CN219248230U

CN219248230U - Edge calculation collector based on internet of things middle stage

Info

Publication number: CN219248230U
Application number: CN202222363130.4U
Authority: CN
Inventors: 刘朋; 穆盛名; 朱嘉政
Original assignee: Harbin Industrial University Micro Intelligence Technology Co ltd
Current assignee: Harbin Industrial University Micro Intelligence Technology Co ltd
Priority date: 2022-09-08
Filing date: 2022-09-08
Publication date: 2023-06-23
Anticipated expiration: 2032-09-08

Abstract

The utility model relates to the technical field of internet of things computing collectors and discloses an edge computing collector based on an internet of things center, which comprises a shell, wherein a sealing cover is fixedly arranged at the upper end of the shell, a fixing frame is fixedly arranged at the middle position of the sealing cover, a processing main board is fixedly arranged at the lower end of the inner part of the shell, a cold end insulating ceramic chip is fixedly arranged at the inner side of the fixing frame close to the processing main board, and a hot end insulating ceramic chip is fixedly arranged at one side, far away from the cold end insulating ceramic chip, of the inner side of the fixing frame. According to the utility model, the edge calculation collector based on the Internet of things platform has the advantages of high-efficiency heat dissipation under the sealing condition of the internal main board through the semiconductor heat dissipation structure, and the auxiliary structure is arranged, so that the internal part of the device can automatically circulate air, the heat dissipation efficiency is greatly improved, the data jack has good dustproof measure design, and the overall design practicability is good, so that the device is worthy of popularization.

Description

Edge calculation collector based on internet of things middle stage

Technical Field

The utility model relates to the technical field of internet of things computing collectors, in particular to an edge computing collector based on an internet of things center.

Background

Currently, the internet of things device collects data from its surrounding environment and transmits the data to a cloud-based platform, the platform can provide various functions including data viewing, data learning and data processing, the use of the cloud to perform data processing is generally referred to as "cloud computing", which essentially means that the data processing is remotely completed by the internet of things device responsible for collecting data, however, the edge computing is a part of the internet of things device itself responsible for part or all of the data processing, when performing the edge computing, an edge computing internet of things acquisition controller needs to be introduced to complete the acquisition and processing of the edge data, while the existing edge computing controller is connected with the internet of things device through an interface thereon, which generally exposes them to the outside, so that dust is liable to fall into, the protection performance of the controller itself and the interface thereon is low, and the heat dissipation part of the edge computing controller is fixedly connected to the housing, which is inconvenient to detach, is liable to accumulate dust, which is inconvenient to clean dust, and affects the heat dissipation performance of the controller, thereby affecting the operation performance of the controller.

Disclosure of Invention

The utility model aims to solve the defects in the prior art, and provides an edge calculation collector based on an internet of things middle table.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the utility model provides an edge calculation collector based on thing networking center, includes the casing, the upper end of casing is fixed and is provided with sealed lid, sealed intermediate position fixed be provided with the fixed frame of lid, the inside of casing is close to the fixed processing mainboard that is provided with of lower extreme, the inside of fixed frame is close to the fixed cold junction insulating porcelain piece that is provided with of processing mainboard, the inside of fixed frame is kept away from one side of cold junction insulating porcelain piece and is fixed and be provided with hot junction insulating porcelain piece, the fixed one end of keeping away from the casing of fixed frame is fixed and is provided with first heat-conducting plate, the fixed shell that is provided with in one end of keeping away from the casing of first heat-conducting plate and the fixed position equidistance that is located the fixed shell is provided with a plurality of first fin, sealed lid is close to one end of casing and the fixed second mount that is located one side of being provided with of position, the frame body internal fixed be provided with the fan of second mount, the front end intermediate position equidistance of casing has been seted up a plurality of square slots, a plurality of square slots in the inslot middle position down in the middle of square slot all is fixed in proper order and has USB jack, net twine and USB jack and net wire and wire, the fixed position all are connected with USB square slot and USB slot all by the fixed slot, all the USB slot is fixed and the position is connected with USB slot all along with USB slot and USB slot;

through above-mentioned technical scheme, the device of this design is through the semiconductor heat radiation structure that sets up when in actual use for the device possesses under the inside mainboard sealed condition, carries out high-efficient radiating advantage, and the auxiliary structure of setting up simultaneously makes the inside of device can be by oneself air cycle, promotes radiating efficiency greatly, and possesses good dustproof measure design to the data socket, and the overall design practicality is good, is worth promoting.

Further, anti-skid patterns are fixedly arranged at the middle positions of the front ends of the plurality of fixing plates close to the lower part;

through the technical scheme, the anti-skid patterns are arranged to facilitate sliding adjustment of the position of the fixing plate.

Further, a plurality of first fixing frames are fixedly arranged at the front end of the fixing shell at equal intervals, and cooling fans are fixedly arranged in the frame bodies of the plurality of first fixing frames;

through the technical scheme, the first fixing frame is convenient for installing the cooling fan, and the cooling fan is convenient for radiating the plurality of first cooling fins.

Further, a second heat conducting plate is fixedly arranged at one end, far away from the fixed shell, of the fixed frame, and a plurality of second radiating fins are fixedly arranged at one end, far away from the fixed shell, of the second heat conducting plate at equal intervals;

through above-mentioned technical scheme, the second heat-conducting plate and the second fin of setting make things convenient for the cold junction insulating ceramic piece to carry out quick heat dissipation operation to the casing inside.

Further, L-shaped assembling frames are fixedly arranged at the side edges of the two sides of the shell;

through above-mentioned technical scheme, the L type assembly jig that sets up is convenient to install the device wholly.

Further, supporting blocks are fixedly arranged at four corners of the inner bottom end of the shell, and the processing main board is fixedly arranged on the plurality of supporting blocks;

through above-mentioned technical scheme, the supporting shoe that sets up conveniently handles the mainboard and installs fixedly.

Further, a plurality of pairs of metal conductors are fixedly arranged at equal intervals on one end of the cold end insulating ceramic chip far away from the processing main board and one end of the hot end insulating ceramic chip close to the processing main board;

through the technical scheme, the plurality of arranged metal conductors form a base frame of the semiconductor heat dissipation structure.

Further, the N-type semiconductor and the P-type semiconductor are electrically connected in series between the plurality of pairs of metal conductors in sequence;

through the technical scheme, after the current is conducted, the metal conductors on one side absorb heat, and the metal conductors on the other side release heat through the design of the structure.

The utility model has the following beneficial effects:

1. according to the utility model, the semiconductor heat dissipation structure of the device is formed by the fixed frame, the cold end insulating ceramic chip, the hot end insulating ceramic chip, the metal conductor, the N-type semiconductor and the P-type semiconductor, in the structure, the device can continuously generate heat during calculation, analysis and processing along with use, compared with the traditional air-cooled passive heat dissipation, the semiconductor heat dissipation structure has the advantages of quick cooling, high heat dissipation efficiency and capability of guaranteeing the sealing and dust prevention of the interior of the device, the heat dissipation efficiency of the device is greatly improved by the integral structural design, and the service life of the device is prolonged by phase change.

2. According to the utility model, the second fixing frame, the exhaust fan, the second heat-conducting plate, the second radiating fins, the square grooves and the fixing plates are arranged to form an auxiliary structure of the device, in the structure, the second fixing frame and the exhaust fan are arranged to drive air containing a large amount of heat in the shell to circularly flow, and the heat is quickly transferred to the second radiating fins, so that the cold-end insulating ceramic chip conveniently passes through the second heat-conducting plate to absorb the heat in the shell more efficiently, the heat dissipation efficiency of the device is improved, and meanwhile, the fixing plates arranged on the square grooves in a sliding manner can slide down to cover the sockets when the sockets are not used, so that the dustproof protection effect on the sockets is achieved, the practicability is good, and the device is worth popularizing.

Drawings

Fig. 1 is a front view of an edge computing collector based on a center station of the internet of things;

FIG. 2 is a side cross-sectional view of an edge computing collector based on a center station of the Internet of things;

FIG. 3 is an enlarged schematic view of FIG. 2 at A;

fig. 4 is a schematic diagram of a semiconductor based on an edge computing collector of a center of internet of things

1. A housing; 2. sealing cover; 3. an L-shaped assembly frame; 4. a square groove; 5. a fixing plate; 6. anti-skid lines; 7. a USB socket; 8. a network cable jack; 9. HDMI socket; 10. a first heat-conducting plate; 11. a heat radiation fan; 12. a first fixing frame; 13. a fixed case; 14. a second heat-conducting plate; 15. a fixed frame; 16. a first heat sink; 17. insulating ceramic chips at the hot end; 18. insulating porcelain piece of cold junction; 19. the second fixing frame; 20. an exhaust fan; 21. a support block; 22. processing a main board; 23. a metal conductor; 24. an N-type semiconductor; 25. a P-type semiconductor; 26. and a second heat sink.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, one embodiment provided by the present utility model is: the utility model provides an edge calculation collector based on thing networking center, which comprises a housin 1, the fixed sealed lid 2 that is provided with in upper end of casing 1, sealed lid 2's intermediate position fixed be provided with fixed frame 15, the inside of casing 1 is close to the fixed processing mainboard 22 that is provided with of lower extreme, the fixed cold junction insulating porcelain piece 18 that is provided with of being close to of fixed frame 15, the fixed hot junction insulating porcelain piece 17 that is provided with in one side of keeping away from of cold junction insulating porcelain piece 18 of fixed frame 15, the fixed first heat-conducting plate 10 that is provided with of one end of keeping away from casing 1 of fixed frame 15, the fixed shell 13 that is provided with in one end of keeping away from casing 1 of first heat-conducting plate 10 and the position equidistance that is located the fixed shell 13 inboard is provided with a plurality of first fin 16, sealed lid 2 is close to one end of casing 1 and the fixed second mount 19 that is provided with one side of being located, the frame body internal fixation of second mount 19 is provided with fan 20, a plurality of square slots 4 have been kept away from to the inside of casing 1's front end intermediate position equidistance, the in-slot middle position of a plurality of square slots 4 is all fixedly provided with

USB

7, 8 and 8, a plurality of HDMI jack sockets 9,

wire jack

8 and 8, USB jack wire 8 and jack position are all set up on the fixed slot 4 are connected electrically by a plurality of jack wire, USB jack wire 8, USB jack position is connected to the position and jack 5.

The front ends of the fixing plates 5 are fixedly provided with anti-skidding patterns 6 near the lower middle position, the front ends of the fixing shells 13 are fixedly provided with a plurality of first fixing frames 12 at equal intervals, cooling fans 11 are fixedly arranged in the frame bodies of the plurality of first fixing frames 12, one ends of the fixing frames 15, which are far away from the fixing shells 13, are fixedly provided with second heat conducting plates 14, one ends of the second heat conducting plates 14, which are far away from the fixing shells 13, are fixedly provided with a plurality of second heat radiating fins 26, two side edge positions of the shell 1 are fixedly provided with L-shaped assembling frames 3, four corners of the inner bottom end of the shell 1 are fixedly provided with supporting blocks 21, a processing main board 22 is fixedly arranged on the plurality of supporting blocks 21, one ends of the cold end insulating ceramic sheets 18, which are far away from the processing main board 22, and one ends of the hot end insulating ceramic sheets 17, which are close to the processing main board 22, are fixedly provided with a plurality of pairs of metal conductors 23 at equal intervals, and N-type semiconductors 24 and P-type semiconductors 25 are sequentially connected in series between the plurality of metal conductors 23.

Working principle: according to the edge calculation collector based on the internet of things center table, along with the use, the device internal processing main board 22 can continuously generate heat during calculation, analysis and processing, at the moment, a series circuit formed by the metal conductor 23, the N-type semiconductor 24 and the P-type semiconductor 25 is electrified, at the moment, the cold end insulating ceramic chip 18 inside the shell 1 can rapidly absorb heat, the hot end insulating ceramic chip 17 can emit heat, then the cooling fan 11 and the exhaust fan 20 can be opened, the working fan blows out normal-temperature air at a high speed along the gap between the first cooling chips 16, the heat emitted along the hot end insulating ceramic chip 17 is dissipated into the air through the first heat conducting plate 10 and along the first cooling chips 16, and meanwhile, the exhaust fan 20 can conduct the air containing heat in the shell 1 onto the second heat conducting plate jack 14 along the gap between the second cooling chips 26, so that the heat in the shell 1 can be absorbed by the cold end insulating ceramic chip 18, the efficiency of the device is greatly improved, the service life of the device is prolonged, meanwhile, the working fan can be used for detaching the corresponding heat conducting plate jack 2, the data can be conveniently connected to a large-scale heat sink, and the device can be conveniently used for the data jack, and the anti-skid protection device is prevented from being connected to the corresponding data jack, and the device is convenient to use, and the anti-skid device is convenient to use, and the whole device is convenient to use, and the anti-skid and has the service, and the service performance and the anti-skid device.

Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.

Claims

1. Edge calculation collector based on thing networking center platform, including casing (1), its characterized in that: the upper end of the shell (1) is fixedly provided with a sealing cover (2), the middle position of the sealing cover (2) is fixedly provided with a fixing frame (15), and the lower end of the inner part of the shell (1) is fixedly provided with a processing main board (22);

the cold end insulating ceramic chip (18) is fixedly arranged at the inner side of the fixed frame (15) close to the processing main board (22), the hot end insulating ceramic chip (17) is fixedly arranged at one side, far away from the cold end insulating ceramic chip (18), of the inner side of the fixed frame (15), the first heat conducting plate (10) is fixedly arranged at one end, far away from the shell (1), of the fixed frame (15), the fixed shell (13) is fixedly arranged at one end, far away from the shell (1), of the first heat conducting plate (10), and a plurality of first radiating fins (16) are fixedly arranged at the positions, far away from one end of the shell (1) and positioned at the inner side of the fixed shell (13), of the fixed frame (15) at equal intervals;

the utility model discloses a sealed lid, including sealed lid (2), sealed lid (1), sealed lid is provided with second mount (19) in the fixed position that is close to one end and is located one side of casing (1), the support body internal fixation of second mount (19) is provided with exhaust fan (20), a plurality of square grooves (4) have been seted up to the front end intermediate position equidistance of casing (1), a plurality of the downthehole position of inslot centre of square groove (4) is all fixed USB socket (7), net twine socket (8) and HDMI socket (9) in proper order, a plurality of USB socket (7), net twine socket (8) and HDMI socket (9) all with handle mainboard (22) electric connection, a plurality of the inslot of square groove (4) is close to the downthehole position and all slides and is provided with fixed plate (5).

2. The edge computing collector based on the internet of things center station as claimed in claim 1, wherein: anti-skid patterns (6) are fixedly arranged at the middle positions of the front ends of the fixing plates (5) close to the lower part.

3. The edge computing collector based on the internet of things center station as claimed in claim 1, wherein: the front end equidistance of fixed shell (13) is fixed and is provided with a plurality of first mount (12), a plurality of in the support body of first mount (12) all fixedly are provided with radiator fan (11).

4. The edge computing collector based on the internet of things center station as claimed in claim 1, wherein: the fixed frame (15) is kept away from the fixed shell (13) one end fixedly provided with second heat-conducting plate (14), the fixed a plurality of second fin (26) that are provided with of one end equidistance that is kept away from fixed shell (13) of second heat-conducting plate (14).

5. The edge computing collector based on the internet of things center station as claimed in claim 1, wherein: l-shaped assembling frames (3) are fixedly arranged at the side edges of two sides of the shell (1).

6. The edge computing collector based on the internet of things center station as claimed in claim 1, wherein: support blocks (21) are fixedly arranged at four corners of the inner bottom end of the shell (1), and the processing main board (22) is fixedly arranged on the plurality of support blocks (21).

7. The edge computing collector based on the internet of things center station as claimed in claim 1, wherein: and a plurality of pairs of metal conductors (23) are fixedly arranged at equal intervals at one end of the cold end insulating ceramic chip (18) far away from the processing main board (22) and one end of the hot end insulating ceramic chip (17) close to the processing main board (22).

8. The internet of things center-based edge computing collector as recited in claim 7, wherein: the N-type semiconductor (24) and the P-type semiconductor (25) are sequentially and electrically connected in series between the plurality of pairs of metal conductors (23).