CN219228169U - Circuit board with heat radiation structure - Google Patents
Circuit board with heat radiation structure Download PDFInfo
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- CN219228169U CN219228169U CN202223425810.0U CN202223425810U CN219228169U CN 219228169 U CN219228169 U CN 219228169U CN 202223425810 U CN202223425810 U CN 202223425810U CN 219228169 U CN219228169 U CN 219228169U
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- circuit board
- heat
- heat dissipation
- fixedly connected
- heat radiation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model discloses a circuit board with a heat radiation structure, which comprises a bottom plate, wherein an adjusting mechanism is arranged on the surface of the bottom plate, a supporting block is fixedly connected to the output end of the adjusting mechanism, a clamping mechanism is arranged on the top surface of the supporting block, the heat radiation mechanism is arranged on the top surface of the bottom plate, the circuit board is arranged at the output end of the clamping mechanism, a heat conducting layer is fixedly arranged on the bottom surface of the circuit board, and heat conducting silicone grease is fixedly connected to the bottom surface of the heat conducting layer. The heat generated by the circuit board can be conducted through the heat conduction layer and the heat conduction silicone grease, heat is dissipated through the heat dissipation plate, the heat generated by the circuit board is conveniently led out through the heat dissipation holes and the heat dissipation column, the heat generated by the circuit board is volatilized, the heat dissipation fan is driven to rotate through the rotation of the output end of the heat dissipation motor, the circuit board is cooled in an air cooling mode, the flow of hot air can be driven, multiple efficient heat dissipation of the circuit board is realized, and the heat dissipation efficiency is improved.
Description
Technical Field
The present disclosure relates to circuit boards, and particularly to a circuit board with a heat dissipation structure.
Background
The circuit board is an important electronic component, is an important component of various electronic products, is applied to various fields along with the development of society, has higher requirements on the circuit board, and is often carried in a multilayer circuit board mode due to the fact that more and more electronic components are arranged on the circuit board, but the multilayer circuit board is generally unfavorable for heat dissipation, and is easy to cause overhigh internal temperature of the circuit board and influence the use of the electronic components after long-time use.
The existing heat dissipation measures of the electronic circuit board generally adopt through holes for heat dissipation or match with a heat dissipation plate for heat dissipation, so that the flow of hot air can not be rapidly and uniformly driven, the heat dissipation efficiency is reduced, and when circuit boards with different sizes and different shapes are installed, the circuit boards can not be well fixed, the circuit boards are inconvenient to install and detach, and the electronic circuit board has certain limitations.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model provides a circuit board with a heat dissipation structure, which solves the problems in the background art.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the utility model provides a circuit board with heat radiation structure, includes the bottom plate, the surface of bottom plate is provided with adjustment mechanism, adjustment mechanism's output fixedly connected with supporting shoe, the top surface of supporting shoe is provided with clamping mechanism, the top surface of bottom plate is provided with heat radiation mechanism, the clamping mechanism output is provided with the circuit board, the bottom surface fixed mounting of circuit board has the heat conduction layer, the bottom surface fixedly connected with heat conduction silicone grease of heat conduction layer, the bottom surface fixedly connected with heating panel of heat conduction silicone grease, the louvre has been seted up on the surface of circuit board, the fixed surface of circuit board installs the heat dissipation post.
Preferably, adjustment mechanism includes two-way lead screw, carousel and slider, the inside rotation of bottom plate is installed two-way lead screw, the one end fixedly connected with carousel of two-way lead screw, the surface screw thread of two-way lead screw installs the slider, through adjustment mechanism's setting, is convenient for adjust the distance between two sets of anchor clamps, is convenient for fix the circuit board of equidimension not.
Preferably, a sliding groove is formed in the surface of the bottom plate, the sliding block is in sliding connection in the sliding groove, and the bidirectional screw rod is driven to rotate by rotating the turntable, so that the sliding block is driven to slide in the sliding groove.
Preferably, the clamping mechanism comprises a clamp, a spring and a pressing plate, wherein the top surface of the supporting block is fixedly connected with the clamp, the surface of the clamp is fixedly connected with the spring, the bottom end of the spring is fixedly connected with the pressing plate, and the circuit board is conveniently fixed through the arrangement of the clamping mechanism.
Preferably, the quantity of the springs is set into a plurality of groups, and the bottom surface of the pressing plate is fixedly connected with a rubber pad, so that the circuit board can be prevented from being damaged when the circuit board is clamped through the arrangement of the rubber pad.
Preferably, the heat dissipation mechanism comprises a shell, a heat dissipation motor and a heat dissipation fan, the shell is fixedly arranged on the top surface of the bottom plate, the heat dissipation motor is fixedly arranged in the shell, the heat dissipation fan is fixedly arranged at the output end of the heat dissipation motor, and the heat dissipation mechanism can drive the flow of hot air and improve the heat dissipation efficiency.
Preferably, the through hole has been seted up on the surface of casing, just the top surface fixed mounting of casing has the filter screen, through the setting of filter screen, can filter the dust in the air, avoids blowing in the dust on the circuit board.
Compared with the prior art, the utility model has the beneficial effects that: this circuit board with heat radiation structure, through adjustment mechanism's setting, drive the supporting shoe and remove, and then adjust the distance between two sets of anchor clamps, place the surface of anchor clamps with the circuit board, under the effect of spring, promote the clamp plate, the circuit board is fixed with dismantling, the heat that produces the circuit board through the setting of heat conduction layer and heat conduction silicone grease is conducted through the heating panel, be convenient for derive the heat that the circuit board is inside to produce through louvre and the setting of heat dissipation post, and then volatilize inside heat, rotate through the output of heat dissipation motor and drive the heat dissipation fan and rotate, dispel the heat to the circuit board with the air-cooled mode, can drive the flow of hot air, realize the multiple high-efficient heat dissipation to the circuit board, improve radiating efficiency.
Drawings
FIG. 1 is a schematic illustration of the structure of the present utility model;
FIG. 2 is a schematic view of a first cross-sectional view of the present utility model;
fig. 3 is a schematic structural view of a second cross-sectional view of the present utility model.
In the figure: 1. a bottom plate; 2. a bidirectional screw rod; 3. a turntable; 4. a slide block; 5. a support block; 6. a clamp; 7. a spring; 8. a pressing plate; 9. a rubber pad; 10. a housing; 11. a through hole; 12. a heat dissipation motor; 13. a heat dissipation fan; 14. a filter screen; 15. a circuit board; 16. a heat conducting layer; 17. heat conductive silicone grease; 18. a heat dissipation plate; 19. a heat radiation hole; 20. and a heat radiation column.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Examples: referring to fig. 1-3, the utility model provides a technical scheme, a circuit board with a heat radiation structure, which comprises a bottom plate 1, wherein an adjusting mechanism is arranged on the surface of the bottom plate 1, the adjusting mechanism comprises a bidirectional screw rod 2, a turntable 3 and a sliding block 4, the bidirectional screw rod 2 is rotatably arranged in the bottom plate 1, one end of the bidirectional screw rod 2 is fixedly connected with the turntable 3, the sliding block 4 is arranged on the surface thread of the bidirectional screw rod 2, the distance between two groups of clamps 6 is conveniently adjusted by the arrangement of the adjusting mechanism, the circuit boards 15 with different sizes are conveniently fixed, sliding grooves are formed on the surface of the bottom plate 1, the sliding block 4 is in sliding connection in the sliding grooves, the bidirectional screw rod 2 is driven to rotate by rotating the turntable 3, the sliding block 4 is driven to slide in the sliding grooves, a supporting block 5 is fixedly connected to the output end of the adjusting mechanism, a clamping mechanism is arranged on the top surface of the supporting block 5, the clamping mechanism comprises a clamp 6, a spring 7 and a pressing plate 8, the top surface of the supporting block 5 is fixedly connected with the clamp 6, the surface of the clamp 6 is fixedly connected with the spring 7, the bottom end of the spring 7 is fixedly connected with the pressing plate 8, the circuit board 15 is convenient to fix through the arrangement of the clamping mechanism, the number of the springs 7 is multiple, the bottom surface of the pressing plate 8 is fixedly connected with a rubber pad 9, when the circuit board 15 is clamped through the arrangement of the rubber pad 9, the circuit board 15 is prevented from being damaged, the top surface of the bottom plate 1 is provided with a heat dissipation mechanism, the heat dissipation mechanism comprises a shell 10, a heat dissipation motor 12 and a heat dissipation fan 13, the shell 10 is fixedly arranged on the top surface of the bottom plate 1, the heat dissipation motor 12 is fixedly arranged in the shell 10, the heat dissipation fan 13 is fixedly arranged at the output end of the heat dissipation motor 12, and the heat dissipation mechanism can drive the flow of hot air through the arrangement of the heat dissipation mechanism, the heat dissipation efficiency is improved, through-hole 11 has been seted up on the surface of casing 10, and the top surface fixed mounting of casing 10 has filter screen 14, through the setting of filter screen 14, can filter the dust in the air, avoid blowing in the dust on circuit board 15, clamping mechanism output is provided with circuit board 15, circuit board 15's bottom surface fixed mounting has heat conduction layer 16, heat conduction layer 16's bottom surface fixedly connected with heat conduction silicone grease 17, heat dissipation hole 19 has been seted up to heat dissipation hole 17's bottom surface fixed connection of heat conduction silicone grease 17's bottom surface heating panel 18, circuit board 15's fixed mounting has heat dissipation post 20, through adjustment mechanism's setting, drive supporting shoe 5 and remove, and then adjust the distance between two sets of anchor clamps 6, place the surface of anchor clamps 6 with circuit board 15, under spring 7's effect, promote clamp plate 8, circuit board 15 is fixed, be convenient for install and dismantle circuit board 15, can conduct the heat that circuit board 15 produced through heat conduction layer 16 and heat conduction silicone grease 17's setting, through heat dissipation hole 19 and post 20, be convenient for with the inside heat dissipation hole 15 produces the motor, the inside heat dissipation hole 12, and heat dissipation efficiency is carried out by the motor, and the heat dissipation fan is carried out by the heat dissipation plate 15 under the effect of spring 7, the effect is realized, the heat dissipation efficiency is high is realized, the heat dissipation efficiency is realized, and the heat dissipation efficiency is increased.
When in use: through rotating carousel 3, drive bi-directional lead screw 2 and rotate, and then drive slider 4 and slide in the spout, drive supporting shoe 5 and remove, and then adjust the distance between two sets of anchor clamps 6, place anchor clamps 6's surface with circuit board 15, under spring 7's effect, promote clamp plate 8, fix circuit board 15, be convenient for install and dismantle circuit board 15, the heat that can produce circuit board 15 through setting up of heat conduction layer 16 and heat conduction silicone grease 17 is conducted, dispel the heat through heating panel 18, the setting through louvre 19 and heat dissipation post 20, be convenient for export the heat that the circuit board 15 is inside, and then volatilize inside heat, rotate through the output of heat dissipation motor 12 and drive heat dissipation fan 13 and rotate, dispel the heat to circuit board 15 with the air-cooled mode, can drive the flow of hot air, realize the multiple high-efficient heat dissipation to circuit board 15, improve the radiating efficiency.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a circuit board with heat radiation structure, includes the bottom plate, its characterized in that, the surface of bottom plate is provided with adjustment mechanism, adjustment mechanism's output fixedly connected with supporting shoe, the top surface of supporting shoe is provided with clamping mechanism, the top surface of bottom plate is provided with heat dissipation mechanism, the clamping mechanism output is provided with the circuit board, the bottom surface fixed mounting of circuit board has the heat conduction layer, the bottom surface fixedly connected with heat conduction silicone grease of heat conduction layer, the bottom surface fixedly connected with heating panel of heat conduction silicone grease, the louvre has been seted up on the surface of circuit board, the fixed surface of circuit board installs the heat dissipation post.
2. The circuit board with the heat radiation structure according to claim 1, wherein the adjusting mechanism comprises a bidirectional screw, a rotary table and a sliding block, the bidirectional screw is rotatably installed in the bottom plate, one end of the bidirectional screw is fixedly connected with the rotary table, and the sliding block is installed on the surface thread of the bidirectional screw.
3. The circuit board with the heat dissipation structure according to claim 2, wherein a chute is formed on the surface of the bottom plate, and the sliding block is slidably connected in the chute.
4. The circuit board with the heat radiation structure according to claim 1, wherein the clamping mechanism comprises a clamp, a spring and a pressing plate, the top surface of the supporting block is fixedly connected with the clamp, the surface of the clamp is fixedly connected with the spring, and the bottom end of the spring is fixedly connected with the pressing plate.
5. The circuit board with the heat dissipation structure according to claim 4, wherein the number of the springs is multiple, and a rubber pad is fixedly connected to the bottom surface of the pressing plate.
6. The circuit board with the heat radiation structure according to claim 1, wherein the heat radiation mechanism comprises a casing, a heat radiation motor and a heat radiation fan, the casing is fixedly arranged on the top surface of the bottom plate, the heat radiation motor is fixedly arranged in the casing, and the heat radiation fan is fixedly arranged at the output end of the heat radiation motor.
7. The circuit board with the heat dissipation structure according to claim 6, wherein the surface of the housing is provided with a through hole, and the top surface of the housing is fixedly provided with a filter screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223425810.0U CN219228169U (en) | 2022-12-20 | 2022-12-20 | Circuit board with heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223425810.0U CN219228169U (en) | 2022-12-20 | 2022-12-20 | Circuit board with heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219228169U true CN219228169U (en) | 2023-06-20 |
Family
ID=86741499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223425810.0U Active CN219228169U (en) | 2022-12-20 | 2022-12-20 | Circuit board with heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219228169U (en) |
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2022
- 2022-12-20 CN CN202223425810.0U patent/CN219228169U/en active Active
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