CN219227935U - Flexible circuit board and display module - Google Patents
Flexible circuit board and display module Download PDFInfo
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- CN219227935U CN219227935U CN202223465051.0U CN202223465051U CN219227935U CN 219227935 U CN219227935 U CN 219227935U CN 202223465051 U CN202223465051 U CN 202223465051U CN 219227935 U CN219227935 U CN 219227935U
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- circuit board
- flexible circuit
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- conductive layer
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Abstract
The utility model discloses a flexible circuit board and a display module, wherein the display module comprises a flexible circuit board, the flexible circuit board comprises a substrate, a conductive layer and an insulating layer which are arranged in a laminated mode, the conductive layer is covered on one side of the substrate, the insulating layer is covered on one side, far away from the substrate, of the conductive layer, a first bending area is formed on the substrate, a second bending area and a third bending area are formed on the conductive layer and the insulating layer corresponding to the bending areas respectively, and at least one of the second bending area and the third bending area is provided with a groove. The flexible circuit board provided by the utility model can improve the flexibility of the circuit board and reduce the possibility of damage to the internal circuit of the flexible circuit board in the bending state while ensuring the strength of the bending area of the flexible circuit board.
Description
Technical Field
The utility model relates to the technical field of automobile parts, in particular to a flexible circuit board and a display module.
Background
The flexible circuit board is also called FPC (FlexiblePrintedCircuit), and generally comprises an insulating substrate and a printed circuit arranged on the substrate, and a flexible circuit board connected with one end of the backlight module is generally included in a display module in electronic equipment such as a mobile phone, and the flexible circuit board is generally connected with one end of the backlight module and needs to be bent and arranged on one side of the backlight module.
In the whole mobile phone assembly process, the flexible circuit board faces the requirement of continuously bending by 90 degrees, certain test is carried out on the flexibility of the bending position, the internal circuit is possibly damaged by bending for a long time and the flexible circuit board has a certain flexible effect, but if the FPC is forced to be bent into a smaller bending radius by a mounting machine, the FPC cannot be restored, even dead bending occurs, and adverse effects are caused on the stability and reliability of the internal circuit.
Disclosure of Invention
The utility model mainly aims to provide the flexible circuit board and the display module, which can improve the flexibility of the circuit board and reduce the possibility of damaging the internal circuit of the flexible circuit board in a bending state while ensuring the strength of the bending area of the flexible circuit board.
In order to achieve the above object, the present utility model provides a flexible circuit board, which includes a substrate, a conductive layer and an insulating layer, wherein the substrate, the conductive layer and the insulating layer are stacked, the conductive layer is covered on one side of the substrate, the insulating layer is covered on one side of the conductive layer away from the substrate, a first bending region is formed on the substrate, a second bending region and a third bending region are formed on the conductive layer and the insulating layer corresponding to the bending regions respectively, and at least one of the second bending region and the third bending region is provided with a groove.
Optionally, a side surface portion of the third inflection region remote from the second inflection region is concave and penetrates into the conductive layer to form the groove.
Optionally, the grooves are filled with an insulating material to cover the conductive layer.
Optionally, the insulating material is ink.
Optionally, the third bending region is provided with a plurality of grooves at intervals.
Optionally, the plurality of grooves are arranged at intervals in the third bending region along the length direction of the substrate; or, the grooves are arranged in the third bending region at intervals along the width direction of the substrate; or, the plurality of groove arrays are distributed in the third bending area.
Optionally, the projection of the groove on the substrate along the thickness direction of the substrate is a parallelogram structure.
Optionally, two adjacent edges of the groove extend along the length direction of the substrate and the width direction of the substrate, respectively.
Optionally, the projection of the grooves on the substrate along the thickness direction of the substrate is a crisscross net structure.
The utility model further provides a display module, which comprises a flexible circuit board, wherein the flexible circuit board comprises a substrate, a conductive layer and an insulating layer which are arranged in a laminated mode, the conductive layer is covered on one side of the substrate, the insulating layer is covered on one side, far away from the substrate, of the conductive layer, a first bending area is formed on the substrate, a second bending area and a third bending area are formed on the conductive layer and the insulating layer, corresponding to the bending areas, respectively, and at least one of the second bending area and the third bending area is provided with a groove.
According to the flexible circuit board provided by the utility model, the conductive layer (generally copper) and/or the insulating layer (generally the covering film) are provided with the groove structures in the areas needing bending, so that the flexible and bendable effects of the bending areas can be increased, the flexible circuit board can have the bending capacity with smaller bending radius, the reliability and stability of an internal circuit can be ensured, and meanwhile, the groove structures are supported by taking the original conductive layer and/or the insulating layer as a framework, so that the strength effect is better compared with that of the traditional flexible circuit board which is covered by ink only, the appearance of the flexible circuit board is not easy to change after the flexible circuit board is bent to a fixed angle or direction, and further the flexible circuit board is easier to operate during storage, transportation, cutting or process operation (such as welding and pulling and inserting) is ensured.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a flexible circuit board according to a first embodiment of the present utility model;
FIG. 2 is a schematic diagram of a cover film and a groove in a second embodiment of a flexible circuit board according to the present utility model;
FIG. 3 is a side view of FIG. 2;
FIG. 4 is a schematic view of a cover film and a recess of a flexible circuit board according to a third embodiment of the present utility model;
FIG. 5 is a schematic view of a cover film and a groove in a fourth embodiment of a flexible circuit board according to the present utility model;
FIG. 6 is a schematic view of a cover film and a groove in a fifth embodiment of a flexible circuit board according to the present utility model;
reference numerals illustrate:
| reference numerals | Name of the name | Reference numerals | Name of the |
| 100 | |
3 | |
| 1 | |
4 | |
| 2 | |
5 | Insulating material |
The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.
The flexible circuit board is also called FPC (FlexiblePrintedCircuit), and generally comprises an insulating substrate and a printed circuit arranged on the substrate, and a flexible circuit board connected with one end of the backlight module is generally included in a display module in electronic equipment such as a mobile phone, and the flexible circuit board is generally connected with one end of the backlight module and needs to be bent and arranged on one side of the backlight module.
In the whole mobile phone assembly process, the flexible circuit board faces the requirement of continuously bending by 90 degrees, certain test is carried out on the flexibility of the bending position, the internal circuit is possibly damaged by bending for a long time and the flexible circuit board has a certain flexible effect, but if the FPC is forced to be bent into a smaller bending radius by a mounting machine, the FPC cannot be restored, even dead bending occurs, and adverse effects are caused on the stability and reliability of the internal circuit.
In view of this, the present utility model provides a flexible circuit board 100 and a display module, which can improve the flexibility of the circuit board and reduce the possibility of damage to the internal circuit of the flexible circuit board 100 due to the bending state while ensuring the strength of the bending region of the flexible circuit board 100. Fig. 1-6 illustrate several embodiments of a flexible circuit board 100 according to the present utility model.
The utility model discloses a flexible circuit board 100, wherein the flexible circuit board 100 comprises a substrate 1, a conductive layer 2 and an insulating layer 3 which are arranged in a stacked manner, the conductive layer 2 is covered on one side of the substrate 1, the insulating layer 3 is covered on one side of the conductive layer 2 far away from the substrate 1, a first bending region is formed on the substrate 1, a second bending region and a third bending region are respectively formed on the conductive layer 2 and the insulating layer 3 corresponding to the bending regions, and at least one of the second bending region and the third bending region is provided with a groove 4.
According to the flexible circuit board 100 provided by the utility model, the conductive layer 2 (generally copper) and/or the insulating layer 3 (generally a covering film) are provided with the groove 4 structure in the area needing bending, so that the flexible and bendable effect of the bending area can be increased, the flexible circuit board 100 has the bending capability of smaller bending radius, the reliability and stability of an internal circuit can be ensured, and meanwhile, the groove 4 structure is supported by taking the original conductive layer 2 and/or the insulating layer 3 as a framework, so that the strength effect is better compared with the strength effect of covering only by using ink in the prior art, the appearance of the flexible circuit board 100 can be kept unchanged after the flexible circuit board 100 is bent to a fixed angle or direction, and further the flexible circuit board 100 is ensured to be easier to operate during storage, transportation, cutting or process operation (such as welding and pulling-in).
It should be noted that, in an embodiment, the grooves 4 may be disposed in the second bending region, that is, the grooves 4 are formed on the surface of the conductive layer 2, and the conductive layer 2 (typically, a copper layer) is generally used as a circuit layout, so that the grooves 4 may be disposed through or not through, so as not to affect the conductive performance of the conductive layer 2, and in this embodiment, an insulating material 5 of ink or other materials needs to be applied in the grooved region to protect the conductive layer 2.
In order to avoid slotting on the conductive layer 2 to reduce the space for circuit layout, in other embodiments, the groove 4 may be disposed in the third bending region, that is, the groove 4 is formed on the surface of the insulating layer 3 (typically, a cover film), and since the insulating layer 3 needs to be used as a protective cover of the conductive layer 2 to prevent dust, dirt, and static electricity, the circuit of the conductive layer 2 is prevented from being oxidized and corroded when the groove 4 is formed, the following two cases need to be more noted:
if the groove 4 is disposed through the insulating layer 3, that is, as shown in fig. 3, a side surface portion of the third bending region away from the second bending region is concave and penetrates to the conductive layer to form the groove 4, then a portion of the conductive layer 2 is exposed in the grooved region, in order to avoid oxidation and damage of the conductive layer 2, an additional insulating material 5 needs to be filled in the grooved region to cover the conductive layer 2, the insulating material 5 may be a thermosetting polyimide material or a solder resist ink material with better bending performance than that of the insulating layer 3 (typically a polyimide material), preferably, the insulating material 5 is ink, and the ink has better plasticity and can be sufficiently adhered in the groove 4 and on the conductive layer 2.
If the groove 4 does not penetrate through the insulating layer 3, that is, a side surface portion of the third bending region away from the second bending region is recessed above the second bending region to form the groove 4, in this case, the opening of the groove 4 does not result in the exposure of the conductive region, so that no other treatment may be performed in the grooved region, but in order to avoid the reduction of the protective effect of the insulating layer 3 due to the reduction of the thickness of the insulating layer 3 at the grooved region, the groove wall of the groove 4 may be additionally covered with the insulating material 5, and the specific material may refer to the above, so that the overall strength of the flexible circuit board 100 is better, but the flexibility may be reduced.
It can be seen that the arrangement of the grooves 4 is not exclusive and that various embodiments are possible according to specific requirements and specific designs, so that no specific provision is made here for the arrangement of the grooves 4.
In order to further improve the bending capability of the flexible circuit board 100, the third bending area is provided with a plurality of grooves 4 at intervals, and the plurality of grooves 4 are provided, so that stress can be uniformly dispersed, and the occurrence of stress concentration can be prevented, so that the situation that the structure is damaged or broken during bending is avoided.
In order to further avoid stress concentration in the bending region of the insulating layer 3, the shape structure of the groove 4 may be determined according to the direction in which the flexible circuit board 100 needs to be bent (in the drawing, the dashed line portion is the extending direction of the crease line in the bending process), please refer to fig. 4, in the third embodiment of the present utility model, the projection of the groove 4 on the substrate 1 along the thickness direction of the substrate 1 is a parallelogram structure, specifically, two adjacent sides of the parallelogram are respectively parallel to the length direction of the substrate 1 and the extending direction of the crease line formed during bending, for example, please refer to fig. 2, when one end of the flexible circuit board 100 is folded 180 degrees in half, the crease line direction formed during bending is the width direction of the flexible circuit board 100, at this time, the two adjacent sides of the groove 4 are respectively extended along the length direction of the substrate 1 and the width direction of the substrate 1, when the bending direction of the flexible circuit board 100 has an angle, the groove 4 arranged in such a manner can be dispersed along the same direction, so that the bending angle of the flexible circuit board 100 can be increased, and the bending performance of the flexible circuit board can be improved.
It can be appreciated that the arrangement manner of the plurality of grooves 4 is various, and in one embodiment, the plurality of grooves 4 are disposed at intervals in the third bending region along the length direction of the substrate 1; in another embodiment, the plurality of grooves 4 are disposed at intervals along the width direction of the substrate 1 in the third bending region; in a fourth embodiment of the present utility model, as shown in fig. 5, a plurality of the grooves 4 are distributed in the third bending region in an array. Wherein the interval between two grooves 4 and the width or length of a single groove 4 are related to the strength and bendability to be balanced, if the flexible circuit board 100 needs to be strong, the width and/or length of the groove 4 may be appropriately long, the interval between the grooves 4 and 4 may be appropriately short, if the flexible circuit board 100 needs to be strong, the width and/or length of the groove 4 may be appropriately short, and the interval between the grooves 4 and 4 may be appropriately long, without being particularly limited in the present utility model.
Of course, in other embodiments, as shown in fig. 6, the projection of the grooves 4 on the substrate 1 along the thickness direction of the substrate 1 is a crisscross network structure, including a crisscross network structure or even a rice-shaped network structure with different angles, that is, a plurality of strip-shaped grooves are criss-cross arranged, which also can play a role in reducing stress concentration, so as to prevent breakage during bending.
The utility model also provides a display module, which comprises the flexible circuit board 100, wherein the specific structure of the flexible circuit board 100 refers to the above embodiment, and since the flexible circuit board 100 adopts all the technical solutions of the above embodiment, at least the display module has all the beneficial effects brought by the technical solutions of the above embodiment, and the details are not repeated here.
The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.
Claims (10)
1. The flexible circuit board is characterized by comprising a substrate, a conductive layer and an insulating layer, wherein the substrate, the conductive layer and the insulating layer are arranged in a stacked mode, the conductive layer is covered on one side of the substrate, the insulating layer is covered on one side, away from the substrate, of the conductive layer, a first bending area is formed on the substrate, the conductive layer and the insulating layer correspond to the bending area, a second bending area and a third bending area are formed on the substrate respectively, and at least one of the second bending area and the third bending area is provided with a groove.
2. The flexible circuit board of claim 1, wherein a side surface portion of the third flex region remote from the second flex region is recessed and extends through to the conductive layer to form the recess.
3. The flexible circuit board of claim 2 wherein the recess is filled with an insulating material to cover the conductive layer.
4. A flexible circuit board according to claim 3, wherein the insulating material is ink.
5. The flexible circuit board of claim 2 wherein said third flex region is provided with a plurality of said grooves in spaced relation.
6. The flexible circuit board of claim 5 wherein a plurality of said recesses are spaced apart along the length of said substrate in said third bending region; or, the grooves are arranged in the third bending region at intervals along the width direction of the substrate; or, the plurality of groove arrays are distributed in the third bending area.
7. The flexible circuit board of claim 2, wherein the projection of the groove onto the substrate in the thickness direction of the substrate is a parallelogram structure.
8. The flexible circuit board of claim 7, wherein two adjacent sides of the recess extend along a length direction of the substrate and a width direction of the substrate, respectively.
9. The flexible circuit board of claim 2 wherein the grooves are projected onto the substrate in a thickness direction of the substrate as a crisscross network.
10. A display module comprising a flexible circuit board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223465051.0U CN219227935U (en) | 2022-12-22 | 2022-12-22 | Flexible circuit board and display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223465051.0U CN219227935U (en) | 2022-12-22 | 2022-12-22 | Flexible circuit board and display module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219227935U true CN219227935U (en) | 2023-06-20 |
Family
ID=86758754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223465051.0U Active CN219227935U (en) | 2022-12-22 | 2022-12-22 | Flexible circuit board and display module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219227935U (en) |
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2022
- 2022-12-22 CN CN202223465051.0U patent/CN219227935U/en active Active
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