CN219210031U - High-low temperature experiment table - Google Patents
High-low temperature experiment table Download PDFInfo
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- CN219210031U CN219210031U CN202320680784.1U CN202320680784U CN219210031U CN 219210031 U CN219210031 U CN 219210031U CN 202320680784 U CN202320680784 U CN 202320680784U CN 219210031 U CN219210031 U CN 219210031U
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- low temperature
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Abstract
The utility model discloses a high-low temperature experiment table, which comprises a test box with a hollow inside, wherein a heat conduction test table is arranged in the test box, and a cold conduction medium flow pipeline, a heating rod and a temperature sensor which are communicated with the outside are arranged in the heat conduction test table; the side wall of the test box is internally provided with a fluid cooling pipeline communicated with the outside, and the test box is also provided with a vacuumizing pipeline, a ventilation joint, two vacuum degree detection pipes and a sensor electric socket which are internally and externally communicated; the article to be tested at high and low temperature is placed on the heat conduction test bench, the temperature in the test box is controlled by the cold conduction medium and the heating rod flowing in the cold conduction medium flow pipeline, the test box is vacuumized by the vacuumizer, the temperature of the test box is constant by fluid flowing in the fluid cooling pipeline, and the high vacuum degree and the low vacuum degree are detected by the two vacuum degree detection pipes respectively.
Description
Technical Field
The utility model relates to the technical field of high-low temperature experimental equipment, in particular to a high-low temperature experiment table.
Background
The high-low temperature tester is an instrument for high-low temperature reliability test. The performance indexes of parts and materials of related products such as electronic electricians, automobiles, motorcycles, aerospace, rubber, plastics, metals, ship weapons, universities and colleges and scientific research institutions are tested under the condition of high and low temperature changes. The volume of a chamber for testing of the existing high-low temperature tester is larger, and a heating pipe and a refrigerating device which are paved in a complex way are generally adopted for heating and refrigerating, so that the temperature control is not accurate, and the device is not suitable for accurate testing of electronic elements.
Therefore, the person skilled in the art is dedicated to develop a high-low temperature experiment table with compact structure and high temperature control precision.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, the present utility model is to provide a high-low temperature laboratory bench with compact structure and high temperature control precision.
In order to achieve the above purpose, the utility model provides a high-low temperature experiment table, which comprises a test box with a hollow inside, wherein a heat conduction test table is arranged in the test box, and a cold conduction medium flow pipeline, a heating rod and a temperature sensor which are communicated with the outside are arranged in the heat conduction test table; the side wall of the test box is internally provided with a fluid cooling pipeline communicated with the outside, and the test box is further provided with a vacuumizing pipeline, a ventilation joint, two vacuum degree detection pipes and a sensor electric socket which are communicated with the inside and the outside.
The two fluid cooling pipelines are respectively arranged on two sides of the test box, and two ends of the fluid cooling pipeline are respectively connected with an inlet connector and an outlet connector which are positioned on the surface of the test box.
The test box comprises a detachable top cover, and an observation window is arranged in the middle of the top cover.
The U-shaped pipe of the cold-conducting medium flow pipeline is fixedly arranged in the heat conduction test bench, and the inlet and the outlet of the cold-conducting medium flow pipeline extend out of the outer surface of the test box respectively.
The bottom of heat conduction testboard and test box is through support column support connection.
The two sides of the test box are also respectively provided with an external connection opening, an external connection plate is sealed on the external connection opening, and a self-sealing wire perforation penetrating through the external connection plate is arranged on the external connection plate.
The beneficial effects of the utility model are as follows: the high-low temperature experiment table comprises a test box with a hollow inside, wherein a heat conduction test table is arranged in the test box, and a cold conduction medium flow pipeline, a heating rod and a temperature sensor which are communicated with the outside are arranged in the heat conduction test table; the side wall of the test box is internally provided with a fluid cooling pipeline communicated with the outside, and the test box is also provided with a vacuumizing pipeline, a ventilation joint, two vacuum degree detection pipes and a sensor electric socket which are internally and externally communicated; the high-precision pointed electronic product to be subjected to high-low temperature impact is placed on the heat conduction test bench, the surface temperature of the heat conduction test bench is controlled by the cold conduction medium and the heating rod which circulate in the cold conduction medium flow pipeline, the vacuum machine performs vacuumizing treatment on the test box through the vacuumizing pipeline, the fluid flowing in the fluid cooling pipeline is constant in temperature, such as water and the like, and the two vacuum degree detection pipes respectively detect the high vacuum degree and the low vacuum degree.
Drawings
FIG. 1 is one of the structural schematic diagrams of the present utility model;
FIG. 2 is a second schematic diagram of the structure of the present utility model;
FIG. 3 is a top plan view of the structure of the present utility model;
FIG. 4 is a cross-sectional view of the structure at A-A of FIG. 3;
fig. 5 is a partial structural schematic of the present utility model.
Detailed Description
The present utility model will be further described with reference to the drawings and examples, and it should be noted that in the description of the present utility model, the terms "upper", "lower", "left", "right", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, only for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific manner, and thus should not be construed as limiting the present utility model. The terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
As shown in fig. 1 to 5, a high-low temperature experiment table comprises a test box 1 with a hollow inside, wherein a heat conduction test table 2 is arranged in the test box 1, and a cold conduction medium circulation pipeline 3, a heating rod 4 and a temperature sensor 5 which are communicated with the outside are arranged in the heat conduction test table 2; the side wall of the test box 1 is internally provided with a fluid cooling pipeline 6 communicated with the outside, and the test box 1 is also provided with a vacuumizing pipeline 7, a ventilation joint 8, two vacuum degree detection pipes 9 and a sensor electric socket 10 which are communicated with the inside and the outside; one of them vacuum degree detecting tube 9 detects the high vacuum degree, another vacuum degree detecting tube 9 detects the low vacuum degree, wait to carry out the high smart point electronic product of high low temperature impact and place on the heat conduction test board, the surface temperature of heat conduction test board is controlled to the cold conduction medium that leads the interior circulation of cold medium runner pipe and heating rod, the vacuum machine carries out the evacuation processing to the test box through the evacuation pipeline, fluid such as water flowing in the fluid cooling pipeline carries out the constant temperature to the test box shell, avoid shell temperature too low or too high, two vacuum degree detecting tubes detect high vacuum degree and low vacuum degree respectively, whole high low temperature laboratory bench compact structure, small in size, the precision of control temperature and vacuum degree that can be better is applicable to the high low temperature accurate test of some high smart point electronic products, can realize the high low temperature experiment of a vacuum environment of 196 ℃ to 500 ℃.
The two sides of the test box 1 are also respectively provided with an external connection opening, an external connection plate 11 is sealed on the external connection opening, a self-sealing wire perforation 12 penetrating through the external connection plate 11 is arranged, and in the test process, a wire penetrates through the self-sealing wire perforation 12 to connect an electronic device to be tested with an instrument, so that the state of the electronic device to be tested is monitored in real time.
The two fluid cooling pipelines 6 are arranged on two sides of the test box 1, two ends of the fluid cooling pipelines 6 are respectively connected with an inlet joint 13 and an outlet joint 14 which are positioned on the surface of the test box 1, external cooling fluid flows into the fluid cooling pipelines 6 from the inlet joint 13, and the cooling fluid flows into the fluid cooling pipelines 6 through the inlet joint 13 and is discharged from the outlet joint 14 after passing through the fluid cooling pipelines 6, so that the temperature of the outer shell of the test box 1 is prevented from being too low in a low-temperature state and the temperature of the outer shell of the test box 1 is prevented from being too high in a high-temperature state.
The test box 1 comprises a detachable top cover 15, an observation window 16 is arranged in the middle of the top cover 15, and the top cover 15 is in sealing connection with the test box 1, so that no air leakage is caused when the vacuum is pumped.
The U-shaped pipe of cold-conducting medium flow pipeline 3, the turn part of cold-conducting medium flow pipeline 3 is fixed to be installed in the heat conduction test bench 2, the exit of cold-conducting medium flow pipeline 3 stretches out respectively the external surface of test box 1, cold-conducting medium flow pipeline 3 and heat conduction test bench 2 area of contact is big, and the cooling effect is good.
The bottom of heat conduction testboard 2 and test box 1 is through support column 17 support connection, simple structure, and the supporting effect is good.
The foregoing describes in detail preferred embodiments of the present utility model. It should be understood that numerous modifications and variations can be made in accordance with the concepts of the utility model by one of ordinary skill in the art without undue burden. Therefore, all technical solutions which can be obtained by logic analysis, reasoning or limited experiments based on the prior art by the person skilled in the art according to the inventive concept shall be within the scope of protection defined by the claims.
Claims (6)
1. A high-low temperature experiment table is characterized in that: the intelligent temperature control device comprises a test box (1) with a hollow interior, wherein a heat conduction test table (2) is arranged in the test box (1), and a cold conduction medium flow pipeline (3), a heating rod (4) and a temperature sensor (5) which are communicated with the outside are arranged in the heat conduction test table ((2); the side wall of the test box (1) is internally provided with a fluid cooling pipeline (6) communicated with the outside, and the test box (1) is further provided with a vacuumizing pipeline (7), a ventilation joint (8), two vacuum degree detection pipes (9) and a sensor electric socket (10) which are communicated with the inside and the outside.
2. The high and low temperature laboratory bench of claim 1, wherein: the two fluid cooling pipelines (6) are arranged on two sides of the test box (1) respectively, and two ends of the fluid cooling pipelines (6) are connected with an inlet joint (13) and an outlet joint (14) which are positioned on the surface of the test box (1) respectively.
3. The high and low temperature laboratory bench of claim 1, wherein: the test box (1) comprises a detachable top cover (15), and an observation window (16) is arranged in the middle of the top cover (15).
4. The high and low temperature laboratory bench of claim 1, wherein: the U-shaped pipe of cold-conducting medium flow pipeline (3), the turning part of cold-conducting medium flow pipeline (3) is fixedly installed in heat conduction testboard (2), the exit of cold-conducting medium flow pipeline (3) stretches out respectively the external surface of test box (1).
5. The high and low temperature laboratory bench of claim 1, wherein: the bottom of the heat conduction test board (2) and the bottom of the test box (1) are connected through a support column (17) in a supporting way.
6. The high and low temperature laboratory bench of claim 1, wherein: the two sides of the test box (1) are respectively provided with an external connection opening, an external connection plate (11) is sealed on the external connection opening, and a self-sealing wire perforation (12) penetrating through the external connection plate (11) is arranged.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202320680784.1U CN219210031U (en) | 2023-03-31 | 2023-03-31 | High-low temperature experiment table |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202320680784.1U CN219210031U (en) | 2023-03-31 | 2023-03-31 | High-low temperature experiment table |
Publications (1)
Publication Number | Publication Date |
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CN219210031U true CN219210031U (en) | 2023-06-20 |
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Family Applications (1)
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CN202320680784.1U Active CN219210031U (en) | 2023-03-31 | 2023-03-31 | High-low temperature experiment table |
Country Status (1)
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CN (1) | CN219210031U (en) |
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2023
- 2023-03-31 CN CN202320680784.1U patent/CN219210031U/en active Active
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