CN219201390U - Detection mechanism for chip mounter - Google Patents

Detection mechanism for chip mounter Download PDF

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Publication number
CN219201390U
CN219201390U CN202223599839.0U CN202223599839U CN219201390U CN 219201390 U CN219201390 U CN 219201390U CN 202223599839 U CN202223599839 U CN 202223599839U CN 219201390 U CN219201390 U CN 219201390U
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detection
light guide
guide plate
backlight
chip mounter
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CN202223599839.0U
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Chinese (zh)
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吴云松
向坤军
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Shenzhen Daneng Zhizao Technology Co ltd
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Shenzhen Daneng Zhizao Technology Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract

The utility model relates to the technical field of patch material detection, and discloses a detection mechanism for a patch machine, which comprises the following components: vibration dish, sharp feeder and detection camera, the discharge end of sharp feeder is equipped with detects the base, first detection light guide plate is installed in proper order on the top that detects the base, the second detects light guide plate and detects the apron, the second detects the light guide plate and is equipped with the second that is used for holding the paster material that waits to detect of sharp feeder transmission and detects the breach, it is located the second and detects the breach directly over to detect the camera, detect be equipped with on the apron with the communicating apron breach of second detection breach, detect the relative both sides of base and distribute and be used for providing two backlight that diffuse reflection light source for waiting to detect the paster material, the detection camera is used for detecting the material direction of waiting to detect the paster material on the first detection light guide plate. The utility model is convenient for detecting the patch materials.

Description

Detection mechanism for chip mounter
Technical Field
The utility model relates to the technical field of patch material detection, in particular to a detection mechanism for a patch machine.
Background
Among the prior art, the chip mounter is a device that carries out the paster to the processing material, and the chip mounter material feed is including detecting station, turn to station and linear material loading station, detects the station and is used for detecting the paster direction of being pasted the material. However, traditional detection station adopts optic fibre detection to discern the paster direction by the paster material, is limited to the material handling mode of chip mounter feed structure, when adopting vacuum adsorption pipe to carry out the material handling between a plurality of stations, traditional detection station is inconvenient to detect the paster direction by the paster material.
Therefore, how to provide a detection assembly for a chip mounter so as to detect the chip mounting material becomes a technical problem to be solved urgently.
Disclosure of Invention
The utility model aims to provide a detection assembly for a chip mounter so as to detect chip mounting materials.
To this end, according to a first aspect, an embodiment of the present utility model discloses a detection mechanism for a chip mounter, including: vibration dish, sharp feeder and detection camera, the discharge end of sharp feeder is equipped with detects the base, first detection light guide plate, second detection light guide plate and detection apron are installed in proper order on the top of detecting the base, the second detection light guide plate is equipped with and is used for holding the second detection breach of waiting to detect the paster material of sharp feeder transmission, the detection camera is located directly over the second detection breach, detect be equipped with on the apron with the communicating apron breach of second detection breach, the relative both sides of detecting the base are distributed and are used for providing two backlight of diffuse reflection light source for waiting to detect the paster material, the detection camera is used for detecting and discerns wait to detect the material direction of paster material on the first detection light guide plate.
The utility model is further characterized in that a first through hole is formed in the first detection light guide plate, a first vacuum adsorption port communicated with the first through hole is formed in the detection base, and the first vacuum adsorption port is used for vacuum adsorption of patch materials to be detected.
The utility model is further characterized in that a second through hole is formed in the first detection light guide plate, a second vacuum adsorption port communicated with the second through hole is formed in the detection base, and the second vacuum adsorption port is used for vacuum adsorption of the patch material to be detected.
The utility model is further characterized in that the second detection light guide plate is provided with an adsorption groove communicated with the second detection notch, the first detection light guide plate is provided with a third through hole communicated with the adsorption groove, the detection base is provided with a third vacuum adsorption port communicated with the third through hole, and the third vacuum adsorption port is used for adsorbing the patch material to be detected in place.
The utility model is further arranged that the width of the adsorption groove is smaller than the width of the patch material to be detected.
The utility model further provides that the backlight lamp comprises a backlight plate and backlight lamp beads, wherein the backlight plate is arranged on the side wall of the detection base, and the backlight lamp beads are diffuse reflection light sources.
The utility model is further arranged that the horizontal height of the backlight lamp beads is flush with the top end wall surface of the second detection light guide plate.
The utility model further provides that the first detection light guide plate and the second detection light guide plate are made of glass materials.
The utility model is further arranged in such a way that the cross section of the second detection notch is rectangular.
The utility model is further characterized in that a chamfer which is arranged in an inclined plane is arranged at one end of the second detection notch, which is close to the linear feeder.
The utility model has the following beneficial effects: in the second detection breach that will wait to detect the paster material transmission to the second detection light guide plate through sharp feeder, the backlight provides diffuse reflection light source for waiting to detect the paster material, detects the material direction that detects the paster material of camera detection discernment, and then provides a detection mechanism for chip mounter, is convenient for detect the paster material.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic perspective view of a detection mechanism for a chip mounter according to the present embodiment;
fig. 2 is a schematic partial structure of a detection mechanism for a chip mounter according to the present embodiment;
fig. 3 is a schematic view of a partial explosion structure of a detection mechanism for a chip mounter according to the present embodiment;
fig. 4 is a schematic structural diagram of a second detection light guide plate in a detection mechanism for a chip mounter according to the present embodiment;
fig. 5 is a schematic structural diagram of a patch material to be detected according to the present embodiment.
Reference numerals: 1. a vibration plate; 2. a linear feeder; 3. detecting a camera; 4. detecting a base; 41. a first vacuum adsorption port; 42. a second vacuum adsorption port; 43. a third vacuum adsorption port; 5. a first detection light guide plate; 51. a first through hole; 52. a second through hole; 53. a third through hole; 6. a second detection light guide plate; 61. a second detection notch; 611. chamfering; 62. an adsorption tank; 7. detecting a cover plate; 71. a cover plate notch; 8. a backlight; 81. a backlight plate; 82. backlight beads; 9. and (5) detecting the patch material.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, or can be communicated inside the two components, or can be connected wirelessly or in a wired way. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In addition, the technical features of the different embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.
The embodiment of the utility model discloses a detection mechanism for a chip mounter, as shown in fig. 1-5, comprising: vibration dish 1, sharp feeder 2 and detection camera 3, the discharge end of sharp feeder 2 is equipped with detects base 4, first detection light guide plate 5 is installed in proper order on the top of detecting base 4, second detection light guide plate 6 and detection apron 7, second detection light guide plate 6 is equipped with the second detection breach 61 that is used for holding the paster material 9 that waits to detect of sharp feeder 2 transmission, detection camera 3 is located directly over the second detection breach 61, be equipped with on the detection apron 7 with the communicating apron breach 71 of second detection breach 61, the relative both sides of detection base 4 distribute have two backlight 8 that are used for providing diffuse reflection light source for waiting to detect paster material 9, detection camera 3 is used for detecting the material direction of waiting to detect paster material 9 on the first detection light guide plate 5 of discernment. In the specific implementation process, the detection base 4, the first detection light guide plate 5, the second detection light guide plate 6 and the detection cover plate 7 are all provided with mounting holes, and the first detection light guide plate 5, the second detection light guide plate 6 and the detection cover plate 7 are mounted on the detection base 4 through the mounting function of the mounting holes.
It should be noted that, the patch material 9 to be detected is conveyed to the second detection notch 61 of the second detection light guide plate 6 by the linear feeder 2, the backlight 8 provides a diffuse reflection light source for the patch material 9 to be detected, the detection camera 3 detects and identifies the material direction of the patch material 9 to be detected, and then a detection mechanism for a chip mounter is provided, so that the patch material is convenient to detect.
As shown in fig. 2 and 3, the first detection light guide plate 5 is provided with a first through hole 51, the detection base 4 is provided with a first vacuum adsorption port 41 communicated with the first through hole 51, and the first vacuum adsorption port 41 is used for vacuum adsorbing the patch material 9 to be detected. In a specific implementation, the cross section of the first through hole 51 is circular.
As shown in fig. 2 and 3, the first detection light guide plate 5 is provided with a second through hole 52, the detection base 4 is provided with a second vacuum adsorption port 42 communicated with the second through hole 52, and the second vacuum adsorption port 42 is used for vacuum adsorbing the patch material 9 to be detected. In a specific implementation, the cross section of the second through hole 52 is circular.
As shown in fig. 2-4, the second detection light guide plate 6 is provided with an adsorption groove 62 communicated with the second detection notch 61, the first detection light guide plate 5 is provided with a third through hole 53 communicated with the adsorption groove 62, the detection base 4 is provided with a third vacuum adsorption port 43 communicated with the third through hole 53, and the third vacuum adsorption port 43 is used for adsorbing the patch material 9 to be detected in place. In the specific implementation process, the first through hole 51, the second through hole 52 and the third through hole 53 are sequentially arranged in a straight line. The third through hole 53 is provided in a circular shape in cross section. It should be noted that, through the adsorption action of the third vacuum adsorption port 43, the patch material 9 to be detected is adsorbed in place, and through the adsorption action of the second vacuum adsorption port 42, the patch material 9 to be detected is adsorbed and fixed on the first detection light guide plate 5, so that the detection camera 3 is convenient for detecting and identifying the patch material.
As shown in fig. 4 and 5, the width of the adsorption groove 62 is smaller than the width of the patch material 9 to be detected. It should be noted that, since the width of the adsorption groove 62 is smaller than the width of the patch material 9 to be detected, the patch material 9 to be detected is prevented from entering the adsorption groove 62.
As shown in fig. 2 and 3, the backlight 8 includes a backlight plate 81 and backlight beads 82, the backlight plate 81 is mounted on the side wall of the detection base 4, and the backlight beads 82 are diffuse reflection light sources. In a specific implementation process, the backlight 81 is mounted to the side wall of the detection base 4 by screws. The backlight beads 82 are diffuse reflection light sources, the number of the backlight beads 82 is plural, and the plural backlight beads 82 are arranged on the backlight plate 81 in a straight line.
As shown in fig. 2 and 3, the backlight beads 82 are flush with the top end wall surface of the second detection light guide plate 6.
As shown in fig. 2 and 3, the first detection light guide plate 5 and the second detection light guide plate 6 are both made of glass materials.
As shown in fig. 2 and 3, the cross section of the second detection notch 61 is rectangular. It should be noted that the cross section of the second detecting notch 61 may be changed according to the shape of the patch material 9 to be detected.
As shown in fig. 2 and 3, the second detection notch 61 is provided with a chamfer 611 provided in an inclined surface at an end near the linear feeder 2. It should be noted that, through the setting of chamfer 611, the patch material 9 to be detected is convenient for smoothly enter the second detection notch 61, and the patch material 9 to be detected can be prevented from colliding with the inner wall of the second detection notch 61.
As shown in fig. 5, the patch material 9 to be detected is an LED chip, and the backlight lamp bead 82 provides a diffuse reflection light source for the LED chip by providing a unfilled corner on the LED chip, so that the LED chip is imaged in the detection camera 3, the detection camera 3 detects and identifies the unfilled corner direction of the LED chip, and then the material direction of the LED chip can be identified and judged, so that the next turning station is convenient for turning the patch material, and the LED chip can be linearly fed in the patch direction.
Working principle: the patch material 9 to be detected is transmitted to the second detection notch 61 of the second detection light guide plate 6 through the linear feeder 2, the backlight 8 provides a diffuse reflection light source for the patch material 9 to be detected, the detection camera 3 detects and identifies the material direction of the patch material 9 to be detected, and then a detection mechanism for a chip mounter is provided, and the patch material is convenient to detect.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the utility model.

Claims (10)

1. A detection mechanism for chip mounter, characterized by comprising: vibration dish (1), sharp feeder (2) and detection camera (3), the discharge end of sharp feeder (2) is equipped with detects base (4), first detection light guide plate (5), second detection light guide plate (6) and detection apron (7) are installed in proper order on the top of detecting base (4), second detection light guide plate (6) are equipped with and are used for holding second detection breach (61) of waiting to detect paster material (9) of sharp feeder (2) transmission, detection camera (3) are located directly over second detection breach (61), be equipped with on detection apron (7) with second detection breach (61) communicating apron breach (71), the relative both sides of detecting base (4) are distributed and are used for waiting to detect two backlight (8) of paster material (9) provide diffuse reflection light source, detection camera (3) are used for detecting and discern wait to detect the material direction of paster material (9) on first detection light guide plate (5).
2. The detection mechanism for the chip mounter according to claim 1, wherein a first through hole (51) is formed in the first detection light guide plate (5), a first vacuum adsorption port (41) communicated with the first through hole (51) is formed in the detection base (4), and the first vacuum adsorption port (41) is used for vacuum adsorbing a chip material (9) to be detected.
3. The detection mechanism for the chip mounter according to claim 1 or 2, wherein a second through hole (52) is formed in the first detection light guide plate (5), a second vacuum adsorption port (42) communicated with the second through hole (52) is formed in the detection base (4), and the second vacuum adsorption port (42) is used for vacuum adsorbing the chip material (9) to be detected.
4. A detection mechanism for a chip mounter according to claim 3, wherein the second detection light guide plate (6) is provided with an adsorption groove (62) communicated with the second detection notch (61), the first detection light guide plate (5) is provided with a third through hole (53) communicated with the adsorption groove (62), the detection base (4) is provided with a third vacuum adsorption port (43) communicated with the third through hole (53), and the third vacuum adsorption port (43) is used for adsorbing a chip material (9) to be detected in place.
5. Detection mechanism for a chip mounter according to claim 4, characterized in that the width of said suction groove (62) is smaller than the width of the chip material (9) to be detected.
6. The detection mechanism for a chip mounter according to claim 1 or 2, wherein the backlight (8) includes a backlight plate (81) and backlight beads (82), the backlight plate (81) is mounted on a side wall of the detection base (4), and the backlight beads (82) are diffuse reflection light sources.
7. The detection mechanism for a chip mounter according to claim 6, wherein a horizontal height of said backlight beads (82) is flush with a top end wall surface of said second detection light guide plate (6).
8. The detection mechanism for a chip mounter according to claim 1 or 2, wherein said first detection light guide plate (5) and said second detection light guide plate (6) are both made of glass materials.
9. The detection mechanism for a chip mounter according to claim 1 or 2, wherein the cross section of said second detection notch (61) is rectangular.
10. The detection mechanism for the chip mounter according to claim 9, wherein a chamfer (611) provided in an inclined surface is provided at an end of the second detection notch (61) close to the linear feeder (2).
CN202223599839.0U 2022-12-27 2022-12-27 Detection mechanism for chip mounter Active CN219201390U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223599839.0U CN219201390U (en) 2022-12-27 2022-12-27 Detection mechanism for chip mounter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223599839.0U CN219201390U (en) 2022-12-27 2022-12-27 Detection mechanism for chip mounter

Publications (1)

Publication Number Publication Date
CN219201390U true CN219201390U (en) 2023-06-16

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Application Number Title Priority Date Filing Date
CN202223599839.0U Active CN219201390U (en) 2022-12-27 2022-12-27 Detection mechanism for chip mounter

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CN (1) CN219201390U (en)

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