the wafer 2, i.e., the process liquid supply system 10 stops applying the process liquid to the wafer 2.
Specifically, during a first period of time, the first valve 125 and the second valve 126 are opened such that the liquid supply 13 outputs the process liquid having the first flow rate plus the second flow rate. At this time, the liquid supply device 13 outputs the maximum flow rate of the process liquid to meet the flow rate parameters required for performing the wet process of the wafer 2. Then, during a second period of time, the first valve 125 is closed and the second valve 126 remains open, so that the liquid supply device 13 outputs a process liquid having a second flow rate. At this time, the valve controlling the large flow rate is closed, the flow rate of the supplied process liquid is rapidly reduced, and the liquid supply device 13 outputs a small flow rate of the process liquid to continuously perform the wet process on the wafer 2. Finally, at the third time period, the first valve 125 and the second valve 126 are closed, so that the liquid supply device 13 stops outputting the process liquid. It should be noted that the duration of the second period of time is short, for example 1-3 seconds. That is, the start time point of the second period is, for example, 1 to 3 seconds before the start time point of the third period. It should be appreciated that by reducing the flow rate of the process liquid output during the second time period, the inertial force of the liquid flow within the tube is reduced, thereby avoiding contamination or overetching of the wafer 2 by the process liquid dripping onto the wafer 2 during the third time period (i.e., when the process is stopped).
Compared with the prior art, the application provides a process liquid supply system, a control method thereof and single wafer processing equipment, wherein the flow rate of the process liquid output by a liquid supply device is controlled through a pipeline group, so that the inertia force of the liquid flow in a pipe is reduced at a proper time point, and the problem that the process liquid drops on a wafer to cause wafer pollution or overetching when the process is stopped is avoided. In addition, the surface tension regulator is arranged to increase the adhesive force between the process liquid and the supply pipe of the liquid supply device, so as to regulate the surface tension value between the process liquid and the output port, and further prevent the residual liquid flowing due to the inertia force from dripping on the surface of the wafer.
The foregoing has described in detail a process liquid supply system and a single wafer processing apparatus according to embodiments of the present application, and specific embodiments have been applied herein to illustrate the principles and implementations of the present application, where the foregoing embodiments are merely provided to assist in understanding the technical solutions and core ideas of the present application. Those of ordinary skill in the art will appreciate that: the technical scheme described in the foregoing embodiments can be modified or some of the technical features thereof can be replaced by equivalents. Such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.
Claims (12)
1. A process liquid supply system, comprising:
a liquid supply configured to provide a process liquid having at least two different flows;
a piping set, coupled to the liquid supply, configured to control the transfer of the process liquid at the at least two different flows, respectively; and
and a liquid supply device connected with the pipeline group and configured to output the process liquid with corresponding flow rate from the pipeline group.
2. The process liquid supply system of claim 1, wherein the liquid supply source comprises:
a first supply configured to output the process liquid having a first flow rate; and
a second supply configured to output the process liquid having a second flow rate, wherein the first flow rate is greater than the second flow rate.
3. The process liquid supply system of claim 2, wherein the piping set comprises:
a first valve configured to control the delivery of the process liquid having the first flow rate; and
and a second valve configured to control the transfer of the process liquid having the second flow rate, wherein the liquid supply device outputs the process liquid having a corresponding flow rate according to the opening and closing of the first valve and the second valve.
4. The process liquid supply system of claim 3, wherein the piping set further comprises: the device comprises a first pipeline, a second pipeline, a third pipeline and a connecting point, wherein the first pipeline is connected between the first supply source and the connecting point, the second pipeline is connected between the second supply source and the connecting point, the third pipeline is connected between the connecting point and the liquid supply device, the first valve is arranged on the first pipeline, and the second valve is arranged on the second pipeline.
5. The process liquid supply system of claim 1, wherein said liquid supply means comprises:
a supply pipe, one end of which is communicated with the pipeline group, and the other end of which is an output port; and
and a surface tension adjuster, provided at the output port of the supply pipe, configured to increase an adhesion force between the process liquid and the liquid supply device.
6. The process liquid supply system of claim 5, wherein the surface tension adjuster comprises an internally threaded surface that abuts the output port.
7. A process liquid supply system, comprising:
a liquid supply configured to output a process liquid;
a piping set, coupled to the liquid supply, configured to transport the process liquid; and
a liquid supply connected to the piping set configured to output the process liquid from the piping set, wherein the liquid supply comprises:
a supply pipe, one end of which is communicated with the pipeline group, and the other end of which is an output port; and
and a surface tension adjuster, provided at the output port of the supply pipe, configured to increase an adhesion force between the process liquid and the liquid supply device.
8. The process liquid supply system of claim 7, wherein the surface tension adjuster comprises an internally threaded surface that abuts the output port.
9. The process liquid supply system of claim 7, wherein the liquid supply source comprises:
a first supply configured to output the process liquid having a first flow rate; and
a second supply configured to output the process liquid having a second flow rate, wherein the first flow rate is greater than the second flow rate.
10. The process liquid supply system of claim 9, wherein the piping set comprises:
a first valve configured to control the delivery of the process liquid having the first flow rate; and
and a second valve configured to control the transfer of the process liquid having the second flow rate, wherein the liquid supply device outputs the process liquid having a corresponding flow rate according to the opening and closing of the first valve and the second valve.
11. The process liquid supply system of claim 10, wherein the piping set further comprises: the device comprises a first pipeline, a second pipeline, a third pipeline and a connecting point, wherein the first pipeline is connected between the first supply source and the connecting point, the second pipeline is connected between the second supply source and the connecting point, the third pipeline is connected between the connecting point and the liquid supply device, the first valve is arranged on the first pipeline, and the second valve is arranged on the second pipeline.
12. A single wafer processing apparatus, comprising:
a carrier configured to carry a wafer thereon;
the process liquid supply system of any one of claims 1-11, wherein the liquid supply is configured to apply the process liquid on the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320189239.2U CN219303618U (en) | 2023-02-08 | 2023-02-08 | Process liquid supply system and single wafer processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320189239.2U CN219303618U (en) | 2023-02-08 | 2023-02-08 | Process liquid supply system and single wafer processing apparatus |
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| Publication Number | Publication Date |
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| CN219303618U true CN219303618U (en) | 2023-07-04 |
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| CN202320189239.2U Active CN219303618U (en) | 2023-02-08 | 2023-02-08 | Process liquid supply system and single wafer processing apparatus |
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