CN219227423U - Power chip capable of resisting electromagnetic interference - Google Patents

Power chip capable of resisting electromagnetic interference Download PDF

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Publication number
CN219227423U
CN219227423U CN202320149597.0U CN202320149597U CN219227423U CN 219227423 U CN219227423 U CN 219227423U CN 202320149597 U CN202320149597 U CN 202320149597U CN 219227423 U CN219227423 U CN 219227423U
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China
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power chip
cover
fixedly connected
heat dissipation
electromagnetic interference
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CN202320149597.0U
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Chinese (zh)
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易双良
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Shenzhen Dexinor Technology Co ltd
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Shenzhen Dexinor Technology Co ltd
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Priority to CN202320149597.0U priority Critical patent/CN219227423U/en
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Abstract

The utility model discloses an anti-electromagnetic interference power chip, which relates to the technical field of power chips and comprises a mounting frame, a power chip body and a partition cover, wherein the bottom of the mounting frame is fixedly connected with a supporting structure, the outer wall of the mounting frame is fixedly connected with a concave block, the inner wall of the mounting frame is fixedly connected with a heat dissipation screen plate, the top of the heat dissipation screen plate is provided with a fixing support column, and the power chip body is arranged at the top of the fixing support column. This but anti-electromagnetic interference's power chip through set up the partition cover in the outside of power chip body to cut off cover internally mounted and inhale the wave plate, make power chip have good anti-electromagnetic interference performance, and unsettled the installing of power chip on the heat dissipation otter board through the fixed stay, avoid power chip bottom heat to store up, cooperate motor and radiator fan again, form the wind that flows, will cut off the heat of storing up in the cover and follow fast and play the bottom and dispel the heat, reach good radiating effect.

Description

Power chip capable of resisting electromagnetic interference
Technical Field
The utility model relates to the technical field of power chips, in particular to an anti-electromagnetic interference power chip.
Background
The power chip is a necessary structure of most electronic devices, and is mainly used for providing stable voltage for each path of module circuit. The power chip is most commonly used for supplying power to a dust collecting circuit, and the integrated circuit is a miniature electronic device or component, and components such as transistors, resistors, capacitors, inductors and the like required in a circuit and wiring are interconnected together by adopting a certain process, and are manufactured on a small or several small semiconductor wafers or dielectric substrates, and then are packaged in a tube shell to form the miniature structure with the required circuit function. The current development of integrated circuits is miniaturization, in which the power chip is typically connected to the pins of the package housing by wires through contacts on the chip, which in turn establish connections with other devices through wires on the printed board.
However, the existing power chip still has some defects, such as poor anti-electromagnetic interference performance of the existing power chip, so that the power chip is easy to be interfered by other power elements in the use process, and the service life of the power chip is influenced due to the problems of unstable voltage, interruption of electric frequency and the like of the power chip caused by electromagnetic interference.
Therefore, there is an urgent need to improve the above-mentioned drawbacks, and the present utility model is directed to the present structure and the shortcomings of the prior art, and provides a power chip capable of resisting electromagnetic interference.
Disclosure of Invention
The present utility model is directed to a power chip capable of resisting electromagnetic interference, so as to solve the problems set forth in the background art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a but anti-electromagnetic interference's power chip, includes mounting bracket, power chip body and cuts off the cover, the bottom fixedly connected with bearing structure of mounting bracket, and the outer wall fixedly connected with spill piece of mounting bracket to the inner wall fixedly connected with heat dissipation otter board of mounting bracket, the fixed stay is installed at the top of fixed stay to the top of heat dissipation otter board moreover, and the outer wall fixedly connected with pin of power chip body, the outside at power chip body is established to the cover that cuts off, and cuts off the interior roof fixed mounting of cover has the wave plate of inhaling to the inner wall fixedly connected with convex piece of cover, the inner wall fixedly connected with mount pad of cover, and the internally mounted of mount pad has the motor to the output shaft of motor passes through the coupling joint and has the radiator fan.
Further, bearing structure is including bracing piece, fixed plate and fastening bolt, and the bottom fixedly connected with fixed plate of bracing piece to the top threaded connection of fixed plate has fastening bolt, and fastening bolt runs through with the fixed plate and links to each other moreover.
Further, the top of bracing piece links to each other with the bottom welding of mounting bracket, and the bottom of bracing piece links to each other with the top welding of fixed plate to mounting bracket, bracing piece and fixed plate constitute integrated structure.
Further, the fixed support posts are arranged at the top of the heat dissipation screen plate in a rectangular array, and the fixed support posts are arranged in the mounting frame through the heat dissipation screen plate.
Further, the fixed support column is arranged between the heat dissipation screen plate and the power chip body, the bottom end of the fixed support column is fixedly connected with the top of the heat dissipation screen plate, and the top end of the fixed support column is movably connected with the bottom of the power chip body.
Further, the power chip body is fixed on the inner side of the mounting frame through the heat dissipation screen plate and the fixing support, the outer wall of the power chip body is movably connected with and attached to the inner wall of the mounting frame, and the inner size of the mounting frame is completely matched with the outer size of the power chip body.
Further, the partition cover comprises a cover shell, an insulating coating and an anti-interference coating, wherein the insulating coating is arranged on the outer wall of the cover shell, the anti-interference coating is arranged on the inner wall of the cover shell, and the insulating coating, the cover shell and the anti-interference coating are sequentially arranged on the partition cover from outside to inside.
Further, the partition cover is kept connected with the mounting frame through the convex block and the concave block, the concave block and the convex block form a clamping structure, and the shape and the size of the convex block are matched with those of the concave block.
The utility model provides a power chip capable of resisting electromagnetic interference, which has the following beneficial effects: this but anti-electromagnetic interference's power chip through set up the partition cover in the outside of power chip body to cut off cover internally mounted and inhale the wave plate, make power chip have good anti-electromagnetic interference performance, and unsettled the installing of power chip on the heat dissipation otter board through the fixed stay, avoid power chip bottom heat to store up, cooperate motor and radiator fan again, form the wind that flows, will cut off the heat of storing up in the cover and follow fast and play the bottom and dispel the heat, reach good radiating effect.
1. The utility model is provided with the partition cover outside the power chip body, can block electromagnetic radiation, has the effect of isolating and protecting, and is provided with the wave absorbing plate, can absorb the electromagnetic radiation entering the partition cover, in addition, the motor and the heat radiating fan radiate, so that electromagnetic interference among all module circuits caused by high-temperature environment is reduced, the improved power chip has good electromagnetic interference resistance, the power chip is less interfered by other power elements in the use process, the problems of unstable voltage, electric frequency interruption and the like caused by electromagnetic interference are avoided, the use effect of the power chip is improved, the good protection effect is also achieved, and the service life of the power chip is prolonged.
2. The utility model is provided with the heat dissipation screen plate and the fixed support, so that the power chip body can be erected in the mounting frame in a suspended manner, the bottom of the power chip body is enhanced to dissipate heat, and the motor and the heat dissipation fan are matched, the motor drives the heat dissipation fan to rotate to form flowing wind, and the heat accumulated in the partition cover is dissipated, so that the improved power chip has good heat dissipation effect, and the heat accumulation after long-time use is avoided, thereby avoiding the damage of the power chip caused by overheat of elements, being difficult to activate an overheat protection mechanism, and reducing the power interruption caused by overheat protection.
Drawings
Fig. 1 is a schematic perspective view of an anti-electromagnetic interference power chip according to the present utility model;
FIG. 2 is a schematic diagram of a power chip with anti-electromagnetic interference function in a front cross-sectional structure according to the present utility model;
FIG. 3 is an enlarged schematic diagram of the structure A in FIG. 2 of a power chip capable of resisting electromagnetic interference according to the present utility model;
FIG. 4 is a schematic diagram showing a three-dimensional structure of a mounting frame-heat dissipating mesh plate of a power chip capable of resisting electromagnetic interference according to the present utility model;
fig. 5 is a schematic diagram of a partial front sectional structure of a shielding cover of a power chip capable of resisting electromagnetic interference according to the present utility model.
In the figure: 1. a mounting frame; 2. a support structure; 201. a support rod; 202. a fixing plate; 203. a fastening bolt; 3. a concave block; 4. a heat dissipation screen; 5. a fixed support; 6. a power chip body; 7. pins; 8. a partition cover; 801. a housing; 802. an insulating coating layer; 803. an anti-interference coating; 9. a wave absorbing plate; 10. a male block; 11. a mounting base; 12. a motor; 13. a heat dissipation fan.
Detailed Description
Embodiments of the present utility model are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the utility model but are not intended to limit the scope of the utility model.
As shown in fig. 1, fig. 2 and fig. 5, a power chip capable of resisting electromagnetic interference comprises a mounting rack 1, a power chip body 6 and a partition cover 8, wherein the bottom fixedly connected with supporting structure 2 of the mounting rack 1, and the outer wall fixedly connected with concave block 3 of the mounting rack 1, and the inner wall fixedly connected with heat dissipation screen 4 of the mounting rack 1, fixed support posts 5 are installed at the top of the heat dissipation screen 4, the power chip body 6 is installed at the top of the fixed support posts 5, and the outer wall fixedly connected with pins 7 of the power chip body 6, the partition cover 8 is covered outside the power chip body 6, the partition cover 8 comprises a cover 801, an insulating coating 802 and an anti-interference coating 803, the outer wall of the cover 801 is provided with the insulating coating 803, and the inner wall of the cover 801 is provided with the anti-interference coating 803, and the partition cover 8 is sequentially the insulating coating 802, the cover 801 and the anti-interference coating 803 from outside to inside, the effect of the partition cover 8 is enhanced, the electromagnetic radiation is prevented from penetrating the partition cover 8 and entering the inside, and the inner top wall fixedly installed with a suction 9, and the inner wall of the partition cover 8 is fixedly connected with a convex block 10 and a concave block 10 are arranged, the concave block 3 and a concave block 3 is matched with the concave block 3 and a concave block 3 is formed, the shape 3 and a concave block 3 is convenient to be matched with the shape 3, and a concave block 3 is formed.
As shown in fig. 1-5, the bottom of the mounting frame 1 is fixedly connected with a supporting structure 2, the supporting structure 2 comprises a supporting rod 201, a fixing plate 202 and a fastening bolt 203, the bottom end of the supporting rod 201 is fixedly connected with the fixing plate 202, the top thread of the fixing plate 202 is connected with the fastening bolt 203, the fastening bolt 203 is connected with the fixing plate 202 in a penetrating way, the mounting frame 1 can be suspended and fixed through the supporting structure 2, so that the bottom radiating effect of the mounting frame 1 is enhanced, the top end of the supporting rod 201 is connected with the bottom of the mounting frame 1 in a welding way, the bottom end of the supporting rod 201 is connected with the top of the fixing plate 202 in a welding way, the mounting frame 1, the supporting rod 201 and the fixing plate 202 form an integrated structure, the integrated design ensures that the connection between the structures is tighter, the structural stability is stronger, the outer wall of the mounting frame 1 is fixedly connected with a concave block 3, and the inner wall of the mounting frame 1 is fixedly connected with a heat radiation screen plate 4, the top of the heat radiation screen plate 4 is provided with a fixed support column 5, the fixed support column 5 is arranged at the top of the heat radiation screen plate 4 in a rectangular array, the fixed support column 5 is arranged in the mounting frame 1 through the heat radiation screen plate 4, the power chip body 6 is arranged at the top of the fixed support column 5, the fixed support column 5 is arranged between the heat radiation screen plate 4 and the power chip body 6, the bottom end of the fixed support column 5 is fixedly connected with the top of the heat radiation screen plate 4, the top end of the fixed support column 5 is movably connected with the bottom of the power chip body 6, the power chip body 6 is fixedly clamped at the inner side of the mounting frame 1 through the heat radiation screen plate 4 and the fixed support column 5, the outer wall of the power chip body 6 is movably connected and attached to the inner wall of the mounting frame 1, the inner size of the mounting frame 1 is completely matched with the outer size of the power chip body 6, through the heat dissipation otter board 4 and the fixed stay 5 that set up for power chip body 6 can unsettled the installation in the inboard of mounting bracket 1, has made things convenient for the bottom heat dissipation of power chip body 6, and the outer wall fixedly connected with pin 7 of power chip body 6, cuts off the cover 8 cover and establishes in the outside of power chip body 6, and cuts off the interior roof fixed mounting of cover 8 and have inhale wave plate 9, and the inner wall fixedly connected with convex piece 10 of cutting off the cover 8, the inner wall fixedly connected with mount pad 11 of cutting off the cover 8, and the internally mounted of mount pad 11 has motor 12, and the output shaft of motor 12 has radiator fan 13 through the coupling joint.
To sum up, this but anti-electromagnetic interference's power chip, firstly according to the structure shown in fig. 1-5, place the power chip body 6 on the fixed pillar 5 of mounting bracket 1 inside, then through inserting the inside concave piece 3 of convex piece 10 alignment mounting bracket 1 outside of wall cover 8, the installation of wall cover 8 is fixed in the power chip body 6 outside, the connection of power chip body 6 and other circuit elements is realized to the reuse pin 7, in the use, if other circuit elements produce electromagnetic interference, the outside wall cover 8 of power chip body 6 can cut off electromagnetic radiation, and wall cover 8 comprises housing 801, insulating coating 802 and anti-interference coating 803 triplex, the design of anti-interference coating 803 makes wall cover 8 have good anti-electromagnetic effect that cuts off, if still have electromagnetic radiation to get into the inside of wall cover 8, the inside wave absorbing plate 9 of wall cover 8 can absorb the electromagnetic radiation who gets into, simultaneously, motor 12 is through driving heat dissipation fan 13 rotatory production flow wind, can be with the heat of the interior wall cover 8 of wall cover from mounting bracket 1 and wall cover 8's bottom that the power chip body 6 is easy to hang down, and the problem is difficult for the bottom that the power chip body is hung in midair because the bottom is 6 is installed at the 6 through fixed at the bottom of the heat dissipation 6.
The embodiments of the utility model have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the utility model in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, and to enable others of ordinary skill in the art to understand the utility model for various embodiments with various modifications as are suited to the particular use contemplated.

Claims (8)

1. The utility model provides a but anti-electromagnetic interference's power chip, includes mounting bracket (1), power chip body (6) and cuts off cover (8), its characterized in that, the bottom fixedly connected with bearing structure (2) of mounting bracket (1), and the outer wall fixedly connected with concave block (3) of mounting bracket (1) to the inner wall fixedly connected with heat dissipation otter board (4) of mounting bracket (1), fixed stay (5) are installed at the top of heat dissipation otter board (4) moreover, the top at fixed stay (5) is installed in power chip body (6), and the outer wall fixedly connected with pin (7) of power chip body (6), cut off cover (8) cover is established in the outside of power chip body (6), and cuts off the inner roof fixed mounting of cover (8) and inhale wave plate (9) to the inner wall fixedly connected with convex piece (10) of cutting off cover (8), the inner wall fixedly connected with mount pad (11) of cutting off cover (8), and the internally mounted of mount pad (11) has motor (12) to the output shaft of motor (12) has heat dissipation fan (13) through the coupling.
2. The power chip of claim 1, wherein the supporting structure (2) comprises a supporting rod (201), a fixing plate (202) and a fastening bolt (203), the bottom end of the supporting rod (201) is fixedly connected with the fixing plate (202), the top thread of the fixing plate (202) is connected with the fastening bolt (203), and the fastening bolt (203) is connected with the fixing plate (202) in a penetrating way.
3. The power chip capable of resisting electromagnetic interference according to claim 2, wherein the top end of the supporting rod (201) is welded with the bottom of the mounting frame (1), the bottom end of the supporting rod (201) is welded with the top of the fixing plate (202), and the mounting frame (1), the supporting rod (201) and the fixing plate (202) form an integrated structure.
4. The power supply chip capable of resisting electromagnetic interference according to claim 1, wherein the fixing support posts (5) are arranged on the top of the heat dissipation screen plate (4) in a rectangular array, and the fixing support posts (5) are installed inside the installation frame (1) through the heat dissipation screen plate (4).
5. The power chip capable of resisting electromagnetic interference according to claim 1, wherein the fixing support (5) is arranged between the heat dissipation screen (4) and the power chip body (6), the bottom end of the fixing support (5) is fixedly connected with the top of the heat dissipation screen (4), and the top end of the fixing support (5) is movably connected with the bottom of the power chip body (6).
6. The power chip capable of resisting electromagnetic interference according to claim 1, wherein the power chip body (6) is fastened and fixed on the inner side of the mounting frame (1) through the heat dissipation screen plate (4) and the fixing support (5), the outer wall of the power chip body (6) is movably connected and attached to the inner wall of the mounting frame (1), and the inner size of the mounting frame (1) is completely matched with the outer size of the power chip body (6).
7. The power chip capable of resisting electromagnetic interference according to claim 1, wherein the isolating cover (8) comprises a cover shell (801), an insulating coating (802) and an anti-interference coating (803), the insulating coating (802) is arranged on the outer wall of the cover shell (801), the anti-interference coating (803) is arranged on the inner wall of the cover shell (801), and the insulating coating (802), the cover shell (801) and the anti-interference coating (803) are sequentially arranged on the isolating cover (8) from outside to inside.
8. The power chip capable of resisting electromagnetic interference according to claim 1, wherein the isolation cover (8) is kept connected with the mounting frame (1) through the convex block (10) and the concave block (3), the concave block (3) and the convex block (10) form a clamping structure, and the shape and the size of the convex block (10) are matched with those of the concave block (3).
CN202320149597.0U 2023-02-08 2023-02-08 Power chip capable of resisting electromagnetic interference Active CN219227423U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320149597.0U CN219227423U (en) 2023-02-08 2023-02-08 Power chip capable of resisting electromagnetic interference

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320149597.0U CN219227423U (en) 2023-02-08 2023-02-08 Power chip capable of resisting electromagnetic interference

Publications (1)

Publication Number Publication Date
CN219227423U true CN219227423U (en) 2023-06-20

Family

ID=86742623

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320149597.0U Active CN219227423U (en) 2023-02-08 2023-02-08 Power chip capable of resisting electromagnetic interference

Country Status (1)

Country Link
CN (1) CN219227423U (en)

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