CN219287794U

CN219287794U - Immersed liquid cooling cabinet device

Info

Publication number: CN219287794U
Application number: CN202222525253.3U
Authority: CN
Inventors: 姜星晨; 张京; 汤弢
Original assignee: Chunjun New Materials Shenzhen Co Ltd
Current assignee: Chunjun New Materials Shenzhen Co Ltd
Priority date: 2022-09-23
Filing date: 2022-09-23
Publication date: 2023-06-30
Anticipated expiration: 2032-09-23

Abstract

The utility model discloses an immersed liquid cooling cabinet device, which comprises a cabinet body, a cabinet cover turned over relative to the cabinet body, a BBU main board assembly and a circulating assembly, wherein the BBU main board assembly and the circulating assembly are arranged in the cabinet body, and cooling liquid is filled in the cabinet body; the BBU main board assembly comprises a plurality of BBU main board frames arranged side by side, a plurality of BBU main board electronic components fixed on the BBU main board frames and a heat dissipation piece arranged on the BBU main board electronic components; the circulation assembly drives cooling liquid in the cabinet body to circulate, so that the cooling liquid enters the BBU main board assembly and passes through the heat dissipation piece, and heat generated by electronic components of the BBU main board is taken away; according to the utility model, the BBU main board frame is arranged to protect BBU main board electronic components, so that the BBU main board electronic components are prevented from being directly impacted by cooling liquid, and the circulating assembly is arranged to accelerate the circulation of the cooling liquid, so that the circulating heat dissipation capacity of the cooling liquid is improved; meanwhile, the heat dissipation piece is arranged and is in direct contact with the BBU main board electronic component, so that on one hand, the BBU main board electronic component is protected, and on the other hand, the heat dissipation capacity is enhanced.

Description

Immersed liquid cooling cabinet device

Technical Field

The utility model belongs to the technical field of liquid cooling devices, and particularly relates to an immersed liquid cooling cabinet device.

Background

The single-phase immersed liquid cooling cabinet is used for carrying out liquid cooling heat dissipation on the electronic equipment. In general, a liquid inlet is formed below a side wall of a single-phase immersed liquid cooling cabinet, a liquid outlet is formed above the side wall, then an electronic device is placed in the single-phase immersed liquid cooling cabinet, and a cooling liquid flows in from the liquid inlet below and flows out from the liquid outlet above, wherein the cooling liquid exchanges heat with the electronic device when flowing through the electronic device, and the cooling liquid with increased temperature releases heat at an external cold source after heat exchange; that is, the cooling liquid absorbs heat generated by the electronic equipment when the cooling liquid is in the liquid cooling cabinet, and then flows into the liquid cooling cabinet after releasing the heat from the outside, so that liquid cooling heat dissipation is circularly realized. However, the existing immersed liquid cooling cabinet has the following problems: 1. when the liquid is damaged, direct impact is caused on the BBU main board electronic element, and the BBU main board electronic element is easy to damage; 2. the liquid refrigerator has insufficient overall circulation, so that the heat dissipation capacity is greatly attenuated.

Disclosure of Invention

The utility model aims to overcome the defects of the prior art and provides an immersed liquid cooling cabinet device.

The utility model adopts the technical scheme that: the utility model provides an immersed liquid cooling cabinet device, which comprises a cabinet body, a cabinet cover turned over relative to the cabinet body, a BBU main board component and a circulating component which are arranged in the cabinet body, wherein the cabinet body is internally filled with cooling liquid;

the BBU main board assembly comprises a plurality of BBU main board frames arranged side by side, a plurality of BBU main board electronic elements fixed on the BBU main board frames and heat dissipation parts arranged on the BBU main board electronic elements;

the circulation assembly drives the cooling liquid in the cabinet body to circulate, so that the cooling liquid enters the BBU main board assembly and passes through the heat dissipation piece, and heat generated by the BBU main board electronic element is taken away.

Further, preferably, the top of the cabinet body is provided with a liquid inlet, the top of the BBU main board frame is provided with a first baffle, a plurality of first through holes are formed in the first baffle, and the liquid inlet is communicated with the first through holes.

Further, preferably, the BBU motherboard assembly includes a second baffle disposed at the bottom of the BBU motherboard frame, and a plurality of second through holes are formed in the second baffle.

Further, preferably, a third baffle is arranged on two side surfaces of the BBU main board frame, and a third through hole is formed in the third baffle.

Further, preferably, a fourth baffle is arranged on the outer side of the third baffle, a buffer chamber is formed by a gap between the third baffle and the fourth baffle, and a fourth through hole is formed in the fourth baffle;

the aperture of the fourth through hole is larger than that of the third through hole.

Further, preferably, the circulating component is a blade, and the circulating component is arranged at the bottom of the BBU main board frame, so that the cooling liquid enters the BBU main board component frame from the bottom and two sides of the BBU main board frame;

or, the circulating assembly is arranged at the bottom and the side surface of the BBU main board frame, so that the cooling liquid enters the BBU main board assembly frame from the bottom and the two sides of the BBU main board frame.

Further, preferably, a fixing seat is provided on the BBU motherboard frame, an engagement groove is provided on the fixing seat, and the BBU motherboard electronic component is engaged in the engagement groove.

Further, preferably, the fixing base is further provided with a fixing rod, the fixing rod surrounds the BBU motherboard electronic component, a fixing hole matched with the fixing rod is formed in the heat dissipation part, and the heat dissipation part is fixed on the fixing base through the fixing hole and covers the BBU motherboard electronic component.

Further, preferably, the fixing rod is sleeved with an elastic fastener, and the elastic fastener is used for adjusting pressure on the BBU main board electronic component.

Further, preferably, the heat dissipation member is a cross-shaped heat dissipation fin, the heat dissipation fin includes a first heat dissipation fin disposed transversely and a second heat dissipation fin disposed longitudinally, and the first heat dissipation fin is fixedly connected with the second heat dissipation fin.

The utility model has the beneficial effects that: according to the submerged liquid cooling cabinet device, the BBU main board frame is arranged to protect BBU main board electronic components, direct impact of circulating cooling liquid on the BBU main board electronic components is avoided, the circulating assembly is arranged in the cabinet body, circulation of the cooling liquid can be accelerated, the cooling liquid is ensured to enter the BBU main board assembly, heat of the BBU main board electronic components is taken away, and the circulating heat dissipation capacity of the cooling liquid is improved; meanwhile, the heat dissipation piece is arranged on the BBU main board electronic element and is in direct contact with the BBU main board electronic element, so that the BBU main board electronic element is protected from direct impact of cooling liquid on one hand, and the heat dissipation capacity is enhanced on the other hand.

Drawings

The utility model will be further described with reference to the accompanying drawings and examples, in which:

FIG. 1 is an exploded view of an submerged liquid cooled cabinet apparatus of the present utility model;

FIG. 2 is an exploded view of the submerged liquid cooled cabinet apparatus of the present utility model (without the circulation assembly and BBU motherboard electronics);

FIG. 3 is a partially exploded view of the BBU motherboard assembly of the present utility model;

FIG. 4 is another side view of FIG. 3;

fig. 5 is a schematic structural diagram of another embodiment of the BBU motherboard frame of the present utility model.

Detailed Description

For a clearer understanding of technical features, objects and effects of the present utility model, a detailed description of embodiments of the present utility model will be made with reference to the accompanying drawings.

An element is referred to as being "mounted" or "disposed" on another element and may be directly or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.

The directions or positions indicated by the terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are directions or positions based on the drawings, and are merely for convenience of description and are not to be construed as limiting the present technical solution. The terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a plurality of" is two or more, unless specifically defined otherwise.

As shown in fig. 1-5, an immersed liquid cooling cabinet device comprises a cabinet body 20, a cabinet cover 30 turned over relative to the cabinet body 20, a BBU main board assembly 10 and a circulating assembly 40 which are arranged in the cabinet body 20, wherein the cabinet body 20 is filled with cooling liquid; the BBU main board assembly 10 comprises a plurality of BBU main board frames 1 arranged side by side, a plurality of BBU main board electronic components 2 fixed on the BBU main board frames 1 and heat dissipation elements 3 arranged on the BBU main board electronic components 2; the circulation assembly 40 drives the cooling liquid in the cabinet 20 to circulate, so that the cooling liquid enters the BBU main board assembly 10 and passes through the heat dissipation member 3, and heat generated by the BBU main board electronic component 2 is taken away.

According to the immersed liquid cooling cabinet device, the BBU main board frame 1 is arranged to protect the BBU main board electronic components 2, so that direct impact of circulating cooling liquid on the BBU main board electronic components 2 is avoided, and the circulating assembly 40 is arranged in the cabinet body 20, so that the circulation of the cooling liquid can be accelerated, the cooling liquid is ensured to enter the BBU main board assembly 10, heat of the BBU main board electronic components 2 is taken away, and the circulating heat dissipation capacity of the cooling liquid is improved; meanwhile, the heat dissipation piece 3 is arranged on the BBU main board electronic element 2, and the heat dissipation piece 3 is in direct contact with the BBU main board electronic element 2, so that on one hand, the BBU main board electronic element 2 is protected from direct impact of cooling liquid, and on the other hand, the heat dissipation capacity is enhanced.

In this embodiment, the electronic component of the BBU (indoor baseband processing unit) motherboard is a device with high energy consumption, and may include a chipset. The memory card slot 50 can also be arranged on the BBU main board frame 1, and the memory card slot 50 is used for placing a memory card. The cooling liquid can be non-conductive liquid with good heat exchange effect. For example, a fluorinated liquid, or a widely used synthetic oil, mineral oil, or the like can be used. In order to accelerate the circulation flow speed of the cooling liquid, a circulation assembly 40 is arranged in the cabinet body 20, the circulation assembly 40 can be a blade, and the rotation of the blade accelerates the circulation flow speed of the cooling liquid and accelerates the heat dissipation effect on the BBU main board electronic element 2. The BBU motherboard frame 1 provides support strength for the BBU motherboard electronic components 2, and one side of the BBU motherboard frame 1 on which the BBU motherboard electronic components 2 are disposed is closed, and the other side of the BBU motherboard frame 1 may be open or closed.

In this embodiment, the top of the cabinet 20 is provided with the liquid inlet 201, the bottom of the cabinet 20 is provided with the liquid outlet, and the cooling liquid flows in from the liquid inlet 201 at the top and flows out from the liquid outlet (not shown) at the bottom, wherein when flowing through the BBU main board assembly 10, the cooling liquid exchanges heat with the BBU main board electronic components 2, and after the heat exchange, the cooling liquid with increased temperature releases heat at an external cold source, so as to realize heat dissipation and temperature reduction of the BBU main board electronic components 2; further, be provided with first baffle 11 at the top of BBU mainboard frame 1, a plurality of first through-holes 111 have been seted up on the first baffle 11, inlet 201 and first through-hole 111 intercommunication, direct impact BBU mainboard electronic component 2 in the BBU mainboard frame 1 when the coolant liquid is got into by inlet 201 has been avoided to the setting of first baffle 11, protection has been carried out BBU mainboard electronic component 2, simultaneously the setting of first through-hole 111 makes the coolant liquid get into by the top of BBU mainboard frame 1 smoothly, get into and take away the inside heat that produces of BBU mainboard subassembly 10.

The BBU main board assembly 10 is detachably connected with the cabinet body 20, specifically, hanging lugs 112 can be arranged on two sides of the top of the BBU main board frame 1, cross beams are arranged on opposite side walls of the cabinet body 20, and the BBU main board assembly 10 can hang the BBU main board frame 1 on the opposite cross beams through the hanging lugs 112; handles 15 may be provided on top of BBU motherboard frame 1 to facilitate transfer of BBU motherboard assembly 10.

Further, the BBU motherboard assembly 10 includes a second baffle 12 disposed at the bottom of the BBU motherboard frame 1, and a plurality of second through holes 121 are formed in the second baffle 12, and the second through holes 121 are configured to enable the cooling liquid to enter the BBU motherboard frame 1 through the second through holes 121, so as to accelerate the flow rate of the cooling liquid; when the circulation assembly 40 is arranged below the BBU main board assembly 10, the circulation assembly 40 drives the cooling liquid in the cabinet body 20 to circulate, the cooling liquid enters the BBU main board frame 1 from the bottom, and the cooling liquid is prevented from directly impacting the BBU main board electronic components 2 in the BBU main board frame 1 when entering from the liquid inlet 201 by the arrangement of the second baffle 12, so that the BBU main board electronic components 2 are protected. Of course, since the circulation assembly 40 accelerates the circulation of the cooling liquid, the driving force generated by the circulation assembly does not directly impact the cooling liquid on the BBU motherboard components, the bottom of the BBU motherboard frame 1 may not be provided with a baffle, i.e. the bottom of the BBU motherboard frame 1 is open, so that the cooling liquid is more likely to enter the BBU motherboard frame 1 from the bottom of the BBU motherboard frame 1.

Further, preferably, the two side surfaces of the BBU motherboard frame 1 are provided with third baffle plates 13, and third through holes 131 are formed in the third baffle plates 13. The third baffle 13 prevents the cooling liquid from directly impacting the BBU main board electronic element 2 when entering from the side surface of the BBU main board frame 1, and protects the BBU main board electronic element 2; meanwhile, the third through holes 131 enable the cooling liquid to smoothly enter from the side face of the BBU main board frame 1, and heat generated in the BBU main board frame is taken away. Meanwhile, under the driving of the circulation assembly 40, the cooling liquid can enter the BBU main board frame 1 from the bottom of the BBU main board frame 1 and flow towards the top, meanwhile, the cooling liquid can enter the BBU main board frame 1 from the side face of the BBU main board frame 1, in the BBU main board frame 1, the cooling liquid entering from the bottom and the cooling liquid entering from the two sides form reflux, namely, the cooling liquid vertically circulates from the bottom to the top, the cooling liquid horizontally circulates from one side to the other side, and finally, the cooling liquid alternately circulates, so that the circulation heat dissipation capacity of the cooling liquid can be ensured to the greatest extent while the BBU main board electronic element 2 is protected.

Further, a fourth baffle 14 is arranged on the outer side of the third baffle 13, a buffer chamber is formed by a gap between the third baffle 13 and the fourth baffle 14, and a fourth through hole 141 is arranged on the fourth baffle 14; the fourth through hole 141 has a larger aperture than the third through hole 131; the formation of the buffer chamber reserves a circulation space for circulating and radiating internal cooling liquid, prevents the cooling liquid in the BBU main board frame 1 from being too high in temperature and not radiating, and also prevents the cooling liquid from directly impacting the BBU main board electronic element 2 when entering from the side surface of the BBU main board frame 1, thereby protecting the BBU main board electronic element 2; the third small through hole of the third baffle 13 is smaller than the fourth through hole 141 of the fourth baffle 14, so that the cooling liquid capable of preventing heat dissipation from flowing back into the BBU main board frame 1 to a certain extent is arranged, and the heat dissipation effect is improved.

The circulating assembly 40 is a blade, the circulating assembly 40 can be provided with a plurality of circulating assemblies 40, the circulating assembly 40 is arranged below the BBU main board frame 1, so that cooling liquid enters the BBU main board assembly 10 frame from the bottom and two sides of the BBU main board frame 1, the cooling liquid can enter from the bottom of the BBU main board frame 1 and flow to the top under the driving of the circulating assembly 40, meanwhile, the cooling liquid can enter the BBU main board frame 1 from the side surface of the BBU main board frame 1, the cooling liquid entering from the bottom of the BBU main board frame 1 and the cooling liquid entering from two sides form reflux, namely the cooling liquid circulates vertically from the bottom to the top, the cooling liquid enters from one side to the other side and circulates horizontally, and finally the cooling liquid circulates in a cross manner, so that the circulating heat dissipation capability of the cooling liquid can be ensured to the greatest extent while protecting the BBU main board electronic components 2; alternatively, to further increase the circulation rate of the cooling liquid, the circulation assembly 40 may be disposed under and beside (lateral to) the BBU motherboard frame 1 at the same time, so that the cooling liquid enters the BBU motherboard assembly 10 frame from the bottom and both sides of the BBU motherboard frame 1; of course, the circulation module 40 is not limited to be disposed below or beside the BBU motherboard frame 1, and is not particularly limited.

Further, preferably, a fixing base 4 is provided on the BBU motherboard frame 1, the fixing base 4 is fixed on the inner wall of the BBU motherboard frame 1, an engagement groove 41 is provided on the fixing base 4, the shape and size of the BBU motherboard electronic component 2 are matched with those of the engagement groove 41, and the BBU motherboard electronic component 2 is directly engaged in the engagement groove 41. The fixing base 4 is arranged to fix the BBU main board electronic element 2 on one hand, and protect the side face of the BBU main board electronic element 2 on the other hand, so that the side face of the BBU main board electronic element 2 is prevented from being flushed by cooling liquid. Meanwhile, in order to ensure the heat dissipation effect of the BBU main board electronic element 2, a heat dissipation element 3 is further arranged, the heat dissipation element 3 is arranged above the BBU main board electronic element 2, and the heat dissipation element 3 is in abutting contact or basically abutting contact with the BBU main board electronic element 2; specifically, fixing base 4 is last still to be provided with dead lever 5, and dead lever 5 sets up around BBU mainboard electronic component 2, has offered the fixed orifices 31 that match with dead lever 5 on the radiating member 3, and radiating member 3 is fixed in on the fixing base 4 and covers BBU mainboard electronic component 2 through fixed orifices 31.

Further, the elastic fastener is sleeved on the fixing rod 5, the elastic fastener can be composed of a spring and a spring arranged above the spring, the spring can be compressed or stretched under the action of the liquid pressure of cooling liquid, the radiating piece 3 is close to or far away from the BBU main board electronic element 2, the elastic fastener can regulate the pressure received by the BBU main board electronic element 2, the BBU main board electronic element 2 is ensured to be subjected to reasonable pressure, the BBU main board electronic element 2 is prevented from being damaged due to overlarge pressure, or the BBU main board electronic element 2 cannot radiate heat in time due to overlarge pressure.

Further, the heat dissipation piece 3 is a heat dissipation fin with a cross structure, the heat dissipation fin comprises a first heat dissipation fin 32 and a second heat dissipation fin 33, the first heat dissipation fin 32 and the second heat dissipation fin 33 are arranged in a longitudinal direction, the first heat dissipation fin 32 and the second heat dissipation fin 33 are fixedly connected, that is, the cooling liquid flowing along the first heat dissipation fin 32 and the cooling liquid flowing along the second heat dissipation fin 33 are collected at the middle position of the heat dissipation piece 3, the cooling liquid flowing directions are reasonably distributed by the arrangement of the first heat dissipation fin 32 and the second heat dissipation fin 33, the heat dissipation capability of the heat dissipation piece 3 is improved, the heat dissipation effect of the heat dissipation piece 3 and the cooling liquid is improved, and heat generated by a BBU main board is taken away in an accelerating mode. Of course, the first heat dissipation fins 32 and the second heat dissipation fins 33 may be disposed transversely or longitudinally, and are not particularly limited herein.

Claims

1. The immersed liquid cooling cabinet device is characterized by comprising a cabinet body (20), a cabinet cover (30) which is turned over relative to the cabinet body (20), a BBU main board assembly (10) and a circulating assembly (40) which are arranged in the cabinet body (20), wherein the cabinet body (20) is filled with cooling liquid;

the BBU main board assembly (10) comprises a plurality of BBU main board frames (1) which are arranged side by side, a plurality of BBU main board electronic components (2) which are fixed on the BBU main board frames (1) and heat dissipation parts (3) which are arranged on the BBU main board electronic components (2);

the circulation assembly (40) drives cooling liquid in the cabinet body (20) to circulate, so that the cooling liquid enters the BBU main board assembly (10) and passes through the heat dissipation piece (3), and heat generated by the BBU main board electronic element (2) is taken away.

2. The immersed liquid cooling cabinet device according to claim 1, wherein a liquid inlet (201) is formed in the top of the cabinet body (20), a first baffle (11) is arranged at the top of the BBU main board frame (1), a plurality of first through holes (111) are formed in the first baffle (11), and the liquid inlet (201) is communicated with the first through holes (111).

3. The immersed liquid cooling cabinet device according to claim 2, wherein the BBU main board assembly (10) comprises a second baffle (12) arranged at the bottom of the BBU main board frame (1), and a plurality of second through holes (121) are formed in the second baffle (12).

4. The immersed liquid cooling cabinet device according to claim 1, wherein a third baffle plate (13) is arranged on two side surfaces of the BBU main board frame (1), and a third through hole (131) is formed in the third baffle plate (13).

5. The immersed liquid cooling cabinet device according to claim 4, wherein a fourth baffle (14) is arranged on the outer side of the third baffle (13), a buffer chamber is formed by a gap between the third baffle (13) and the fourth baffle (14), and a fourth through hole (141) is arranged on the fourth baffle (14);

the aperture of the fourth through hole (141) is larger than the aperture of the third through hole (131).

6. The submerged liquid cooled cabinet arrangement according to claim 1, characterized in that the circulation assembly (40) is a paddle, the circulation assembly (40) being arranged below the BBU motherboard frame (1) such that cooling liquid enters the BBU motherboard assembly (10) frame from the bottom and both sides of the BBU motherboard frame (1);

or, the circulating assembly (40) is arranged below and at the side part of the BBU main board frame (1) so that cooling liquid enters the BBU main board assembly (10) frame from the bottom and two sides of the BBU main board frame (1).

7. The immersed liquid cooling cabinet device according to claim 1, wherein a fixing seat (4) is arranged on the BBU main board frame (1), an embedding groove (41) is formed in the fixing seat (4), and the BBU main board electronic component (2) is embedded in the embedding groove (41).

8. The immersed liquid cooling cabinet device according to claim 7, wherein a fixing rod (5) is further arranged on the fixing base (4), the fixing rod (5) is arranged around the BBU motherboard electronic component (2), a fixing hole (31) matched with the fixing rod (5) is formed in the heat dissipation piece (3), and the heat dissipation piece (3) is fixed on the fixing base (4) through the fixing hole (31) and covers the BBU motherboard electronic component (2).

9. The immersed liquid cooling cabinet device according to claim 8, wherein elastic fasteners are sleeved on the fixing rods (5), and the elastic fasteners are used for adjusting pressure on the BBU main board electronic element (2).

10. The submerged liquid cooling cabinet device according to claim 1, wherein the heat dissipation piece (3) is a cross-shaped heat dissipation fin, the heat dissipation fin comprises a first heat dissipation fin (32) arranged transversely and a second heat dissipation fin (33) arranged longitudinally, and the first heat dissipation fin (32) is fixedly connected with the second heat dissipation fin (33).