CN219303042U

CN219303042U - Anti-bending intelligent chip storage card

Info

Publication number: CN219303042U
Application number: CN202320620965.5U
Authority: CN
Inventors: 朱春红; 虞曼
Original assignee: Shenzhen Kumi Industrial Co ltd
Current assignee: Shenzhen Kumi Industrial Co ltd
Priority date: 2023-03-20
Filing date: 2023-03-20
Publication date: 2023-07-04
Anticipated expiration: 2033-03-20

Abstract

The application discloses anti crooked intelligent chip memory card, including bottom plate, support casing, strengthening rib, memory card mainboard and guard plate, bottom plate top fixedly connected with supports the casing bottom, support the inside buffer layer that bonds of casing, the inside memory card mainboard that bonds of buffer layer, memory card mainboard top welding chip body, memory card mainboard top bonds the heat conduction glue with chip main part top, the heat conduction glue top bonds the fin, support the inside fixedly connected with a plurality of strengthening rib of casing. Through at the inside strengthening rib that fills of support casing, the strengthening rib adopts the steel bar material of hardness too high to make, and is provided with a plurality of protruding strip on fin top, effectual anti bending ability that improves support casing.

Description

Anti-bending intelligent chip storage card

Technical Field

The application relates to the field of intelligent chip memory cards, in particular to an anti-bending intelligent chip memory card.

Background

The SD card memory card is an independent storage medium used in mobile phones, digital cameras, portable computers, MP3 and other digital products, and is generally in the form of a card, so it is collectively called "memory card", also called "digital memory card", "memory card", etc.

The hardness of current intelligent chip memory card is too low, bends it easily, leads to inside memory card mainboard and chip to receive the damage, causes the damage of intelligent chip memory card, and the untimely derivation of temperature that produces when intelligent chip memory card operates, can make the practical life of inside chip reduce. Therefore, a smart chip memory card resistant to bending is proposed in view of the above-mentioned problems.

Disclosure of Invention

The embodiment provides an anti-bending intelligent chip memory card, which is used for solving the problems that the hardness of the intelligent chip memory card in the prior art is too low, the intelligent chip memory card is easy to bend, an internal memory card main board and a chip are damaged, the intelligent chip memory card is damaged, the temperature generated when the intelligent chip memory card operates is not timely led out, and the practical service life of the internal chip is reduced.

According to an aspect of the application, there is provided an anti-bending intelligent chip memory card, which comprises a base plate, a support shell, reinforcing ribs, a memory card main board and a protection plate, wherein the bottom plate top is fixedly connected with the bottom of the support shell, a buffer layer is bonded inside the support shell, the memory card main board is bonded inside the buffer layer, a chip body is welded at the top end of the memory card main board, a heat conducting adhesive is bonded at the top end of the memory card main board and the top end of the chip body, a heat radiating fin is bonded at the top end of the heat conducting adhesive, and a plurality of reinforcing ribs are fixedly connected inside the support shell.

Further, the reinforcing ribs are made of steel bar materials.

Further, the radiating fin is made of an aluminum sheet material, the top end of the radiating fin is fixedly connected with a protruding strip, and the protruding strip is made of an aluminum material.

Further, the bottom end of the memory card motherboard is electrically connected with the copper column through a connecting wire.

Further, the buffer layer is made of a silica gel material, and the heat-conducting glue is made of a silicone grease material.

Through this above-mentioned embodiment of application, the bottom plate has been adopted, supporting housing, the strengthening rib, memory card mainboard and guard plate, the hardness of having solved intelligent chip memory card is too low, it is crooked to it easily, lead to inside memory card mainboard and chip to receive the damage, cause the damage of intelligent chip memory card, and the untimely derivation of temperature that produces when intelligent chip memory card operates, can make the problem that the life of inside chip reduces, the rib has been obtained through inside packing the supporting housing, the strengthening rib adopts the steel bar material of hardness too high to make, and be provided with a plurality of protruding strip on the fin top, the effectual effect of the anti bending capacity of supporting housing that improves.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive faculty for a person skilled in the art.

FIG. 1 is a schematic overall perspective view of an embodiment of the present application;

FIG. 2 is a schematic diagram of the overall internal structure of an embodiment of the present application;

fig. 3 is a schematic top view of a connection structure according to an embodiment of the present application.

In the figure: 1. a bottom plate; 2. a support housing; 3. reinforcing ribs; 4. a buffer layer; 5. a memory card motherboard; 6. a chip body; 7. externally connecting copper columns; 8. a heat-conducting adhesive; 9. a protection plate; 10. a heat sink; 101. and (5) protruding strips.

Detailed Description

In order to make the present application solution better understood by those skilled in the art, the following description will be made in detail and with reference to the accompanying drawings in the embodiments of the present application, it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, shall fall within the scope of the present application.

It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe the embodiments of the present application described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

In the present application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are used primarily to better describe the present application and its embodiments and are not intended to limit the indicated device, element or component to a particular orientation or to be constructed and operated in a particular orientation.

Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "mounted," "configured," "provided," "connected," "coupled," and "sleeved" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Referring to fig. 1-3, an anti-bending intelligent chip memory card comprises a bottom plate 1, a support shell 2, reinforcing ribs 3, a memory card main board 5 and a protection plate 9, wherein the top end of the bottom plate 1 is fixedly connected with the bottom end of the support shell 2, a buffer layer 4 is adhered inside the support shell 2, the memory card main board 5 is adhered inside the buffer layer 4, a chip body 6 is welded at the top end of the memory card main board 5, a heat-conducting adhesive 8 is adhered at the top end of the memory card main board 5 and the top end of the chip body, a heat-conducting adhesive 8 is adhered with a heat-radiating fin 10, a plurality of reinforcing ribs 3 are fixedly connected inside the support shell 2, the reinforcing ribs 3 are made of steel bar materials with high hardness, and a plurality of protruding strips 101 are arranged at the top end of the heat-radiating fin 10, so that the anti-bending capacity of the support shell 2 is effectively improved;

the strengthening rib 3 adopts the billet material to make, is convenient for improve the hardness that supports casing 2, fin 10 adopts aluminum sheet material to make, fin 10 top fixed connection protruding strip 101, protruding strip 101 adopts aluminum material to make, is convenient for improve the holistic heat dissipation of memory card, the copper post is connected through the connecting wire electricity to memory card mainboard 5 bottom, is convenient for be connected with external equipment, buffer layer 4 adopts the silica gel material to make, heat conduction glue 8 adopts the silicone grease material to make.

When the memory card is used, the buffer layer 4 is arranged at the bottom end of the inside of the support shell 2, the buffer layer 4 is made of a silica gel material, vibration generated when a memory card accidentally falls down is buffered, the memory card main board 5 and a chip in the memory card are prevented from being affected by vibration, the damage to the support shell 2 can be reduced by fixedly connecting the bottom board 1 and the protection board 9 on the upper side and the lower side of the support shell 2 respectively, the heat conducting glue 8 is adhered to the top end of the memory card main board 5 and the top end of the chip body 6, the heat conducting fin 10 is adhered to the top end of the heat conducting glue 8, and when the memory card main board 5 and the chip run, generated heat is led into the heat fin 10 to dissipate heat, the reinforcing rib 3 is made of a steel bar material with overhigh hardness, and the top end of the heat fin 10 is provided with the plurality of protruding strips 101, so that the bending resistance of the support shell 2 is effectively improved, and the bottom end of the memory card main board 5 is electrically connected with a copper column through a connecting wire, so that the memory card and the memory card can be conveniently connected with a device.

The beneficial point of the application lies in:

1. the reinforcing ribs are filled in the support shell and made of steel bar materials with high hardness, and the top ends of the radiating fins are provided with a plurality of protruding strips, so that the bending resistance of the support shell is effectively improved;

2. the heat conducting glue is adhered to the top ends of the memory card main board and the chip body, and the radiating fins are adhered to the top ends of the heat conducting glue, so that when the memory card main board and the chip run, generated heat is led into the radiating fins for radiating.

The related circuits, electronic components and modules are all in the prior art, and can be completely implemented by those skilled in the art, and needless to say, the protection of the present application does not relate to improvements of software and methods.

The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. An anti-bending intelligent chip storage card, which is characterized in that: including bottom plate (1), support casing (2), strengthening rib (3), memory card mainboard (5) and guard plate (9), bottom plate (1) top fixedly connected with support casing (2) bottom, support casing (2) inside bonding buffer layer (4), inside bonding memory card mainboard (5) of buffer layer (4), memory card mainboard (5) top welding chip body (6), memory card mainboard (5) top bonds heat conduction glue (8) with chip main part top, heat conduction glue (8) top bonds fin (10), support casing (2) inside fixedly connected with a plurality of strengthening rib (3).

2. A smart chip memory card as defined in claim 1, wherein: the reinforcing ribs (3) are made of steel bar materials.

3. A smart chip memory card as defined in claim 1, wherein: the heat dissipation plate (10) is made of an aluminum sheet material, the top end of the heat dissipation plate (10) is fixedly connected with the protruding strip (101), and the protruding strip (101) is made of the aluminum sheet material.

4. A smart chip memory card as defined in claim 1, wherein: the bottom end of the memory card main board (5) is electrically connected with an external copper column (7) through a connecting wire.

5. A smart chip memory card as defined in claim 1, wherein: the buffer layer (4) is made of a silica gel material, and the heat conducting glue (8) is made of a silicone grease material.