CN219285748U - Resonator, substrate loss angle testing device and system - Google Patents

Abstract

The application discloses a resonator, a substrate loss angle testing device and a substrate loss angle testing system, and belongs to the field of quantum chip manufacturing. The resonator includes a first body, a second body, a channel, and a signal port. Wherein the two bodies are detachably connected to jointly define an internally located and closed cavity. The channel is communicated with the cavity and is arranged on the first body and/or the second body; and the signal port is attached through the channel. The resonator can provide an electromagnetic environment that is less noisy and can thus be used for more accurate testing of substrates, thereby facilitating the fabrication of higher quality quantum chips.

Description

Resonator, substrate loss angle testing device and system

Technical Field

The application belongs to the field of quantum chip manufacturing, and particularly relates to a resonator, a substrate loss angle testing device and a system.

Background

In superconducting quantum chips, it is often necessary to couple with the qubit using a resonant cavity in order to perform a read operation on the qubit. The resonant cavity is generally of a one-dimensional coplanar waveguide resonant cavity structure. Since the performance of the quantum chip is associated with various lines (e.g., transmission lines, control lines), components (e.g., capacitors) therein. For example, the substrate of a quantum chip may affect the relaxation time of the quantum chip. The above components, when transmitting various corresponding signals, generate signal loss/signal power attenuation, and therefore, it is necessary to examine this. Resonators such as coplanar waveguide structures currently used in superconducting quantum chips are poorly performing in practical use and improvements are needed.

Disclosure of Invention

In view of this, the present application discloses a resonator, substrate loss angle testing apparatus and system that can be used for substrate testing of quantum chips. Which can provide a more tamper-resistant test environment, thereby helping to obtain a more accurate test structure.

The scheme exemplified by the application is implemented as follows.

In a first aspect, examples of the present application propose a resonator comprising:

a first body;

a second body configured to be removably coupled to the first body to cooperatively define an internally located and enclosed cavity;

a channel communicated with the cavity and arranged on the first body and/or the second body, and

a signal port attached through a channel.

The resonator in the example forms a closed cavity with the first body and the second body, and thus a space isolated from the environment outside the resonator can be provided in the cavity, so that interference can be reduced. The first body and the second body are detachably connected, so that an object to be tested can be conveniently placed in a test environment provided by the cavity. The channel allows the signal port to be connected thereto so that a test signal can be transmitted through the signal port during testing.

Briefly, a test input signal is transferred into a cavity formed by the first body and the second body via a signal port attached to the channel. Since the cavity is closed, the signal can act in a tamper-proof manner on the test object placed in the cavity, and a test output signal corresponding to the test result can also be obtained through the signal port.

According to some examples of the present application, the cavity is located in the first body or the second body; and/or the entire inner surface of the cavity is a polished smooth surface.

According to some examples of the present application, the first body is provided with a first slot and the second body is provided with a second slot, the first slot and the second slot together defining a cavity.

According to some examples of the present application, the resonator defines a reference plane between the contact surfaces of the first body and the second body; the reference plane is taken as a symmetrical plane, and the first groove and the second groove are symmetrically distributed.

According to some examples of the present application, the first body and/or the second body has a storage slot adjacent to or through to the cavity.

According to some examples of the present application, the storage slot is comprised of a first notch and a second notch, wherein the first notch and the second notch are arranged in a direction across the cavity.

According to some examples of the present application, the cavity defines a depth direction, a length direction, and a width direction, wherein the depth direction is perpendicular to the reference plane and defines a distribution of the first and second grooves, the length direction and the width direction being perpendicular to the depth direction, respectively;

the first body and/or the second body are/is provided with a storage groove which is close to or penetrates through the cavity, the storage groove is provided with a first notch and a second notch, and the first notch and the second notch are arranged across the cavity along the width direction;

the track of the storage groove is positioned on the symmetrical plane of the cavity along the width direction.

According to some examples of the present application, the number ports include an input port and an output port.

According to some examples of the present application, a signal port has a metal cylinder, and a dielectric layer surrounding the metal cylinder.

According to some examples of the present application, the dielectric layer is made of polytetrafluoroethylene.

In a second aspect, examples of the present application provide a substrate loss angle testing apparatus comprising: the resonator described above; and a substrate located within the cavity of the resonator.

According to some examples of the present application, when the resonator is configured with a pocket, the substrate is secured by the pocket and partially suspended from the cavity.

According to some examples of the present application, the substrate is a wafer.

In a third aspect, examples of the present application provide a substrate loss angle test system comprising: the resonator described above or the substrate loss angle testing device described above; and a signal device in data communication with the signal port of the resonator.

According to some examples of the present application, when the signal port includes an input port and an output port, the signal device includes an arbitrary waveform generator for inputting the measurement signal from the input port, and an oscilloscope for recording at least the feedback signal from the output port.

The beneficial effects are that:

compared with the prior art, the resonator is a resonant cavity with a three-dimensional structure. Which is able to provide a more tamper-resistant environment within the cavity provided, whereby, upon subsequent testing, the input signal of the test may be less disturbed and the output signal of the corresponding test is also less adversely affected by the disturbing signal. In this way, the true performance of the test object can be more accurately measured, and thus can facilitate the preparation of quantum devices based thereon that meet the expected performance.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.

Fig. 1 is a schematic structural diagram of the overall appearance of a resonator according to an embodiment of the present disclosure;

FIG. 2 is a schematic structural view of a first body in the resonator of FIG. 1;

FIG. 3 is a schematic diagram of a second body in the resonator of FIG. 1;

FIG. 4 is a schematic diagram of a communication port in the resonator of FIG. 1;

fig. 5 shows a schematic structural diagram of a substrate arrangement into the resonator of fig. 1.

Icon: a 100-resonator; 101-a first body; 102-a second body; 103-an input port; 104-an output port; 201-a first groove; 202-a second groove; 301-a first gap; 302-a second gap; 303-connecting holes; 304-connecting columns; 401-metal columns; 402-a dielectric layer; 403-a fixed plate; 500-substrate.

Detailed Description

With the continuous increase of the operating frequency, various components fabricated on various substrates may generate great loss, and even cause failure in normal operation. This may be due, for example, to the fact that a small amount of conductivity present in the substrate causes signal guided wave modes to couple into the substrate, thereby creating large losses. For example, a transmission line fabricated on the surface of a substrate, forms a non-uniform medium with the substrate and free space during the propagation of a signal, and when the frequency of the signal increases to some extent, the signal guided wave mode on the transmission line couples into the substrate, causing transmission line loss, i.e., signal power attenuation.

Similarly, in the fabrication of quantum chips, the stability and uniformity of service and performance of quantum chips is to a considerable extent wafer (or substrate) dependent. Which in turn is directly related to the loss tangent (dielectric loss magnitude) of the wafer. Therefore, it is necessary to detect the wafer loss tangent.

In view of this, in an example, referring to fig. 1 to 4 together, the inventors propose a resonator 100. In general, the resonator 100 is a three-dimensional cavity structure that provides a less disturbed cavity. Thus, when testing is desired, relatively more accurate results can be obtained by placing test objects (e.g., various nonmetallic materials) in the cavity and then performing the test.

The resonator 100 includes a first body 101, a second body 102, and a signal port.

Wherein the first body 101 and the second body 102 are detachably connected and together define an internal and closed cavity. For example by bolting; or by a latch. For example, the first body 101 has a connection post 304, and the second body 102 has a connection hole 303 that mates with the connection post 304. The first body 101 and the second body 102 may be provided with both the connection post 304 and the connection hole 303 as shown in fig. 3. The first and second bodies may be made of aluminum so as to be compatible with superconducting materials such as aluminum in the superconducting quantum chip.

Wherein the first body 101 and the second body 102 are detachably connected to take and place a test object (cavity placement test object). While resonator 100 also has a channel (provided in one or both of the first body 101, the second body 102) and it communicates with the cavity for the application of the signal under test. Further, a signal port is attached in the channel as a signal loading means.

The first body 101 and the second body 102 are made of various suitable metal materials, such as copper or aluminum. Generally, it is beneficial to use the same metallic material for both. In order to avoid the adverse effect of the surface oxide layer. The copper may alternatively be oxygen free copper TU1 and the aluminum may be 6061 aluminum, for example.

The cavity in the resonator 100 (the entire inner surface of the cavity being a polished smooth surface, which would be beneficial) may be provided separately to the first body 101 and in an open structure, while the corresponding second body 102 is used to removably close the cavity. For example, the first body 101 is provided with a desired open slot, and the second body 102 is engaged with the second body 102 as a cover-like structure. Similarly, the second body 102 is provided with the required open grooves, and the first body 101 is engaged with the first body 101 as a cover-like structure.

Alternatively, in other examples, the cavity is formed by the first body 101 and the second body 102 mated together. For example, the first body 101 therein is provided with a first slot 201 and the second body 102 therein is provided with a second slot 202, and the first slot 201 and the second slot 202 together define a cavity. I.e. when the first body 101 and the second body 102 are combined, the first groove 201 and the second groove 202 are combined to form a cavity.

The first groove 201 and the second groove 202 may have freely designed groove shapes, which are not particularly limited in the examples of the present application; similarly, the dimensions of the two can also be freely selected without particular limitation. For example, the first groove 201 and the second groove 202 are the same shape, but different in size.

In some examples, the first and second grooves 201 and 202 are each constructed as a rectangular parallelepiped type groove. Both having the same shape and size. For example, this can be described as: the resonator 100 defines a reference plane, which is located between the contact surfaces of the first body 101 and the second body 102. And thus, the first groove 201 and the second groove 202 are symmetrically divided with the reference plane as a symmetry plane. Thus, it can be understood that, as an example, the cross sections of the first groove 201 and the second groove 202 are the same rectangle in the direction parallel to the reference plane; meanwhile, in a direction perpendicular to the reference plane (which may be described as a depth direction), the depth of the first groove 201 and the depth of the second groove 202 are the same.

Since it is necessary to dispose a test object (such as the aforementioned wafer) in the cavity in order to perform a test, it is possible to selectively design a placement groove at a position adjacent to or penetrating through the cavity at one or both of the first body 101 and the second body 102.

The storage tank can be manufactured independently of the first body 101 and the second body 102. For example, the cavity is in the first body 101, and the storage slot is in the second body 102; alternatively, the cavity is in the second body 102 and the storage slot is in the first body 101.

In addition, from the edge profile of the cavity, the storage slot may have one contact position with it, or two contact positions, or more contact positions. For example, in some examples, for the case of having two contact locations, the storage slot may be formed by a first notch 301 and a second notch 302, as in fig. 2. And wherein the first and second indentations 301, 302 are arranged in a direction across the cavity. For example, in a plane parallel to the reference plane, the direction from one end to the other end of the cavity is a first direction, and the object placing grooves are distributed along a second direction; for example, the cavities and the storage slots are distributed vertically and horizontally.

For ease of description and understanding, the cavity may be defined with a depth direction, a length direction, and a width direction. That is, the cavity is formed to extend in three directions. Based on this, where the depth direction is perpendicular to the aforementioned reference plane, the distribution of the first grooves 201 and the second grooves 202 is in the depth direction. Accordingly, the length direction and the width direction are perpendicular to the depth direction, respectively. That is, the longitudinal direction, the width direction, and the depth direction are orthogonal to each other.

Based on this, one or both of the first body 101 and the second body 102 have a storage slot adjacent to or through to the cavity. The storage groove is provided with a first notch 301 and a second notch 302, and the first notch 301 and the second notch 302 are arranged across the cavity along the width direction. Further, the track of the storage groove may be a symmetry plane located in the width direction of the cavity. For example, the storage groove has a certain expansion dimension in the width direction of the cavity, and therefore, symmetrically extends to both sides in the width direction at the midpoint in the width direction of the cavity cross section.

Considering that the cavity is associated with the storage slot, similarly, the storage slot may be formed in both the first body 101 and the second body 102, or in either the first body 101 or the second body 102. When the storage tank is formed in both the first body 101 and the second body 102, for example, the storage tank may be considered to be two parts sectioned by the reference plane as a cross section.

Therefore, the wafer can provide two contact parts, and the two contact parts are respectively arranged at the two gaps of the object placing groove, so that the wafer spans the cavity. Or one end of the wafer is fixed in the storage groove, and the other end extends into the cavity and is suspended in the cavity.

On this basis, the resonator 100 is provided with a signal port for inputting and outputting a corresponding signal. And the signal port is fixed (replaced or removed if necessary) by a passage communicating with the cavity. The fixing can be gluing, clamping, such as interference fit, threaded connection, etc., or crimping.

For a particular connection, one end of the signal port is inserted into the channel, either near the cavity or extending into the cavity. The other end of the signal port is far away from the first body 101 and also far away from the second body 102. In some examples, the signal ports are arranged in a pose perpendicular to the surface of the body.

The signal port may be one and thus serve as both an input line and an output line; the test may be performed using the reflected signal in this example. Alternatively, the signal ports have two, and one of them is the input port 103 and the other is the output port 104. The specific number and arrangement positions of the signal ports may be configured according to actual needs in different examples, and are not particularly limited, but the number of the signal ports is limited to being capable of inputting signals into the cavity and outputting signals from the cavity to external devices. The loss tangent of the measurement object can be obtained by measuring data in a manner known in the art (typically, a loss network analyzer, HFSS simulation software, etc.) and will not be described in detail in this application.

The signal port may be provided with various suitable devices capable of transmitting microwave signals. For example, the signal port is mainly composed of two parts; one of which is a metal pillar 401 and the other of which is a dielectric layer 402. Dielectric layer 402 wraps around the outer surface of metal cylinder 401. Both can be considered substantially coaxial. Wherein the metal pillars 401 are, for example, copper; dielectric layer 402 may be polytetrafluoroethylene. Further, it is fixed to the first body 101 and the second body 102 for convenience. An elongated fixing plate 403 is disposed on the outer surface of the dielectric layer 402, and through holes are disposed at both ends of the fixing plate 403 to be fixed by bolts, for example, fig. 4.

Thus, the structure of the resonator 100 has been fully explained by the above. As an application example thereof, a substrate loss angle test apparatus may be proposed. The test apparatus includes a resonator 100 and a substrate (e.g., a wafer). And the substrate is located within the cavity of the resonator 100. Referring to fig. 5, in the case where the resonator 100 is configured with a placement groove, the substrate 500 is fixed by the placement groove and partially suspended in the cavity.

Further, the signaling means may be configured based on the generation of the test signal and the obtaining of the feedback signal. Thus, in an example, a substrate loss angle testing system may also be presented, comprising a resonator 100 or substrate loss angle testing means, and a signal means in data communication connection with a signal port of the resonator 100. As an alternative example, where the signal port comprises an input port 103 and an output port 104, the signal device comprises an arbitrary waveform generator for the incoming measurement signal from the input port 103, and an oscilloscope for at least recording the outgoing feedback signal from the output port 104. And, therefore, the arbitrary waveform generator is connected in signal communication with the input port 103; the oscilloscope is connected in signal communication with an output port 104.

The resonator 100 provided in the substrate loss angle testing apparatus and system has a similar structure to the resonator 100 in the above embodiment and has the same advantageous effects as described above, and thus will not be described in detail. For details not disclosed, those skilled in the art will understand with reference to the description of the superconducting structure above, and for the sake of economy, details are not repeated here.

The embodiments described above by referring to the drawings are exemplary only and are not to be construed as limiting the present application. For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application clear, the foregoing descriptions of the embodiments of the present application are described in detail with reference to the accompanying drawings. However, as will be appreciated by those of ordinary skill in the art, in the various embodiments of the present application, numerous technical details have been set forth in order to provide a better understanding of the present application. However, the technical solutions claimed in the present application can be implemented without these technical details and with various changes and modifications based on the following embodiments. The division of the examples is for convenience of description, and should not be construed as limiting the specific implementation manner of the present application, and the embodiments may be mutually combined and referred to without contradiction.

It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be implemented in sequences other than those illustrated or otherwise described herein.

Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

The foregoing detailed description of the construction, features and advantages of the present application will be presented in terms of embodiments illustrated in the drawings, wherein the foregoing description is merely illustrative of preferred embodiments of the application, and the scope of the application is not limited to the embodiments illustrated in the drawings.

Claims (15)

1. A resonator, comprising:

a first body;

a second body configured to be removably coupled to the first body to cooperatively define an internally located and enclosed cavity;

a channel communicated with the cavity and arranged on the first body and/or the second body, and

a signal port attached through the channel.

2. The resonator according to claim 1, characterized in that the cavity is located in the first body or in the second body;

and/or the entire inner surface of the cavity is a polished smooth surface.

3. The resonator of claim 1, wherein a first body is provided with a first slot and a second body is provided with a second slot, the first slot and the second slot together defining the cavity.

4. A resonator according to claim 3, characterized in that the resonator defines a reference plane between the contact surfaces of the first body and the second body;

and the reference surface is taken as a symmetrical plane, and the first groove and the second groove are symmetrically distributed.

5. The resonator according to any of claims 1-4, characterized in that the first body and/or the second body has a recess adjacent to or penetrating the cavity.

6. The resonator according to claim 5, wherein the pocket is formed by a first notch and a second notch, wherein the first notch and the second notch are arranged in a direction across the cavity.

7. The resonator of claim 4, wherein the cavity defines a depth direction, a length direction, and a width direction, wherein the depth direction is perpendicular to the reference plane and defines a distribution of the first and second grooves, the length direction and the width direction being perpendicular to the depth direction, respectively;

the first body and/or the second body are/is provided with a storage groove which is close to or penetrates through the cavity, the storage groove is provided with a first notch and a second notch, and the first notch and the second notch are arranged across the cavity along the width direction;

the track of the storage groove is positioned on the symmetrical plane of the cavity along the width direction.

8. The resonator of claim 1, wherein the signal port comprises an input port and an output port.

9. The resonator according to claim 1 or 8, characterized in that the signal port has a metal cylinder and a dielectric layer surrounding the metal cylinder.

10. The resonator according to claim 9, characterized in that the dielectric layer is made of polytetrafluoroethylene.

11. A substrate loss angle testing apparatus, comprising:

a resonator according to any of claims 1 to 10; and

a substrate is positioned within the cavity of the resonator.

12. The device of claim 11, wherein when the resonator is configured with a pocket, the substrate is secured by the pocket and partially suspended from the cavity.

13. The substrate loss angle testing apparatus of claim 11, wherein the substrate is a wafer.

14. A substrate loss angle test system, comprising:

a resonator according to any of claims 1 to 10, or a substrate loss angle testing apparatus according to any of claims 11 or 12 or 13; and

and a signal device in data communication with a signal port of the resonator.

15. The substrate loss angle test system of claim 14, wherein when the signal port includes an input port and an output port, the signal device includes an arbitrary waveform generator for inputting a measurement signal from the input port, and an oscilloscope for recording at least a feedback signal from the output port.

Images