CN219278150U

CN219278150U - Chip preservation device

Info

Publication number: CN219278150U
Application number: CN202223317833.XU
Authority: CN
Inventors: 请求不公布姓名; 张辉
Original assignee: Origin Quantum Computing Technology Co Ltd
Current assignee: Origin Quantum Computing Technology Co Ltd
Priority date: 2022-12-07
Filing date: 2022-12-07
Publication date: 2023-06-30
Anticipated expiration: 2032-12-07

Abstract

The application discloses a chip preservation device, which comprises a box body, wherein a cavity for accommodating a chip is formed in the box body; the clamping element is used for fixing the chip and is arranged in the cavity; the air inlet valve is used for being connected with an air source, the air inlet valve is communicated with the cavity, and the air source can input protective gas into the cavity through the air inlet valve; and the exhaust valve is used for being connected with the vacuumizing equipment. When the chip is required to be transported, the chip is arranged in the cavity, the chip is fixed by the clamping element so as to keep the chip stable, the air inlet valve is closed, the exhaust valve communicated with the vacuumizing equipment is arranged, the vacuumizing equipment is used for vacuumizing the cavity, and then the air source is used for conveying protective gas into the cavity through the air inlet valve, so that the content of water molecules and oxygen molecules in the cavity is greatly reduced, and the situation that electronic elements on the chip are damaged due to contact with water molecules and oxygen molecules in the air is avoided as much as possible.

Description

Chip preservation device

Technical Field

The application belongs to the technical field of chips, and particularly relates to a chip preservation device.

Background

Integrated circuits, or microcircuits, microchips, wafers/chips, are made up of a large number of transistors. Different chips have different integration scales, up to hundreds of millions; as small as tens, hundreds of transistors. The chip is distributed with tiny electronic elements, which are the most important parts in the electronic equipment, bear the functions of operation and storage, and are the core components of many electronic equipment.

In the prior art, when a chip is transported, electronic elements on the chip are exposed in the air, so that the electronic elements are extremely easy to damage, and the performance of the chip is greatly affected.

It should be noted that the information disclosed in the background section of the present application is only for enhancement of understanding of the general background of the present application and should not be taken as an admission or any form of suggestion that this information forms the prior art already known to a person skilled in the art.

Disclosure of Invention

The object of the present application is to provide a chip deposit device, which solves the drawbacks of the prior art, and which provides a chip deposit device capable of being filled with a protective gas.

One embodiment of the present application provides a chip deposit device including:

the box body is internally provided with a cavity for accommodating the chip;

the clamping element is used for fixing the chip and is arranged in the cavity;

the air inlet valve is used for being connected with an air source, the air inlet valve is communicated with the cavity, and the air source can input protective gas into the cavity through the air inlet valve;

and the exhaust valve is used for being connected with the vacuumizing equipment and is communicated with the cavity.

The chip deposit device as described above, wherein the shielding gas is nitrogen or an inert gas.

The chip deposit device as described above, wherein the inert gas is argon or neon.

A chip deposit device as described above, wherein the clamping member includes:

the clamping groove is used for accommodating the chip and is arranged in the cavity;

and the pressing piece is used for being abutted with the chip and matched with the clamping groove so that the chip is kept fixed.

The chip preservation device is characterized in that the pressing piece adopts an elastic pressing strip, and the elastic pressing strip is abutted with the edge of the chip.

The chip preservation device comprises the box body, wherein the box body comprises the separable box cover and the box body, the clamping groove is formed in the box body, and the elastic pressing strip is arranged on one surface of the box cover, which faces the box body.

The chip preservation device is characterized in that the box cover is in sealing connection with the box body, and a sealing ring is arranged at the joint of the box cover and the box body.

The chip preservation device is characterized in that a pressure gauge is arranged on one surface of the box cover, which is away from the box body, and the pressure gauge is communicated with the cavity to monitor the pressure in the cavity.

The chip preservation device is characterized in that the box cover is connected with the box body through the movable buckle.

Compared with the prior art, the application provides a chip preservation device, which comprises a box body, wherein a cavity for accommodating a chip is formed in the box body; the clamping element is used for fixing the chip and is arranged in the cavity; the air inlet valve is used for being connected with an air source, the air inlet valve is communicated with the cavity, and the air source can input protective gas into the cavity through the air inlet valve; and the exhaust valve is used for being connected with the vacuumizing equipment and is communicated with the cavity. In this application, when the chip is transported to needs, settle the chip in the cavity, close the admission valve, open the discharge valve again, start evacuating equipment, utilize evacuating equipment to take out the vacuum in with the cavity, then close the discharge valve, open the admission valve, utilize the air supply to pass through the admission valve and carry the shielding gas in to the cavity, thereby utilize the air in the shielding gas replacement cavity, thereby greatly reduced the content of water molecule, oxygen molecule in the cavity, thereby at the in-process of transporting the chip, electronic component on the chip has been avoided as far as possible and the water molecule in the air, the circumstances that the oxygen molecule contacted and damaged, and, in the in-process of utilizing the air in the shielding gas replacement cavity, utilize the fixed chip of clamping element in order to make the chip keep stable, thereby avoid the air current to strike and lead to the chip to rock impaired in the cavity.

Drawings

FIG. 1 is a perspective view of a chip deposit device provided herein;

FIG. 2 is a front view of the chip deposit device provided in the present application;

FIG. 3 is a cross-sectional view of the chip deposit device provided herein;

fig. 4 is a top view of the chip deposit device provided in the present application.

Reference numerals illustrate:

1-box body, 2-air inlet valve, 3-air outlet valve, 4-clamping element, 5-pressure gauge and 6-movable buckle;

11-box body, 12-box cover, 41-clamping groove and 42-elastic pressing bar.

Detailed Description

The embodiments described below by referring to the drawings are exemplary only for the purpose of illustrating the present application and are not to be construed as limiting the present application.

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the embodiments of the present application will be described in detail below with reference to the accompanying drawings. However, as will be appreciated by those of ordinary skill in the art, in the various embodiments of the present application, numerous technical details have been set forth in order to provide a better understanding of the present application. However, the technical solutions claimed in the present application can be implemented without these technical details and with various changes and modifications based on the following embodiments. The following embodiments are divided for convenience of description, and should not be construed as limiting the specific implementation of the present application, and the embodiments may be mutually combined and referred to without contradiction.

In addition, it will be understood that when a layer (or film), region, pattern, or structure is referred to as being "on" a substrate, layer (or film), region, and/or pattern, it can be directly on another layer or substrate, and/or intervening layers may also be present. In addition, it will be understood that when a layer is referred to as being "under" another layer, it can be directly under the other layer and/or one or more intervening layers may also be present. In addition, references to "upper" and "lower" on the respective layers may be made based on the drawings.

Integrated circuits, or microcircuits, microchips, wafers/chips, are made up of a large number of transistors. Different chips have different integration scales, up to hundreds of millions; as small as tens, hundreds of transistors. The chip is distributed with tiny electronic elements, which are the most important parts in the electronic equipment, bear the functions of operation and storage, and are the core components of many electronic equipment. In the prior art, when a chip is transported, electronic elements on the chip are exposed in the air, so that the electronic elements are extremely easy to damage, the performance of the chip is greatly influenced, and the electronic elements on the chip are exposed in the air for a long time in the transportation process, are contacted with substances such as oxygen, water molecules and the like in the air, so that the electronic elements are extremely easy to be irreversibly damaged, and the performance of the chip is greatly influenced.

FIG. 1 is a perspective view of a chip deposit device provided herein;

fig. 2 is a front view of the chip deposit device provided in the present application.

Referring to fig. 1 and fig. 2, a chip preservation device provided in an embodiment of the present application includes:

a box body 1, wherein a cavity for accommodating a chip is formed in the box body 1;

the clamping element 4 is used for fixing the chip, the clamping element 4 is arranged in the cavity, the chip can be clamped and fixed by the clamping element 4, so that the chip is kept stable, the chip is prevented from being damaged due to shaking in the cavity in the chip transferring process, and the purpose of protecting the chip is achieved;

the air inlet valve 2 is used for being connected with an air source, the air inlet valve 2 is communicated with the cavity, the air source can input protective gas into the cavity through the air inlet valve 2, when the protective gas is required to be input into the cavity, the air outlet of the air source is connected with the air inlet valve 2, so that the air inlet valve 2 is kept in an open state, the protective gas can be continuously conveyed into the cavity, the cavity is filled with the protective gas, the chip is in the atmosphere of the protective gas, the protective gas adopts gas which does not react with electronic elements on the chip, and therefore the electronic elements are prevented from being damaged.

The exhaust valve 3 is used for being connected with the vacuumizing equipment, the exhaust valve 3 is communicated with the cavity, before the protective gas is input into the cavity, the vacuumizing equipment is used for vacuumizing the cavity, and the air in the cavity is pumped out as much as possible, so that the content of water molecules and oxygen molecules in the cavity is reduced.

In this embodiment, when a chip needs to be transported, the chip is placed in the cavity, the air inlet valve 2 is in a closed state, the vacuumizing device is communicated with the air outlet valve 3, the air outlet valve 3 is opened, and the vacuumizing device is started, so that the vacuumizing device is used for vacuumizing the cavity, then the air outlet valve 3 is closed, and then a gas source is used for conveying protective gas into the cavity through the air inlet valve 2, so that the air in the cavity is replaced by the protective gas, and the content of water molecules and oxygen molecules in the cavity is greatly reduced.

Fig. 3 is a cross-sectional view of the chip deposit device provided in the present application.

As shown in connection with fig. 3, in some embodiments of the present application, the clamping element 4 comprises:

the clamping grooves 41 are used for placing the chips, the clamping grooves 41 are arranged in the cavity, and illustratively, the clamping grooves 41 are formed on the side walls of the cavity, a plurality of groups of clamping grooves 41 are symmetrically arranged on the two opposite side walls in the cavity, and the chips can be embedded into the clamping grooves 41, so that the clamping grooves 41 are used for limiting, and the chips are kept stable in the cavity;

the pressing piece is used for being abutted to the chip, the pressing piece is matched with the clamping groove 41 so that the chip is kept fixed, the pressing piece is used for pressing the chip, certain pressure is applied to the chip, so that the bonding degree of the chip and the clamping groove 41 is higher, the chip is placed more firmly, the stability of the chip is further improved, the pressing piece is an elastic pressing strip 42, the elastic pressing strip 42 is abutted to the edge of the chip, the chip is pressed by the elastic pressing strip 42, and the chip is placed in the clamping groove 41 more firmly under the pressing of the elastic pressing strip 42.

In this embodiment, through setting up in draw-in groove 41 matched with pressure piece, utilize pressure piece to oppress the chip, make the chip place more firm to further improve the stability of chip, in the in-process of evacuating the cavity and inputting shielding gas, make the chip can resist the impact of air current, avoid the chip to rock and harm in the cavity under the impact of air current.

In some embodiments of the present application, the case body 1 includes a separable case cover 12 and a case body 11, the clamping groove 41 is disposed in the case body 11, the elastic bead 42 is disposed in the case cover 12 and is toward one side of the case body 11, the elastic bead 42 corresponds to the position of the clamping groove 41, in implementation, the clamping groove 41 is formed in an inner wall of the case body 11, the clamping groove 41 is integrally formed with the case body 11, the clamping groove 41 is vertically downward in a direction to facilitate insertion and removal of the chip, the elastic bead 42 is disposed in one side of the case cover 12 toward the case body 11, after the chip is disposed in the clamping groove 41, the case cover 12 is closed, the elastic bead 42 is just abutted to the edge of the chip, the chip is pressed by the elastic bead 42, so that the chip is kept stable, in implementation, when the case cover 12 is in a closed state, the opening of the elastic bead 42 contacts with the edge of the chip, the opening of the elastic bead 42 is embedded in the opening of the chip, the elastic bead 42 is forced to firmly deform in the clamping groove 41, and the chip is firmly deformed by the elastic bead 42.

It should be noted that, when the cover 12 is detachably connected to the case body 11, the cover 12 may be fixed to the case body 11 in different manners, including but not limited to: the box cover 12 and the box body 11 pass through the box cover 12 and are fixed on the box body 11 through the screw, in order to realize such fixing, can be in the box cover 12 with correspond on the box body 11 and set up the screw hole that is used for fixing, in addition to this, the box cover 12 with the box body 11 can also realize dismantling the connection through movable buckle 6, utilizes movable buckle 6 can realize the box cover 12 with the quick installation and the dismantlement of box body 11 to be convenient for get fast and put the chip.

In some embodiments of the present application, the lid 12 is in sealing connection with the box body 11, a sealing ring is disposed at a connection position between the lid 12 and the box body 11, and illustratively, in a specific manner, a sealing groove is processed at the top of the box body 11, and the sealing ring is installed in the sealing groove, and when the lid 12 is buckled with the box body 11, a gap between the lid 12 and the box body 11 is filled with the sealing ring, so that good tightness is maintained between the lid 12 and the box body 11.

In this embodiment, the sealing ring is used to keep a good sealing state between the box cover 12 and the box body 11, so as to ensure good sealing performance of the cavity, avoid air in the external environment from entering the cavity as much as possible, and avoid leakage of protective gas in the cavity as much as possible, and the sealing ring is used to block the cavity from generating gas exchange with the external environment, so as to avoid water molecules and oxygen molecules in the air from entering the cavity and damaging the chip.

Referring to fig. 4, in some embodiments of the present application, the lid 12 is away from one side of the box body 11 and is provided with the pressure gauge 5, where the pressure gauge 5 is communicated with the cavity to monitor the pressure in the cavity, and when the protective gas is input into the cavity by using the air source, the pressure in the cavity is monitored in real time by using the pressure gauge 5, and when the pressure in the cavity is greater than the external atmospheric pressure, the air source is closed, so that the air pressure in the cavity is at the positive pressure, thereby avoiding that the water molecules and oxygen molecules in the external air enter the cavity, avoiding the damage caused by the contact of the electronic elements on the chip with the water molecules and the oxygen molecules in the air to the maximum extent, and further prolonging the shelf life of the chip.

The foregoing detailed description of the construction, features and advantages of the present application will be presented in terms of embodiments illustrated in the drawings, wherein the foregoing description is merely illustrative of preferred embodiments of the application, and the scope of the application is not limited to the embodiments illustrated in the drawings.

Claims

1. A chip deposit device, comprising:

the chip packaging box comprises a box body (1), wherein a cavity for accommodating a chip is formed in the box body (1);

-a clamping element (4) for fixing the chip, the clamping element (4) being arranged in the cavity;

an inlet valve (2) for connection to a gas source, the inlet valve (2) being in communication with the cavity, the gas source being capable of inputting a shielding gas into the cavity through the inlet valve (2);

and the exhaust valve (3) is used for being connected with the vacuumizing equipment, and the exhaust valve (3) is communicated with the cavity.

2. The chip deposit device according to claim 1, characterized in that the shielding gas is nitrogen or inert gas.

3. The chip deposit device according to claim 2, characterized in that the inert gas is argon or neon.

4. A chip deposit device according to any of claims 1 to 3, characterized in that said gripping element (4) comprises:

a card slot (41) for placing the chip, the card slot (41) being arranged in the cavity;

and the pressing piece is used for being abutted with the chip and matched with the clamping groove (41) so that the chip is kept fixed.

5. The chip deposit device according to claim 4, characterized in that the pressing member adopts an elastic pressing bar (42), and the elastic pressing bar (42) is abutted against the edge of the chip.

6. The chip preservation apparatus according to claim 5, wherein the case body (1) comprises a separable case cover (12) and a case body (11), the clamping groove (41) is provided in the case body (11), and the elastic pressing bar (42) is provided on a surface of the case cover (12) facing the case body (11).

7. Chip preservation apparatus according to claim 6, characterized in that the cover (12) is in sealing connection with the case body (11), and a sealing ring is provided at the connection between the cover (12) and the case body (11).

8. Chip deposit device according to claim 7, characterized in that a pressure gauge (5) is mounted on a side of the cover (12) facing away from the box body (11), the pressure gauge (5) being in communication with the cavity for monitoring the pressure in the cavity.

9. Chip preservation apparatus according to claim 7, characterized in that the lid (12) is connected to the box body (11) by means of a movable catch (6).