CN219217882U - Alkali-resistant thermal-reduction adhesive tape - Google Patents
Alkali-resistant thermal-reduction adhesive tape Download PDFInfo
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- CN219217882U CN219217882U CN202223459621.5U CN202223459621U CN219217882U CN 219217882 U CN219217882 U CN 219217882U CN 202223459621 U CN202223459621 U CN 202223459621U CN 219217882 U CN219217882 U CN 219217882U
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- layer
- alkali
- resistant
- thermal
- adhesive tape
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- 239000003513 alkali Substances 0.000 title claims abstract description 45
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 24
- 239000011248 coating agent Substances 0.000 claims abstract description 45
- 238000000576 coating method Methods 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 230000004044 response Effects 0.000 claims abstract description 21
- 230000001737 promoting effect Effects 0.000 claims abstract description 18
- 239000002318 adhesion promoter Substances 0.000 claims description 10
- -1 polytetrafluoroethylene Polymers 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 229920000123 polythiophene Polymers 0.000 claims description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 4
- 229920002799 BoPET Polymers 0.000 claims description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 4
- 229910052731 fluorine Inorganic materials 0.000 claims description 4
- 239000011737 fluorine Substances 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 3
- 239000010452 phosphate Substances 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 3
- 229910052845 zircon Inorganic materials 0.000 claims description 3
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 9
- 230000009467 reduction Effects 0.000 abstract description 7
- 238000012545 processing Methods 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 5
- 230000007797 corrosion Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 84
- 239000012790 adhesive layer Substances 0.000 description 12
- 230000000181 anti-adherent effect Effects 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000003431 cross linking reagent Substances 0.000 description 5
- 239000003999 initiator Substances 0.000 description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- IHRVFYVCBGOJRU-UHFFFAOYSA-N [F].C1(=CC=CC=C1)O Chemical compound [F].C1(=CC=CC=C1)O IHRVFYVCBGOJRU-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Adhesive Tapes (AREA)
Abstract
The utility model relates to the technical field of alkali-resistant thermal-adhesive-tape, in particular to an alkali-resistant thermal-adhesive-tape, which comprises an alkali-resistant coating, a first substrate layer, an adhesion promoting layer and a thermal-response adhesive-tape layer, wherein the alkali-resistant coating, the first substrate layer, the adhesion promoting layer and the thermal-response adhesive-tape layer are sequentially and compositely connected from top to bottom. The utility model has the characteristics of good high adhesiveness, antistatic property, strong alkali corrosion resistance, easy stripping after high temperature viscosity reduction and the like, and meets the protection requirement in the glass processing process.
Description
Technical Field
The utility model relates to the technical field of alkali-resistant heat-reducing adhesive tapes, in particular to an alkali-resistant heat-reducing adhesive tape.
Background
With the rapid development of electronic consumer products, mobile phones experience plastic, metal to glass body transitions. The glass body has the advantages of attractive color, comfortable hand feeling, weak signal blocking, no influence on the wireless charging technology and the like, and becomes the standard of the current flagship mobile phone. The processing of glass is also of interest to the industry. After the glass is subjected to CNC processing, sand blasting and other working procedures, the problems of burrs, uneven surface particles and the like exist. In industry, high temperature attack is typically performed using strong alkali solutions of potassium hydroxide. Substrates such as PET, PI and the like cannot be corroded by alkali resistance; PET protection film and PI protection film can't play the guard action to glass course of working. And the conventional acrylic, polyurethane, organic silicon and other high-viscosity pressure-sensitive adhesives are difficult to peel off at high temperature, and the adhesive is extremely easy to remain.
Disclosure of Invention
In view of the above, the utility model provides a strong alkali resistant thermal-reduction adhesive tape which has the characteristics of good high adhesiveness, excellent strong alkali corrosion resistance, easy stripping after high temperature adhesion reduction and the like, and meets the protection requirement in the glass processing process.
Technical proposal
In order to achieve the above purpose, the utility model is realized by the following technical scheme:
the utility model provides a strong alkali-resistant thermal adhesive tape which comprises an alkali-resistant coating, a first substrate layer, an adhesion promoting layer and a thermal response adhesive-reducing layer, wherein the alkali-resistant coating, the first substrate layer, the adhesion promoting layer and the thermal response adhesive-reducing layer are sequentially connected in a compound manner from top to bottom.
Further, the anti-static coating comprises a release layer, a first anti-static layer, a second substrate layer and a second anti-static layer, wherein the release layer, the first anti-static layer, the second substrate layer and the second anti-static layer are sequentially and compositely connected from top to bottom, and the release layer is compositely connected with the thermal response anti-adhesive layer.
Further, the alkali-resistant coating is any one of a phenolic resin coating, polytetrafluoroethylene or phenol fluorine modified resin, and the thickness of the alkali-resistant coating is 1-10 mu m.
Further, the adhesion promoting layer is any one of an organic titanic acid adhesion promoter, a zircon adhesion promoter, a zirconia aluminate adhesion promoter or an alkyl phosphate, and the thickness of the adhesion promoting layer is 0.5-3 mu m.
Further, the thickness of the thermal response anti-adhesive layer is 5-50 μm.
Further, the first substrate layer is any one of CPP, PE or PO film, and the thickness of the first substrate layer is 30-80 μm.
Further, the second substrate layer is any one of a PET film, a PP film or a PI film, and the thickness of the second substrate layer is 25-75 μm.
Further, the release layer is any one of a silicon release coating, a non-silicon release coating or a fluorine release coating, and the thickness of the release layer is smaller than 1 mu m.
Further, the first antistatic layer and the second antistatic layer are both any one of polythiophene, quaternary ammonium salt or sulfonate, and the thickness of the first antistatic layer and the second antistatic layer is smaller than 1 μm.
Further, each component in the thermal response anti-adhesive layer comprises 100 parts of acrylic acid glue, 20 parts of acrylic acid oligomer, 1 part of cross-linking agent, 1 part of thermal initiator and 60 parts of solvent according to parts by weight, and the thermal response anti-adhesive layer has the characteristics of quick viscosity reduction, easy stripping and no residual adhesive in a high-temperature environment.
Advantageous effects
Compared with the known public technology, the technical scheme provided by the utility model has the following beneficial effects: the utility model has the characteristics of good high adhesiveness, antistatic property, strong alkali corrosion resistance, easy stripping after high temperature viscosity reduction and the like, and meets the protection requirement in the glass processing process.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is evident that the drawings in the following description are only some embodiments of the present utility model and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
Fig. 1 is a schematic structural diagram of a strong alkali-resistant thermal adhesive tape according to the present utility model.
Reference numerals in the drawings represent respectively:
the anti-alkali coating comprises an alkali-resistant coating 1, a first substrate layer 2, an adhesion promoting layer 3, a thermal response anti-adhesive layer 4, a release layer 5, a first antistatic layer 6, a second substrate layer 7 and a second antistatic layer 8.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. It will be apparent that the described embodiments are some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The utility model is further described below with reference to examples.
As shown in fig. 1, the alkali-resistant thermal adhesive tape comprises an alkali-resistant coating 1, a first substrate layer 2, an adhesion promoting layer 3 and a thermal response adhesive-reducing layer 4, wherein the alkali-resistant coating 1, the first substrate layer 2, the adhesion promoting layer 3 and the thermal response adhesive-reducing layer 4 are sequentially and compositely connected from top to bottom.
As the optimization of the technical scheme, the anti-static adhesive coating further comprises a release layer 5, a first anti-static layer 6, a second substrate layer 7 and a second anti-static layer 8, wherein the release layer 5, the first anti-static layer 6, the second substrate layer 7 and the second anti-static layer 8 are sequentially and compositely connected from top to bottom, and the release layer 5 is compositely connected with the thermal response anti-adhesive layer 4.
As a preferable mode of the above technical scheme, the alkali-resistant coating 1 is any one of a phenolic resin coating, polytetrafluoroethylene or phenol fluorine modified resin, and the thickness of the alkali-resistant coating is 1-10 μm.
As a preferable aspect of the above-described technical solution, the adhesion promoting layer 3 is any one of an organic titanate adhesion promoter, a zircon adhesion promoter, a zirconia aluminate adhesion promoter, or an alkyl phosphate, and the thickness of the adhesion promoting layer 3 is 0.5 to 3 μm.
Preferably, the thickness of the thermally responsive adhesive-reducing layer 4 is 5 to 50. Mu.m.
As a preferable aspect of the above-described aspect, the first base material layer 2 is any one of CPP, PE, and PO film, and the thickness of the first base material layer 2 is 30 to 80 μm. CPP, PE and PO films have excellent strong alkali corrosion resistance, and the hot glue adhesive has the characteristics of good high adhesion, easy stripping after high-temperature viscosity reduction and the like.
As a preferable aspect of the above-described aspect, the second base material layer 7 is any one of a PET film, a PP film, and a PI film, and the thickness of the second base material layer 7 is 25 to 75 μm.
As a preferable aspect of the foregoing technical solution, the release layer 5 is any one of a silicon release coating, a non-silicon release coating, and a fluorine release coating, and the thickness of the release layer 5 is less than 1 μm.
As a preferable aspect of the foregoing disclosure, the first antistatic layer 6 and the second antistatic layer 8 are each one of polythiophene, quaternary ammonium salt, and sulfonate, and the thicknesses of the first antistatic layer 6 and the second antistatic layer 8 are each less than 1 μm.
As the optimization of the technical scheme, each component in the thermal response anti-adhesive layer 4 comprises 100 parts of acrylic acid glue, 20 parts of acrylic acid oligomer, 1 part of cross-linking agent, 1 part of thermal initiator and 60 parts of solvent according to parts by weight, and the thermal response anti-adhesive layer has the characteristics of quick viscosity reduction and easy stripping and no residual adhesive in a high-temperature environment.
Preparation of the adhesive tape
Example 1:
the utility model provides a thermal-arrest adhesive tape of resistant alkali, includes alkali-resistant coating, first substrate layer, adhesion promotion layer, thermal response anti-adhesive layer, from layer, first antistatic layer, second substrate layer and second antistatic layer, its preparation steps are as follows:
1) Respectively coating a first antistatic layer and a second antistatic layer on two sides of a second substrate layer with the thickness of 25 mu m by micro-concave coating, and then coating a release layer on the other side of the first antistatic layer by micro-concave coating, wherein the coating is 0.2g/m 2 Obtaining a double-sided antistatic release layer;
2) The alkali-resistant coating is coated on one side of a first substrate layer with the thickness of 50 mu m at the thickness of 5 mu m, a 1 mu m adhesion promoting layer is applied on the other side of the first substrate layer, and a 25 mu m thermal response anti-adhesive layer is coated;
3) And coating a double-sided antistatic release layer on the other side of the thermal response anti-adhesive layer.
Wherein the first substrate layer is a PO film, and the second substrate layer is a PET film;
the first antistatic layer and the second antistatic layer are respectively made of a polythiophene coating, and the polythiophene coating is purchased from SD310 of Dongguan Mingxin plastic material Co., ltd; the release layer is a silicon release coating, and is selected from the Dow Corning SYL-OFF SB 7558;
the alkali-resistant coating adopts a phenolic resin coating and is purchased from KR-120A of Changsha Qiantai industry Co., ltd; the adhesion promoting layer is an organic titanic acid adhesion promoter coating and is selected from PI2 of Nanjing Nernder chemical Co., ltd; the thermal response anti-adhesive layer comprises, by weight, 100 parts of acrylic glue, 20 parts of acrylic oligomer, 1 part of cross-linking agent, 1 part of thermal initiator and 60 parts of ethyl acetate. The cross-linking agent is selected from German Bayer TDI curing agent L75, and the thermal initiator adopts dibenzoyl peroxide.
Example 2:
the difference from example 1 is that: no alkali-resistant coating.
Example 3:
the difference from example 1 is that: without an adhesion promoting layer.
Example 4:
the difference from example 1 is that: the cross-linking agent component was 5 parts.
Example 5:
the difference from example 1 is that: the thermal initiator component was 3 parts.
(II) Performance test
As shown by the performance test results, the adhesive tape in the embodiment 1 prepared by the technical scheme has the characteristics of good high adhesiveness, antistatic property, strong alkali corrosion resistance, easiness in peeling after high-temperature viscosity reduction and the like, and meets the protection requirement in the glass processing process.
The above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; these modifications or substitutions do not depart from the essence of the corresponding technical solutions from the protection scope of the technical solutions of the embodiments of the present utility model.
Claims (9)
1. The alkali-resistant thermal-reduction adhesive tape is characterized by comprising an alkali-resistant coating, a first substrate layer, an adhesion promoting layer and a thermal-response adhesive-reduction layer, wherein the alkali-resistant coating, the first substrate layer, the adhesion promoting layer and the thermal-response adhesive-reduction layer are sequentially connected in a compound manner from top to bottom.
2. The alkali-resistant thermal adhesive tape according to claim 1, further comprising a release layer, a first antistatic layer, a second substrate layer and a second antistatic layer, wherein the release layer, the first antistatic layer, the second substrate layer and the second antistatic layer are sequentially and compositely connected from top to bottom, and the release layer is compositely connected with the thermal response adhesive-reducing layer.
3. The alkali-resistant thermal-reduction adhesive tape according to claim 1, wherein the alkali-resistant coating is any one of a phenolic resin coating, polytetrafluoroethylene or a phenolic fluorine modified resin, and the alkali-resistant coating has a thickness of 1-10 μm.
4. The heat-reducing adhesive tape of claim 1, wherein the adhesion promoting layer is any one of an organotitanate adhesion promoter, a zircon adhesion promoter, a zirconia aluminate adhesion promoter, or an alkyl phosphate, and the adhesion promoting layer has a thickness of 0.5 to 3 μm.
5. A heat-resistant, strong-alkali-resistant, heat-reducing adhesive tape according to claim 1, wherein the thickness of the heat-responsive, adhesive-reducing layer is 5-50 μm.
6. The heat-resistant and strong-alkali-resistant adhesive tape according to claim 1, wherein the first substrate layer is any one of CPP, PE or PO film, and the thickness of the first substrate layer is 30 to 80 μm.
7. The heat-reducing adhesive tape of claim 2, wherein the second substrate layer is any one of a PET film, a PP film, and a PI film, and the thickness of the second substrate layer is 25-75 μm.
8. The alkali-resistant thermal release adhesive tape according to claim 2, wherein the release layer is any one of a silicon release coating, a non-silicon release coating or a fluorine release coating, and the thickness of the release layer is less than 1 μm.
9. The heat-resistant and alkali-resistant adhesive tape according to claim 2, wherein the first antistatic layer and the second antistatic layer are each any one of polythiophene, quaternary ammonium salt or sulfonate, and the thickness of each of the first antistatic layer and the second antistatic layer is less than 1 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223459621.5U CN219217882U (en) | 2022-12-22 | 2022-12-22 | Alkali-resistant thermal-reduction adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223459621.5U CN219217882U (en) | 2022-12-22 | 2022-12-22 | Alkali-resistant thermal-reduction adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219217882U true CN219217882U (en) | 2023-06-20 |
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ID=86747845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223459621.5U Active CN219217882U (en) | 2022-12-22 | 2022-12-22 | Alkali-resistant thermal-reduction adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219217882U (en) |
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2022
- 2022-12-22 CN CN202223459621.5U patent/CN219217882U/en active Active
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Address after: 215316 No. 3123, Huanqing Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Boyi Xincheng Polymer Materials Co.,Ltd. Address before: 215316 No. 3123, Huanqing Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: KUNSHAN BYE POLYMER MATERIAL Co.,Ltd. |