CN219214177U

CN219214177U - Heat setting voltage machine

Info

Publication number: CN219214177U
Application number: CN202223346346.6U
Authority: CN
Inventors: 王雪松
Original assignee: Yili Zhuowan Clothing Manufacturing Co ltd
Current assignee: Yili Zhuowan Clothing Manufacturing Co ltd
Priority date: 2022-12-11
Filing date: 2022-12-11
Publication date: 2023-06-20
Anticipated expiration: 2032-12-11

Abstract

The utility model discloses a heat setting electric machine, which comprises a table device for supporting the heat setting of a semiconductor die, a pressing device arranged at the top of the table device and used for electrically pressing the semiconductor die, and a positioning device arranged on the table device and used for limiting and positioning the semiconductor die, wherein the pressing device is used for electrically pressing the semiconductor die; the positioning device comprises two telescopic cylinders which are symmetrically arranged, a push plate is arranged between telescopic ends of the telescopic cylinders, and a positioning block is arranged on one side of the push plate. According to the heat setting electric machine, through the arrangement of open positioning, the semiconductor dies with different sizes can be positioned conveniently, and the applicability is improved; by the aid of the pneumatic telescopic auxiliary positioning, labor intensity is reduced, and time and labor are saved; through the setting of upper and lower simultaneous heating compress tightly, guaranteed the quality of semiconductor hot pressing design.

Description

Heat setting voltage machine

Technical Field

The utility model belongs to the field of semiconductor production, and particularly relates to a heat setting electric press.

Background

The heat setting electric press is one kind of press, and the press has oil press, air pressure, etc. The pressure value of the electric motor can be regulated generally, namely, the pressure is set to be 100kg, and the electric motor is not pressurized any more when the pressure is set to be 100kg, so that the pressure is stable.

The chinese patent of contrast application number 202122336638.0 discloses a heat setting electric press convenient to location, including processing platform and top board, the top board is located the top of processing platform, the backup pad has all been fixed to the both sides of processing platform upper surface, the roof has been fixed on the top of backup pad, the upper surface of processing platform has the holding down plate admittedly, the upper surface of holding down plate has fixed the locating frame, the buckling groove has been seted up to the upper surface of holding down plate, the inside of top board and holding down plate all is provided with the change structure, the surface of roof and top board all is provided with drive assembly.

The above patent is only suitable for hot press shaping positioning with fixed size, and has poor applicability. Therefore, a new device is designed, and the utility model is convenient for positioning semiconductor dies with different sizes through the arrangement of open positioning, thereby increasing the applicability; by the aid of the pneumatic telescopic auxiliary positioning, labor intensity is reduced, and time and labor are saved; through the setting of upper and lower simultaneous heating compress tightly, guaranteed the quality of semiconductor hot pressing design.

Disclosure of Invention

The present utility model is directed to a heat-setting electric press, which solves the above-mentioned problems in the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the heat setting electric press comprises a table device for supporting the heat setting of the semiconductor die, a pressing device which is arranged at the top of the table device and used for electrically pressing the semiconductor die for heat setting, and a positioning device which is arranged on the table device and used for limiting and positioning the semiconductor die; the positioning device comprises two telescopic cylinders which are symmetrically arranged, a push plate is arranged between telescopic ends of the telescopic cylinders, and a positioning block is arranged on one side of the push plate.

Further: the table device comprises a supporting table, a lower base plate is arranged in the middle of the supporting table, lower heating wires are uniformly distributed in the middle of the lower base plate, and a lower joint is arranged behind the supporting table.

Further: the pressing device comprises an upper pressing plate, upper heating wires are uniformly distributed in the middle of the upper pressing plate, an upper joint is arranged at the rear of the upper pressing plate, a sliding frame is arranged on the upper pressing plate, a lead screw is arranged in the middle of the sliding frame, and a motor is arranged at the bottom end of the lead screw.

Further: the lower backing plate is rectangular in shape, and the lower backing plate is connected with the supporting table through bolts.

Further: the motor is connected with the table device through bolts, and the sliding frame is connected with the table device in a sliding mode.

Further: the positioning block is L-shaped, and the positioning block and the table device are riveted together.

Compared with the prior art, the utility model has the beneficial effects that:

1. through the arrangement of open positioning, semiconductor dies with different sizes can be positioned conveniently, and applicability is improved;

2. by the aid of the pneumatic telescopic auxiliary positioning, labor intensity is reduced, and time and labor are saved;

3. through the setting of upper and lower simultaneous heating compress tightly, guaranteed the quality of semiconductor hot pressing design.

Drawings

FIG. 1 is a schematic diagram of a heat-setting electric press according to the present utility model;

FIG. 2 is a schematic view of a table device of a heat-setting electric machine according to the present utility model;

FIG. 3 is a schematic view of a pressing device of a heat-setting electric press according to the present utility model;

fig. 4 is a schematic diagram of a positioning device of a heat-setting electric press according to the present utility model.

In the reference numerals: 1. a table device; 101. a support table; 102. a lower backing plate; 103. a lower joint; 104. a lower heating wire; 2. a pressing device; 201. an upper press plate; 202. an upper joint; 203. an upper heating wire; 204. a carriage; 205. a motor; 206. a screw rod; 3. a positioning device; 301. a telescopic cylinder; 302. a push plate; 303. and (5) positioning blocks.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, a heat setting electric press comprises a table device 1 for supporting the heat setting of a semiconductor die, a pressing device 2 arranged at the top of the table device 1 and used for electrically pressing the semiconductor die for heat setting, and a positioning device 3 arranged on the table device 1 and used for limiting and positioning the semiconductor die.

In this embodiment: the table device 1 comprises a supporting table 101, a lower base plate 102 is arranged in the middle of the supporting table 101, lower heating wires 104 are uniformly distributed in the middle of the lower base plate 102, a lower joint 103 is arranged behind the supporting table 101, the lower base plate 102 is rectangular, the lower base plate 102 is connected with the supporting table 101 through bolts, a die provided with a semiconductor is placed on the lower base plate 102, and the lower joint 103 conducts electricity to enable the lower heating wires 104 to heat the lower base plate 102;

in this embodiment: the pressing device 2 comprises an upper pressing plate 201, upper heating wires 203 are uniformly distributed in the middle of the upper pressing plate 201, an upper joint 202 is arranged at the rear of the upper pressing plate 201, a sliding frame 204 is arranged on the upper pressing plate 201, a lead screw 206 is arranged in the middle of the sliding frame 204, a motor 205 is arranged at the bottom end of the lead screw 206, the motor 205 is connected with the table device 1 through bolts, the sliding frame 204 is connected with the table device 1 in a sliding way, the motor 205 drives the lead screw 206 to rotate, the upper pressing plate 201 is driven to press downwards through the sliding frame 204, a semiconductor die is pressed on the lower base plate 102, and the upper joint 202 conducts electricity to enable the upper heating wires 203 to heat the upper pressing plate 201;

in this embodiment: the positioning device 3 comprises two telescopic cylinders 301 which are symmetrically arranged, a push plate 302 is arranged between telescopic ends of the telescopic cylinders 301, a positioning block 303 is arranged on one side of the push plate 302, the positioning block 303 is L-shaped, the positioning block 303 and the table device 1 are riveted together, the telescopic cylinders 301 extend to push a semiconductor die to be attached to the side face of the positioning block 303 through the push plate 302, and then the push plate 302 is reset.

Working principle: the die with the semiconductor is placed on the lower base plate 102 and is clung to the rear end face of the positioning block 303, the telescopic cylinder 301 stretches to push the semiconductor die to be clung to the side face of the positioning block 303 through the push plate 302, then the push plate 302 is reset, the motor 205 drives the lead screw 206 to rotate, the upper pressing plate 201 is driven to press down through the descending of the carriage 204, the semiconductor die is pressed on the lower base plate 102, meanwhile, the upper connector 202 conducts electricity to enable the upper heating wire 203 to heat the upper pressing plate 201, the lower connector 103 conducts electricity to enable the lower heating wire 104 to heat the lower base plate 102, and the semiconductor in the semiconductor die is subjected to hot press shaping.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a heat setting electric press, includes be used for bearing semiconductor die hot briquetting's table device (1) with be used for electronic device (2) that pushes down semiconductor die hot briquetting of pushing down of table device (1) top installation, its characterized in that: the positioning device (3) is arranged on the table device (1) and used for limiting and positioning the semiconductor die;

the positioning device (3) comprises two telescopic cylinders (301) which are symmetrically arranged, a push plate (302) is arranged between telescopic ends of the telescopic cylinders (301), and a positioning block (303) is arranged on one side of the push plate (302).

2. A heat-set electrical machine according to claim 1, wherein: the table device (1) comprises a supporting table (101), a lower base plate (102) is arranged in the middle of the supporting table (101), lower heating wires (104) are uniformly distributed in the middle of the lower base plate (102), and a lower joint (103) is arranged behind the supporting table (101).

3. A heat-set electrical machine according to claim 1, wherein: the pushing device (2) comprises an upper pressing plate (201), upper heating wires (203) are uniformly distributed in the middle of the upper pressing plate (201), an upper joint (202) is installed behind the upper pressing plate (201), a sliding frame (204) is installed on the upper pressing plate (201), a lead screw (206) is installed in the middle of the sliding frame (204), and a motor (205) is arranged at the bottom end of the lead screw (206).

4. A heat-set electrical machine according to claim 2, characterized in that: the lower base plate (102) is rectangular in shape, and the lower base plate (102) is connected with the supporting table (101) through bolts.

5. A heat-set electrical machine according to claim 3, wherein: the motor (205) is connected with the table device (1) through bolts, and the sliding frame (204) is connected with the table device (1) in a sliding mode.

6. A heat-set electrical machine according to claim 1, wherein: the positioning block (303) is L-shaped, and the positioning block (303) and the table device (1) are riveted together.