CN219226229U - Process chamber for semiconductor device - Google Patents

Abstract

The utility model relates to the technical field of semiconductor equipment, in particular to a process chamber of semiconductor equipment. The process chamber of the semiconductor device comprises a cavity, a lining and an inner door assembly; the inner lining is arranged in the cavity and is provided with a sheet conveying port; the inner door assembly comprises an inner door, and the inner door is used for shielding or avoiding the sheet conveying opening; the inside of inner door has inner door air flue, and the inside of inside lining has inside lining air flue, and inner door air flue and inside lining air flue all have air inlet and gas outlet. According to the process chamber of the semiconductor device, the temperature of the process chamber is reduced by the double control means of reducing the power of the heater and purging and radiating, so that the duration of a process flow is shortened, the wafer yield of an etching process is higher, the consistency of process conditions such as wafer starting is improved, the etching consistency of wafers is higher, and the wafer yield is higher.

Description

Process chamber for semiconductor device

Technical Field

The utility model relates to the technical field of semiconductor equipment, in particular to a process chamber of semiconductor equipment.

Background

The process chamber of the semiconductor device is generally provided with an inner door capable of reciprocating so as to realize the transmission of the wafer between the transmission cavity and the process chamber, when the wafer needs to be transmitted, the inner door is opened to enable the wafer transmission port of the lining of the process chamber to be opened, and the wafer can be transmitted through a mechanical arm; when an etching process is required, the inner door is raised to form a closed reaction environment in the process chamber so as to enable the etching process.

The temperature in the process chamber of the existing semiconductor equipment can rise rapidly after starting, after the etching processing of one wafer is finished, the temperature is difficult to reduce to the temperature value required before the starting of the next wafer in a short time, the process flow time is long, the wafer yield of the etching process is affected, the starting condition of the wafer is difficult to keep consistent, the etching consistency of the wafer is poor, and the wafer yield is low.

Disclosure of Invention

The utility model aims to provide a process chamber of semiconductor equipment, so as to solve the technical problems of low wafer yield and low yield of the semiconductor equipment in the related art.

The utility model provides a process chamber of a semiconductor device, which comprises a chamber body, a lining and an inner door assembly.

The lining is arranged in the cavity, and a sheet conveying opening is formed in the lining; the inner door assembly comprises an inner door, and the inner door is used for shielding or avoiding the sheet conveying opening.

The inside of inner door has inner door air flue, the inside of inside lining has inside lining air flue, inner door air flue with inside lining air flue all has air inlet and gas outlet.

Preferably, as an implementation manner, the inner door air channel includes a plurality of rectangular-like channels, along the width direction of the rectangular-like channels, the rectangular-like channels are sequentially arranged and sequentially communicated with the long-side channels of adjacent rectangular-like channels, the outer long-side channel of one end of the rectangular-like channels is communicated with the inner door air inlet, and the outer long-side channel of the other end of the rectangular-like channels is communicated with the inner door air outlet.

Preferably, as an implementation manner, the inner door air channel further comprises a U-shaped channel, and the rectangular-like channel is located in an area surrounded by the U-shaped channel; the outer long side channels of the rectangular-like channels at the other end part are communicated with the middle channels of the U-shaped channels, two air outlets of the inner door are arranged, and the channels at the two sides of the U-shaped channels are respectively communicated with the two air outlets of the inner door.

Preferably, as an implementation manner, the inner door assembly further comprises an inner door heater and an inner door supporting lifting seat fixedly arranged at the lower end part of the inner door, wherein the inner door supporting lifting seat is provided with a containing groove for containing the inner door heater, and a notch of the containing groove faces the inner door.

Preferably, as an implementation manner, the air inlet of the inner door is arranged at the lower end part of the inner door and is opposite to the accommodating groove, the inner door lifting seat is provided with a through hole communicated with the accommodating groove, and the through hole is used for penetrating and connecting the inner door heater with a first electric wire of the electric control system and is used for penetrating and arranging an air inlet channel communicated with the air inlet of the inner door and the air supply device.

Preferably, as an implementation manner, the inner door assembly further comprises an inner door supporting seat, a connecting shaft and a driving mechanism.

The side wall of the cavity is provided with a mounting opening at a position below the lining, and the inner door supporting seat penetrates through and is sealed and fixed at the mounting opening.

The inner door supporting seat is provided with an abdication space, and the driving mechanism is positioned in the abdication space and fixedly arranged on the inner door supporting seat; the part of the inner door supporting seat, which is positioned at the inner side of the cavity, is provided with a guide hole, and the connecting shaft penetrates through the guide hole; the power output end of the driving mechanism is connected with the lower end of the connecting shaft, the upper end of the connecting shaft is fixedly arranged at the lower end part of the inner door bracket lifting seat, and the connecting shaft can drive the inner door to lift under the driving of the driving mechanism.

The connecting shaft is of a hollow structure, is communicated with the through hole and is used for penetrating the first electric wire and the air inlet channel; the abdication space of the inner door supporting seat provides a movement space for the end part of the connecting shaft and the air inlet passage extending out of the end part.

Preferably, as an embodiment, the liner is a ring-shaped structure; the lining air passage is of a serpentine structure and is arranged in a reciprocating turning-back and spiral mode, and the turning-back part is close to the side part of the sheet conveying opening.

Preferably, as an implementation manner, the process chamber of the semiconductor device includes an upper electrode and a liner heater, a liner cover plate is disposed between the upper electrode and the liner, and the liner heater is disposed between the liner cover plate and the liner, and is used for heating the liner.

Preferably, as an implementation manner, the upper end part of the liner is provided with a liner air inlet, the upper electrode is provided with a first air inlet, the liner cover plate is provided with a second air inlet, one end of the second air inlet is communicated with the first air inlet, and the other end of the second air inlet is communicated with the liner air inlet.

Preferably, as an implementation manner, a first sealing structure is arranged between the upper electrode and the lining cover plate, a second sealing structure is arranged between the lining cover plate and the lining, and the first sealing structure and the second sealing structure are used for isolating the second air inlet hole from the vacuum environment in the cavity.

Preferably, as an implementation manner, the bottom surface of the lining cover plate is provided with a first annular groove, the upper part of the lining is provided with a second annular groove, the first annular groove is opposite to the second annular groove, the lining heater is positioned in the first annular groove and the second annular groove, and polymer heat-conducting glue is arranged between the lining heater and the second annular groove.

Preferably, as an implementation manner, the upper electrode is provided with a first threading hole, and the lining cover plate is provided with a second threading hole.

The first threading hole and the second threading hole are used for threading a second wire for connecting the lining heater and the electric control system; the inner lining cover plate is provided with a third sealing structure between the inner lining and the inner lining, a fourth sealing structure is arranged between the upper electrode and the inner lining cover plate, and the third sealing structure and the fourth sealing structure are used for isolating the inner lining heater from the vacuum environment in the cavity.

Preferably, as an implementation manner, the process chamber of the semiconductor device further comprises an air pumping device, and an air pumping port of the air pumping device is communicated with the inside of the cavity.

An inner door air outlet is arranged at the lower end part of the inner door, and is positioned above the air extraction opening of the air extraction device and communicated with the inside of the cavity; and/or the lower end part of the lining is provided with a lining air outlet which is positioned above the air extraction opening of the air extraction device and is communicated with the inside of the cavity.

Preferably, as an implementation manner, the inner door is provided with an inner door base and an inner door side cover, the inner door base is provided with a first groove, the inner door side cover is fixedly connected to one side of the inner door base, provided with the first groove, and the inner door side cover is sealed at the notch of the first groove to form the inner door air channel.

The lining has lining base and inside lining side cap, the second recess has been seted up to the lining base, the inside lining side cap rigid coupling in the lining base be equipped with one side of second recess, the inside lining side cap seal in the notch of second recess forms the inside lining air flue.

Compared with the related art, the utility model has the beneficial effects that:

according to the process chamber of the semiconductor device, the temperature of the process chamber is reduced by the double control means of reducing the power of the heater and purging and radiating, so that the duration of a process flow is shortened, the wafer yield of an etching process is higher, the consistency of process conditions such as wafer starting is improved, the etching consistency of wafers is higher, and the wafer yield is higher.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the related art, the drawings that are required to be used in the embodiments or the related technical descriptions will be briefly described, and it is apparent that the drawings in the following description are only embodiments of the present utility model, and other drawings may be obtained according to the provided drawings without inventive effort for those skilled in the art.

Fig. 1 is a schematic cross-sectional structure of a process chamber of a semiconductor device according to an embodiment of the present utility model;

fig. 2 is a schematic cross-sectional view of an inner door assembly of a process chamber of a semiconductor device according to an embodiment of the present utility model;

fig. 3 is an exploded view of an inner door assembly of a process chamber of a semiconductor device according to an embodiment of the present utility model;

FIG. 4 is a schematic diagram of an inner door air passage in an inner door assembly according to an embodiment of the present utility model;

FIG. 5 is a schematic view of an exploded view of an inner door assembly according to an embodiment of the present utility model;

fig. 6 is a cross-sectional view of a partial structure of a process chamber of a semiconductor device according to an embodiment of the present utility model;

fig. 7 is an exploded view of a part of the structure of a process chamber of a semiconductor device according to an embodiment of the present utility model;

fig. 8 is a schematic diagram of a liner gas passage in a process chamber of a semiconductor device according to an embodiment of the present utility model;

fig. 9 is a schematic diagram of an exploded structure of a liner of a process chamber of a semiconductor device according to an embodiment of the present utility model.

Reference numerals illustrate:

100-inner door; 110-inner door airways; 111-rectangular-like channels; 112-U-shaped channel; 120-an inner door base; 121-a first groove; 130-inner door side cover;

200-inner door heater;

300-an air inlet path; 310-air inlet joint;

410-inner door holder; 411-receiving slot; 420-an inner door support; 421-guiding holes; 422-yield space; 430-a connecting shaft; 431-sealing flange; 440-a drive mechanism; 450-connecting plates;

500-lining; 510-lining the airway; 511-liner air outlet; 520-a slice conveying port; 530-a third sealing structure; 540-lining a base; 541-a second groove; 550-lining side covers; 560-a second annular groove;

600-cavity;

700-upper electrode; 710-a first air inlet aperture; 720-a first threading hole;

800-lining cover plate; 810-a second air inlet hole; 820-fourth seal arrangement;

900-liner heater; 910-a second wire; 920-high molecular heat-conducting glue;

1000-air extracting device.

Detailed Description

The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The utility model will now be described in further detail by way of specific examples of embodiments in connection with the accompanying drawings.

In the related art, a heating rod is arranged outside a process chamber through a screw, the heating rod heats the process chamber according to a set temperature, heat is mainly transmitted through the screw and finally transmitted to the lining, so that the lining is heated, and the environmental temperature in the process chamber is improved; after the etching processing of one wafer is finished, the heating power of the heating rod is reduced, the inner lining is naturally cooled, so that the environmental temperature in the process chamber is reduced to a temperature value required before the next wafer is started, namely, the temperature of the process chamber is controlled only by a single control means for adjusting the power of the heater in the related technology.

Referring to fig. 1-3, the present embodiment provides a process chamber for a semiconductor apparatus, comprising a chamber body 600, a liner 500, and an inner door assembly; the inner liner 500 is arranged in the cavity 600, and the inner liner 500 is provided with a sheet conveying port 520; the inner door assembly comprises an inner door 100, wherein the inner door 100 is used for shielding or avoiding the sheet conveying opening 520; the interior of the inner door 100 has an inner door air passage 110, the interior of the liner 500 has a liner air passage 510, and both the inner door air passage 110 and the liner air passage 510 have an air inlet and an air outlet.

After the inner door 100 is opened, the wafer can be sent into the cavity 600 from the wafer transfer port 520 of the liner 500; before the wafer starts, the power of the heater is reduced, gas (which may be compressed gas) can be filled into the inner door air passage 110 and the inner lining air passage 510 from the air inlet, and the gas in the inner door air passage 110 and the inner lining air passage 510 is pumped out from the air outlet, so that the gas entering the inner door air passage 110 can flow along the inner door air passage 110 from the air inlet on the inner door air passage 110 to the air outlet, the gas entering the inner lining air passage 510 can flow along the inner lining air passage 510 from the air inlet on the inner lining air passage 510 to the air outlet, in the process, the gas can take away heat on the inner door 100 and the inner lining 500, so that the inner door 100 and the inner lining 500 can be cooled down quickly, the heat in the cavity 600 can be dissipated quickly through the inner door 100 and the inner lining 500, and the duration that the temperature in the cavity 600 is reduced to the temperature value required before the wafer starts can be shortened; in addition, the uniformity of the temperature distribution of the various portions of the inner door 100 and the liner 500 can be improved. The inner liner air passage 510 and the inner door air passage 110 cooperate to perform purging and heat dissipation on the inner liner 500 and the inner door 100, respectively, which is equivalent to the heat dissipation function around the cavity 600, so that the temperature distribution of each area of the cavity 600 can be more uniform. The gas charged into the inner door 100 and the inner liner 500 is preferably compressed gas, which has a high specific heat capacity, and can absorb more heat when flowing along the inner door air passage 110, so as to improve the heat transfer efficiency, and further, the cooling speed of the inner door 100.

Therefore, in the process chamber of the semiconductor device provided in this embodiment, the temperature of the chamber 600 is reduced by the dual control means of reducing the power of the heater and purging and radiating, so that the duration of the process flow is shortened, the wafer yield of the etching process is higher, the consistency of the process conditions such as wafer starting is improved, the etching consistency of the wafer is higher, and the wafer yield is higher.

Preferably, referring to fig. 4 and 5, the inner door air duct 110 may be configured as a labyrinth channel to improve the contact area between the air in the inner door air duct 110 and the inner door 100 and the uniformity of the air distribution, thereby improving the heat dissipation efficiency and the uniformity of the temperature distribution of each portion of the inner door 100.

The inner door air duct 110 includes a plurality of rectangular-like channels 111, the rectangular-like channels 111 are sequentially arranged along the width direction thereof, and adjacent long-side channels of two rectangular-like channels 111 which are arbitrarily connected are communicated, on the basis, an outer long-side channel of one end of the rectangular-like channels 111 (i.e., a long-side channel of the rectangular-like channel 111 which is far away from other rectangular-like channels 111) is communicated with an inner door air inlet, and an outer long-side channel of the other end of the rectangular-like channels 111 is communicated with an inner door air outlet; referring to fig. 4, arrows represent the flow direction of the gas, and the gas can flow through each rectangular-like channel 111 in sequence after entering from the inlet of the inner door and finally be discharged from the outlet of the inner door, in this process, the gas flow can be divided into two when entering each rectangular-like channel 111, respectively flows along different channel sections of the rectangular-like channel 111, and is converged into one when flowing out from the rectangular-like channel 111, which is beneficial to improving the heat dissipation efficiency and the uniformity of the temperature distribution. Wherein the rectangular-like channels 111 at one end and the rectangular-like channels 111 at the other end are two rectangular-like channels 111 at two ends of all the rectangular-like channels 111, respectively. The above-mentioned "rectangle-like" means that the shape is corresponding or similar to a rectangle, and has two pairs of oppositely arranged sides, namely a long side and a short side, the long side is oppositely arranged with the long side, the short side is oppositely arranged with the short side, and the line shape of the side can be a straight line or an arc line; in contrast to the inner door 100, since the rectangular-like channel 111 is disposed on the inner door 100, the long side and the wide side thereof are adapted to the shape of the inner door, and when the inner door 100 has an arc adapted to the inner liner 500, the long side or the wide side of the rectangular-like channel is also an arc adapted to the arc of the inner door 100, i.e. the channel is not strictly rectangular, and is defined as a rectangular-like channel herein.

The inner door air passage 110 may further include a U-shaped channel 112, the rectangular-like channel 111 is disposed in an area surrounded by the U-shaped channel 112, the outer long side channel of the rectangular-like channel 111 at the other end is connected to the middle channel of the U-shaped channel 112, and meanwhile, the two inner door air outlets are provided, and two side channels of the U-shaped channel 112 are respectively connected to the two inner door air outlets, so that when the air flows out from the rectangular-like channel 111 at the other end, the air can enter the U-shaped channel 112 and is split into two streams, flows towards the two side channels respectively, and finally flows out from the two inner door air outlets.

The U-shaped channels 112 may be disposed near the edges of the inner door 100, and the long side channels of the rectangular-like channels 111 may be disposed parallel to each other, and the two side channels of the U-shaped channels 112 may be disposed parallel to the wide side channels of the rectangular-like channels 111, and the two side channels of the U-shaped channels 112 may be disposed near the wide side channels of the rectangular-like channels 111; the outer long side channel of the rectangular-like channel 111 at the other end is parallel to the long side channel of the rectangular-like channel 111, and the outer long side channel of the rectangular-like channel 111 at the other end is arranged at the position close to the wide side channel of the rectangular-like channel 111, so that the distribution range of the inner door air channel 110 is enlarged, the space between the channels is reduced, the contact area between the air in the inner door air channel 110 and the inner door 100 is increased, the distribution uniformity of the air in the inner door air channel 110 in the inner door 100 is improved, and the heat dissipation efficiency and the temperature distribution uniformity can be improved.

Preferably, the rectangular-like channels 111 and the U-shaped channels 112 are both symmetrical, and the communication portions of the rectangular-like channels 111 are all disposed at the middle point of the long-side channels, and the communication portions of the middle channels of the U-shaped channels 112 are disposed at the middle point of the middle channels, so that the heat dissipation efficiency and the uniformity of the temperature distribution can be further improved.

Referring to fig. 3, the inner door assembly further includes an inner door heater 200, an inner door supporting seat 410 may be fixedly provided at a lower end portion of the inner door 100, and a receiving slot 411 may be formed in the inner door supporting seat 410 to receive the inner door heater 200 by using the receiving slot 411; the notch of the accommodating groove 411 is arranged towards the inner door 100, the inner door heater 200 cannot be separated from the accommodating groove 411 under the sealing cover of the end surface of the inner door 100, the inner door heater 200 is not required to be fixed in other connection modes, and the assembly is convenient; in addition, the inner door heater 200 can directly heat the inner door 100, thereby realizing rapid temperature rise of the inner door 100, being beneficial to reducing adhesion of etching byproducts on the inner door 100, prolonging the service life of the inner door 100 and improving the process stability. Specifically, the inner door supporting and lifting seat 410 may be provided with a strip structure, and further, the accommodating slot 411 may be provided with a strip structure, so as to facilitate enlarging the area of the accommodating slot 411, so as to enlarge the contact area between the inner door heater 200 and the inner door 100 in the accommodating slot 411, thereby further accelerating the temperature rising speed and the temperature distribution uniformity of the inner door 100. Among them, the inner door heater 200 may be a heating rod, and furthermore, the inner door heater 200 may be provided in two.

Referring to fig. 2 and 3, the above-mentioned inlet port of the inner door may be provided at the lower end portion of the inner door 100 so as to face the receiving slot 411 of the inner door holder 410, and a through hole communicating with the receiving slot 411 is formed in the inner door holder 410, so that a first wire connecting the inner door heater 200 and the electric control system may be inserted into the through hole, so that the electric control system may control the inner door heater 200; meanwhile, the air inlet circuit 300 communicated with the air inlet of the inner door can also penetrate through the through hole, so that the air supply device can provide an air source for the air inlet of the inner door. The air inlet channel 300 may be an air pipe, at this time, an air inlet connector 310 may be screwed at the air inlet of the inner door, and the air pipe may be inserted into the air inlet connector 310, so as to achieve communication between the air pipe and the air channel 110 of the inner door.

The specific structure of the inner door assembly may further include an inner door supporting seat 420, a connecting shaft 430 and a driving mechanism 440, wherein a mounting opening is formed in a position of the sidewall of the cavity 600 below the inner door 100, and the inner door supporting seat 420 is penetrated and sealed and fixed at the mounting opening, so as to realize the mounting and fixing of the inner door supporting seat 420 and ensure a sealed environment in the cavity 600. Setting a yielding space 422 on the inner door supporting seat 420, placing the driving mechanism 440 in the yielding space 422, and fixing the driving mechanism 440 to the inner door supporting seat 420, so that the driving mechanism 440 can be installed and fixed; a guide hole 421 is provided at a portion of the inner door supporting seat 420 located inside the cavity 600, and the connection shaft 430 is inserted into the guide hole 421 to circumferentially position the connection shaft 430 by using the guide hole 421 on the inner door supporting seat 420. The power output end of the driving mechanism 440 is connected with the lower end of the connecting shaft 430, so that the upper end of the connecting shaft 430 is fixed to the lower end of the inner door holder 410, and therefore the inner door support seat 420 can support the inner door 100 from the lower side of the inner door 100 through the connecting shaft 430, the inner door 100 is supported, and the connecting shaft 430 can drive the inner door 100 to lift under the driving of the driving mechanism 440, so that the inner door 100 can be switched between the shielding state and the avoiding state of the sheet conveying opening 520. The connecting shaft 430 is configured as a hollow structure such that the hollow chamber of the connecting shaft 430 is communicated with the through hole of the inner door holder 410, and thus, the air inlet passage 300 and the first electric wire can be inserted into the through hole of the inner door holder 410 through the hollow chamber of the connecting shaft 430; the space 422 of the inner door supporting seat 420 can provide a movement space for the end of the connecting shaft 430 and the air inlet channel 300 extending out of the end, thus ensuring that the air supply is not affected by the movement of the inner door 100.

Specifically, a cylinder may be used as the driving mechanism 440, and a connection plate 450 may be installed at the end of the piston of the cylinder, and the connection plate 450 may be used to indirectly connect the piston to the connection shaft 430; further, a clearance hole corresponding to the hollow chamber of the connection shaft 430 may be formed on the connection plate 450, so that the first electric wire and the air inlet path 300 can be smoothly penetrated out. The sealing flange 431 may be sleeved on the connecting shaft 430, and the sealing flange 431 and the connecting shaft 430 are in sliding seal, and the sealing flange 431 may be fixedly installed on the inner door supporting seat 420, so that the sealing performance of the cavity 600 may be ensured in the process of the connecting shaft 430 reciprocating along the guiding hole 421.

Preferably, the inner door assembly further comprises a guide assembly, the guide assembly is arranged in the guide hole 421 and sleeved on the outer side of the connecting shaft 430, the connecting shaft 430 can be a spline shaft, the guide assembly comprises a spline nut and a flat key, the spline nut is sleeved on the connecting shaft 430 and is in sliding fit with the connecting shaft 430, so that relative rotation between the connecting shaft 430 and the spline nut is limited on the premise that the connecting shaft 430 can do lifting linear motion, the spline nut can play a guide role on lifting of the spline shaft, the fact that the spline shaft cannot swing during lifting motion is guaranteed, and the bottom of the sealing flange 431 abuts against the upper end face of the spline nut, so that the position of the spline nut in the axial direction of the connecting shaft 430 can be limited.

And, two limit grooves are relatively provided on the outer circumferential surface of the spline nut and the inner sidewall of the guide hole 421, and the flat key is disposed in the two limit grooves and cooperates with the two limit grooves, so that the relative rotation between the spline nut 64 and the inner door supporting seat 420 can be limited, and the limitation of the rotational degree of freedom of the connecting shaft 430 can be realized.

Preferably, referring to fig. 8 and 9, the lining air duct 510 may be configured as a labyrinth channel, so that the contact area between the gas in the lining air duct 510 and the lining 500 and the uniformity of gas distribution may be improved, and not only the heat dissipation efficiency may be improved, but also the uniformity of temperature distribution at various portions of the lining 500 may be improved.

Preferably, referring to fig. 7-9, the liner 500 may be configured as a ring structure, on the basis of which the liner air channel 510 may be configured as a serpentine structure that is reciprocally folded and spirally wound, and the folded portion is disposed near the side portion of the wafer transfer port 520, so that the liner air channel 510 is as full as possible of each region of the liner 500, so as to further improve the contact area between the gas in the liner air channel 510 and the liner 500 and the uniformity of gas distribution.

Referring to fig. 6 and 7, in the specific structure of the process chamber of the semiconductor device provided in this embodiment, there are an upper electrode 700 and a liner heater 900, a liner cover plate 800 is disposed between the upper electrode 700 and the liner 500, and the inner door heater 200 is disposed between the liner cover plate 800 and the liner 500, so that the liner heater 900 can directly heat the liner 500, thereby realizing rapid temperature rise of the liner 500, being beneficial to reducing adhesion of etching byproducts on the liner 500, prolonging the service life of the liner 500, and improving process stability.

The air inlet of the inner liner is arranged at the upper end part of the inner liner 500, the upper electrode 700 is provided with a first air inlet hole 710, the inner liner cover plate 800 is provided with a second air inlet hole 810, one end of the second air inlet hole 810 is communicated with the first air inlet hole 710, and the other end of the second air inlet hole 810 is communicated with the air inlet of the inner liner, so that air can be injected into the top end of the first air inlet hole 710 of the upper electrode 700, and after entering the first air inlet hole 710, the air can enter the inner liner air channel 510 through the first air inlet hole 710 and the second air inlet hole 810 in sequence, so that air supply to the inner liner air channel 510 is realized.

Preferably, a first sealing structure may be provided between the upper electrode 700 and the liner cover plate 800, and a second sealing structure may be provided between the liner cover plate 800 and the liner 500, so as to isolate the second air inlet holes 810 from the vacuum environment in the chamber 600 by using the first sealing structure and the second sealing structure, to prevent gas leakage or to advance the entry into the chamber 600 before entering the liner passage 510.

A first annular groove may be formed on the bottom surface of the inner liner cover plate 800, a second annular groove 560 may be formed on the upper portion of the inner liner 500, and the first annular groove and the second annular groove 560 are arranged opposite to each other, the inner liner heater 900 is installed in the first annular groove and the second annular groove 560, after the inner liner cover plate 800 and the inner liner 500 are mutually fixed, the first annular groove and the second annular groove 560 may be buckled to form a closed groove, and the inner liner heater 900 may be sealed in the closed groove, thereby realizing the fixation of the inner liner heater 900; of course, it is also possible that only one of the first annular groove and the second annular groove 560 is provided. Preferably, referring to fig. 6 and 7, a polymer heat-conducting glue 920 may be disposed between the inner liner heater 900 and the second annular groove 560, and the polymer heat-conducting glue 920 has good heat-conducting property and can achieve surface contact heat transfer, and further improves heat transfer efficiency and heating uniformity.

Further, referring to fig. 6, a first threading hole 720 may be formed on the upper electrode 700, and a second threading hole may be formed on the liner cover plate 800, and a second wire 910 connecting the liner heater 900 and the electric control system may be threaded through the first threading hole 720 and the second threading hole, so that the electric control system may control the liner heater 900. On this basis, a third sealing structure 530 may be disposed between the liner cover plate 800 and the liner 500, and a fourth sealing structure 820 may be disposed between the upper electrode 700 and the liner cover plate 800, so that the third sealing structure 530 and the fourth sealing structure 820 are utilized to isolate the liner heater 900 from the vacuum environment in the cavity 600, so that the liner heater 900 is heated in the atmospheric environment, thereby facilitating heat transfer, improving heat transfer efficiency, and further accelerating the temperature rising speed of the liner 500. The third sealing structure 530 and the fourth sealing structure 820 may be sealing rings coaxial with the cavity 600, and at this time, the third sealing structure 530 and the fourth sealing structure 820 are two, the two third sealing structures 530 are respectively disposed at two sides of the closed slot, and the two fourth sealing structures 820 are respectively disposed at two sides of the second threading hole.

Preferably, the inner wall of the liner 500 and the inner wall of the inner door 100 are disposed on the same cylindrical surface, so that in the closed state of the inner door 100, the cavity wall of the whole cavity 600 is a complete cylindrical surface, the distribution of the air flow field is more uniform, and the uniformity of etching processing can be improved.

An air extractor 1000 may be added, the air extraction opening of the air extractor 1000 is communicated with the cavity 600, so that the air extractor 1000 is utilized to vacuumize the cavity 600, on the basis, an air outlet of the inner door is arranged at the lower end part of the inner door 100 and is communicated with the cavity 600, i.e. the air outlet of the inner door is downwards led to the cavity 600, so that the air flowing out from the air outlet of the inner door can be extracted by the air extractor 1000 through the cavity 600; preferably, the inner door air outlet is arranged above the air extraction opening of the air extraction device 1000, so that the air in the inner door air channel 110 can be rapidly extracted by the air extraction device 1000, and therefore, after the air in the inner door air channel 110 flows out from the inner door air outlet, the air flow field in the cavity 600 is not easy to interfere, and the uniformity of etching processing is guaranteed. Accordingly, the liner gas outlet 511 is provided at the lower end portion of the liner 500 and communicates with the cavity 600, i.e., the liner gas outlet 511 opens downward into the cavity 600, so that the gas flowing out of the liner gas outlet 511 can be extracted by the gas extraction device 1000 through the cavity 600; preferably, the liner air outlet 511 is disposed above the air extraction opening of the air extraction device 1000, so that the air in the liner air channel 510 can be rapidly extracted by the air extraction device 1000, and thus, after the air in the liner air channel 510 flows out from the liner air outlet 511, the air flow field in the cavity 600 is not easy to be disturbed, which is beneficial to ensuring the uniformity of etching processing. The air extractor 1000 may be a high vacuum pump, which has a larger pump, and further ensures the stability of the air flow field inside the cavity 600.

Specifically, referring to fig. 3 and 5, the inner door 100 includes an inner door base 120 and an inner door side cover 130, a first groove 121 is formed on the inner door base 120, and the inner door side cover 130 is fixedly connected to a side of the inner door base 120 where the first groove 121 is formed, so that the inner door air channel 110 is formed by sealing a notch of the first groove 121 with the inner door side cover 130, so as to facilitate the implementation of the air channel labyrinth design. Preferably, the inner door side cover 130 and the inner door base 540 are welded into one piece by diffusion welding with high temperature resistance and few particles, which ensures the tightness of the inner door air duct 110.

Specifically, referring to fig. 7 and 9, the liner 500 includes a liner base 540 and a liner side cover 550, wherein a second groove 541 is formed on the liner base 540, and the liner side cover 550 is fixedly connected to the side of the liner base 540, where the second groove 541 is formed, so as to seal the notch of the second groove 541 by using the liner side cover 550, thereby forming the liner air channel 510, so as to facilitate the implementation of the air channel labyrinth design. Preferably, the lining side cover 550 and the lining base 540 are welded into a whole by a diffusion welding mode with high temperature resistance and less particles, so that the tightness of the lining air channel 510 can be ensured.

In practice, the liner heater 900 and the inner door heater 200 cooperate to heat the liner 500 and the inner door 100, respectively; meanwhile, the inner liner air passage 510 and the inner door air passage 110 cooperate to respectively purge and dissipate heat of the inner liner 500 and the inner door 100, which is equivalent to the heating and heat dissipation functions around the cavity 600, so that better temperature control performance can be obtained and the temperature distribution of each area of the cavity 600 can be more uniform. In addition, the inner liner heater 900, the inner door heater 200 and the electric heating rods on the upper electrode 700 act together, which is equivalent to the fact that the periphery and the upper part of the chamber can be heated, so that higher heating efficiency can be obtained, and the uniformity of temperature distribution in the process chamber is better.

In the description of the present utility model, it should be noted that the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present utility model and simplifying the description, and are not indicative or implying that the apparatus or element in question must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present utility model.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model.

Claims (14)

1. A process chamber for a semiconductor device, comprising a chamber body (600), a liner (500), and an inner door assembly;

the lining (500) is arranged in the cavity (600), and the lining (500) is provided with a sheet conveying port (520); the inner door assembly comprises an inner door (100), wherein the inner door (100) is used for shielding or avoiding the sheet conveying opening (520);

the inside of the inner door (100) is provided with an inner door air passage (110), the inside of the lining (500) is provided with a lining air passage (510), and the inner door air passage (110) and the lining air passage (510) are provided with an air inlet and an air outlet.

2. The process chamber of the semiconductor device according to claim 1, wherein the inner door air passage (110) comprises a plurality of rectangular-like channels (111), the rectangular-like channels (111) are sequentially arranged along the width direction of the rectangular-like channels (111) and sequentially communicated with the long side channels of the adjacent rectangular-like channels (111), the outer long side channel of the rectangular-like channels (111) at one end is communicated with the inner door air inlet, and the outer long side channel of the rectangular-like channels (111) at the other end is communicated with the inner door air outlet.

3. The process chamber of the semiconductor apparatus of claim 2, wherein the inner door flue (110) further comprises a U-shaped channel (112), the rectangular-like channel (111) being located within an area enclosed by the U-shaped channel (112); the outer long side channel of the rectangular-like channel (111) at the other end part is communicated with the middle channel of the U-shaped channel (112), two inner door air outlets are arranged, and the two side channels of the U-shaped channel (112) are respectively communicated with the two inner door air outlets.

4. The process chamber of claim 1, wherein the inner door assembly further comprises an inner door heater (200) and an inner door holder (410) secured to a lower end of the inner door (100), the inner door holder (410) having a receiving slot (411) for receiving the inner door heater (200), a slot of the receiving slot (411) being oriented toward the inner door (100).

5. The process chamber of claim 4, wherein the inner door air inlet is provided at a lower end of the inner door (100) and is opposite to the receiving groove (411), and the inner door holder (410) has a through hole communicating with the receiving groove (411), for penetrating a first wire connecting the inner door heater (200) and an electric control system, and for penetrating an air inlet path (300) communicating with the inner door air inlet.

6. The process chamber of a semiconductor apparatus of claim 5, wherein the inner door assembly further comprises an inner door support (420), a connection shaft (430), and a drive mechanism (440):

a mounting opening is formed in a part, below the lining (500), of the side wall of the cavity (600), and the inner door supporting seat (420) penetrates through the mounting opening and is fixed in a sealing manner;

the inner door supporting seat (420) is provided with a yielding space (422), and the driving mechanism (440) is positioned in the yielding space (422) and fixedly arranged on the inner door supporting seat (420); the part of the inner door supporting seat (420) positioned at the inner side of the cavity (600) is provided with a guide hole (421), and the connecting shaft (430) penetrates through the guide hole (421); the power output end of the driving mechanism (440) is connected with the lower end of the connecting shaft, the upper end of the connecting shaft (430) is fixedly arranged at the lower end part of the inner door support lifting seat (410), and the connecting shaft (430) can drive the inner door (100) to lift under the driving of the driving mechanism (440);

the connecting shaft (430) is of a hollow structure, is communicated with the through hole and is used for penetrating the first electric wire and the air inlet channel (300); the abdication space (422) of the inner door supporting seat (420) provides a movement space for the end part of the connecting shaft (430) and the air inlet channel (300) extending out of the end part.

7. The process chamber of a semiconductor apparatus of claim 1, wherein the liner (500) is a ring-shaped body structure; the lining air passage (510) is of a serpentine structure and is arranged in a reciprocating turning-back and spiral mode, and the turning-back part is close to the side part of the sheet conveying opening (520).

8. The process chamber of the semiconductor apparatus of claim 1, further comprising an upper electrode (700) and a liner heater (900), wherein a liner cover plate (800) is disposed between the upper electrode (700) and the liner (500), and wherein the liner heater (900) is disposed between the liner cover plate (800) and the liner (500) for heating the liner (500).

9. The process chamber of claim 8, wherein a liner air inlet is provided at an upper end of the liner (500), the upper electrode (700) is provided with a first air inlet hole (710), the liner cover plate (800) is provided with a second air inlet hole (810), one end of the second air inlet hole (810) is communicated with the first air inlet hole (710), and the other end is communicated with the liner air inlet.

10. The process chamber of the semiconductor device of claim 9, wherein a first sealing structure is provided between the upper electrode (700) and the liner cover plate (800), a second sealing structure is provided between the liner cover plate (800) and the liner (500), and the first sealing structure and the second sealing structure are used for isolating the second air inlet holes (810) from a vacuum environment in the cavity (600).

11. The process chamber of claim 8, wherein the bottom surface of the liner cover plate (800) has a first annular groove, the upper portion of the liner (500) has a second annular groove (560), the first annular groove is disposed opposite to the second annular groove (560), the liner heater (900) is disposed in the first annular groove and the second annular groove (560), and a polymer heat-conducting glue (920) is disposed between the liner heater (900) and the second annular groove (560).

12. The process chamber of the semiconductor device of claim 8, wherein the upper electrode (700) is provided with a first threading hole (720), and the liner cover plate (800) is provided with a second threading hole;

the first threading hole (720) and the second threading hole are used for threading a second electric wire (910) for connecting the lining heater (900) and an electric control system; a third sealing structure (530) is arranged between the lining cover plate (800) and the lining (500), a fourth sealing structure (820) is arranged between the upper electrode (700) and the lining cover plate (800), and the third sealing structure (530) and the fourth sealing structure (820) are used for isolating the vacuum environment in the lining heater (900) and the cavity (600).

13. The process chamber of a semiconductor apparatus according to any one of claims 1 to 12, further comprising an evacuation device (1000), an evacuation port of the evacuation device (1000) being in communication with the interior of the chamber (600);

an inner door air outlet is arranged at the lower end part of the inner door (100), is positioned above an air extraction opening of the air extraction device (1000) and is communicated with the inside of the cavity (600); and/or, the lower end part of the lining (500) is provided with a lining air outlet (511), and the lining air outlet (511) is positioned above the air extraction opening of the air extraction device (1000) and is communicated with the inside of the cavity (600).

14. The process chamber of a semiconductor device according to any one of claims 1 to 12, wherein the inner door (100) has an inner door base (120) and an inner door side cover (130), the inner door base (120) is provided with a first groove (121), the inner door side cover (130) is fixedly connected to a side of the inner door base (120) provided with the first groove (121), and the inner door side cover (130) is sealed to a notch of the first groove (121) to form the inner door air channel (110);

and/or, the lining (500) is provided with a lining base (540) and a lining side cover (550), the lining base (540) is provided with a second groove (541), the lining side cover (550) is fixedly connected to one side of the lining base (540) provided with the second groove (541), and the lining side cover (550) is sealed in a notch of the second groove (541) to form the lining air channel (510).

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