CN219234619U - Clamp for thin-wall semiconductor parts - Google Patents
Clamp for thin-wall semiconductor parts Download PDFInfo
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- CN219234619U CN219234619U CN202320298286.0U CN202320298286U CN219234619U CN 219234619 U CN219234619 U CN 219234619U CN 202320298286 U CN202320298286 U CN 202320298286U CN 219234619 U CN219234619 U CN 219234619U
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- positioning
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- wall
- clamping platform
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model provides a clamp for thin-wall semiconductor parts, which comprises a clamping platform; at least two positioning grooves are formed in the clamping platform; a positioning hole is formed in the positioning groove; threads are arranged in the positioning holes; an expansion pin is arranged above the positioning hole in the positioning groove; the expansion pin comprises a cylindrical barrel body with a circular groove; the circular groove is provided with a through hole at a position corresponding to the positioning hole; the through hole extends out of the supporting hole wall to one side far away from the circular groove; grooves are intermittently formed in the circumferential direction of the supporting hole wall; a positioning screw is arranged in the wall of the supporting hole; the positioning screw passes through the through hole and the positioning hole in sequence to fasten the expansion pin on the clamping platform. The fixture provided by the utility model can fix thin-wall semiconductor parts, does not cause the twisting and warping of the parts, and is beneficial to controlling the planeness of the semiconductor parts.
Description
Technical Field
The utility model relates to the technical field of semiconductor part processing, in particular to a clamp for a thin-wall type semiconductor part.
Background
When certain thin-wall semiconductor parts are processed, the flatness of the processing surface has higher precision requirements, particularly parts made of easily deformable materials such as aluminum (AL 6061), stainless steel (SUS 304) and the like, the plane structure of the thin-wall semiconductor parts is easy to twist and deform in the processing process, the standard requirements are difficult to reach, and the clamping difficulty is higher.
CN113319627a discloses a clamping mechanism for processing the flatness of a thin-wall part, which comprises a supporting seat and a pull rod connected to the supporting seat in a sliding way, wherein a plurality of pressing mechanisms arranged along the circumferential direction of the pull rod are rotationally connected to the supporting seat, and a clamping gap for clamping the thin-wall part is arranged between the pressing mechanisms and the supporting seat; a linkage mechanism for driving the pressing mechanism to slide and rotate relative to the supporting seat along with the sliding of the pull rod is arranged between the pull rod and the pressing mechanism. However, the mechanism has a relatively complex composition and relatively high operation difficulty.
CN216399344U discloses a fixture for processing flatness of thin-walled parts, the on-line screen storage device comprises a base, the inside swing joint of base has the bidirectional threaded rod, the surface threaded connection of bidirectional threaded rod has the screw sleeve, screw sleeve's surface fixedly connected with connecting seat, the spout has been seted up to the upper surface of base, the inside sliding connection of spout has the slider, the surface fixedly connected with connecting plate of connecting seat, the connecting seat passes through the connecting plate and is connected with the slider, the surface fixedly connected with stopper of slider. Although this mechanism can prevent deformation of the component, it is large in size and is not suitable for holding a precise semiconductor component.
Therefore, it is important to provide a jig suitable for thin-walled semiconductor components having high flatness requirements.
Disclosure of Invention
Aiming at the defects existing in the prior art, the utility model aims to provide the clamp for the thin-wall semiconductor parts, which can fix the thin-wall semiconductor parts, can not cause the twisting and the warping of the parts, is beneficial to controlling the planeness of the semiconductor parts and solves the problems that the thin-wall semiconductor parts are difficult to hold and the planeness is unqualified.
To achieve the purpose, the utility model adopts the following technical scheme:
the utility model provides a clamp for thin-wall semiconductor parts, which comprises a clamping platform;
at least two positioning grooves are formed in the clamping platform;
a positioning hole is formed in the positioning groove;
threads are arranged in the positioning holes;
an expansion pin is arranged above the positioning hole in the positioning groove;
the expansion pin comprises a cylindrical barrel body with a circular groove;
through holes are formed in the circular grooves at positions corresponding to the positioning holes;
the through hole extends out of the supporting hole wall to one side far away from the circular groove;
grooves are intermittently formed in the circumferential direction of the supporting hole wall;
a positioning screw is arranged in the wall of the supporting hole;
the positioning screw passes through the through hole and the positioning hole in sequence to fasten the expansion pin on the clamping platform.
According to the utility model, a process positioning hole is formed in a part to be processed of the part to be processed, a positioning groove is formed in the clamping platform according to the position of the process positioning hole, then an expansion pin is placed in the positioning groove, the expansion pin is fixed on the clamping platform by using a positioning screw, and the process positioning hole of the part to be processed is sleeved into a supporting hole wall with a discontinuous groove, so that the clamping of the thin-wall part is completed. According to the utility model, on one hand, the flatness of the supporting platform is controlled to meet the requirement, so that the thin-wall type semiconductor component is not easy to deform or bend, and the thin-wall type semiconductor component is suitable for thin-wall type semiconductor components with high flatness requirement; on the other hand, the position of the thin-wall type semiconductor part on the clamping platform is fixed through the supporting hole wall with the intermittent grooves, when the positioning screw is screwed into the positioning hole downwards, the supporting hole wall with the intermittent grooves can expand from the center to the periphery along with the descending of the positioning screw, the expanding gap of the supporting hole wall can be adjusted by controlling the descending depth of the positioning screw, and finally the outer diameter of the supporting hole wall is matched with the process positioning hole of the part, so that the processing of the part is facilitated, the clamping is convenient, and the planeness and the yield of the part are further ensured. The fixture for the thin-wall semiconductor parts can enable the flatness of the parts to meet the tolerance requirement of semiconductor products.
Preferably, the upper edge of the cylindrical barrel is flush with the holding platform.
Preferably, the height of the supporting hole wall is greater than the depth of the circular groove.
Preferably, the difference between the height of the supporting hole wall and the depth of the circular groove is 6-8mm, for example, 6mm, 6.2mm, 6.4mm, 6.8mm, 7mm, 7.2mm, 7.4mm, 7.6mm, 7.8mm or 8mm, but not limited to the recited values, other non-recited values within the range of values are equally applicable.
Preferably, at least 8 grooves, for example, 8, 9 or 10 grooves, are uniformly and intermittently arranged in the circumferential direction of the supporting hole wall, but the method is not limited to the listed values, and other non-listed values in the range of values are equally applicable.
Preferably, the outer diameter of the cylindrical barrel is 30-34mm, for example 30mm, 31mm, 32mm, 33mm or 34mm, but not limited to the values recited, other values not recited in the numerical range are equally applicable.
Preferably, the inner diameter of the through hole is 8-12mm, for example, 8mm, 8.5mm, 9mm, 9.5mm, 10mm, 10.5mm, 11mm, 11.5mm or 12mm, but not limited to the recited values, and other non-recited values within the numerical range are equally applicable.
Preferably, the flatness of the holding platform is 0.01-0.03mm, for example, 0.01mm, 0.02mm or 0.03mm, but the flatness is not limited to the recited values, and other non-recited values in the numerical range are equally applicable.
Preferably, the holding platform is provided with at least 4 positioning slots, for example 4, 5 or 6, but not limited to the recited values, other non-recited values within the range of values are equally applicable.
Preferably, the set screw comprises a socket head cap screw.
The utility model provides a clamp for thin-wall semiconductor parts, which is used for clamping the parts and comprises the following operation processes:
(1) Arranging a process positioning hole at a part to be processed on a part to be processed;
(2) Arranging a positioning groove at the position of the clamping platform corresponding to the process positioning hole, placing the expansion pin into the positioning groove, fixing the expansion pin on the clamping platform by using a positioning screw, expanding the supporting hole wall from the center to the periphery along with the screwing of the positioning screw to the positioning hole, and determining the screwing depth of the positioning screw according to the process positioning hole size of the part to be processed;
(3) And sleeving the process positioning hole of the part to be processed into the supporting hole wall of the expansion pin, and completing the clamping of the part.
Compared with the prior art, the utility model has the beneficial effects that:
the thin-wall type semiconductor part clamp provided by the utility model holds the part through the expansion pin, and the expansion gap of the wall of the supporting hole is controlled through the depth of the screw screwed into the positioning hole, so that the expansion gap is matched with the process positioning hole of the part, the expansion force generated by the expansion pin can not cause the distortion and tilting of the part, the problem of stress deformation of the thin-wall type part is solved, and the thin-wall type part clamp is suitable for clamping the semiconductor part with higher requirement on flatness.
Drawings
FIG. 1 is a schematic view of a structure of a clamp according to embodiment 1 of the present utility model;
FIG. 2 is a schematic view of the structure of the expansion pin according to embodiment 1 of the present utility model;
in the figure: 1-a clamping platform; 2-expanding the pin; 3-a cylindrical barrel; 4-supporting hole walls; 5-grooves; 6-set screw.
Detailed Description
The technical scheme of the utility model is further described below by the specific embodiments with reference to the accompanying drawings.
The present utility model will be described in further detail below. The following examples are merely illustrative of the present utility model and are not intended to represent or limit the scope of the utility model as defined in the claims.
It is to be understood that in the description of the present utility model, the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus are not to be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.
It should be noted that, in the description of the present utility model, unless explicitly specified and limited otherwise, the terms "disposed," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art in a specific case.
It will be appreciated by those skilled in the art that the present utility model necessarily includes the necessary piping, conventional valves and general pumping equipment for achieving the process integrity, but the foregoing is not a major inventive aspect of the present utility model, and that the present utility model is not particularly limited thereto as the layout may be added by themselves based on the process flow and the equipment configuration options.
Example 1
The embodiment provides a fixture for thin-walled semiconductor components, and a schematic structural diagram of the fixture is shown in fig. 1. The clamp comprises a clamping platform 1, wherein 4 positioning grooves are formed in the clamping platform 1; the positioning groove is internally provided with a positioning hole, the positioning hole is internally provided with threads, the positioning hole is internally provided with an expansion pin 2 above the positioning hole, the structural schematic diagram of the expansion pin 2 is shown in fig. 2, the expansion pin 2 comprises a cylindrical barrel 3 containing a circular groove, the position of the circular groove corresponding to the positioning hole is provided with a through hole, one side of the through hole far away from the circular groove extends to form a supporting hole wall 4, the circumferential discontinuity of the supporting hole wall 4 is provided with a groove 5, the supporting hole wall 4 is internally provided with a positioning screw 6, the positioning screw 6 sequentially fastens the expansion pin 2 on a clamping platform 1 through the through hole and the positioning hole, the upper edge of the cylindrical barrel 3 is flush with the clamping platform 1, the height of the supporting hole wall 4 is larger than the depth of the circular groove, the difference between the height of the supporting hole wall 4 and the depth of the circular groove is 7mm, the circumferential discontinuity of the supporting hole wall 4 is provided with 8 grooves 5, the outer diameter of the cylindrical barrel 3 is 32mm, the inner diameter of the through hole is 10mm, the clamping plane is 0.02mm of the positioning screw is 0.02 mm.
Example 2
This embodiment provides a thin-walled semiconductor component's anchor clamps, compares with embodiment 1 only and is different in that the difference between the height of supporting hole wall and the degree of depth of circular recess is 6mm, the external diameter of cylindrical barrel is 30mm, the internal diameter of through-hole is 8mm, add and hold the planarization of platform and be 0.01mm.
Example 3
This embodiment provides a thin-walled semiconductor component's anchor clamps, compares with embodiment 1 only in the difference between the height of support pore wall and the degree of depth of circular recess is 8mm, the external diameter of cylindrical barrel is 34mm, the internal diameter of through-hole is 12mm, add and hold the planarization of platform and be 0.03mm.
The procedure for clamping the thin-walled semiconductor component provided in examples 1-3 was as follows:
(1) Arranging a process positioning hole at a part to be processed on a part to be processed;
(2) Arranging a positioning groove at the position of the clamping platform corresponding to the process positioning hole, placing the expansion pin into the positioning groove, fixing the expansion pin on the clamping platform by using a positioning screw, expanding the supporting hole wall from the center to the periphery along with the screwing of the positioning screw to the positioning hole, and determining the screwing depth of the positioning screw according to the process positioning hole size of the part to be processed;
(3) And sleeving the process positioning hole of the part to be processed into the supporting hole wall of the expansion pin, and completing the clamping of the part.
Comparative example 1
This comparative example provides a clamp, the clamp includes first clamp plate and second clamp plate, with the part clamping between first clamp plate and second clamp plate when clamping the part.
The parts were held by the jigs provided in examples 1 to 3 and comparative example 1, and then cut, and the flatness of the cut parts was as shown in table 1.
TABLE 1
| Flatness/(mm) | |
| Example 1 | 0.02 |
| Example 2 | 0.03 |
| Example 3 | 0.02 |
| Comparative example 1 | 0.05 |
As can be seen from examples 1-3, the fixture provided by the utility model can enable the flatness of the machined parts to be below 0.03mm. In contrast to the conventional clamp-on press plate type clamping fixture in comparative example 1, in example 1, compared with comparative example 1, the flatness of the part is significantly lower than that of comparative example 1 after the part is processed by using the clamp provided in example 1. Therefore, the fixture provided by the utility model can ensure that the part has good flatness, and effectively prevent the part from deformation such as distortion, tilting and the like.
In summary, the clamp for the thin-walled semiconductor component solves the problem of stress deformation of the thin-walled semiconductor component, and is suitable for clamping the semiconductor component with high requirements on flatness.
The applicant declares that the above is only a specific embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and it should be apparent to those skilled in the art that any changes or substitutions that are easily conceivable within the technical scope of the present utility model disclosed by the present utility model fall within the scope of the present utility model and the disclosure.
Claims (10)
1. The fixture for the thin-wall semiconductor parts is characterized by comprising a clamping platform;
at least two positioning grooves are formed in the clamping platform;
a positioning hole is formed in the positioning groove;
threads are arranged in the positioning holes;
an expansion pin is arranged above the positioning hole in the positioning groove;
the expansion pin comprises a cylindrical barrel body with a circular groove;
through holes are formed in the circular grooves at positions corresponding to the positioning holes;
the through hole extends out of the supporting hole wall to one side far away from the circular groove;
grooves are intermittently formed in the circumferential direction of the supporting hole wall;
a positioning screw is arranged in the wall of the supporting hole;
the positioning screw passes through the through hole and the positioning hole in sequence to fasten the expansion pin on the clamping platform.
2. The clamp of thin-walled semiconductor components of claim 1, wherein the upper edge of the cylindrical barrel is flush with the clamping platform.
3. The thin-walled semiconductor component fixture of claim 1, wherein the support hole wall has a height greater than the depth of the circular recess.
4. A thin-walled semiconductor component holder according to claim 3 characterized in that the difference between the height of the support hole wall and the depth of the circular recess is 6-8mm.
5. The fixture for thin-walled semiconductor components of claim 1 wherein the support hole wall is uniformly circumferentially interrupted with at least 8 grooves.
6. The fixture for thin-walled semiconductor components of claim 1, wherein the cylindrical barrel has an outer diameter of 30-34mm.
7. The fixture for thin-walled semiconductor components of claim 1, wherein the through-hole has an inner diameter of 8-12mm.
8. The fixture for thin-walled semiconductor components of claim 1, wherein the flatness of the clamping platform is 0.01-0.03mm.
9. The clamp of thin-walled semiconductor components of claim 1, wherein the clamping platform is provided with at least 4 locating slots.
10. The clamp of a thin-walled semiconductor component of claim 1, wherein the set screw comprises a socket head cap screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320298286.0U CN219234619U (en) | 2023-02-23 | 2023-02-23 | Clamp for thin-wall semiconductor parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320298286.0U CN219234619U (en) | 2023-02-23 | 2023-02-23 | Clamp for thin-wall semiconductor parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219234619U true CN219234619U (en) | 2023-06-23 |
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ID=86809343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320298286.0U Active CN219234619U (en) | 2023-02-23 | 2023-02-23 | Clamp for thin-wall semiconductor parts |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219234619U (en) |
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2023
- 2023-02-23 CN CN202320298286.0U patent/CN219234619U/en active Active
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