CN219181765U - Surface-mounted wireless connection module and electronic product - Google Patents
Surface-mounted wireless connection module and electronic product Download PDFInfo
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- CN219181765U CN219181765U CN202222987439.0U CN202222987439U CN219181765U CN 219181765 U CN219181765 U CN 219181765U CN 202222987439 U CN202222987439 U CN 202222987439U CN 219181765 U CN219181765 U CN 219181765U
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Abstract
The utility model relates to the technical field of wireless connection modules, in particular to a surface-mounted wireless connection module and an electronic product, wherein the module comprises a printed substrate, an antenna module and a wireless communication module; the printed substrate comprises an antenna area and a circuit wiring area, the antenna module is attached to the antenna area, and the wireless communication module is attached to the circuit wiring area; the antenna module comprises a carrier antenna which is arranged on the front surface of the printed substrate and is connected with a radio frequency circuit of the printed substrate; the wireless communication module comprises a main chip and a plurality of module pins, wherein the main chip is arranged on the front surface of the printed substrate, and the plurality of module pins are arranged on the edge of the printed substrate. According to the technical scheme, the discrete hardware structure of the traditional wireless voice equipment is effectively simplified, and meanwhile, more peripheral devices can be carried under the condition of optimizing the size of the wireless connection module, so that the module can integrate more functions, such as wireless communication, MCU, voice decoding and the like.
Description
Technical Field
The present utility model relates to wireless connection modules, and particularly to a wireless connection module and an electronic device.
Background
With the rapid development of the internet of things technology, the concept of the internet of things is mature, various factories and businesses push out respective internet of things platforms, intelligent products of the internet of things adopting wireless control modes such as WIFI, bluetooth and ZigBee are more and more, the service capability range of handheld terminal equipment is greatly expanded by means of peripheral equipment such as a screen of intelligent equipment (such as a mobile phone and a tablet) and computing capability of cloud service, and ecology of the internet of things is more and more abundant.
At present, in the aspect of intelligent voice, alarm by adopting a buzzer is too monotonous, while some intelligent products still adopt a traditional discrete hardware structure, usually 5 chips such as a microcontroller (Microcontroller Unit, MCU), voice, flash memory (Flash), bluetooth, a battery and the like are required, the board frame is bulky, and the cost, the power consumption and the like are also increased.
In addition, the general purpose module has fewer GPIO (General Purpose Input/Output) pins, generally only supports limited ADC, UART, PWM and other functions, and is suitable for the fields of electrician, illumination, sensing and the like. The resources of the pin peripheral are very tense, and in many cases, the conditions of multiplexing GPIO, welding additional peripheral devices and the like appear, so that the complexity of a circuit is improved, and the cost of a single board is increased.
Disclosure of Invention
In order to solve at least the above technical problems in the prior art, the embodiment of the utility model provides a mounted wireless connection module and an electronic product.
An aspect of the present utility model provides a mounting wireless connection module, including a printed substrate, an antenna module and a wireless communication module; the printed substrate comprises an antenna area and a circuit wiring area, the antenna module is attached to the antenna area, and the wireless communication module is attached to the circuit wiring area; the antenna module comprises a carrier plate antenna which is arranged on the front surface of the printed substrate and is connected with a radio frequency circuit of the printed substrate; the wireless communication module comprises a main chip and a plurality of module pins, wherein the main chip is arranged on the front surface of the printed substrate, and the module pins are arranged on the edge of the printed substrate.
In some embodiments, the carrier plate antenna is a serpentine carrier plate antenna; the serpentine carrier-plate antenna comprises a plurality of radiating arms, and the widths of adjacent radiating arms are different.
In some embodiments, the circuit routing area of the printed substrate includes two sides and a bottom; the plurality of module pins are arranged on two side edges and one bottom edge of the circuit wiring area in a U-shaped mode.
In some embodiments, the wireless communication module comprises 28 module pins, 10 module pins are respectively arranged on two sides of the circuit wiring area, and 8 module pins are arranged on the bottom side of the circuit wiring area; the module pins comprise a power supply pin, a hardware reset pin, an empty pin and an input/output pin, wherein the input/output pin comprises a 4-path PWM pin, a 1-path ADC pin, a 2-path GPIO pin, a 2-path UART pin, a 1-path SPI pin, a 1-path MIC pin and a 1-path Speaker pin.
In some embodiments, the printed substrate further comprises a metal shield; the metal shielding cover is arranged in a circuit wiring area of the printed substrate.
In some embodiments, the antenna module further comprises an IPEX antenna; the circuit routing area of the printed substrate further includes an antenna mount for interfacing with the IPEX antenna.
In some embodiments, the back of the printed substrate is provided with a copper-exposed heat dissipation pad and a radio frequency test pad; the copper-exposed heat dissipation pad is attached to the main chip and used for dissipating heat of the main chip, and the radio frequency test pad is used for being connected with the radio frequency circuit and used for welding radio frequency conducting wire test and debugging radiation performance.
In some embodiments, the printed substrate is rectangular, and the printed substrate has a length of 15 mm to 25mm, a width of 10 mm to 20 mm, and a thickness of 1.5 mm to 3 mm.
Another aspect of the embodiment of the present utility model provides an electronic product, including the above-mentioned mounted wireless connection module.
In some embodiments, the electronic product is one or more of a smoke sensor, a smart door lock, an electric vehicle, a jump rope, or a body fat scale.
According to the mounting type wireless connection module and the electronic product, the antenna module and the wireless communication module are connected to the printed substrate in a mounting mode, so that the discrete hardware structure of the traditional wireless voice equipment is effectively simplified, meanwhile, more peripheral devices can be mounted under the condition that the size of the wireless connection module is optimized through the structural form of the main chip and the pins of the plurality of modules, and further more functions can be integrated by the module, such as wireless communication, MCU, voice decoding and the like.
Drawings
The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present utility model will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. Several embodiments of the present utility model are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which:
in the drawings, the same or corresponding reference numerals indicate the same or corresponding parts.
Fig. 1 is a schematic structural diagram of a mounting wireless connection module according to an embodiment of the utility model;
fig. 2 is a schematic diagram of a front structure of a printed substrate in a mounting wireless connection module according to an embodiment of the utility model;
fig. 3 is a schematic structural diagram of the back surface of a printed substrate in a mounting wireless connection module according to an embodiment of the present utility model;
fig. 4 is a block diagram of a hardware structure of a mounting wireless connection module according to an embodiment of the present utility model;
fig. 5 is a schematic diagram of a partial structure of a module pin in a mounting wireless connection module according to an embodiment of the utility model.
In the figure:
1: printing a substrate; 2: an antenna region; 3: a circuit wiring region; 4: a carrier plate antenna; 5: a module pin; 6: a metal shield; 7: an antenna base; 8: copper-exposed heat dissipation bonding pads; 9: and a radio frequency test pad.
Detailed Description
In order to make the objects, features and advantages of the present utility model more comprehensible, the technical solutions according to the embodiments of the present utility model will be clearly described in the following with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1 to 5, an embodiment of the present utility model provides a mounting wireless connection module, which includes a printed substrate 1, an antenna module and a wireless communication module. The antenna module and the wireless communication module are arranged on the front surface of the printed substrate 1 in a mounting mode; the surface mount device of the wireless connection module comprises a main chip, a crystal, a resistance-capacitance sensor and the like.
In the embodiment of the utility model, a printed substrate 1 comprises an antenna area 2 and a circuit wiring area 3, an antenna module is attached to the antenna area 2, and a wireless communication module is attached to the circuit wiring area 3; the antenna module comprises a carrier plate antenna 4, wherein the carrier plate antenna 4 is arranged on the front surface of the printed substrate 1 and is connected with a radio frequency circuit of the printed substrate 1; the wireless communication module comprises a main chip and a plurality of module pins 5, wherein the main chip is arranged on the front surface of the printed substrate 1, and the plurality of module pins 5 are arranged on the edge of the printed substrate 1.
For example, the control mode of the wireless connection module may be bluetooth connection, that is, the main chip is a bluetooth chip, but the control mode is not limited thereto, and the main chip may also be a Wifi chip or a Zigbee chip. For example, the module adopts a high-integration FR8016HA Bluetooth chip, and simultaneously, an audio DAC is carried through a module pin 5, peripheral equipment such as Flash, a hardware coder and decoder and the like are built in, and a single module can realize the wireless Bluetooth+MCU+voice decoding function.
For example, the antenna region 2 is located in an upper partial region of the printed substrate 1. For example, the area of the circuit wiring region 3 is twice the area of the antenna region 2, or other multiple relationships are also possible.
In some embodiments, the carrier antenna 4 is a serpentine carrier antenna that is free of additional copper and other traces for radiating transmit and receive wireless signals. For example, the serpentine carrier antenna has a length and width of 14.4mm×5.4mm, a radiating arm linewidth of 0.3 to 0.6mm, and a ground line linewidth of 0.9mm, respectively. Compared with the conventional general module antenna, the serpentine carrier plate antenna provided by the utility model is compressed in length and width, so that the serpentine carrier plate antenna is more suitable for miniaturization of modules.
For example, a serpentine carrier antenna includes a plurality of radiating arms, and the widths of adjacent radiating arms are different. The widths of the adjacent radiation arms are not consistent, so that the electric field offset components among the wirings can be reduced, and the external radiation efficiency of the antenna can be increased.
In some embodiments, the antenna module further comprises an IPEX antenna; the circuit wiring area 3 of the printed substrate 1 further comprises an antenna mount 7 for connecting with an IPEX antenna. The module may default to a serpentine board-mounted antenna on the printed substrate 1, but simultaneously reserves the IPEX antenna mount 7. In the case of some limited antenna space, the external antenna can avoid the situation of poor signal radiation performance.
For example, a common bonding pad is reserved on the radio frequency circuit, the transmission direction of radio frequency signals is controlled by changing the actual bonding position of the resistor, namely, when the signal receiving and transmitting are all through the snake-shaped plate-carried antenna, the resistor at the side of the snake-shaped carrier antenna is bonded, otherwise, when the signal receiving and transmitting are all through the IPEX antenna, the resistor at the side of the antenna seat 7 is bonded, and under the structure, the selection of the antenna can be facilitated. The antenna to which the antenna base 7 is connected is not limited to the IPEX antenna, and may be a rod-shaped antenna, a ceramic block antenna, an FPC antenna, or the like.
In some embodiments, the circuit routing area 3 of the printed substrate 1 includes portions of radio frequency circuitry, interface circuitry, crystal circuitry, power circuitry, and the like. For example, the power supply circuit mainly includes a 3.3V power supply circuit and a 5V charge interface, and the radio frequency circuit part mainly adjusts the radio frequency transmission and reception performance of the main chip by fine tuning the parameters of the capacitor and inductor devices, so that the module achieves better radiation performance while satisfying the wireless mandatory authentication requirements such as SRRC (national radio management committee mandatory authentication), FCC (american EMC mandatory authentication) and CE (authentication of european community).
For example, the printed substrate 1 includes two side edges and one bottom edge; the plurality of module pins 5 are disposed in a U-shape on both sides and one bottom side of the circuit wiring area 3. For example, the wireless communication module includes 28 module pins 5, 10 module pins 5 are respectively disposed on two sides of the circuit wiring area 3, and 8 module pins 5 are disposed on the bottom side of the circuit wiring area 3; the module pin 5 comprises a power supply pin, a hardware reset pin, an empty pin and an input/output pin, wherein the input/output pin comprises a 4-path PWM pin, a 1-path ADC pin, a 2-path GPIO pin, a 2-path UART pin, a 1-path SPI pin, a 1-path MIC pin and a 1-path Speaker pin. Each module pin 5 functions as shown in the following table:
wherein P represents a power supply pin, I/O represents a digital input/output pin, AI/AO represents an analog input/output pin, and the uppermost first module pin 5 on the left side of the current page is pin1 of the IC in the front surface of the printed substrate 1 as shown in fig. 1 and 2, then the order of the U-shape is sequentially increased one by one, and the first module sent out from the mouth on the right side of the current page is pin28 of the IC. The above table only describes the functions of the module pins 5, and does not limit the order of the module pins 5, and the module order can be changed according to actual application requirements.
As shown in fig. 5, the module pins 5 are stamp holes, which not only can meet the requirement of use strength, but also are easy to manufacture and shape. For example, the thickness of the substrate defaults to 0.8mm, the pitch of the pin pads is 1.27mm, the width of the pads is 0.8mm, the radius of half holes is 0.25mm, the radius of the top circular pad is 0.4mm, and the length of the bottom rectangular pad is 1.0mm.
In some embodiments, the printed substrate 1 further comprises a metallic shield 6; the metal shield 6 is provided in the circuit wiring region 3 of the printed board 1. All internal components are protected from signal interference and other physical factors (e.g., human touch, water immersion, electric shock, etc.) by a metal shield 6.
In some embodiments, the back surface of the printed substrate 1 is provided with copper-exposed heat dissipation pads 8 and radio frequency test pads 9; the copper-exposed heat dissipation bonding pad 8 is attached to the main chip and used for dissipating heat of the main chip, and the radio frequency test bonding pad 9 is used for being connected with a radio frequency circuit and used for welding radio frequency conducting wire test and debugging radiation performance.
For example, the back of the main chip comprises a square copper exposure area with the thickness of 2.79mm multiplied by 2.79mm, and the square copper exposure area comprises a 3 multiplied by 3 grounding through hole array, and the structure is used for dissipating heat generated during the operation of the main chip; the radio frequency test pad 9 can be used for welding radio frequency conducting wires for testing and debugging radio frequency radiation performance; the back side of the on-board antenna (the back side of the antenna area 2) is a clear area, again without any metal wiring.
In some embodiments, the printed substrate 1 is rectangular, and the length of the printed substrate 1 is 15 mm to 25mm, the width is 10 mm to 20 mm, and the thickness is 1.5 mm to 3 mm. For example, the module size is 19mm×15.5mm×2.5mm, wherein the shielding cover height is 1.7mm, and the thickness of the printed substrate 1 defaults to 0.8mm, or may be 1.0mm, 1.2mm, etc.
The embodiment of the utility model provides an electronic product, which comprises the surface mount wireless connection module. For example, the electronic product is one or more of a smoke sensor, an intelligent door lock, an electric vehicle, a jump rope or a body fat scale.
According to the mounting type wireless connection module and the electronic product provided by the embodiment of the utility model, the antenna module and the wireless communication module are connected to the printed substrate 1 in a mounting mode, so that the discrete hardware structure of the traditional wireless voice equipment is effectively simplified, and meanwhile, more peripheral devices can be mounted under the condition of optimizing the size of the wireless connection module through the structural form of the main chip and the plurality of module pins 5, so that the module can integrate more functions, such as wireless communication, MCU, voice decoding and the like.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The foregoing is merely illustrative embodiments of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the technical scope of the present utility model, and the utility model should be covered. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.
Claims (10)
1. The surface-mounted wireless connection module is characterized by comprising a printed substrate (1), an antenna module and a wireless communication module;
the printed substrate (1) comprises an antenna area (2) and a circuit wiring area (3), the antenna module is attached to the antenna area (2), and the wireless communication module is attached to the circuit wiring area (3);
the antenna module comprises a carrier plate antenna (4), wherein the carrier plate antenna (4) is arranged on the front surface of the printed substrate (1) and is connected with a radio frequency circuit of the printed substrate (1);
the wireless communication module comprises a main chip and a plurality of module pins (5), wherein the main chip is arranged on the front surface of the printed substrate (1), and the module pins (5) are arranged on the edge of the printed substrate (1).
2. The mounted wireless connection module according to claim 1, wherein the carrier-board antenna (4) is a serpentine carrier-board antenna;
the serpentine carrier-plate antenna comprises a plurality of radiating arms, and the widths of adjacent radiating arms are different.
3. The mounted wireless connection module according to claim 1, wherein the circuit routing area (3) of the printed substrate (1) comprises two sides and one bottom;
the plurality of module pins (5) are arranged on two side edges and one bottom edge of the circuit wiring area (3) in a U-shaped mode.
4. A mounted wireless connection module according to claim 3, wherein the wireless communication module comprises 28 module pins (5), 10 module pins (5) are respectively arranged on two sides of the circuit wiring area (3), and 8 module pins (5) are arranged on the bottom side of the circuit wiring area (3);
the module pin (5) comprises a power supply pin, a hardware reset pin, an empty pin and an input/output pin, wherein the input/output pin comprises a 4-path PWM pin, a 1-path ADC pin, a 2-path GPIO pin, a 2-path UART pin, a 1-path SPI pin, a 1-path MIC pin and a 1-path Speaker pin.
5. A mounted wireless connection module according to any one of claims 1 to 3, wherein the printed substrate (1) further comprises a metal shield (6);
the metal shield (6) is provided in the circuit wiring region (3) of the printed board (1).
6. A mounted wireless connection module according to any one of claims 1 to 3, wherein the antenna module further comprises an IPEX antenna;
the circuit wiring area (3) of the printed substrate (1) further comprises an antenna mount (7) for connecting with the IPEX antenna.
7. A mounted wireless connection module according to any one of claims 1 to 3, characterized in that the back side of the printed substrate (1) is provided with copper-exposed heat dissipation pads (8) and radio frequency test pads (9);
the copper-exposed heat dissipation bonding pad (8) is attached to the main chip and used for dissipating heat of the main chip, and the radio frequency test bonding pad (9) is used for being connected with the radio frequency circuit and used for testing and debugging radiation performance of a welding radio frequency conducting wire.
8. A mounted wireless connection module according to any one of claims 1 to 3, wherein the printed substrate (1) is rectangular, and the printed substrate (1) has a length of 15 mm to 25mm, a width of 10 mm to 20 mm, and a thickness of 1.5 mm to 3 mm.
9. An electronic product comprising the mounted wireless connection module according to any one of claims 1 to 8.
10. The electronic product of claim 9, wherein the electronic product is one or more of a smoke sensor, a smart door lock, an electric vehicle, a jump rope, or a body fat scale.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222987439.0U CN219181765U (en) | 2022-11-08 | 2022-11-08 | Surface-mounted wireless connection module and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222987439.0U CN219181765U (en) | 2022-11-08 | 2022-11-08 | Surface-mounted wireless connection module and electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219181765U true CN219181765U (en) | 2023-06-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222987439.0U Active CN219181765U (en) | 2022-11-08 | 2022-11-08 | Surface-mounted wireless connection module and electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219181765U (en) |
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2022
- 2022-11-08 CN CN202222987439.0U patent/CN219181765U/en active Active
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