CN110819243A - Easy-to-prepare thermal viscosity-reducing adhesive tape and preparation method thereof - Google Patents

Easy-to-prepare thermal viscosity-reducing adhesive tape and preparation method thereof Download PDF

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Publication number
CN110819243A
CN110819243A CN201911005140.7A CN201911005140A CN110819243A CN 110819243 A CN110819243 A CN 110819243A CN 201911005140 A CN201911005140 A CN 201911005140A CN 110819243 A CN110819243 A CN 110819243A
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China
Prior art keywords
adhesive
thermal
viscosity
functional layer
reducing
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CN201911005140.7A
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Chinese (zh)
Inventor
喻四海
车荣升
朱恒志
施法宽
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KUNSHAN BYE MACROMOLECULE MATERIAL CO Ltd
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KUNSHAN BYE MACROMOLECULE MATERIAL CO Ltd
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Priority to CN201911005140.7A priority Critical patent/CN110819243A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/003—Presence of (meth)acrylic polymer in the primer coating

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)

Abstract

The invention belongs to the technical field of protective films and adhesive tapes, and particularly discloses an easy-to-prepare thermal viscosity-reducing adhesive tape and a preparation method thereof, wherein the easy-to-prepare thermal viscosity-reducing adhesive tape comprises a plastic base material, wherein a thermal viscosity-reducing functional layer is coated on the plastic base material, is formed by coating thermal viscosity-reducing adhesive on the plastic base material and curing the thermal viscosity-reducing functional layer, an adhesive layer is coated on the thermal viscosity-reducing functional layer, and a release film is coated on the adhesive layer; according to the working principle of the thermal-viscosity-reducing adhesive tape, when the external temperature reaches above the working temperature of the thermal-viscosity-reducing functional layer, the microspheres in the thermal-viscosity-reducing functional layer expand by multiple times or even dozens of times, so that the foaming of the adhesive layer can be caused, the surface of the adhesive layer becomes rough, the viscosity of the adhesive layer is reduced, the thermal-viscosity-reducing functional layer and the adhesive layer are processed in two procedures, and the selectivity of the microspheres to an adhesive in the preparation process of the traditional thermal-viscosity-reducing adhesive tape is avoided.

Description

Easy-to-prepare thermal viscosity-reducing adhesive tape and preparation method thereof
Technical Field
The invention belongs to the technical field of protective films and adhesive tapes, and particularly relates to a thermal viscosity-reducing adhesive tape easy to prepare and a preparation method thereof.
Background
The thermal viscosity reducing adhesive tape is a unique film, has adhesive force under normal temperature condition, can be adhered with a common adhesive film, can be easily peeled off only by heating until the adhesive force disappears, can not damage an adherend when peeling the adhesive tape, is applied to various manufacturing procedures of electronic components for automation and labor saving, simplifies the manufacturing procedures, can select processing shapes of flat films, reels, labels and the like as a thermal viscosity protective film, can also select heating temperature during peeling, has great advantages in the aspect of temporary fixing of electronic components, avoids scratching and damage of products, and particularly is a protective film for wafer cutting or substrate cutting, back grinding and thinning in a semiconductor wafer factory.
The existing thermal viscosity reducing adhesive tape adhesive layer is generally formed by mixing an adhesive and expandable microspheres, and a substance with the functions of adhesion and viscosity reduction is in the same layer in the adhesive tape structure, so that the mode has an obvious limitation, namely the selectivity of the microspheres to the adhesive is high in the preparation process, the wall material of the expandable microspheres is organic resin, the solvent used by the adhesive is required to have no solubility to the microspheres, otherwise, the microspheres lose the thermal viscosity reducing function, and in addition, the adhesive solution is required to have stable dispersing capacity to the microspheres, otherwise, the microspheres are easy to settle, the product appearance and the viscosity reducing effect are influenced, and based on the problems, the practical thermal viscosity reducing adhesive tape cannot be prepared by certain types of adhesives.
Disclosure of Invention
The invention aims to provide a thermal viscosity-reducing adhesive tape easy to prepare and a preparation method thereof, so as to solve the problem that some adhesive systems proposed in the background technology cannot prepare the thermal viscosity-reducing adhesive tape.
In order to achieve the purpose, the invention adopts the following technical scheme: the thermal anti-sticking adhesive tape easy to prepare comprises a plastic base material, wherein a thermal anti-sticking functional layer is coated on the plastic base material and is formed by coating thermal anti-sticking adhesive on the plastic base material after being cured, an adhesive layer is coated on the thermal anti-sticking functional layer, a release film is coated on the adhesive layer, and the plastic base material, the thermal anti-sticking functional layer, the adhesive layer and the release film are fixedly bonded by adopting an adhesive.
Preferably, the thermal viscosity-reducing adhesive is prepared by mixing resin, a curing agent, a solvent, a self-expansion microsphere foaming agent and toner.
Preferably, the adhesive is a solvent type high-temperature-resistant polyacrylate pressure-sensitive adhesive.
Preferably, the plastic base material is one of polyethylene PE, polypropylene PP, polyvinyl chloride PVC, polyolefin PO, polyester PET and polyimide PI film with the thickness of 5-150 μm.
Preferably, the thermal viscosity reducing functional layer is a mixture of 10-50 μm alcohol-soluble acrylate adhesive and expandable microspheres, wherein the particle size of the expandable microspheres is 5-40 μm, and the addition proportion is 5-20% of the weight of the expandable microspheres.
Preferably, the adhesive layer is 2-50 μm polyacrylate pressure-sensitive adhesive, polyurethane pressure-sensitive adhesive, organic silicon pressure-sensitive adhesive and rubber pressure-sensitive adhesive.
Preferably, the release film is one of a silicon-based release film or release paper, a fluorine-based release film or release paper, and a non-silicon non-fluorine-based release film or release paper with the thickness of 5-50 μm.
A preparation method of a heat-viscosity reduction adhesive tape easy to prepare comprises the following steps:
s1, coating a thermal viscosity reduction functional layer with the dry weight of 30g/m2 on a plastic base material with the thickness of 36 mu m;
s2, coating a toluene solvent type low-viscosity polyurethane pressure-sensitive adhesive layer with the dry weight of 20g/m2 on the thermal-viscosity-reducing functional layer;
and S3, finally compounding a 50-micron silicon-based PET release film on the adhesive layer to obtain the thermal de-bonding adhesive tape.
Preferably, the heat-thinning functional layer in S1 is prepared by mixing emulsion-type polyacrylate pressure-sensitive adhesive and expandable microspheres.
The invention has the technical effects and advantages that: compared with the prior art, the invention firstly coats a thermal viscosity reducing functional layer on the plastic substrate, then coats an adhesive layer on the thermal viscosity reducing functional layer, and finally compounds the release film on the adhesive layer.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural diagram of the thermal adhesive reduction tape of the present invention.
In the figure: 1. a plastic substrate; 2. a thermal de-bonding functional layer; 3. an adhesive layer; 4. and (4) a release film.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The specific embodiments described herein are merely illustrative of the invention and do not delimit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1, the invention provides an easy-to-prepare thermal anti-adhesion adhesive tape and a preparation method thereof, the easy-to-prepare thermal anti-adhesion adhesive tape comprises a plastic substrate 1, a thermal anti-adhesion functional layer 2 is coated on the plastic substrate 1, the thermal anti-adhesion functional layer 2 is formed by coating a thermal anti-adhesion adhesive on the plastic substrate 1 and curing, an adhesive layer 3 is coated on the thermal anti-adhesion functional layer 2, a release film 4 is coated on the adhesive layer 3, and the plastic substrate 1, the thermal anti-adhesion functional layer 2, the adhesive layer 3 and the release film 4 are all bonded and fixed by an adhesive.
Specifically, the thermal viscosity-reducing adhesive is prepared by mixing resin, a curing agent, a solvent, a self-expanding microsphere foaming agent and toner.
Specifically, the adhesive is a solvent type high-temperature-resistant polyacrylate pressure-sensitive adhesive.
Specifically, the plastic substrate 1 is one of polyethylene PE, polypropylene PP, polyvinyl chloride PVC, polyolefin PO, polyester PET, and polyimide PI film of 5-150 μm.
Specifically, the thermal viscosity reduction functional layer 2 is a mixture of 10-50 μm alcohol-soluble acrylate adhesive and expandable microspheres, wherein the particle size of the expandable microspheres is 5-40 μm, and the addition proportion is 5-20% of the weight of the expandable microspheres.
Specifically, the adhesive layer 3 is 2-50 μm polyacrylate pressure-sensitive adhesive, polyurethane pressure-sensitive adhesive, organic silicon pressure-sensitive adhesive and rubber pressure-sensitive adhesive.
Specifically, the release film 4 is one of a silicon-based release film or release paper, a fluorine-based release film or release paper, and a non-silicon non-fluorine-based release film or release paper with a thickness of 5 to 50 μm.
A preparation method of a heat-viscosity reduction adhesive tape easy to prepare comprises the following steps:
s1, mixing the dry weight of the mixture with 30g/m2The thermal viscosity-reducing functional layer 2 (the weight ratio of the emulsion type propionate pressure-sensitive adhesive to the expandable microspheres is 85%: 15%) is coated on a PET plastic film material 1 with the thickness of 36 mu m;
s2, and then mixing the dry weight of 20g/m2The toluene solvent type low-viscosity polyurethane pressure-sensitive adhesive layer 3 is coated on the thermal de-bonding functional layer 2;
and S3, finally compounding a 50-micron silicon-based PET release film 4 on the adhesive layer 3 to obtain the thermal adhesive reduction tape.
Specifically, the heat-thinning functional layer 2 in S1 is prepared by mixing emulsion type polyacrylate pressure-sensitive adhesive and expandable microspheres.
Example 2
Referring to fig. 1, the invention provides an easy-to-prepare thermal anti-adhesion adhesive tape and a preparation method thereof, the easy-to-prepare thermal anti-adhesion adhesive tape comprises a plastic substrate 1, a thermal anti-adhesion functional layer 2 is coated on the plastic substrate 1, the thermal anti-adhesion functional layer 2 is formed by coating a thermal anti-adhesion adhesive on the plastic substrate 1 and curing, an adhesive layer 3 is coated on the thermal anti-adhesion functional layer 2, a release film 4 is coated on the adhesive layer 3, and the plastic substrate 1, the thermal anti-adhesion functional layer 2, the adhesive layer 3 and the release film 4 are all bonded and fixed by an adhesive.
Specifically, the thermal viscosity-reducing adhesive is prepared by mixing resin, a curing agent, a solvent, a self-expanding microsphere foaming agent and toner.
Specifically, the adhesive is a solvent type high-temperature-resistant polyacrylate pressure-sensitive adhesive.
Specifically, the plastic substrate 1 is one of polyethylene PE, polypropylene PP, polyvinyl chloride PVC, polyolefin PO, polyester PET, and polyimide PI film of 5-150 μm.
Specifically, the thermal viscosity reduction functional layer 2 is a mixture of 10-50 μm alcohol-soluble acrylate adhesive and expandable microspheres, wherein the particle size of the expandable microspheres is 5-40 μm, and the addition proportion is 5-20% of the weight of the expandable microspheres.
Specifically, the adhesive layer 3 is 2-50 μm polyacrylate pressure-sensitive adhesive, polyurethane pressure-sensitive adhesive, organic silicon pressure-sensitive adhesive and rubber pressure-sensitive adhesive.
Specifically, the release film 4 is one of a silicon-based release film or release paper, a fluorine-based release film or release paper, and a non-silicon non-fluorine-based release film or release paper with a thickness of 5 to 50 μm.
A preparation method of a heat-viscosity reduction adhesive tape easy to prepare comprises the following steps:
s1, mixing the dry weight of the mixture with 30g/m2The thermal viscosity-reducing functional layer 2 (the weight ratio of the emulsion type propionate pressure-sensitive adhesive to the expandable microspheres is 85%: 15%) is coated on a PET plastic film material 1 with the thickness of 36 mu m;
s2, and then mixing the dry weight of 20g/m2The toluene solvent type low-viscosity polyurethane pressure-sensitive adhesive layer 3 is coated on the thermal de-bonding functional layer 2;
and S3, finally compounding a 50-micron silicon-based PET release film 4 on the adhesive layer 3 to obtain the thermal adhesive reduction tape.
Specifically, the heat-thinning functional layer 2 in S1 is prepared by mixing emulsion type polyacrylate pressure-sensitive adhesive and expandable microspheres.
Example 3
Referring to fig. 1, the invention provides an easy-to-prepare thermal anti-adhesion adhesive tape and a preparation method thereof, the easy-to-prepare thermal anti-adhesion adhesive tape comprises a plastic substrate 1, a thermal anti-adhesion functional layer 2 is coated on the plastic substrate 1, the thermal anti-adhesion functional layer 2 is formed by coating a thermal anti-adhesion adhesive on the plastic substrate 1 and curing, an adhesive layer 3 is coated on the thermal anti-adhesion functional layer 2, a release film 4 is coated on the adhesive layer 3, and the plastic substrate 1, the thermal anti-adhesion functional layer 2, the adhesive layer 3 and the release film 4 are all bonded and fixed by an adhesive.
Specifically, the thermal viscosity-reducing adhesive is prepared by mixing resin, a curing agent, a solvent, a self-expanding microsphere foaming agent and toner.
Specifically, the adhesive is a solvent type high-temperature-resistant polyacrylate pressure-sensitive adhesive.
Specifically, the plastic substrate 1 is one of polyethylene PE, polypropylene PP, polyvinyl chloride PVC, polyolefin PO, polyester PET, and polyimide PI film of 5-150 μm.
Specifically, the thermal viscosity reduction functional layer 2 is a mixture of 10-50 μm alcohol-soluble acrylate adhesive and expandable microspheres, wherein the particle size of the expandable microspheres is 5-40 μm, and the addition proportion is 5-20% of the weight of the expandable microspheres.
Specifically, the adhesive layer 3 is 2-50 μm polyacrylate pressure-sensitive adhesive, polyurethane pressure-sensitive adhesive, organic silicon pressure-sensitive adhesive and rubber pressure-sensitive adhesive.
Specifically, the release film 4 is one of a silicon-based release film or release paper, a fluorine-based release film or release paper, and a non-silicon non-fluorine-based release film or release paper with a thickness of 5 to 50 μm.
A preparation method of a heat-viscosity reduction adhesive tape easy to prepare comprises the following steps:
s1, mixing the dry weight of the mixture with 40g/m2The thermal viscosity-reducing functional layer 2 (the weight ratio of the alcohol-soluble propionate pressure-sensitive adhesive to the expandable microspheres is 80%: 20%) is coated on a PET plastic film material 1 with the thickness of 50 mu m;
s2, and then mixing the dry weight of 10g/m2The toluene solvent type organic silicon pressure-sensitive adhesive layer 3 is coated on the thermal viscosity reduction functional layer 2;
and S3, finally compounding a fluoride PET release film 4 with the thickness of 50 mu m on the adhesive layer 3 to obtain the thermal de-bonding adhesive tape.
Specifically, the heat-thinning functional layer 2 in S1 is prepared by mixing emulsion type polyacrylate pressure-sensitive adhesive and expandable microspheres.
Example 4
Referring to fig. 1, the invention provides an easy-to-prepare thermal anti-adhesion adhesive tape and a preparation method thereof, the easy-to-prepare thermal anti-adhesion adhesive tape comprises a plastic substrate 1, a thermal anti-adhesion functional layer 2 is coated on the plastic substrate 1, the thermal anti-adhesion functional layer 2 is formed by coating a thermal anti-adhesion adhesive on the plastic substrate 1 and curing, an adhesive layer 3 is coated on the thermal anti-adhesion functional layer 2, a release film 4 is coated on the adhesive layer 3, and the plastic substrate 1, the thermal anti-adhesion functional layer 2, the adhesive layer 3 and the release film 4 are all bonded and fixed by an adhesive.
Specifically, the thermal viscosity-reducing adhesive is prepared by mixing resin, a curing agent, a solvent, a self-expanding microsphere foaming agent and toner.
Specifically, the adhesive is a solvent type high-temperature-resistant polyacrylate pressure-sensitive adhesive.
Specifically, the plastic substrate 1 is one of polyethylene PE, polypropylene PP, polyvinyl chloride PVC, polyolefin PO, polyester PET, and polyimide PI film of 5-150 μm.
Specifically, the thermal viscosity reduction functional layer 2 is a mixture of 10-50 μm alcohol-soluble acrylate adhesive and expandable microspheres, wherein the particle size of the expandable microspheres is 5-40 μm, and the addition proportion is 5-20% of the weight of the expandable microspheres.
Specifically, the adhesive layer 3 is 2-50 μm polyacrylate pressure-sensitive adhesive, polyurethane pressure-sensitive adhesive, organic silicon pressure-sensitive adhesive and rubber pressure-sensitive adhesive.
Specifically, the release film 4 is one of a silicon-based release film or release paper, a fluorine-based release film or release paper, and a non-silicon non-fluorine-based release film or release paper with a thickness of 5 to 50 μm.
A preparation method of a heat-viscosity reduction adhesive tape easy to prepare comprises the following steps:
s1, mixing the dry weight of the mixture with 30g/m2The thermal viscosity-reducing functional layer 2 (the weight ratio of the alcohol-soluble propionate pressure-sensitive adhesive to the expandable microspheres is 90%: 10%) is coated on a PE plastic film material 1 with the thickness of 36 mu m;
s2, and then mixing the dry weight of 20g/m2Ethyl acetate solvent type high viscosity polyacrylateThe pressure-sensitive adhesive adhesion layer 3 is coated on the thermal de-bonding functional layer 2;
and S3, finally compounding the 36-micron silicon-based PET release film 4 on the adhesive layer 3 to obtain the thermal adhesive reduction tape.
Specifically, the heat-thinning functional layer 2 in S1 is prepared by mixing emulsion type polyacrylate pressure-sensitive adhesive and expandable microspheres.
Example 5
Referring to fig. 1, the invention provides an easy-to-prepare thermal anti-adhesion adhesive tape and a preparation method thereof, the easy-to-prepare thermal anti-adhesion adhesive tape comprises a plastic substrate 1, a thermal anti-adhesion functional layer 2 is coated on the plastic substrate 1, the thermal anti-adhesion functional layer 2 is formed by coating a thermal anti-adhesion adhesive on the plastic substrate 1 and curing, an adhesive layer 3 is coated on the thermal anti-adhesion functional layer 2, a release film 4 is coated on the adhesive layer 3, and the plastic substrate 1, the thermal anti-adhesion functional layer 2, the adhesive layer 3 and the release film 4 are all bonded and fixed by an adhesive.
Specifically, the thermal viscosity-reducing adhesive is prepared by mixing resin, a curing agent, a solvent, a self-expanding microsphere foaming agent and toner.
Specifically, the adhesive is a solvent type high-temperature-resistant polyacrylate pressure-sensitive adhesive.
Specifically, the plastic substrate 1 is one of polyethylene PE, polypropylene PP, polyvinyl chloride PVC, polyolefin PO, polyester PET, and polyimide PI film of 5-150 μm.
Specifically, the thermal viscosity reduction functional layer 2 is a mixture of 10-50 μm alcohol-soluble acrylate adhesive and expandable microspheres, wherein the particle size of the expandable microspheres is 5-40 μm, and the addition proportion is 5-20% of the weight of the expandable microspheres.
Specifically, the adhesive layer 3 is 2-50 μm polyacrylate pressure-sensitive adhesive, polyurethane pressure-sensitive adhesive, organic silicon pressure-sensitive adhesive and rubber pressure-sensitive adhesive.
Specifically, the release film 4 is one of a silicon-based release film or release paper, a fluorine-based release film or release paper, and a non-silicon non-fluorine-based release film or release paper with a thickness of 5 to 50 μm.
A preparation method of a heat-viscosity reduction adhesive tape easy to prepare comprises the following steps:
s1, mixing the dry weight of the mixture with 20g/m2Thermal viscosity reduction functional layer 2 (alcohol-soluble polyacrylate pressure-sensitive adhesive)And the weight ratio of the expanded microspheres is 90%: 10%) is coated on a PVC plastic film material 1 with the thickness of 36 mu m;
s2, and then mixing the dry weight of 20g/m2The toluene solvent type rubber type pressure sensitive adhesive layer 3 is coated on the thermal de-bonding functional layer 2;
and S3, finally compounding a 50-micron silicon PVC release film 4 on the adhesive layer 3 to obtain the thermal de-bonding adhesive tape.
Specifically, the heat-thinning functional layer 2 in S1 is prepared by mixing emulsion type polyacrylate pressure-sensitive adhesive and expandable microspheres
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims (9)

1. An easy-to-prepare thermal adhesive reduction tape characterized by: including plastic substrate (1), the coating has heat visbreaking functional layer (2) on plastic substrate (1), heat visbreaking functional layer (2) is by the coating of heat visbreaking glue form after the solidification on plastic substrate (1), the coating has adhesive layer (3) on heat visbreaking functional layer (2), the coating has from type membrane (4) on adhesive layer (3), plastic substrate (1) heat visbreaking functional layer (2) adhesive layer (3) with all adopt the adhesive to bond fixedly between type membrane (4).
2. A readily preparable thermal de-bonding tape according to claim 1, characterized in that: the thermal viscosity-reducing adhesive is prepared by mixing resin, a curing agent, a solvent, a self-expanding microsphere foaming agent and toner.
3. A readily preparable thermal de-bonding tape according to claim 1, characterized in that: the adhesive is a solvent type high-temperature-resistant polyacrylate pressure-sensitive adhesive.
4. A readily preparable thermal de-bonding tape according to claim 1, characterized in that: the plastic base material (1) is one of Polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), Polyolefin (PO), Polyester (PET) and Polyimide (PI) films with the thickness of 5-150 mu m.
5. A readily preparable thermal de-bonding tape according to claim 1, characterized in that: the thermal viscosity reduction functional layer (2) is a mixture of 10-50 mu m alcohol-soluble acrylate adhesive and expandable microspheres, wherein the particle size of the expandable microspheres is 5-40 mu m, and the addition proportion is 5-20% of the weight of the expandable microspheres.
6. A readily preparable thermal de-bonding tape according to claim 1, characterized in that: the adhesive layer (3) is 2-50 mu m polyacrylate pressure-sensitive adhesive, polyurethane pressure-sensitive adhesive, organic silicon pressure-sensitive adhesive and rubber pressure-sensitive adhesive.
7. A readily preparable thermal de-bonding tape according to claim 1, characterized in that: the release film (4) is one of a silicon-based release film or release paper, a fluorine-based release film or release paper, and a non-silicon non-fluorine-based release film or release paper with the thickness of 5-50 mu m.
8. A method for preparing a thermal adhesive tape easy to prepare according to claim 1, wherein: the method comprises the following steps:
s1, coating the thermal viscosity reduction functional layer 2 with the dry weight of 30g/m2 on a plastic base material (1) with the thickness of 36 mu m;
s2, coating a toluene solvent type low-viscosity polyurethane pressure-sensitive adhesive layer (3) with the dry weight of 20g/m2 on the thermal-viscosity-reducing functional layer (2);
s3, finally compounding a 50-micron silicon-based PET release film (4) on the adhesive layer (3) to obtain the thermal anti-sticking adhesive tape.
9. A method for preparing a heat-activated, pressure-reducing adhesive tape easy to prepare as claimed in claim 8, wherein: the heat-thinning functional layer (2) in the S1 is prepared by mixing emulsion type polyacrylate pressure-sensitive adhesive and expandable microspheres.
CN201911005140.7A 2019-10-22 2019-10-22 Easy-to-prepare thermal viscosity-reducing adhesive tape and preparation method thereof Pending CN110819243A (en)

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CN201911005140.7A CN110819243A (en) 2019-10-22 2019-10-22 Easy-to-prepare thermal viscosity-reducing adhesive tape and preparation method thereof

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Application Number Priority Date Filing Date Title
CN201911005140.7A CN110819243A (en) 2019-10-22 2019-10-22 Easy-to-prepare thermal viscosity-reducing adhesive tape and preparation method thereof

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CN (1) CN110819243A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111648161A (en) * 2020-06-12 2020-09-11 浙江道明新材料有限公司 Method for manufacturing release paper with microspheres
CN112322205A (en) * 2020-10-21 2021-02-05 宁波东旭成新材料科技有限公司 Preparation method of thermal viscosity reduction protective film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111648161A (en) * 2020-06-12 2020-09-11 浙江道明新材料有限公司 Method for manufacturing release paper with microspheres
CN112322205A (en) * 2020-10-21 2021-02-05 宁波东旭成新材料科技有限公司 Preparation method of thermal viscosity reduction protective film

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