CN219228203U - Middle frame assembly for terminal equipment and terminal equipment - Google Patents

Abstract

The present disclosure relates to a middle frame assembly for a terminal device and a terminal device, wherein the middle frame assembly for a terminal device comprises: middle frame body, functional module and first heat conduction spare, the middle frame body includes: a bottom plate and a side plate arranged on the periphery of the bottom plate; the functional module is arranged on the middle frame body, and the functional module and the bottom plate are spaced apart in the thickness direction of the terminal equipment to form a first heat conduction gap; the first heat conduction piece sets up in first heat conduction clearance, and first heat conduction piece all links to each other with functional module and bottom plate in order to give the heat transfer of functional module the center body. The middle frame assembly of this disclosure is high in integration level, neither influences the complete machine and piles up, does not influence complete machine thickness again, compares with traditional middle frame assembly, and first heat conduction spare is convenient for in time high-efficient realization function module and the heat conduction between the middle frame body, and radiating efficiency is higher, has solved because the heat dissipation problem that the function module during operation produced.

Description

Middle frame assembly for terminal equipment and terminal equipment

Technical Field

The disclosure relates to the technical field of mobile equipment, and in particular relates to a middle frame assembly for terminal equipment and the terminal equipment.

Background

With the development of mobile communication technology, terminal devices such as mobile phones and notebook computers are becoming indispensable electronic products in life. And the electronic products such as mobile phones, notebook computers and the like mostly adopt a wireless transmission technology to carry out radio frequency communication. With the development of wireless transmission technology, a great deal of millimeter wave modules are being applied.

However, in the use process of the millimeter wave module, the problem of heat dissipation caused by the power consumption of the millimeter wave module is difficult to solve all the time, mainly because the heat dissipation efficiency is not ideal, heat cannot be timely emitted to be accumulated in the terminal equipment, the service life of the terminal equipment is directly influenced, and the design requirement of the terminal equipment cannot be met.

Disclosure of Invention

To overcome the problems in the related art, the present disclosure provides a middle frame assembly for a terminal device and a terminal device.

According to a first aspect of embodiments of the present disclosure, there is provided a middle frame assembly for a terminal device, including:

the middle frame body, the middle frame body includes: a bottom plate and a side plate arranged on the periphery of the bottom plate;

a functional module provided on the center body and spaced apart from the bottom plate in a thickness direction of the terminal device to form a first heat conduction gap;

the first heat conduction piece is arranged in the first heat conduction gap, and the first heat conduction piece is connected with the functional module and the bottom plate so as to transfer heat of the functional module to the middle frame body.

In some embodiments, the functional module is mounted on the middle frame body by a mount, at least a portion of which is spaced apart from the bottom plate in a thickness direction of the terminal device to form the first heat conduction gap.

In some embodiments, the mount comprises: and the first plate part is connected with the functional module, the first plate part and the bottom plate are spaced apart in the thickness direction of the terminal equipment to form the first heat conduction gap, and the first heat conduction piece is connected with the first plate part and the bottom plate.

In some embodiments, the mount further comprises: and a second plate portion formed on an edge of the first plate portion away from the side plate and extending in a thickness direction of the terminal device, the second plate portion and the first plate portion defining an accommodation space accommodating the functional module.

In some embodiments, the second plate portion is spaced apart from the functional module to form a second thermally conductive gap;

the middle frame assembly further comprises: the second heat conduction piece is arranged in the second heat conduction gap, and the second heat conduction piece is connected with the second plate part and the functional module.

In some embodiments, the middle frame assembly for a terminal device further includes:

the third heat conduction piece is connected with the side surface of the second plate part far away from the side plate, and the third heat conduction piece is suitable for transferring heat on the second plate part to the middle frame body.

In some embodiments, a partition plate extending in the thickness direction of the terminal device is provided on the bottom plate, the partition plate being located on a side of the second plate portion away from the side plate and being spaced apart from the second plate portion to form a third heat conduction gap;

the third heat conduction piece is arranged in the third heat conduction gap, and the third heat conduction piece is connected with the partition plate and the second plate part.

In some embodiments, at least one of the first, second, and third heat conductive members is configured as a flexible member; and/or the number of the groups of groups,

at least one of the first heat conductive member, the second heat conductive member, and the third heat conductive member is configured as a heat conductive silicone grease or a heat conductive silicone gel.

In some embodiments, the middle frame body is provided with a mounting boss, the mounting piece is provided with a mounting leg, and the mounting leg is fixed on the mounting boss through a fastener.

In some embodiments, the mounting bosses are two and spaced apart in the length direction of the functional module, the mounting feet are also two and spaced apart in the length direction of the functional module, and each of the mounting feet is secured to a corresponding one of the mounting bosses by a fastener.

According to a second aspect of embodiments of the present disclosure, there is provided a terminal device, including: a mid-frame assembly for a terminal device as in any of the embodiments of the first aspect above.

The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects: this disclosure functional module and the bottom plate of center body are spaced apart in order to form first heat conduction clearance in terminal equipment's thickness direction, and first heat conduction spare sets up in first heat conduction clearance, and first heat conduction spare all links to each other with functional module and bottom plate in order to give the heat transfer of functional module the center body, and this disclosure's center subassembly integrated level is high, neither influences the complete machine and piles up, does not influence complete machine thickness again, compares with traditional center subassembly, and first heat conduction spare is convenient for in time high-efficient realization heat conduction between functional module and the center body, and radiating efficiency is higher, has solved because the radiating problem that produces in the functional module course of working.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a schematic structural view of a center assembly for a terminal device in the related art.

Fig. 2 is a schematic structural view showing a middle frame assembly for a terminal device according to an exemplary embodiment.

Fig. 3 is an exploded view of the center assembly for the terminal device of fig. 2.

Fig. 4 is a partial structure diagram illustrating a middle frame body for a terminal device according to an exemplary embodiment.

Fig. 5 is a schematic structural view showing another middle frame assembly for a terminal device according to an exemplary embodiment.

Fig. 6 is an exploded view of the center assembly for the terminal device of fig. 5.

Fig. 7 is a partial structure diagram of another center body for a terminal device according to an exemplary embodiment.

Fig. 8 is a schematic diagram showing a structure of a functional module according to an exemplary embodiment.

Fig. 9 is a schematic structural view of a mount according to an exemplary embodiment.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present disclosure as detailed in the accompanying claims.

With the rapid growth of wireless transmission technology, the radio frequency communication requirements for mobile devices, intelligent hardware, etc. are increasing. Among them, the transmission technology of millimeter wave modules has been regarded as one of the key communication technologies with high quality transmission capability.

In the related art, as shown in fig. 1, a gap 2 exists between a metal fixing bracket 1 around a millimeter wave module and a functional module 20 due to installation errors, and after the heat generated by the millimeter wave module during operation reaches the metal fixing bracket 1, the heat on the metal fixing bracket 1 is difficult to transfer outwards due to lower air heat conductivity in the gap 2 between the metal fixing bracket 1 and the functional module 20, so that the problem of unsatisfactory heat dissipation effect exists in the millimeter wave module.

In order to solve the technical problems, the present disclosure provides a middle frame assembly for a terminal device. As shown in fig. 2-3 and fig. 5-6, a center assembly for a terminal device includes: the middle frame body 10, the functional module 20 and the first heat conducting member 30.

The center body 10 includes: the bottom plate 101 and the side plate 102 provided on the outer peripheral edge of the bottom plate 101. The functional module 20 is disposed on the center body 10, and the functional module 20 is spaced apart from the bottom plate 101 in the thickness direction of the terminal device to form the first heat conduction gap 40. The first heat conductive member 30 is disposed in the first heat conductive gap 40, and the first heat conductive member 30 is connected to both the functional module 20 and the bottom plate 101 to transfer heat of the functional module 20 to the middle frame body 10.

The bottom plate 101 is fixedly connected with the side plate 102, and the middle frame body 10 includes a metal portion 103 and a plastic portion 104, as shown in fig. 4 and 7, the metal portion 103 may be formed by die casting, stamping or 3D printing, and the forming manner of the metal portion 103 is not limited in the present disclosure. The plastic portion 104 may be formed by injection molding or by machining to remove material. Specifically, there are a variety of ways to remove material, such as cutting, etching, etc., and the present disclosure is not limited to the manner in which the plastic portion 104 is formed.

Specifically, the metal portion 103 and the plastic portion 104 are disposed separately, that is, the metal portion 103 and the plastic portion 104 are two separately molded parts. Meanwhile, the metal part 103 is connected with the plastic part 104, and various manners of connecting the metal part 103 with the plastic part 104 are available, such as screwing, riveting, snap-fitting, etc.

The first heat conductive member 30 may be a heat conductive sheet, and the shape of the heat conductive sheet may be a rectangular sheet, a prismatic sheet, a circular sheet, or a heat conductive sheet of other shapes, which is not particularly limited in the present disclosure.

It is understood that the functional module 20 is a millimeter wave module, the millimeter wave is an electromagnetic wave between microwave and light wave, and the millimeter wave frequency band is generally 30 GHz-300 GHz, and the corresponding wavelength is 1 mm-10 mm. Millimeter wave communication refers to communication performed using millimeter waves as a carrier for transmitting information.

According to the heat transfer device, the first heat conducting piece 30 is arranged, heat generated by the functional module 20 is directly transferred to the bottom plate 101 through the first heat conducting piece 30, heat conduction between the functional module 20 and the middle frame body 10 is further achieved, the heat transfer mode that heat generated by the traditional functional module 20 is indirectly transferred to the bottom plate 101 through air of the first heat conducting gap 40 is avoided, heat dissipation efficiency is higher, and rapid heat dissipation of the functional module 20 is facilitated.

By adopting the structure, the functional module 20 and the bottom plate 101 of the middle frame body 10 are spaced apart in the thickness direction of the terminal equipment to form the first heat conduction gap 40, the first heat conduction piece 30 is arranged in the first heat conduction gap 40, the first heat conduction piece 30 is connected with the functional module 20 and the bottom plate 101 to transfer heat of the functional module 20 to the middle frame body 10, the integration level is high, the whole machine stacking is not affected, the whole machine thickness is not affected, compared with a traditional middle frame assembly, the first heat conduction piece 30 is convenient for timely and efficiently realizing heat conduction between the functional module 20 and the middle frame body 10, the heat dissipation efficiency is higher, the heat dissipation problem caused by the operation of the functional module 20 is solved, and meanwhile, the realization of functions such as the structural strength, the data transfer of the terminal equipment is guaranteed.

In some embodiments, as shown in fig. 3, 6, 9, the functional module 20 is mounted on the middle frame body 10 by a mounting member 50, at least part of the mounting member 50 being spaced apart from the bottom plate 101 in the thickness direction of the terminal device to form the first heat conduction gap 40.

Illustratively, the mounting member 50 is an integrally formed sheet metal member by which the functional module 20 is mounted on the center body 10, at least part of the sheet metal member being spaced apart from the bottom plate 101 in the thickness direction of the terminal device to form the first heat conduction gap 40. Through setting up mounting 50, on the one hand, be convenient for install function module 20 on middle frame body 10, on the other hand, mounting 50 plays the heat conduction, carries out quick conduction with the heat that function module 20 produced, reduces thermal gathering, does benefit to the heat dissipation of middle frame subassembly.

In some embodiments, as shown in fig. 9, the mount 50 includes: the first plate portion 501, the first plate portion 501 is connected to the functional module 20, the first plate portion 501 is spaced apart from the base plate 101 in the thickness direction of the terminal device to form the first heat conduction gap 40, and the first heat conduction member 30 is connected to both the first plate portion 501 and the base plate 101.

The first plate 501 is a sheet metal part.

It is understood that a connection may be a contact connection, which may be understood as at least a partial contact or fitting of two parts in contact. That is, the first plate portion 501 contacts or abuts at least part of the functional module 20, the first heat conductive member 30 contacts or abuts at least part of the first plate portion 501, and the first heat conductive member 30 contacts or abuts at least part of the bottom plate 101.

The first plate 501 may be disposed parallel to the bottom plate 101, and the heat generated by the functional module 20 is transferred to the first heat conducting member 30 through the first plate 501, and then directly transferred to the bottom plate 101 through the first heat conducting member 30, so that the heat conduction between the functional module 20 and the middle frame body 10 is realized, the heat transfer mode of heat conduction of the heat generated by the traditional functional module 20 through the air of the first heat conducting gap 40 is avoided, the heat dissipation efficiency is higher, and the rapid heat dissipation of the functional module 20 is facilitated.

In some embodiments, as shown in FIGS. 2-3, 5-6, the mount 50 further comprises: and a second plate portion 502 formed on an edge of the first plate portion 501 away from the side plate 102 and extending in a thickness direction of the terminal device, the second plate portion 502 and the first plate portion 501 defining a receiving space for receiving the functional module 20.

Wherein the second plate 502 is a sheet metal part.

Illustratively, the second plate 502 may be disposed perpendicular to the bottom plate 101, and the functional module 20 is mounted in the accommodating space, which facilitates fixing the functional module 20, while heat generated by the functional module 20 may also be transferred through the second plate 502.

In some embodiments, as shown in fig. 3, 6, 9, the second plate portion 502 is spaced apart from the functional module 20 to form a second thermally conductive gap 60.

The middle frame assembly further comprises: the second heat conducting member 70, the second heat conducting member 70 is disposed in the second heat conducting gap 60, and the second heat conducting member 70 is connected to both the second plate portion 502 and the functional module 20.

The second heat conductive member 70 may be a heat conductive sheet, and the shape of the heat conductive sheet may be a rectangular sheet, a prismatic sheet, a circular sheet, or a heat conductive sheet of other shapes, which is not particularly limited in the present disclosure.

It is understood that a connection may be a contact connection, which may be understood as at least a partial contact or fitting of two parts in contact. That is, the second heat conductive member 70 contacts or abuts at least a portion of the second plate portion 502, and the second heat conductive member 70 contacts or abuts at least a portion of the functional module 20.

The second heat conducting member 70 is a rectangular plate, and accordingly, the second heat conducting gap 60 is a rectangular structure, and by providing the second heat conducting member 70, a part of heat generated by the functional module 20 is directly transferred to the second plate 502 through the second heat conducting member 70, and another part of heat generated by the functional module 20 is directly transferred to the first plate 501 through the first heat conducting member 30, and then the two parts of heat are transferred to the bottom plate 101 through the mounting member 50, thereby realizing three-dimensional heat dissipation of the functional module 20, and having higher heat dissipation efficiency and being beneficial to rapid heat dissipation of the functional module 20.

The second heat conducting member 70 is a prismatic sheet, and accordingly, the second heat conducting gap 60 is a prismatic structure, and by providing the second heat conducting member 70, a part of heat generated by the functional module 20 is directly transferred to the second plate portion 502 through the second heat conducting member 70, and another part of heat generated by the functional module 20 is directly transferred to the first plate portion 501 through the first heat conducting member 30, and then the two parts of heat are transferred to the bottom plate 101 through the mounting member 50, thereby realizing three-dimensional heat dissipation of the functional module 20, and having higher heat dissipation efficiency and being beneficial to rapid heat dissipation of the functional module 20.

In some embodiments, as shown in fig. 5-6, the middle frame assembly for a terminal device further comprises: and a third heat conductive member 80.

The third heat conducting member 80 is connected to the side of the second plate portion 502 away from the side plate 102, and the third heat conducting member 80 is adapted to transfer heat from the second plate portion 502 to the middle frame body 10.

The third heat conductive member 80 may be a heat conductive sheet, and the shape of the heat conductive sheet may be a rectangular sheet, a prismatic sheet, a circular sheet, or a heat conductive sheet of other shapes, which is not particularly limited in the present disclosure.

It is understood that a connection may be a contact connection, which may be understood as at least a partial contact or fitting of two parts in contact. I.e., the third heat conductive member 80 is in contact with or in abutment with at least a portion of the side of the second plate portion 502 remote from the edge plate 102.

By way of example, the third heat conducting member 80 is a rectangular plate, by arranging the third heat conducting member 80, a part of heat generated by the functional module 20 is directly transferred to the second plate portion 502 through the second heat conducting member 70, a part of heat transferred to the second plate portion 502 is transferred to the first plate portion 501, a part of heat is transferred to the third heat conducting member 80, and then the third heat conducting member 80 transfers the part of heat to the middle frame body 10, thereby realizing three-dimensional heat dissipation of the functional module 20, and having higher heat dissipation efficiency and being beneficial to rapid heat dissipation of the functional module 20.

By way of example, the third heat-conducting member 80 is a prismatic sheet, by providing the third heat-conducting member 80, a part of the heat generated by the functional module 20 is directly transferred to the second plate portion 502 through the second heat-conducting member 70, a part of the heat transferred to the second plate portion 502 is transferred to the first plate portion 501, a part of the heat is transferred to the third heat-conducting member 80, and then the third heat-conducting member 80 transfers the part of the heat to the middle frame body 10, thereby realizing three-dimensional heat dissipation of the functional module 20, and having higher heat dissipation efficiency and being beneficial to rapid heat dissipation of the functional module 20.

In some embodiments, as shown in fig. 5-6, the bottom plate 101 is provided with a partition 105 extending in the thickness direction of the terminal device, the partition 105 being located on a side of the second plate portion 502 remote from the side plate 102 and spaced apart from the second plate portion 502 to form the third heat conduction gap 90;

the third heat conductive member 80 is disposed in the third heat conductive gap 90, and the third heat conductive member 80 is connected to both the partition 105 and the second plate portion 502.

The partition 105 may be integrally formed with the base plate 101, or may be separately formed from the base plate 101, that is, the partition 105 may be formed as two separate parts with the base plate 101. Meanwhile, the partition 105 may be connected to the base plate 101, and there may be various ways in which the partition 105 may be connected to the base plate 101, such as screwing, riveting, snap-fitting, etc.

It is understood that a connection may be a contact connection, which may be understood as at least a partial contact or fitting of two parts in contact. That is, the third heat conductive member 80 is in contact with or in contact with at least a portion of the separator 105, and the third heat conductive member 80 is in contact with or in contact with at least a portion of the second plate portion 502.

The third heat conducting member 80 is a rectangular plate, and accordingly, the third heat conducting gap 90 is a rectangular structure, by providing the third heat conducting member 80, a part of heat generated by the functional module 20 is directly transferred to the second plate portion 502 through the second heat conducting member 70, a part of heat transferred to the second plate portion 502 can be transferred to the third heat conducting member 80, the heat transferred to the third heat conducting member 80 is transferred to the middle frame body 10 through the partition plate 105, the middle frame body 10 conducts heat out, and other parts of heat generated by the functional module 20 can be directly transferred to the bottom plate 101 through the first heat conducting member 30 and the second heat conducting member, so that three-dimensional heat dissipation of the functional module 20 is realized, the heat dissipation efficiency is higher, and the rapid heat dissipation of the functional module 20 is facilitated.

The third heat conducting member 80 is a prismatic sheet, correspondingly, the third heat conducting gap 90 is a prismatic structure, by providing the third heat conducting member 80, a part of heat generated by the functional module 20 is directly transferred to the second plate portion 502 through the second heat conducting member 70, a part of heat transferred to the second plate portion 502 can be transferred to the third heat conducting member 80, the heat transferred to the third heat conducting member 80 is transferred to the middle frame body 10 through the partition plate 105, the middle frame body 10 conducts heat, and other parts of heat generated by the functional module 20 can be directly transferred to the bottom plate 101 through the first heat conducting member 30 and the second heat conducting member, so that three-dimensional heat dissipation of the functional module 20 is realized, the heat dissipation efficiency is higher, and the rapid heat dissipation of the functional module 20 is facilitated.

In some embodiments, as shown in fig. 6, at least one of the first, second and third heat conductive members 30, 70 and 80 is configured as a flexible member;

and/or at least one of the first heat conductive member 30, the second heat conductive member 70, and the third heat conductive member 80 is configured as a heat conductive silicone grease or a heat conductive silicone gel.

Wherein, the shape of the first heat conductive member 30 may be rectangular, prismatic, circular or other shape; the shape of the second heat conductive member 70 may be rectangular, prismatic, circular or other shape; the shape of the third heat conductive member 80 may be rectangular, prismatic, circular, or other shapes. The shapes of the first heat conductive member 30, the second heat conductive member 70, and the third heat conductive member 80 may be the same or different, which is not particularly limited in the present disclosure.

The first heat conductive member 30, the second heat conductive member 70 and the third heat conductive member 80 are flexible members, so that the first heat conductive member 30, the second heat conductive member 70 and the third heat conductive member 80 perform the dual functions of heat dissipation and buffering fixation.

Illustratively, at least one of the first, second and third heat conductive members 30, 70 and 80 is configured as a heat conductive silicone grease. Specifically, the first heat conductive member 30 is configured as a heat conductive silicone grease, and the second heat conductive member 70 and the third heat conductive member 80 are flexible members. Or the first heat conductive member 30 and the second heat conductive member 70 are each configured of heat conductive silicone grease, and the third heat conductive member 80 is a flexible member. Or the first heat conductive member 30, the second heat conductive member 70, and the third heat conductive member 80 are each configured of a heat conductive silicone grease.

Illustratively, at least one of the first, second and third heat conductive members 30, 70 and 80 is configured as a heat conductive silicone gel. Specifically, the first heat conductive member 30 is configured as a heat conductive silicone, and the second heat conductive member 70 and the third heat conductive member 80 are flexible members. Or the first heat conductive member 30 and the second heat conductive member 70 are each configured as a heat conductive silicone, and the third heat conductive member 80 is a flexible member. Or the first heat conductive member 30, the second heat conductive member 70, and the third heat conductive member 80 are each configured as a heat conductive silicone.

The heat transfer process is as follows: part of the heat generated by the functional module 20 is transferred to the middle frame assembly through the first plate part 501 and the first heat conducting piece 30, the other part of the heat generated by the functional module 20 is directly transferred to the second plate part 502 through the second heat conducting piece 70, part of the heat transferred to the second plate part 502 is transferred to the first plate part 501, then transferred to the middle frame assembly through the first plate part 501 and the first heat conducting piece 30, and then transferred to the third heat conducting piece 80, the heat transferred to the third heat conducting piece 80 is transferred to the middle frame body 10 through the partition 105, and the middle frame body 10 conducts the heat out, so that three-dimensional heat dissipation of the functional module 20 is realized, the heat dissipation efficiency is higher, and the rapid heat dissipation of the functional module 20 is facilitated.

In some embodiments, as shown in fig. 2-7 and 9, the middle frame body 10 is provided with a mounting boss 10-1, the mounting member 50 is provided with a mounting leg 50-1, and the mounting leg 50-1 is fixed to the mounting boss 10-1 by a fastener (not shown).

Illustratively, the mounting bosses 10-1 are two and spaced apart in the length direction of the functional module 20, and the mounting feet 50-1 are also two and spaced apart in the length direction of the functional module 20, each of the mounting feet 50-1 being secured to a corresponding mounting boss 10-1 by fasteners.

In the embodiment of the disclosure, the mounting boss 10-1 is disposed on the middle frame body 10, and the mounting leg 50-1 is disposed on the mounting member 50, and the mounting leg 50-1 and the mounting boss 10-1 are mounted by the fastening member, so that the mounting member 50 can be conveniently and detachably mounted on the middle frame body 10, and further the disassembly and assembly of the functional module 20 are facilitated.

Based on the same inventive concept, the present disclosure also provides a terminal device. The terminal device comprises: the center assembly for a terminal device as in any one of the embodiments above.

The terminal device may be a communication module including a mobile phone, a tablet computer, a notebook computer, a palm computer, a PDA (Personal Digital Assistant ), a POS (Point of Sales), a mobile internet device (Mobile Internet Device, MID), a wearable device (e.g., a smart watch, a smart bracelet, a pedometer, etc.), or other configurable functional module 20 (millimeter wave module).

According to the heat conduction device, the first heat conduction gap 40 is formed by spacing the functional module 20 and the bottom plate 101 of the middle frame body 10 in the thickness direction of the terminal device, the first heat conduction piece 30 is arranged in the first heat conduction gap 40, the first heat conduction piece 30 is connected with the functional module 20 and the bottom plate 101 to transfer heat of the functional module 20 to the middle frame body 10, the integration level is high, the whole machine stacking is not affected, the whole machine thickness is not affected, compared with a traditional middle frame assembly, the first heat conduction piece 30 is convenient to timely and efficiently realize heat conduction between the functional module 20 and the middle frame body 10, the heat dissipation efficiency is higher, the heat dissipation problem caused by the consumption of the functional module 20 is solved, and meanwhile, the structural strength, the antenna and the heat dissipation function are realized.

It is understood that the term "plurality" in this disclosure means two or more, and other adjectives are similar thereto. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship. The singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It is further understood that the terms "first," "second," and the like are used to describe various information, but such information should not be limited to these terms. These terms are only used to distinguish one type of information from another and do not denote a particular order or importance. Indeed, the expressions "first", "second", etc. may be used entirely interchangeably. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure.

It will be further understood that the terms "center," "longitudinal," "transverse," "front," "rear," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship based on that shown in the drawings, merely for convenience in describing the present embodiments and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operate in a particular orientation.

It will be further understood that "connected" includes both direct connection where no other member is present and indirect connection where other element is present, unless specifically stated otherwise.

It will be further understood that although operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. In certain circumstances, multitasking and parallel processing may be advantageous.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the scope of the appended claims.

Claims (10)

1. A center assembly for a terminal device, comprising:

the middle frame body, the middle frame body includes: a bottom plate and a side plate arranged on the periphery of the bottom plate;

a functional module provided on the center body and spaced apart from the bottom plate in a thickness direction of the terminal device to form a first heat conduction gap;

the first heat conduction piece is arranged in the first heat conduction gap, and the first heat conduction piece is connected with the functional module and the bottom plate so as to transfer heat of the functional module to the middle frame body.

2. The center assembly for a terminal device of claim 1,

the functional module is mounted on the center body by a mounting member, at least a portion of which is spaced apart from the bottom plate in a thickness direction of the terminal device to form the first heat conduction gap.

3. A center assembly for a terminal device according to claim 2, wherein,

the mount includes: and the first plate part is connected with the functional module, the first plate part and the bottom plate are spaced apart in the thickness direction of the terminal equipment to form the first heat conduction gap, and the first heat conduction piece is connected with the first plate part and the bottom plate.

4. A center assembly for a terminal device according to claim 3, wherein,

the mount further comprises: and a second plate portion formed on an edge of the first plate portion away from the side plate and extending in a thickness direction of the terminal device, the second plate portion and the first plate portion defining an accommodation space accommodating the functional module.

5. The center assembly for a terminal device of claim 4,

the second plate portion is spaced apart from the functional module to form a second thermally conductive gap;

the middle frame assembly further comprises: the second heat conduction piece is arranged in the second heat conduction gap, and the second heat conduction piece is connected with the second plate part and the functional module.

6. The center assembly for a terminal device of claim 5, further comprising:

the third heat conduction piece is connected with the side surface of the second plate part far away from the side plate, and the third heat conduction piece is suitable for transferring heat on the second plate part to the middle frame body.

7. The center assembly for a terminal device of claim 6, wherein,

a partition plate extending in the thickness direction of the terminal equipment is arranged on the bottom plate, and the partition plate is positioned on one side of the second plate part far away from the side plate and is spaced from the second plate part so as to form a third heat conduction gap;

the third heat conduction piece is arranged in the third heat conduction gap, and the third heat conduction piece is connected with the partition plate and the second plate part.

8. The center assembly for a terminal device of claim 7,

at least one of the first heat conductive member, the second heat conductive member, and the third heat conductive member is configured as a flexible member; and/or the number of the groups of groups,

at least one of the first heat conductive member, the second heat conductive member, and the third heat conductive member is configured as a heat conductive silicone grease or a heat conductive silicone gel.

9. A center assembly for a terminal device according to claim 2, wherein,

the middle frame body is provided with a mounting boss, the mounting piece is provided with mounting support legs, and the mounting support legs are fixed on the mounting boss through fasteners.

10. A terminal device, comprising: a mid-frame assembly for a terminal device as claimed in any one of claims 1 to 9.

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