CN217820119U - Device for measuring thermal resistance and evaporability of nanofluid - Google Patents
Device for measuring thermal resistance and evaporability of nanofluid Download PDFInfo
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- CN217820119U CN217820119U CN202220720545.XU CN202220720545U CN217820119U CN 217820119 U CN217820119 U CN 217820119U CN 202220720545 U CN202220720545 U CN 202220720545U CN 217820119 U CN217820119 U CN 217820119U
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Abstract
The utility model discloses a measure device of nanometer fluid thermal resistance and evaporability, including the glass cover, glass cover lower extreme fixedly connected with heating cabinet installs electrical heating rod and copper one in the heating cabinet, installs the heat pipe in the glass cover, and a copper level sets up and connects electrical heating rod, and the bottom of glass cover is connected to the lower extreme of heat pipe and communicates with the heating cabinet, and the upper end of heat pipe is provided with the gas outlet, just is in the glass cover the both sides position department of heat pipe is provided with copper two, two vertical settings of copper and with glass cover inner wall fixed connection, this device through the copper that has surface microstructure, heat pipe, sponge filler, can dismantle parts such as bottom, the measuring device of putting up has realized the improvement of indirect heating equipment heat exchange efficiency, and the measurement of the reduction of irreversible loss and different shapes carrier and load nanometer fluid sample among the energy transfer process has fine heat preservation heat-proof, more reasonable and effectual energy of utilizing, reduces the working costs, and easy operation.
Description
Technical Field
The utility model belongs to the technical field of the nanometer fluid heat transfer field, concretely relates to measure device of nanometer fluid thermal resistance and evaporability.
Background
Currently, nanofluid is a new material, and the heat transfer performance of the nanofluid is remarkable and is concerned. However, there is no fixed device for measuring nanofluid thermal resistance, most of the existing devices for measuring thermal resistance are built by experimenters, no fixed measurement standard exists, and a certain error exists in the testing device.
The core of the testing component of the existing testing device comprises a pressure-resistant quartz glass cylinder body, a thin film electric heater, a condenser pipe, a temperature testing device, a pressure sensor and the like. The heating surface, the transparent quartz glass cylinder body and the heating film are fastened to form a closed cavity, and quantitative nano fluid is filled into the cavity to form a complete testing assembly. However, the testing device does not consider the influence of the processing method of the heat exchange surface, the surface roughness, the material characteristics, the old and new degree and the geometric shape of the container on the boiling heat transfer of the nanofluid.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems, the utility model provides a measure device of nanometer fluid thermal resistance and evaporability, the device both can survey nanometer fluid thermal resistance and can measure its evaporability, its technical scheme as follows:
the utility model discloses a measure device of nanometer fluid thermal resistance and evaporability, including the glass cover, glass cover lower extreme fixedly connected with heating cabinet, install electrical heating rod and copper one in the heating cabinet, install the heat pipe in the glass cover, a copper level sets up and connects the electrical heating rod, the bottom of glass cover is connected to the lower extreme of heat pipe and communicates with the heating cabinet, the upper end of heat pipe is provided with the gas outlet, just in the glass cover the both sides position department of heat pipe is provided with copper two, two vertical settings of copper and with glass cover inner wall fixed connection, the glass cover is gone up the fixed water inlet one that is provided with, water inlet two, delivery port, thermal resistance measurement mouth one, thermal resistance measurement mouth two, thermal resistance measurement mouth three, thermal resistance measurement mouth four and boiling point measurement mouth (16) one end of being connected to the heat pipe side, thermal resistance measurement mouth one, thermal resistance measurement mouth two, thermal resistance measurement mouth three, thermal resistance measurement mouth four and boiling point measurement mouth (16) the other end that stretches out the glass cover all is provided with the sensor on thermal resistance measurement mouth one, thermal resistance measurement mouth two, thermal resistance measurement mouth three, thermal resistance measurement mouth four and boiling point measurement mouth (16) independent sensors that stretch out.
Furthermore, the cooling module is respectively connected with the first water inlet and the second water outlet through rubber pipes.
Furthermore, the cooling module is respectively connected with the water inlet II and the water outlet through rubber pipes.
Furthermore, a grid microstructure is arranged on the first copper plate.
Further, the internal structure of the heat pipe is any one of a hot-melt slag structure, a groove structure and a multiple metal mesh structure.
Furthermore, sponge filler is filled in the part, located below the horizontal position of the boiling point measuring port, between the second copper plate and the inner wall of the glass cover.
Further, the heat-sensitive sensor is connected with a data display.
Further, the heating box comprises a drawer mechanism, and the drawer mechanism is installed at an upper position of the copper plate.
According to the invention, through the measuring device which is built by the copper plate with the surface microstructure, the heat pipe, the sponge filler, the detachable bottom and the like, the improvement of the heat exchange efficiency of the heat exchange equipment, the reduction of irreversible loss in the energy transfer process and the measurement of carriers with different shapes and loaded nano fluid samples thereof are realized, the method has good heat preservation and heat insulation properties, more reasonable and effective energy utilization is realized, the operating cost is reduced, and the operation is simple.
Compared with the prior art, the utility model adopts the above technical scheme, have following technological effect:
1. the device can measure the thermal resistance and the evaporability of the fluid.
2. The copper plate microstructure of the device can improve the heat conduction rate of the measured object.
3. The device can be used for measuring the thermal conductivity of carriers with different shapes and loaded nanofluid samples.
4. The device can test the thermal conductivity of the heat pipe loaded with the nanofluid.
5. The sponge filler in the device can reduce the heat loss in the measuring process and improve the measuring accuracy.
Drawings
Fig. 1 is a structural diagram of the apparatus for measuring thermal resistance and evaporability of nanofluid according to the present invention.
The reference numbers in the figures illustrate:
1. an electrical heating rod; 2. a first copper plate; 3. a heat pipe; 4. a sponge filler; 5. a second copper plate; 6. a glass cover; 7. a data display; 8. a cooling module; 9. a first water inlet; 10. a water inlet II; 11. a water outlet; 12. a thermal resistance first measurement port; 13. a second measurement port for thermal resistance; 14. a third measurement port for thermal resistance; 15. a fourth measurement port for thermal resistance; 16. a boiling point measuring port; 17. a heat-sensitive sensor; 18. a rubber tube; 19. a loading and unloading device; 20. an air outlet; 21. and (4) heating the box.
Detailed Description
The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention based on the embodiments of the present invention.
Referring to fig. 1, a device structure of the present invention is shown. The structure comprises an electric heating rod 1, a first copper plate 2, a heat pipe 3, a sponge filler 4, a glass cover 6, a data display 7, a cooling module 8, a first water inlet 9, a second water inlet 10, a water outlet 11, a first thermal resistance measuring port 12, a second thermal resistance measuring port 13, a third thermal resistance measuring port 14, a fourth thermal resistance measuring port 15, a boiling point measuring port 16, a thermal sensor 17, a rubber pipe 18, a drawer mechanism 19 and an air outlet 20.
And an air outlet is formed at the upper end of the heat pipe 3. The internal structure of the heat pipe 3 can be a hot slag structure, a groove structure, a multiple metal mesh, and can be selected according to the requirement. The heat pipe 3 is installed in the glass cover 6, and the lower end thereof is connected to the bottom of the glass cover 6 and communicated with the heating box 21.
And a second copper plate 5 is arranged in the glass cover 6 and at the positions of two sides of the heat pipe 3, and the second copper plate 5 is vertically arranged.
The heat pipe 3 is connected with a first thermal resistance measuring port 12, a second thermal resistance measuring port 13, a third thermal resistance measuring port 14, a fourth thermal resistance measuring port 15 and one end of a boiling point measuring port 16, the other ends of the first thermal resistance measuring port 12, the second thermal resistance measuring port 13, the third thermal resistance measuring port 14, the fourth thermal resistance measuring port 15 and the boiling point measuring port 16 extend out of the side face of the glass cover 6, the thermal resistance measuring ports 12, the second thermal resistance measuring port 13, the fourth thermal resistance measuring port 15 and the boiling point measuring port 16 of the third thermal resistance measuring port 14 are located at different horizontal positions and used for measuring the temperature of the nanofluid at different positions, later-stage calculation is facilitated, and the horizontal height of the boiling point measuring port 16 is located between the second thermal resistance measuring port 13 and the third thermal resistance measuring port 14.
And independent thermal sensors 17 are arranged at the extending ends of the first thermal resistance measuring port 12, the second thermal resistance measuring port 13, the third thermal resistance measuring port 14, the fourth thermal resistance measuring port 15 and the boiling point measuring port 16, and the thermal sensors 17 are connected with the data display 7 and used for displaying the temperature of each position point.
The sponge filler 4 is used for heat preservation, prevents heat loss in the measuring process, reduces experimental measurement errors, is arranged between the second copper plate 5 and the inner wall of the glass cover 6, and is located below the horizontal position of the boiling point measuring port 16.
In the device, all joints except the joints of the first thermal resistance measurement port 12, the second thermal resistance measurement port 13, the third thermal resistance measurement port 14, the fourth thermal resistance measurement port 15 and the boiling point measurement port 16 with the thermal sensor 17 are sealed.
When the device is used, a nanofluid sample is placed on a bottom copper plate, namely the copper plate I2, the electric heating rod 1 heats the nanofluid, the heat conduction capacity of the nanofluid is improved due to the surface microstructure of the copper plate I2, the nanofluid is heated and evaporated into the heat pipe 3, nano steam sequentially passes through four measuring ports of a thermal resistor when rising in the heat pipe 3, the temperature of the measuring ports is transmitted to the data display 7 through the thermal sensor 17, and then the formula R = (T =) can be utilized 1 -T 2 ) /Q, to calculate the thermal resistance, where T 1 Is CHO 1 Value of (A) and CHO 2 Difference of values of (D), T 2 Is CHO 3 Value of (A) and CHO 4 Q is the heat flow of the device. In the whole measuring process, the water outlet and the water inlet are connected through the rubber tube 18, and the temperature of the device is reduced.
When the evaporation is measured, the temperature is transmitted to the data display 7 through the heat-sensitive sensor 17 to be read when the heat pipe 3 passes through the boiling point measuring port, namely the boiling point of the nano fluid. And in the whole measuring process, the water outlet and the water inlet II are connected with a cooling device by a rubber tube 8, so that the device is cooled.
In another embodiment of the present invention, the device is provided with a drawer mechanism 19, the drawer mechanism 19 is installed in the heating box 21 and is disposed above the first copper plate 2, and it can pull the bottom containing the tested sample open like a drawer, which can be used to measure the thermal conductivity of carriers with different shapes and loaded nanofluid samples.
The above description is only the preferred embodiment of the present invention; the scope of the present invention is not limited thereto. Any person skilled in the art should also be able to cover the protection scope of the present invention by replacing or changing the technical solution and the modified concept of the present invention within the technical scope of the present invention.
Claims (8)
1. A device for measuring the thermal resistance and evaporativity of nanofluid, comprising a glass cover (6), characterized in that: the glass cover (6) lower end is fixedly connected with a heating box (21), an electric heating rod (1) and a copper plate (2) are installed in the heating box (21), a heat pipe (3) is installed in the glass cover (6), the copper plate (2) is horizontally arranged and connected with the electric heating rod (1), the lower end of the heat pipe (3) is connected with the bottom of the glass cover (6) and communicated with the heating box (21), an air outlet is formed in the upper end of the heat pipe (3), two copper plates (5) are arranged in the glass cover (6) and at the positions of the two sides of the heat pipe (3), the two copper plates (5) are vertically arranged and fixedly connected with the inner wall of the glass cover (6), the glass cover (6) is fixedly provided with a first water inlet (9), a second water inlet (10) and a water outlet (11), the side surface of the heat pipe (3) is connected with one end of a first thermal resistance measuring port (12), a second thermal resistance measuring port (13), a third thermal resistance measuring port (14), a fourth thermal resistance measuring port (15) and one end of a boiling point measuring port (16), the other ends of the first thermal resistance measuring port (12), the second thermal resistance measuring port (13), the third thermal resistance measuring port (14), the fourth thermal resistance measuring port (15) and the boiling point measuring port (16) extend out of the side surface of the glass cover (6), and the heat pipe is arranged on the first thermal resistance measuring port (12), and independent thermal sensors (17) are arranged at the extending ends of the second thermal resistance measuring port (13), the third thermal resistance measuring port (14), the fourth thermal resistance measuring port (15) and the boiling point measuring port (16).
2. The device for measuring the thermal resistance and the evaporativity of the nanofluid according to claim 1, wherein: the water inlet and outlet cooling device is characterized by further comprising a cooling module (8), wherein the cooling module (8) is connected with the first water inlet (9) and the second water outlet (11) through rubber tubes (18) respectively.
3. The device for measuring the thermal resistance and the evaporability of the nanofluid as claimed in claim 2, wherein: and the cooling module (8) is respectively connected with the water inlet II (10) and the water outlet (11) through rubber tubes (18).
4. The apparatus for measuring thermal resistance and evaporability of nanofluid according to claim 2 or 3, wherein: and a grid microstructure is arranged on the first copper plate (2).
5. The device for measuring the thermal resistance and the evaporability of the nanofluid according to claim 4, wherein: the internal structure of the heat pipe (3) is any one of a hot-melt slag structure, a groove structure and a multiple metal mesh structure.
6. The apparatus for measuring thermal resistance and evaporativity of nanofluid according to claim 5, wherein: and sponge fillers (4) are filled in the part, which is positioned between the second copper plate (5) and the inner wall of the glass cover (6) and below the horizontal position of the boiling point measuring port (16).
7. The device for measuring the thermal resistance and the evaporability of the nanofluid according to claim 6, wherein: the heat-sensitive sensor (17) is connected with the data display (7).
8. The device for measuring the thermal resistance and the evaporability of the nanofluid according to claim 6, wherein: the heating box (21) comprises a drawer mechanism (19), and the drawer mechanism (19) is installed at the position above the first copper plate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220720545.XU CN217820119U (en) | 2022-03-29 | 2022-03-29 | Device for measuring thermal resistance and evaporability of nanofluid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220720545.XU CN217820119U (en) | 2022-03-29 | 2022-03-29 | Device for measuring thermal resistance and evaporability of nanofluid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217820119U true CN217820119U (en) | 2022-11-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220720545.XU Active CN217820119U (en) | 2022-03-29 | 2022-03-29 | Device for measuring thermal resistance and evaporability of nanofluid |
Country Status (1)
| Country | Link |
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| CN (1) | CN217820119U (en) |
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2022
- 2022-03-29 CN CN202220720545.XU patent/CN217820119U/en active Active
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