CN217820119U - A device for measuring thermal resistance and evaporation of nanofluid - Google Patents

Abstract

The utility model discloses a measure device of nanometer fluid thermal resistance and evaporability, including the glass cover, glass cover lower extreme fixedly connected with heating cabinet installs electrical heating rod and copper one in the heating cabinet, installs the heat pipe in the glass cover, and a copper level sets up and connects electrical heating rod, and the bottom of glass cover is connected to the lower extreme of heat pipe and communicates with the heating cabinet, and the upper end of heat pipe is provided with the gas outlet, just is in the glass cover the both sides position department of heat pipe is provided with copper two, two vertical settings of copper and with glass cover inner wall fixed connection, this device through the copper that has surface microstructure, heat pipe, sponge filler, can dismantle parts such as bottom, the measuring device of putting up has realized the improvement of indirect heating equipment heat exchange efficiency, and the measurement of the reduction of irreversible loss and different shapes carrier and load nanometer fluid sample among the energy transfer process has fine heat preservation heat-proof, more reasonable and effectual energy of utilizing, reduces the working costs, and easy operation.

Description

A device for measuring thermal resistance and evaporation of nanofluid

technical field

The utility model belongs to the technical field of the nanofluid heat transfer field, in particular to a device for measuring the thermal resistance and evaporability of the nanofluid.

Background technique

At present, as a new material, nanofluid has attracted attention due to its remarkable heat transfer performance. However, there is no fixed device for measuring the thermal resistance of nanofluids. Most of the existing devices for measuring thermal resistance are built by the experimenters themselves. There is no fixed measurement standard, and there will be certain errors in the test device itself.

The core of the existing test device test assembly is composed of a pressure-resistant quartz glass cylinder, a thin-film electric heater, a condenser tube, a temperature test and a pressure sensor. The heating surface, transparent quartz glass cylinder, and heating film are fastened to form a closed cavity, which is filled with a certain amount of nanofluid to form a complete test assembly. However, this test device does not take into account the processing method of the heat exchange surface, the influence of surface roughness, material properties, newness and oldness, and the geometric shape of the container on the nanofluid boiling heat transfer.

Utility model content

In order to solve the above problems, the utility model provides a device for measuring the thermal resistance and evaporability of nanofluids. The device can measure both thermal resistance and evaporability of nanofluids. The technical scheme is as follows:

The utility model discloses a device for measuring the thermal resistance and evaporability of a nanofluid, which comprises a glass cover, a heating box is fixedly connected to the lower end of the glass cover, an electric heating rod and a copper plate are installed in the heating box, and the glass A heat pipe is installed in the cover, and the copper plate is arranged horizontally and connected to an electric heating rod. The lower end of the heat pipe is connected to the bottom of the glass cover and communicates with the heating box. The upper end of the heat pipe is provided with an air outlet, which is inside the glass cover and Two copper plates are arranged on both sides of the heat pipe, and the second copper plate is vertically arranged and fixedly connected with the inner wall of the glass cover. The first water inlet, the second water inlet, and the water outlet are fixedly arranged on the glass cover, and the side of the heat pipe is connected Thermal resistance measuring port 1, thermal resistance measuring port 2, thermal resistance measuring port 3, thermal resistance measuring port 4 and one end of the boiling point measuring port (16), the thermal resistance measuring port 1, thermal resistance measuring port 2, thermal resistance measuring port 3. The other end of the thermal resistance measuring port 4 and the boiling point measuring port (16) stretches out from the side of the glass cover, at the thermal resistance measuring port 1, the thermal resistance measuring port 2, the thermal resistance measuring port 3, the thermal resistance measuring port 4 and the boiling point Independent heat-sensitive sensors are arranged on the protruding end of the measuring port (16).

Further, the cooling module is respectively connected to the water inlet one and the water outlet through rubber tubes.

Further, the cooling module is respectively connected to the second water inlet and the water outlet through rubber tubes.

Further, the first copper plate is provided with a grid microstructure.

Further, the internal structure of the heat pipe is any one of a hot slag structure, a groove structure, and a multiple metal mesh structure.

Further, the part between the second copper plate and the inner wall of the glass cover and below the level of the boiling point measuring port is filled with sponge filler.

Further, the thermal sensor is connected with a data display.

Further, the heating box includes a drawer mechanism, and the drawer mechanism is installed at a position above the copper plate.

The invention realizes the improvement of heat exchange efficiency of heat exchange equipment, the reduction of irreversible loss in the process of energy transfer and the different shapes For the measurement of the carrier and its loaded nanofluid samples, the method has good thermal insulation performance, more reasonable and effective energy utilization, lower operating costs, and simple operation.

Compared with the prior art by adopting the above technical scheme, the utility model has the following technical effects:

1. This device can measure both the thermal resistance of the fluid and its evaporation.

2. The copper plate microstructure of the device can improve the heat conduction rate of the measured object.

3. This device can be used to measure the thermal conductivity of different shapes of carriers and their loaded nanofluid samples.

4. This device can test the thermal conductivity of the nanofluid loaded on the heat pipe.

5. The sponge filling in this device can reduce the loss of heat during the measurement process and improve the accuracy of measurement.

Description of drawings

Fig. 1 is a structural diagram of a device for measuring the thermal resistance and evaporability of nanofluids of the present invention.

Explanation of symbols in the figure:

1. Electric heating rod; 2. Copper plate 1; 3. Heat pipe; 4. Sponge filler; 5. Copper plate 2; 6. Glass cover; 7. Data display; 8. Cooling module; 9. Water inlet 1; 10. Inlet Nozzle 2; 11. Water outlet; 12. The first measuring port of thermal resistance; 13. The second measuring port of thermal resistance; 14. The third measuring port of thermal resistance; 15. The fourth measuring port of thermal resistance; 16. Boiling point measuring port; 17, thermal sensor; 18, rubber tube; 19, loading and unloading device; 20, gas outlet; 21, heating box.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention; obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. For example, based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

See also Fig. 1, have shown device structure of the present utility model among the figure. The structure includes an electric heating rod 1, a copper plate 2, a heat pipe 3, a sponge filling 4, a glass cover 6, a data display 7, a cooling module 8, a water inlet 9, a water inlet 10, a water outlet 11, and a thermal resistance measurement port 12, thermal resistance measuring port 2 13, thermal resistance measuring port 3 14, thermal resistance measuring port 4 15, boiling point measuring port 16, thermal sensor 17, rubber tube 18, drawer mechanism 19, air outlet 20.

The glass cover 6 and the heating box 21 are the main structure of the device. The heating box 21 is used to accommodate the measured object, wherein the electric heating rod 1 and the copper plate-2 are installed in the heating box 21. The electric heating rod 1 is used for A heat source is provided for heating the nanofluid, and the electric heating rod 1 is connected to a copper plate 2, which is horizontally arranged and placed at the bottom of the heating box 21, and a grid microstructure is arranged on the copper plate 2 for improving the nanofluid. Fluid heat transfer capability. The space above the copper plate 12 is to place the sample to be tested.

The upper end of the heat pipe 3 is provided with an air outlet. The internal structure of the heat pipe 3 can be a hot slag structure, a groove structure, or multiple metal meshes, which can be selected according to needs. The heat pipe 3 is installed in the glass cover 6 , and its lower end is connected to the bottom of the glass cover 6 and communicated with the heating box 21 .

In the glass cover 6 and on both sides of the heat pipe 3, two copper plates 5 are arranged, and the second copper plates 5 are vertically arranged.

Said glass cover 6 is fixedly provided with water inlet one 9, water inlet two 10, and water outlet 11, wherein: the position of water outlet 11 is above the horizontal position of water inlet one 9 and water inlet two 10, and said water inlet one 9. The second water inlet 10 , the water outlet 11 and the cooling module 8 can all be connected by rubber tubes 18 . When the rubber tube 18 is connected to the water inlet one 9 and the water outlet 11, the thermal resistance is measured; when the rubber tube 18 is connected to the water inlet two 10 and the water outlet 11, the evaporation is measured.

The heat pipe 3 is connected with one end of thermal resistance measuring port 12, thermal resistance measuring port 2 13, thermal resistance measuring port 3 14, thermal resistance measuring port 4 15 and boiling point measuring port 16. The thermal resistance measuring port 1 12, The other end of the thermal resistance measuring port 13, the thermal resistance measuring port 3 14, the thermal resistance measuring port 4 15 and the boiling point measuring port 16 stretch out from the side of the glass cover 6, the thermal resistance measuring port 12, the thermal resistance measuring port 2 13, The thermal resistance measurement port 4 15 and the boiling point measurement port 16 of the thermal resistance measurement port 3 14 are located at different horizontal positions, which are used to measure the temperature of the nanofluid at different positions, which is convenient for later calculation, and the level of the boiling point measurement port 16 is located at the thermal resistance measurement Between port 2 13 and thermal resistance measurement port 3 14.

An independent thermosensitive sensor 17 is arranged on one end of the thermal resistance measurement port 12, the thermal resistance measurement port 2 13, the thermal resistance measurement port 3 14, the thermal resistance measurement port 4 15 and the boiling point measurement port 16. Thermal sensor 17 is connected with data display 7, is used for displaying the temperature of each position point.

The sponge filler 4 is used for heat preservation, prevents heat loss during the measurement process, and reduces experimental measurement errors. It is arranged on the part between the copper plate 2 5 and the inner wall of the glass cover 6, and is located below the horizontal position of the boiling point measurement port 16.

In this device, except for thermal resistance measuring port 1 12, thermal resistance measuring port 2 13, thermal resistance measuring port 3 14, thermal resistance measuring port 4 15, and the connection between boiling point measuring port 16 and thermal sensor 17, all Connections are sealed.

When the device is in use, the nanofluid sample is placed on the bottom copper plate, that is, the copper plate 1, and the electric heating rod 1 heats the nanofluid. Due to the surface microstructure of the copper plate 2, the heat conduction capacity of the nanofluid is improved, and the nanofluid is heated and evaporated into the heat pipe. In 3, when the nano-vapor rises in the heat pipe 3, it will pass through the four measuring ports of the thermal resistance in turn, and the temperature of the measuring port is transmitted to the data display 7 by the thermal sensor 17, and then the formula R=(T ₁ -T ₂ )/Q, to calculate the thermal resistance, where T ₁ is the difference between the value of CHO ₁ and CHO ₂ , T ₂ is the difference between the value of CHO ₃ and CHO ₄ , and Q is the heat flow of the device. In the whole measurement process, the water outlet and the water inlet are connected to each other with a rubber tube 18 to cool down the device.

When measuring evaporation, when passing through the boiling point measuring port in the heat pipe 3, the temperature is transmitted to the data display 7 by the thermosensitive sensor 17 for reading, that is, the boiling point of the nanofluid. During the whole measurement process, the water outlet and the water inlet two are connected to the cooling device with the rubber tube 8 to cool down the device.

In another embodiment of the present utility model, the device is provided with a drawer mechanism 19, and the drawer mechanism 19 is installed on the heating box 21, and is arranged on the top of the copper plate 1, which can pull apart the bottom of the sample to be tested like a drawer , which can be used to measure the thermal conductivity of different shapes of carriers and their loaded nanofluid samples.

The above description is only a preferred embodiment of the utility model; however, the scope of protection of the utility model is not limited thereto. Anyone familiar with the technical field within the technical scope disclosed in the utility model, according to the technical solution of the utility model and its improvement concept to make an equivalent replacement or change, shall be covered in the protection scope of the utility model.

Claims (8)

1. A device for measuring nanofluid thermal resistance and evaporability, comprising a glass cover (6), characterized in that: the lower end of the glass cover (6) is fixedly connected with a heating box (21), and the heating box (21) An electric heating rod (1) and a copper plate (2) are installed inside, a heat pipe (3) is installed inside the glass cover (6), and the copper plate one (2) is arranged horizontally and connected to the electric heating rod (1). The lower end of the heat pipe (3) is connected to the bottom of the glass cover (6) and communicated with the heating box (21). 3) Two copper plates (5) are arranged at the two sides, the two copper plates (5) are vertically arranged and fixedly connected with the inner wall of the glass cover (6), and the water inlet one (9) is fixedly arranged on the glass cover (6). ), water inlet two (10), water outlet (11), described heat pipe (3) side connection thermal resistance measuring port one (12), thermal resistance measuring port two (13), thermal resistance measuring port three (14), Thermal resistance measuring port four (15) and one end of the boiling point measuring port (16), said thermal resistance measuring port one (12), thermal resistance measuring port two (13), thermal resistance measuring port three (14), thermal resistance measuring port The other end of four (15) and the boiling point measuring port (16) stretches out the side of glass cover (6), at thermal resistance measuring port one (12), thermal resistance measuring port two (13), thermal resistance measuring port three (14) ), thermal resistance measuring port four (15) and the end that the boiling point measuring port (16) stretches out are all provided with independent thermosensitive sensor (17). 2. a kind of device for measuring nanofluid thermal resistance and evaporability according to claim 1, is characterized in that: also comprises cooling module (8), and described cooling module (8) is respectively connected with water inlet one (9) and Water outlet (11) is connected by rubber tube (18). 3. A device for measuring nanofluid thermal resistance and evaporability according to claim 2, characterized in that: the cooling module (8) is connected to the water inlet two (10) and the water outlet (11) respectively through rubber tubes (18) CONNECTION. 4. A device for measuring thermal resistance and evaporability of nanofluids according to claim 2 or 3, characterized in that: the copper plate one (2) is provided with a grid microstructure. 5. A device for measuring thermal resistance and evaporability of nanofluids according to claim 4, characterized in that: the internal structure of the heat pipe (3) is a thermal slag structure, a groove structure, and a multiple metal mesh structure. any structure. 6. A device for measuring nanofluid thermal resistance and evaporability according to claim 5, characterized in that: between said copper plate two (5) and the inner wall of the glass cover (6), and located at the boiling point measuring port (16 ) below the horizontal position is filled with a sponge filler (4). 7. A device for measuring thermal resistance and evaporability of nanofluids according to claim 6, characterized in that: the thermal sensor (17) is connected with a data display (7). 8. A device for measuring thermal resistance and evaporability of nanofluids according to claim 6, characterized in that: the heating box (21) includes a drawer mechanism (19), and the drawer mechanism (19) is installed on a copper plate One (2) upper positions.

Images