CN219195165U

CN219195165U - High multilayer HDI board electroplates and fills hole device

Info

Publication number: CN219195165U
Application number: CN202223120131.2U
Authority: CN
Inventors: 黄爱华; 杨凤; 马建伟
Original assignee: Jiangxi Jingchao Technology Co ltd
Current assignee: Jiangxi Jingchao Technology Co ltd
Priority date: 2022-11-23
Filing date: 2022-11-23
Publication date: 2023-06-16
Anticipated expiration: 2032-11-23

Abstract

The utility model discloses a high multilayer HDI plate electroplating hole filling device, which comprises a copper cylinder, wherein a right-angle mounting plate is arranged at the upper part of the copper cylinder, two groups of electric telescopic rods are arranged at the upper part of the right-angle mounting plate in a penetrating way, jet flow boxes are arranged at one end parts of the two groups of electric telescopic rods, slow flow plates are welded inside the two groups of jet flow boxes, a plurality of groups of first jet holes are formed in opposite surfaces of the two groups of jet flow boxes, two groups of right-angle baffles, two groups of limit frame plates and a conical filter screen are arranged inside the copper cylinder, a plurality of groups of second jet holes are formed in opposite surfaces of the two groups of right-angle baffles, connecting pipes are arranged on the far surfaces of the two groups of jet flow boxes, and expansion joints are arranged at one end parts of the two groups of the connecting pipes. The beneficial effects are that: the utility model adopts the conical filter screen, and the interception structure is provided by the conical filter screen, so that the phenomenon that impurities obstruct the recycling of copper liquid can be avoided, and a guarantee is brought for the continuous use of the high multilayer HDI plate electroplating hole filling device.

Description

High multilayer HDI board electroplates and fills hole device

Technical Field

The utility model relates to the technical field of circuit board production and manufacturing, in particular to a high multilayer HDI board electroplating hole filling device.

Background

The HDI board is a circuit board (technology) for producing a printed circuit board, a circuit board with higher distribution density by using a micro-blind buried hole technology, the high multilayer HDI board manufactured by adopting a stacking process needs to use an electroplating hole filling device to finish electroplating hole filling work of a through hole and a blind hole, and the high multilayer HDI board has the advantages of simplicity in operation, stable structure, stable filling and the like in practical use.

The prior art discloses the publication number: CN217283646U is a circuit board electro-coppering hole filling device, including the copper jar, the back flow, the circulating pump, elevating system, the elevating platform, parallel baffle, the jet flow case, circulation pushing mechanism, the telescopic joint, the double-end motor, first rolling disc, the second rolling disc, the fixed axle, the connecting rod, the box, first injection otter board, the slow flow board, first jet hole, the backup pad, limiting plate and second jet hole, first of all, realize the circulation reciprocates of jet flow case under circulation pushing mechanism and circulating pump's effect, and pump high-pressure copper liquid for the jet flow incasement, then the copper liquid in the jet flow case need first jet hole and second jet hole in through first injection otter board and the L type backup pad can be to the circuit board earlier, wherein because the motion of the upper and lower of jet flow case, make continuously form the dislocation between first jet hole and the second jet hole, and then continuously adjust the sectional area and the speed of copper liquid jet flow, and cooperate elevating system to adjust the height of circulation pushing mechanism, make the dislocation relation between first jet hole and the second jet hole send out and change, thereby make the intensity of circuit board both sides different, and then more easily will be discharged in the bubble effect.

When impurities still exist on the rear surface of the opening of the HDI plate, the sprayed copper liquid can flush down the impurities without interception structures, so that the circulating pipeline structure is blocked, the copper liquid cannot be recycled, and hidden danger is brought to the continuous use of the utility model.

For the problems in the related art, no effective solution has been proposed at present.

Disclosure of Invention

(one) solving the technical problems

Aiming at the defects of the prior art, the utility model provides a high multilayer HDI plate electroplating hole filling device which is provided with an interception structure, can avoid the problem that impurities obstruct the recycling of copper liquid, and further solves the problems in the prior art.

(II) technical scheme

In order to realize the advantages of having an interception structure and avoiding the obstruction of impurities on the recycling of the copper liquid, the utility model adopts the following specific technical scheme:

the utility model provides a high multilayer HDI board electroplates and fills hole device, includes the copper jar, right angle mounting panel is installed on the upper portion of copper jar, and right angle mounting panel's upper portion runs through and installs two sets of electric telescopic handle to two sets of jet flow case is all installed to electric telescopic handle's one end tip, two sets of the inside equal welded of jet flow case has the slow flow board, two sets of the multiunit first jet hole has been seted up to jet flow case's face in opposite directions, the internally mounted of copper jar has two sets of right angle baffle, two sets of limit frame plates and conical filter screen, two sets of the multiunit second jet hole has been seted up to the face in opposite directions of right angle baffle, two sets of the connecting pipe is all installed to jet flow case's face of keeping away from, and two sets of the one end tip of connecting pipe all installs the telescopic joint, two sets of the lower part of copper jar is run through to one end tip of telescopic joint, two sets of circulating pump is all installed to the lateral wall of back flow, the terminal surface of right angle mounting panel is provided with the built-in groove, and the inside of built-in groove is provided with the rotor plate, the internally mounted of copper jar has two sets of limit frame plates and conical plug, and the screw rod fixed to have the fixed plug tube, the screw rod has the fixed plug tube has the fixed hole, the screw has the fixed plug, the fixed plug has the screw has the fixed plug, the fixed plug has the fixed plug.

Further, the two groups of fixing screws and the four groups of mounting nuts are mutually matched in threads.

Further, the cross section size of the plug is the same as the cross section size of the opening at the lower end of the funnel.

Further, the inside both sides of built-in groove all weld the mounting tube, and two sets of the inside of mounting tube all is provided with the bearing, and two sets of the inside of bearing is run through there is the connecting axle, the rotor plate is run through to the one end of connecting axle, the multiunit mounting groove has been seted up to the outer wall of rotor plate, and the multiunit the screw thread through-hole has all been seted up to the inside both sides of mounting groove, and the multiunit screw thread through-hole's inside all runs through there is fastening bolt.

Further, a plurality of groups of threaded through holes and a plurality of groups of fastening bolt threads are mutually matched.

Further, one ends of the two groups of connecting pipes respectively penetrate through the interiors of the two groups of limiting frame plates.

Further, the electric cabinet is installed to one side of copper jar, and the internally mounted of electric cabinet has control panel to control panel passes through the electric wire with two sets of electric telescopic handle and two sets of circulating pump electric connection.

(III) beneficial effects

Compared with the prior art, the utility model provides a high multilayer HDI plate electroplating hole filling device, which has the following beneficial effects:

(1) According to the utility model, the conical filter screen is adopted, when the high multilayer HDI plate electroplating hole filling device is actually used, copper liquid sprayed out through the two groups of jet flow boxes, the multiple groups of first jet holes and the multiple groups of second jet holes firstly contacts the HDI plate, redundant copper liquid can fall on the inner bottom surface of the copper cylinder through the funnel and the conical filter screen, the two groups of circulating pumps start to work by using the control panel, the two groups of circulating pumps can pump out copper liquid in the copper cylinder, the two groups of circulating pumps enter the two groups of jet flow boxes through the two groups of return pipes, the two groups of expansion joints and the two groups of connecting pipes, the purpose of recycling is achieved, the conical filter screen can filter impurities in the copper liquid, when the conical filter screen needs to be cleaned, an operator moves up by hand to fix the pore plate, the plug is driven to move upwards, when the plug enters the opening of the funnel, the funnel is blocked, the copper liquid can not pass through the funnel, when the pore plate is sleeved with the lower part of the funnel, the two groups of fixing screws are matched with the four groups of mounting nuts through screw threads, the four groups of mounting nuts are rotated clockwise, the four groups of mounting nuts are operated, when the four groups of mounting nuts are tightly contacted with the fixing screws, the two groups of the copper mounting nuts are blocked by the fixing nuts, the two groups of the copper liquid are tightly contact with the plug holes, the copper liquid can be continuously led out through the filter screen, and the position of the high-level filter screen can be continuously, and can be prevented from being continuously used, and the impurities can be continuously used by using the filter screen through the filter screen, and can be continuously arranged through the filter screen can be kept through the high position through the filter screen.

(2) According to the utility model, the rotating plate is adopted, when the high multilayer HDI plate electroplating hole filling device is actually used, an operator moves a plurality of groups of HDI plates into a plurality of groups of mounting grooves respectively by hands, then the plurality of groups of threaded through holes and the plurality of groups of fastening bolt threads are mutually matched, the operator rotates a plurality of groups of fastening bolts clockwise and anticlockwise by hands, when the plurality of groups of fastening bolts are in close contact with the plurality of groups of HDI plates, the operator can rotate the rotating plate by hands by using two groups of mounting pipes, two groups of bearings and connecting shafts to drive the plurality of groups of HDI plates to synchronously move, when one group of HDI plates is expected to move to an expected position, the control panel can be utilized to enable two groups of circulating pumps to start working so as to perform hole filling work, in the process, the time for waiting for dismounting the HDI plates can be saved, and the working efficiency of the high multilayer HDI plate electroplating hole filling device is improved by the arranged rotating plate.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a high multilayer HDI plate electroplating hole filling device according to the present utility model;

FIG. 2 is a perspective view of a plug according to the present utility model;

FIG. 3 is an enlarged view of FIG. 1A in accordance with the teachings of the present utility model;

FIG. 4 is an enlarged view of B of FIG. 1 in accordance with the teachings of the present utility model;

fig. 5 is an enlarged view of C in fig. 1 according to the present utility model.

In the figure:

1. a copper cylinder; 2. a right angle mounting plate; 3. an electric telescopic rod; 4. a jet box; 5. a slow flow plate; 6. a first injection hole; 7. a connecting pipe; 8. an expansion joint; 9. a return pipe; 10. a circulation pump; 11. a limit frame plate; 12. a right angle baffle; 13. a second injection hole; 14. a conical filter screen; 15. a built-in groove; 16. a rotating plate; 17. a positioning tube; 18. a plug; 19. sleeving a pore plate; 20. fixing the blind hole; 21. an opening; 22. a fixed orifice plate; 23. a fixed screw; 24. installing a nut; 25. a limiting plate; 26. a funnel; 27. a connecting shaft; 28. a mounting groove; 29. a threaded through hole; 30. a fastening bolt; 31. installing a pipe; 32. and (3) a bearing.

Detailed Description

For the purpose of further illustrating the various embodiments, the present utility model provides the accompanying drawings, which are a part of the disclosure of the present utility model, and which are mainly used to illustrate the embodiments and, together with the description, serve to explain the principles of the embodiments, and with reference to these descriptions, one skilled in the art will recognize other possible implementations and advantages of the present utility model, wherein elements are not drawn to scale, and like reference numerals are generally used to designate like elements.

According to an embodiment of the utility model, a high multilayer HDI board electroplating hole filling device is provided.

The utility model will be further described with reference to the accompanying drawings and the specific embodiments, as shown in fig. 1-5, a high multilayer HDI board electroplating hole filling device according to an embodiment of the utility model comprises a copper cylinder 1, a right angle mounting plate 2 is installed at the upper part of the copper cylinder 1, two groups of electric telescopic rods 3 are installed at the upper part of the right angle mounting plate 2 in a penetrating way, jet boxes 4 are installed at one end parts of the two groups of electric telescopic rods 3, slow flow boards 5 are welded inside the two groups of jet boxes 4, a plurality of groups of first jet holes 6 are formed at opposite surfaces of the two groups of jet boxes 4, two groups of right angle baffle plates 12, two groups of limit frame plates 11 and a conical filter screen are installed inside the copper cylinder 1, a plurality of groups of second jet holes 13 are formed at opposite surfaces of the two groups of right angle baffle plates 12, connecting pipes 7 are installed at the far surfaces of the two groups of jet boxes 4, and expansion joints 8 are installed at one end parts of the two groups of connecting pipes 7, and the return pipes 9 are installed at the end parts of one ends of the two groups of expansion joints 8, one ends of the two groups of return pipes 9 penetrate through the lower part of the copper cylinder 1, the side walls of the two groups of return pipes 9 are provided with the circulating pumps 10, the end surface of the right-angle mounting plate 2 is provided with the built-in groove 15, the inside of the built-in groove 15 is provided with the rotating plate 16, the inner wall of the copper cylinder 1 is fixedly provided with the limiting plate 25, the upper part of the limiting plate 25 is welded and penetrated with the funnel 26, the inner bottom surface of the copper cylinder 1 is penetrated and provided with the positioning pipe 17, the inside of the positioning pipe 17 is slidably provided with the plug 18, the side wall of the plug 18 is fixedly sleeved with the sleeved hole plate 19 and the fixed hole plate 22, the lower part of the plug 18 is provided with the fixed blind hole 20, the inner wall of the fixed blind hole 20 is provided with the two groups of openings 21, the outer wall of the positioning pipe 17 is welded with the inner wall of the conical filter screen 14, the lower part of the copper cylinder 1 is welded with the two groups of the fixed screws 23, and the one end of two sets of fixing screw 23 runs through the upper portion of fixed orifice plate 22 respectively, and two sets of installation nuts 24 have all been cup jointed to the lateral wall of two sets of fixing screw 23, through the conical filter screen 14 that sets up, possess the interception structure, can avoid impurity to hinder the cyclic utilization of copper liquid, bring a guarantee for the continuous use of high multilayer HDI board electroplating hole filling device.

In one embodiment, the two sets of fixing screws 23 and the four sets of mounting nuts 24 are threaded with each other to facilitate adjustment of the use positions of the four sets of mounting nuts 24.

In one embodiment, the plug 18 has the same cross-sectional dimensions as the lower opening of the funnel 26, ensuring that the plug 18 can block the lower opening of the funnel 26.

In an embodiment, the inside both sides of built-in groove 15 all weld and have installation tube 31, and the inside of two sets of installation tube 31 all is provided with bearing 32, and the inside of two sets of bearings 32 is run through and is had connecting axle 27, the rotor plate 16 is run through to the one end of connecting axle 27, multiunit mounting groove 28 has been seted up to the outer wall of rotor plate 16, and screw through-hole 29 has all been seted up to the inside both sides of multiunit mounting groove 28, and fastening bolt 30 has all been run through to the inside of multiunit screw through-hole 29, through the rotor plate 16 of setting up, in the course of working, can save the time of waiting for dismouting HDI board, the work efficiency of high multilayer HDI board electroplating hole filling device has been improved.

In one embodiment, the plurality of sets of threaded through holes 29 and the plurality of sets of fastening bolts 30 are threadedly engaged with each other to facilitate adjustment of the use positions of the plurality of sets of fastening bolts 30.

In one embodiment, one end of each of the two sets of connecting pipes 7 penetrates the inside of each of the two sets of limiting frame plates 11, and each of the two sets of limiting frame plates 11 serves to limit the two sets of connecting pipes 7.

In one embodiment, an electric cabinet is installed on one side of the copper cylinder 1, and a control panel is installed inside the electric cabinet, and the control panel is electrically connected with the two groups of electric telescopic rods 3 and the two groups of circulating pumps 10 through wires, and the control panel can be realized through simple programming by a person skilled in the art, and belongs to common knowledge in the art, and only the control panel is used without transformation, so that the control mode and circuit connection are not described in detail.

Working principle:

when the high multilayer HDI plate electroplating hole filling device is actually used, copper liquid sprayed out from two groups of jet boxes 4, a plurality of groups of first jet holes 6 and a plurality of groups of second jet holes 13 firstly contacts with the HDI plate, redundant copper liquid can fall on the inner bottom surface of a copper cylinder 1 through a funnel 26 and a conical filter screen 14, two groups of circulating pumps 10 start to work by using a control panel, the copper liquid in the copper cylinder 1 can be pumped out by the two groups of circulating pumps 10, the copper liquid enters the two groups of jet boxes 4 through the two groups of return pipes 9, the two groups of expansion joints 8 and the two groups of connecting pipes 7, the aim of recycling is fulfilled, the conical filter screen 14 can filter impurities in the copper liquid, when the conical filter screen 14 needs to be cleaned, an operator can move up the fixed pore plate 22 by hand to drive the plug 18 to move up, when the plug 18 enters the opening 21 at the lower end of the funnel 26, the funnel 26 is blocked, and the copper liquid dropped at the moment can not pass through the funnel 26, when the sleeved hole plate 19 contacts with the lower part of the funnel 26, two groups of fixing screws 23 and four groups of mounting nuts 24 are used for matching with each other in threads, an operator rotates the four groups of mounting nuts 24 clockwise and anticlockwise by hand, when the four groups of mounting nuts 24 are in close contact with the fixed hole plate 22, the using position of the plug 18 is fixed, impurities at the upper part of the conical filter screen 14 can be led out through the two groups of openings 21 and the fixed blind holes 20 to finish cleaning of the impurities, the arranged conical filter screen 14 is provided with an interception structure, the impurities can be prevented from obstructing the recycling of copper liquid, a guarantee is brought to the continuous use of the high multilayer HDI plate electroplating hole filling device, meanwhile, when the high multilayer HDI plate electroplating hole filling device is actually used, the operator moves a plurality of groups of HDI plates into the plurality of mounting grooves 28 respectively by hand, and then the plurality of groups of threaded through holes 29 and the plurality of fastening bolts 30 are matched with each other in threads, when the worker rotates the plurality of groups of fastening bolts 30 clockwise and anticlockwise by hand, and when the plurality of groups of fastening bolts 30 are in close contact with the plurality of groups of HDI plates, the worker can rotate the rotating plate 16 by hand to drive the plurality of groups of HDI plates to do synchronous motion by utilizing the two groups of mounting pipes 31, the two groups of bearings 32 and the connecting shaft 27, when one group of HDI plates is expected to move to an expected position, the control panel can be utilized to enable the two groups of circulating pumps 10 to start working so as to perform hole filling work, in this process, the worker can disassemble and assemble the other groups of HDI plates, and the time for waiting for disassembling the HDI plates can be saved in the working process by the arranged rotating plate 16, so that the working efficiency of the high multilayer HDI plate electroplating hole filling device is improved.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "configured," "connected," "secured," "screwed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms described above in this application will be understood by those of ordinary skill in the art in view of the specific circumstances.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.

Claims

1. The utility model provides a high multilayer HDI board electroplates and fills hole device, its characterized in that, including copper jar (1), right angle mounting panel (2) are installed on the upper portion of copper jar (1), and the upper portion of right angle mounting panel (2) runs through and installs two sets of electric telescopic handle (3), and two sets of jet current case (4) are all installed to the tip of one end of electric telescopic handle (3), and two sets of the inside of jet current case (4) is all welded slow flow board (5), and two sets of the multiunit first jet hole (6) have been seted up to the face in opposite directions of jet current case (4), the internally mounted of copper jar (1) has two sets of right angle baffle (12), two sets of limit frame plates (11) and conical filter screen, and two sets of right angle baffle (12) set up multiunit second jet hole (13), two sets of jet current case (4) keep away from the face and all install connecting pipe (7), and two sets of the tip of jet current case (7) all installs telescopic joint (8), and two sets of tip (9) of telescopic joint (8) all have end, install back flow (9) in opposite directions face of jet current case (4) sets of jet current case (4) has a plurality of sets of jet current case (4), and back flow tube (15) is provided with back flow tube (15), the inner wall fixed mounting of copper jar (1) has limiting plate (25), and the upper portion welding of limiting plate (25) runs through has funnel (26), the inside bottom surface of copper jar (1) runs through installs registration arm (17), and the inside slidable mounting of registration arm (17) has stopper post (18) to the lateral wall of stopper post (18) is fixed to have cup jointed orifice plate (19) and fixed orifice plate (22), the lower part of stopper post (18) is provided with fixed blind hole (20), and two sets of openings (21) have been seted up to the inner wall of fixed blind hole (20), the outer wall of registration arm (17) and the inner wall welding of conical screen (14), the lower part welding of copper jar (1) has two sets of fixing screw (23), and two sets of one end of fixing screw (23) runs through the upper portion of fixed orifice plate (22) respectively, and two sets of the lateral wall of fixing screw (23) has all cup jointed two sets of installation nuts (24).

2. A high multilayer HDI board electroplating hole filling apparatus according to claim 1, wherein two sets of said set screws (23) and four sets of said mounting nuts (24) are threadedly engaged with each other.

3. The high multilayer HDI board electroplating hole filling apparatus of claim 1 wherein the plug (18) has a cross-sectional dimension equal to a cross-sectional dimension of the funnel (26) at the lower opening.

4. The high multilayer HDI board electroplating hole filling device according to claim 1, wherein mounting pipes (31) are welded on two sides of the inside of the built-in groove (15), bearings (32) are arranged in the two groups of mounting pipes (31), connecting shafts (27) penetrate through the interiors of the two groups of bearings (32), one end of each connecting shaft (27) penetrates through the rotating plate (16), a plurality of groups of mounting grooves (28) are formed in the outer wall of the rotating plate (16), threaded through holes (29) are formed in two sides of the interiors of the plurality of groups of mounting grooves (28), and fastening bolts (30) penetrate through the interiors of the plurality of groups of threaded through holes (29).

5. The high multilayer HDI board electroplating hole filling apparatus according to claim 4, wherein a plurality of sets of said threaded through holes (29) and a plurality of sets of said fastening bolts (30) are threadedly engaged with each other.

6. The high multilayer HDI board electroplating hole filling device according to claim 1, wherein one ends of the two sets of connecting pipes (7) respectively penetrate through the interiors of the two sets of limiting frame plates (11).

7. The high multilayer HDI plate electroplating hole filling device according to claim 1, wherein an electric cabinet is installed on one side of the copper cylinder (1), a control panel is installed inside the electric cabinet, and the control panel is electrically connected with two groups of electric telescopic rods (3) and two groups of circulating pumps (10) through electric wires.