CN219267607U

CN219267607U - Chip dotting device

Info

Publication number: CN219267607U
Application number: CN202223610940.1U
Authority: CN
Inventors: 曾凡贵
Original assignee: Silicon Electric Semiconductor Equipment Shenzhen Co ltd
Current assignee: Silicon Electric Semiconductor Equipment Shenzhen Co ltd
Priority date: 2022-12-30
Filing date: 2022-12-30
Publication date: 2023-06-27
Anticipated expiration: 2032-12-30

Abstract

The utility model provides a chip dotting device which comprises a workbench, a rotating assembly and a nozzle assembly, wherein the rotating assembly is rotatably arranged on the workbench; the nozzle assembly is movably arranged above the rotating assembly, and the rotating shaft of the rotating assembly is positioned on the moving path of the nozzle assembly; the nozzle assembly moves to spot the chip on the rotating assembly. According to the technical scheme, the rotating assembly drives the chip to rotate, the nozzle assembly moves along one direction, and the nozzle assembly can realize dotting treatment on the whole surface of the chip by adjusting the rotating angle of the rotating assembly. The position of the chip is not required to be moved, the occupied operation space is reduced, and the space utilization rate is improved.

Description

Chip dotting device

Technical Field

The utility model relates to the technical field of packaging chips, in particular to a chip dotting device.

Background

With the development of the semiconductor industry, the requirement on the automation integration degree of a machine is higher and higher, and the requirement on the space utilization rate is higher and higher.

In the prior art, when a chip is dotted by equipment such as a probe, a manufacturer independently moves through two mutually perpendicular shafts, and a workpiece to be dotted completes the movement of one surface and the dotting; in practice, the occupied space of the structure is more than 3-4 times of the surface area of the workpiece to be dotted, and the space utilization rate is not high.

Disclosure of Invention

The utility model mainly aims to provide a chip dotting device, which aims to solve the technical problems of large operation space occupied by equipment and low space utilization rate in the prior art when a chip is dotted.

In order to achieve the above object, the present utility model provides a chip dotting device, including:

a work table;

the rotating assembly is rotatably arranged on the workbench;

the nozzle assembly is movably arranged above the rotating assembly, and the rotating shaft of the rotating assembly is positioned on the moving path of the nozzle assembly;

the nozzle assembly moves to spot the chip on the rotating assembly.

Optionally, the chip dotting device further includes:

the controller is electrically connected with the rotating assembly and the nozzle assembly respectively;

the controller is used for controlling the nozzle assembly to move back and forth once, and the rotating assembly rotates once by a preset angle until the rotating assembly rotates once.

Optionally, the rotating assembly includes:

the rotary driving piece is arranged on the workbench;

the rotary table is arranged on the rotary driving piece, and the rotary driving piece drives the rotary table to rotate.

Optionally, the rotary drive is an encoder motor.

Optionally, the rotating assembly further comprises:

the sucking disc assembly is arranged on the rotating assembly and is used for sucking the chip;

and the rotation assembly drives the sucking disc assembly and the chip to synchronously rotate when rotating.

Optionally, the suction cup assembly includes:

the slide glass sucker is provided with a plurality of adsorption holes;

and the vacuum generators are respectively communicated with the adsorption holes.

Optionally, the slide chuck is provided with a limit ring, and the adsorption holes are uniformly distributed in the limit ring.

Optionally, the nozzle assembly comprises:

the linear driving piece is arranged on one side of the rotating assembly;

the ink jet nozzle is arranged on the linear driving piece, and the rotating shaft of the rotating assembly is positioned on the moving path of the nozzle of the ink jet nozzle.

Optionally, the linear driving member is a linear module.

Optionally, the ink jet nozzle is rotatably connected to the linear driving member.

According to the technical scheme, the rotating assembly drives the chip to rotate, the nozzle assembly moves along one direction, and the nozzle assembly can realize dotting treatment on the whole surface of the chip by adjusting the rotating angle of the rotating assembly. The position of the chip is not required to be moved, the occupied operation space is reduced, and the space utilization rate is improved.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a chip dotting device of the present utility model.

Reference numerals illustrate:

reference numerals	Name of the name	Reference numerals	Name of the name
				10	Working table	20	Rotating assembly
21	Rotary driving piece	22	Rotary table
				31	Slide chuck	40	Nozzle assembly
41	Ink jet nozzle	42	Linear driving member

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.

Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In addition, the technical solutions of the embodiments of the present utility model may be combined with each other, but it is necessary to be based on the fact that those skilled in the art can implement the technical solutions, and when the technical solutions are contradictory or cannot be implemented, the combination of the technical solutions should be considered as not existing, and not falling within the scope of protection claimed by the present utility model.

The utility model provides a chip dotting device, please refer to fig. 1, the chip dotting device comprises a workbench 10, a rotating assembly 20 and a nozzle assembly 40, wherein the rotating assembly 20 is rotatably arranged on the workbench 10; the nozzle assembly 40 is movably arranged above the rotating assembly 20, and the rotating shaft of the rotating assembly 20 is positioned on the moving path of the nozzle assembly 40; the nozzle assembly 40 moves to spot the chip on the rotating assembly 20.

The table 10 serves to support the rotating assembly 20 and the nozzle assembly 40. The workbench 10 is provided with a base and a bracket, the rotating assembly 20 is arranged on the base, the bracket is provided with a certain height, and the nozzle assembly 40 is arranged on the bracket, so that the nozzle assembly 40 can be positioned above the rotating assembly 20. The shoe is intended to be placed on an external structure, such as a table top or the like.

When dotting processing is carried out, the center of the chip is aligned to the rotating shaft of the rotating assembly 20, so that the chip rotates along the center of the chip when the rotating assembly 20 drives the chip to rotate. The center of the chip is aligned to the rotating shaft of the rotating assembly 20 by taking the chip as a circular distance, so that the chip is driven to rotate along the center of the circle.

The moving direction of the nozzle assembly 40 is perpendicular to the rotation axis of the rotating assembly 20. I.e., the nozzle assembly 40 performs a dotting process on the diameter or radius of the chip. The angle of the chip is adjusted by the rotating assembly 20, so that dotting treatment is performed on different positions on the chip.

It should be noted that, the chip may also be rectangular, square, etc. and the dotting processing mode is the same as the round.

In order to further increase the automation degree of the chip dotting device according to the present utility model, a controller may be further provided, and the controller may be electrically connected to the rotating assembly 20 and the nozzle assembly 40, respectively.

Under the action of the controller, the rotation angle of the rotation assembly 20 and the moving distance of the nozzle assembly 40 are automatically controlled, so that the chip can be dotted at a desired position.

In this embodiment, the dotting process is described as an example on the entire surface of the chip. The controller controls the nozzle assembly 40 to reciprocate once, and ink jet dotting is performed at intervals during the reciprocation. The dotting of one diameter on the chip is completed by one round trip movement. After the nozzle assembly 40 moves back and forth once, the rotating assembly 20 is controlled to rotate by the preset angle, the preset angle can be 1-10 degrees different or larger, and the nozzle assembly 40 moves back and forth once again, so that dotting treatment on the other diameter is completed. Similarly, after the rotation assembly 20 drives the chip to rotate for one circle, the dotting process is completed on the whole surface of the chip.

To further improve the dotting efficiency, in this embodiment, the nozzle assembly 40 may be controlled to move only once in one direction, and the rotating assembly 20 may be correspondingly rotated once. So that the nozzle assembly 40 can spot two diameters in one round trip movement cycle.

According to the technical scheme of the utility model, the rotating assembly 20 drives the chip to rotate, the nozzle assembly 40 moves along one direction, and the nozzle assembly 40 can realize dotting treatment on the whole surface of the chip by adjusting the rotating angle of the rotating assembly 20. The position of the chip is not required to be moved, the occupied operation space is reduced, and the space utilization rate is improved.

Specifically, the rotating assembly 20 includes a rotation driving member 21 and a rotary table 22, and the rotation driving member 21 is disposed on the workbench 10; the rotary table 22 is provided on the rotary driving member 21, and the rotary driving member 21 drives the rotary table 22 to rotate.

The top surface of the turntable 22 is planar for placement of chip structures.

In order to ensure that the center of the chip can be accurately aligned with the rotating shaft of the rotary driving piece 21, the rotary table 22 adopts a circular structure, and the rotating shaft of the rotary driving piece 21 is overlapped with the center of the rotary table 22, so that the center of the chip is only required to be ensured to be aligned with the center of the rotary table 22, and the convenience in operation is improved.

The rotary driving piece 21 can adopt an encoder motor, so that the rotation angle can be accurately controlled, and the dotting accuracy of the chip dotting device is ensured.

Further, the rotating assembly 20 further includes a suction cup assembly, which is disposed on the rotating assembly 20, and is used for sucking the chip; the rotation assembly 20 rotates to drive the sucking disc assembly and the chip to synchronously rotate.

The suction cup assembly is mounted on the rotary table 22 and rotates as the rotary table 22 rotates.

The chip may be placed directly on the chuck assembly. The sucking disc subassembly produces vacuum and thereby adsorbs the chip, avoids appearing the skew at the position of dotting in-process chip. Further ensuring the accuracy and stability of the chip dotting device.

Specifically, the suction cup assembly comprises a slide suction cup 31 and a vacuum generator, wherein the slide suction cup 31 is provided with a plurality of suction holes; the vacuum generator is respectively communicated with the plurality of adsorption holes.

At least one of the adsorption holes is connected with a vacuum generator through a pipeline, and when the chip is placed, the vacuum generator is started, vacuum is generated on the adsorption holes, so that suction force is formed to tightly adsorb the chip on the slide chuck 31.

The surface of the slide chuck 31 is flat, so that the chip is prevented from tilting in the dotting process, and the dotting accuracy is affected.

Further, the slide chuck 31 is provided with a limit ring, and a plurality of adsorption holes are uniformly distributed in the limit ring.

The slide chuck 31 has a raised reloading feature thereon to form the stop collar. The size of the limit ring can be adjusted according to the size and the shape of the chip, so that the limit ring has the effect of limiting and fixing the chip.

The operation convenience of operators is also facilitated, and the chip is placed in the limit ring when dotting is performed.

Specifically, the nozzle assembly 40 includes a linear driving member 42 and an ink jet nozzle 41, wherein the linear driving member 42 is disposed at one side of the rotating assembly 20; the ink jet nozzle 41 is disposed on the linear driving member 42, and the rotation shaft of the rotation assembly 20 is located on the movement path of the nozzle of the ink jet nozzle 41.

The linear driving member 42 may be a linear module. The ink jet 41 is mounted on a sliding seat of the linear module, so that the movement of the ink jet 41 is realized.

The ink jet nozzle 41 is communicated with an external ink supply mechanism through a pipeline, so that ink jet dotting on the chip is realized.

In this embodiment, the nozzle 41 moves along with the linear driving member 42, and the nozzle of the nozzle 41 passes through the rotation shaft of the rotation assembly 20. That is, the ink jet nozzle 41 moves along the diameter of the chip, thereby jetting ink onto the chip, and achieving a dotting effect.

Further, the ink jet nozzle 41 is rotatably connected to the linear driving member 42. In this embodiment, different ink jetting effects, such as dot size, can be achieved by rotating the direction of the ink jetting nozzle 41, that is, jumping the frame to jet ink.

The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims

1. A chip dotting device, characterized in that the chip dotting device comprises:

a work table;

the rotating assembly is rotatably arranged on the workbench;

the nozzle assembly moves to spot the chip on the rotating assembly.

2. The chip dotting device of claim 1, wherein said chip dotting device further comprises:

3. The chip dotting device of claim 1, wherein said rotating assembly comprises:

the rotary driving piece is arranged on the workbench;

4. A chip dotting device as claimed in claim 3, wherein said rotary drive member is an encoder motor.

5. The chip dotting device of claim 1, wherein said rotating assembly further comprises:

6. The chip dotting device of claim 5, wherein said chuck assembly comprises:

the slide glass sucker is provided with a plurality of adsorption holes;

7. The chip dotting device of claim 6, wherein the slide chuck is provided with a stop collar, and a plurality of the adsorption holes are uniformly distributed in the stop collar.

8. The chip dotting device of claim 1, wherein said nozzle assembly comprises:

the linear driving piece is arranged on one side of the rotating assembly;

9. The chip dotting device of claim 8, wherein the linear driving member is a linear die set.

10. The chip dotting device of claim 8, wherein said ink jet nozzle is rotatably coupled to said linear actuator.