CN219204825U

CN219204825U - Heating adsorption component and laminating equipment applying same

Info

Publication number: CN219204825U
Application number: CN202222766525.9U
Authority: CN
Inventors: 张海峰; 杨县伟
Original assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Current assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Priority date: 2022-10-20
Filing date: 2022-10-20
Publication date: 2023-06-16
Anticipated expiration: 2032-10-20

Abstract

The application provides a heating adsorption component, including hot plate, heat-conducting plate, suction plate and temperature sensor. The temperature sensor is embedded in the heating plate, and the heating plate and the suction plate are respectively positioned on two opposite sides of the heat conducting plate. And the heating plate is also provided with an air duct, at least one air hole penetrates through the suction plate and the heat conducting plate, and each air hole is communicated with the air duct. The application still provides an application heating adsorption component's laminating equipment. Laminating equipment the heating adsorption component is convenient for improve production efficiency.

Description

Heating adsorption component and laminating equipment applying same

Technical Field

The application relates to the field of flexible circuit board lamination, in particular to a heating adsorption component and lamination equipment using the same.

Background

As the structural integrity of FPC (Flexible Printed Circuit, flexible circuit boards) products increases, the FPC structure becomes more complex, and the different structures of each region of the FPC result in surface irregularities. At present, when the FPC flexible board is attached to the surface of the FPC, the hot melt adhesive of the adhesive can be melted only by a long time when the FPC is attached to the adhesive, and the problem of long attaching time is solved. Accordingly, there is a need to provide a novel structure to solve the above-mentioned problems.

Disclosure of Invention

For solving above-mentioned technical problem, the purpose of this application is to provide a heating adsorption component and an use heating adsorption component's laminating equipment to improve production efficiency.

A first aspect of the present application provides a thermal absorption assembly comprising a heating plate, a heat conducting plate, a suction plate, and a temperature sensor. The temperature sensor is embedded in the heating plate, and the heating plate and the suction plate are respectively positioned on two opposite sides of the heat conducting plate. And the heating plate is also provided with an air duct, at least one air hole penetrates through the suction plate and the heat conducting plate, and each air hole is communicated with the air duct.

The above-mentioned heating adsorption component of this application, the suction plate pass through the heat-conducting plate with the hot plate is connected, is passing through when heating adsorption component adsorbs and heats the material, is favorable to promoting heat conduction efficiency to improve the rate of heating up of material. And the heat conduction pipe on the heating plate is communicated with the air holes penetrating through the suction plate and the heat conduction plate, so that the material can be further heated through air in a channel formed by communicating the heat conduction pipe and the air holes when the material is adsorbed and heated by the heating adsorption component, and the heating rate of the material is further improved. In conclusion, the heating adsorption component can improve production efficiency. In addition, temperature sensor inlays to be located in the hot plate, be convenient for real-time supervision hot plate's temperature when adsorbing and heating the material through heating adsorption component to be convenient for control the heating temperature to the material, avoid the too low time consuming overlength of temperature or the too high damage material of temperature or FPC board etc. and then be favorable to improving production efficiency.

Based on the first aspect, in one possible implementation manner, the suction plate is a heat-conducting silica gel suction plate.

In the above-mentioned possible implementation mode, the heat conduction silica gel suction plate material is soft and is difficult to destroy the adsorbed material to the heat conduction silica gel suction plate has the filling nature, and silica gel can fill when the structure of adsorbed material is uneven, guarantees adsorption strength on the basis that does not destroy the structure of adsorbed material, is favorable to reducing the risk that the material drops, and then is favorable to promoting production efficiency.

Based on the first aspect, in one possible implementation manner, the thickness of the suction plate is 3.95mm to 4.05mm, and the total thickness of the suction plate and the heat conducting plate is 7.95mm to 8.05mm.

In the possible implementation manner, the suction plate with the thickness is matched with the total thickness of the suction plate and the heat conducting plate, so that the flexibility of the suction plate is guaranteed, the adsorbed material is prevented from being damaged, and meanwhile, heat is quickly transferred from the heating plate to the adsorbed material to heat the adsorbed material, and the production efficiency is improved.

Based on the first aspect, in one possible implementation manner, the number of the air holes is a plurality, each air hole has a diameter of 0.95mm to 1.05mm, and a space between centers of two adjacent air holes is 3mm to 5mm.

In the possible implementation manner, the air holes in the diameter range and the air hole distribution in the interval are favorable for providing uniform adsorption force when adsorbing materials, so that effective adsorption is facilitated, the risk of uneven materials caused by uneven adsorption force is reduced, and further the production efficiency is improved.

Based on the first aspect, in one possible implementation manner, a side, away from the suction plate, of the heat conducting plate is concave towards the suction plate to form an air groove, the air groove is communicated with the air guide pipe, and each air hole is communicated with the air groove.

In the possible implementation manner, the air holes are communicated with the air guide pipe through the air grooves, so that the adsorption force generated by each air hole is more uniform.

Based on the first aspect, in one possible implementation manner, the depth of the air groove is 0.9mm to 1.1mm.

A second aspect of the present application provides a laminating apparatus, including adjacent setting's carrier, move material device, feedway, move the material device be located the carrier with between the feedway. The material moving device comprises a sliding rail, a connecting piece and the heating adsorption assembly. The sliding rail extends along a first direction, the connecting piece is slidably installed on the sliding rail, and the heating adsorption component is installed at one end of the connecting piece.

The laminating equipment of this application, owing to it has heating adsorption component as above-mentioned, consequently, this laminating equipment is also favorable to promoting production efficiency.

In a possible implementation manner, the heating adsorption component is rotatably connected with the connecting piece.

In the possible implementation manner, the heating adsorption component is rotatably connected with the connecting piece, so that the position of the adsorbed material can be adjusted, and the alignment accuracy during subsequent lamination can be improved.

Based on the second aspect, in one possible implementation manner, the material moving device further includes an alignment camera, where the alignment camera is located on a side of the suction plate away from the heating plate.

In the possible implementation manner, the material absorbed by the heating adsorption component moves to the upper part of the alignment camera along the sliding rail, and the heating adsorption component is driven to rotate by the feedback of the alignment camera compared with the connecting piece to adjust the position of the absorbed material, so that the alignment accuracy during subsequent lamination is improved.

Based on the second aspect, in one possible implementation manner, the feeding device includes a workbench, a mold, a punching motor and a overturning suction head assembly, the mold, the punching motor is fixed on the workbench, the punching motor is connected with a punch in the mold, the overturning suction head assembly is arranged adjacent to the mold, and the overturning suction head assembly includes a overturning piece with one end rotatably connected with the workbench and a suction head mounted on the overturning piece.

Drawings

Fig. 1 is a schematic structural diagram of a laminating apparatus according to an embodiment provided in the present application.

Fig. 2 is a schematic structural diagram of a heating adsorption component according to an embodiment of the present application.

Fig. 3 is a schematic diagram of an open mold state of a mold according to an embodiment provided in the present application.

Fig. 4 is a schematic diagram of a mold clamping state of a mold according to an embodiment of the present disclosure.

Description of the main reference signs

The following detailed description will further illustrate the application in conjunction with the above-described figures.

Detailed Description

The technical solutions of the present application will be clearly and completely described below in connection with specific embodiments. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The names of the technical means used in the specification of the present application are for the purpose of describing specific embodiments only, and are not intended to limit the present application.

The following embodiments and features of the embodiments may be combined with each other without collision.

Referring to fig. 1 to 4, a bonding apparatus 200 using a heat absorption assembly 100 according to an embodiment of the present application is provided. The laminating apparatus 200 includes a material loading table 20, a material moving device 30, and a material feeding device 40. The material moving device 30 is located between the material carrying table 20 and the material feeding device 40.

The loading table 20 may be moved in the second direction Y relative to the transfer device 30 to be close to or away from the transfer device 30. The material carrying table 30 is used for carrying materials to be pasted.

The material transferring device 30 comprises a bracket 31, a connecting piece 33 and the heating adsorption assembly 100. The bracket 31 is provided with a slide rail 32 extending along the first direction X. Wherein the first direction X is different from the second direction Y. In this embodiment, the first direction X may be perpendicular to the second direction Y. The loading table 20 and the feeding device 40 may be spaced apart along the first direction X. The connecting piece 33 is slidably connected to the slide rail 32. The heat absorbing assembly 100 is mounted to one end of the connection member 33. In this embodiment, the heat absorbing assembly 100 may be mounted to the lower end of the connection member 33.

The heating adsorption component 100 may be further rotatably connected to the connecting piece 33 in the third direction Z, so as to drive the adsorbed material to move in the third direction Z, thereby being beneficial to adjusting the position of the adsorbed material, and facilitating accurate alignment when the adsorbed material is attached to the material to be attached. The third direction Z is different from the first direction X and different from the second direction Y. In this embodiment, the plane in which the third direction Z is located may be parallel to the planes in which the first direction X and the second direction Y are located.

The heat adsorption assembly 100 includes a heating plate 11, a heat conduction plate 13, a suction plate 15, and a temperature sensor 17.

The heating plate 11 includes a heat conductive metal plate 111 and a heating element 113, and the heating element 113 is embedded in the heat conductive metal plate 111. The thermally conductive metal plate 111 may be, but is not limited to, a copper block, a steel block, or the like. The heating element 113 may be, but is not limited to, a heat generating resistor. The size and shape of the heating plate 11 are not limited, and may be specifically selected as needed.

The temperature sensor 17 is embedded in the heating plate 11 and is used for monitoring the temperature of the heating plate 11. In this embodiment, the temperature sensor 17 may be disposed adjacent to the heating element 113.

The heat conductive plate 13 is made of a material having a good heat conductive effect, and may be, but not limited to, an aluminum plate, an aluminum alloy plate, or the like. The shape and size of the heat conductive plate 13 are not limited, and may be specifically selected according to the need.

The heating plate 11 and the suction plate 15 are respectively positioned at two sides of the heat conducting plate 13. The heating plate 11 is further provided with an air duct 110, an opening at one end of the air duct 110 is located on the surface of the heating plate 11 facing the heat conducting plate 13, and an opening at the other end of the air duct 110 can be located on the surface of the heating plate 11 facing away from the heat conducting plate 13 or on the side wall of the heating plate 11.

The heat conduction plate 13 is detachably mounted to the heating plate 11. In the present embodiment, the heat conductive plate 13 may be fixed to the heating plate 11 by, but not limited to, a heat conductive screw 130. In some embodiments, the heat conducting plate 13 may be detachably connected to the heating plate 11 by means of a snap fit, an adhesive, or the like.

Preferably, the shape and size of the surface of the heat conductive plate 13 facing the heating plate 11 may be the same as the shape and size of the surfaces of the heating plate 11 and the heat conductive plate 13, respectively.

The suction plate 15 may be, but is not limited to, a silicone suction plate. The suction plate 15 may be attached to the heat-conducting plate 13 by, but not limited to, vulcanizing agent at high temperature and high pressure. In the present embodiment, the thickness of the suction plate 15 may be 3.95mm to 4.05mm. The total thickness of the suction plate 15 and the heat conductive plate 13 may be 7.95mm to 8.05mm.

The shape and size of the suction plate 15 are not limited, and may be specifically selected according to the need. Preferably, the size of the suction plate 15 is larger than the size of the material to be adsorbed, more preferably, the outer edge of the suction plate 15 can be expanded by 1.9mm to 2.0mm compared with the outer edge of the material to be adsorbed, so that the damage to the material to be attached caused by the oversized suction plate in the thickness attaching process is avoided.

At least one air hole 101 penetrates the suction plate 15 and the heat conduction plate 13 in the thickness direction, and each air hole 101 communicates with the air duct 110. In this embodiment, the number of the air holes 101 may be plural. Each of the air holes 101 may have a diameter of 0.95mm to 1.05mm, and a distance between centers of two adjacent air holes may be 3mm to 5mm. The distribution of the plurality of air holes 101 can be adjusted according to the shape of the material to be adsorbed.

The side of the heat conducting plate 13 facing away from the suction plate 15 may further be concave inward toward the suction plate 15 to form an air groove 131, the air groove 131 is communicated with the air duct 110, and each air hole 101 is communicated with the air groove 131. In the present embodiment, the depth of the air groove 131 may be, but is not limited to, 0.9mm to 1.1mm.

The transfer device 30 may also include an alignment camera 35 and a controller (not shown). The alignment camera 35 is located on the side of the suction plate 15 facing away from the heating plate 13. In this embodiment, the loading table 20, the alignment camera 35, and the feeding device 40 may be spaced apart along the first direction X.

The controller can control the heating and adsorbing assembly 100 to rotate relative to the connecting piece 33 according to the information fed back by the alignment camera 35.

The feeding device 40 may include a table 41, a die 42, a ram motor 43, and a flip-tip assembly 45. The table 41 includes a frame (not shown) and a table top (not shown), and the punch motor 43 is located below the table top and mounted on the frame. The die 42 is located below the table, which is provided with a fenestration (not shown) corresponding to the die. The mold 42 includes an upper mold 421, a lower mold 423, and a punch 425 having a vacuum suction function. The upper die 421 is fixed below the mesa, and the upper die 421 has an opening (not shown). The lower die 423 is connected to the press motor 43, and can be closed or opened by being driven by the press motor 43. The punch 425 is provided to the lower die 423 and extends toward the opening of the upper die 421. The material belt to be punched is located between the upper die 421 and the lower die 423, and when the dies are closed, the punch 425 impacts the material belt to obtain material, and the punch 425 adsorbs the material obtained by punching and passes through the opening of the upper die 421 with the material obtained by punching.

In this embodiment, the lower die 423 may include a base a and a pressing plate B, where the pressing plate B is located on a side of the base a facing the upper die 421, and the pressing plate B is elastically connected with the base a. One end of the punch 425 is arranged on the base A, and the other end of the punch 425 penetrates through the pressing plate B and is flush with the surface of the pressing plate B, which is away from the base A. The base A is also provided with a guide column A1, and the guide column A1 also passes through the pressing plate B. The upper die 421 further includes a guide groove C disposed corresponding to the guide post A1. The pressing motor 43 is connected to the base a. When the pressing motor 43 drives the base a to move toward the upper die 421, the guide post A1 is first moved upward to be inserted into the guide groove C, then the upward driving is continued to bring the pressing plate B into contact with the upper die 421 and hold the material tape, and then the upward driving is continued to be compressed between the pressing plate B and the base a, so that the punch 425 protrudes from the pressing plate B to impact the held material tape and take away the material from the opening of the upper die 421.

The invert tip assembly 45 is disposed on the table adjacent to the mold 42. The invert tip assembly 45 includes an invert 451 and a tip 453. The turnover member 451 is rotatably connected to the table at one end thereof, and the suction head 453 is mounted to the turnover member 451. The overturning suction head assembly 45 can absorb the material on the punch 425 from the opening window of the table top through the suction head 453, and then overturn to enable the material to face upwards, so that the material is conveniently absorbed and taken away by the heating absorption assembly 100.

The above examples are preferred embodiments of the present application, but the embodiments of the present application are not limited by the above examples, which are only for explaining the claims. The scope of protection of the application is not limited to the description. Any alterations or substitutions that would be easily recognized by those skilled in the art within the technical scope of the present disclosure are included in the scope of the present application.

Claims

1. The utility model provides a heating adsorption component, its characterized in that includes hot plate, heat-conducting plate, suction disc and temperature sensor, temperature sensor inlays and locates in the hot plate, the hot plate with the suction disc is located respectively the opposite both sides of heat-conducting plate, still be equipped with the air duct on the hot plate, at least an air vent runs through the suction disc with the heat-conducting plate, and each the gas pocket with the air duct intercommunication.

2. The heat absorbing assembly of claim 1, wherein the suction plate is a thermally conductive silicone suction plate.

3. The heat absorbing assembly of claim 2, wherein the thickness of the suction plate is 3.95mm to 4.05mm and the total thickness of the suction plate and the heat conductive plate is 7.95mm to 8.05mm.

4. The heat absorbing assembly of claim 1, wherein the number of air holes is plural, each air hole has a diameter of 0.95mm to 1.05mm, and a space between two adjacent air holes is 3mm to 5mm.

5. The heat absorbing assembly of claim 1, wherein a side of the heat conducting plate facing away from the suction plate is recessed toward the suction plate to form an air channel, the air channel being in communication with the air duct, each of the air holes being in communication with the air channel.

6. The heat absorbing assembly of claim 5, wherein the air slot has a depth of 0.9mm to 1.1mm.

7. Laminating equipment, characterized by, including the carrying platform that sets up adjacently, move material device, feedway, move the material device and be located carry the material platform with between the feedway, move the material device and include slide rail, connecting piece and the heating adsorption component of any one of claims 1 through 6, the slide rail extends along first direction, the connecting piece slidable install in the slide rail, the heating adsorption component install in the one end of connecting piece.

8. The bonding apparatus of claim 7, wherein the heat absorbing assembly is rotatably coupled to the coupling member.

9. The bonding apparatus of claim 7, wherein the material moving device further comprises an alignment camera positioned on a side of the suction plate facing away from the heating plate.

10. The bonding apparatus of claim 7, wherein the supply means comprises a table, a die, a punch motor, and a tip turning assembly, the die, the punch motor being secured to the table, the punch motor being coupled to a punch in the die, the tip turning assembly being disposed adjacent the die, the tip turning assembly comprising a tip turning member having one end rotatably coupled to the table, and a tip mounted to the tip turning member.