CN219179550U

CN219179550U - Chip heat dispersion check out test set

Info

Publication number: CN219179550U
Application number: CN202223184343.7U
Authority: CN
Inventors: 刘锡淮
Original assignee: Wuxi Zexin Microelectronics Technology Co ltd
Current assignee: Wuxi Zexin Microelectronics Technology Co ltd
Priority date: 2022-11-30
Filing date: 2022-11-30
Publication date: 2023-06-13
Anticipated expiration: 2032-11-30

Abstract

The utility model provides chip heat radiation performance detection equipment which comprises a bottom plate and a fixing mechanism, wherein the fixing mechanism comprises a chute, a sliding block, a clamping plate and a fastening knob, a heat radiation chip is arranged at the top of a base, the fixing mechanism is arranged outside the heat radiation chip, a lifting mechanism is arranged at the rear part of the bottom plate, a temperature detector is arranged at the bottom of the lifting mechanism, a display screen is arranged at the front end of the temperature detector, and a buzzer is arranged inside the temperature detector. This heat dissipation chip heat dispersion check out test set places heat dissipation chip at the bottom plate top, then through the setting of spout, slider, splint and fastening knob in the fixed establishment, the slider passes through the spout and controls the removal, is the welding between splint and the slider, and the slider drives splint and presss from both sides tight with the both sides of heat dissipation chip to it is stable fixed with heat dissipation chip, thereby when reaching the in-process detection at chip work, avoid radiator fan to produce some vibrations and lead to the chip to take place the skew, make monitoring data more accurate, the effect that detection efficiency is high.

Description

Chip heat dispersion check out test set

Technical Field

The utility model relates to the technical field of chip detection, in particular to a chip heat radiation performance detection device.

Background

After the transistor is produced in a large quantity, various solid-state semiconductor components such as diodes, transistors and the like are used in a large quantity, the functions and roles of a vacuum tube in a circuit are replaced, the technical progress of semiconductor manufacturing in the middle and later stages of the 20 th century is achieved, the integrated circuit is enabled, compared with the manual assembly of the circuit by using individual discrete electronic components, the integrated circuit can integrate a large number of micro-transistors into a small chip, the method is a great progress, the mass production capacity and the reliability of the integrated circuit are improved, the modularization method of circuit design ensures that a standardized integrated circuit is adopted to replace the design of discrete transistors, a large quantity of heat is generated when the chip works, even an electric device is burnt when the chip is seriously burnt, heat dissipation treatment is needed by means of a radiator, meanwhile, the heat dissipation performance of the chip is required to be detected, when the chip works, the heat dissipation fan generates some vibration, the chip is possibly offset, the detection data is not accurate enough, the detection efficiency is low, and therefore the chip heat dissipation performance detection equipment is particularly required.

However, when the existing chip works in the process of detection, the cooling fan can generate some vibration, which may cause the chip to deviate, so that the detection data is not accurate enough and the detection efficiency is low.

Disclosure of Invention

The utility model aims to provide a device for detecting the heat radiation performance of a chip, which solves the problems that when the existing chip is detected in the working process of the chip, the heat radiation fan generates some vibration, the chip is possibly offset, the detection data is not accurate enough and the detection efficiency is low.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a chip heat dispersion check out test set, includes bottom plate and fixed establishment, and fixed establishment includes spout, slider, splint and fastening knob, the base top is equipped with the heat dissipation chip, the heat dissipation chip outside is provided with fixed establishment, the bottom plate rear portion is provided with elevating system, the elevating system bottom is equipped with the temperature detector, the temperature detector front end is provided with the display screen, the inside bee calling organ that is provided with of temperature detector.

Preferably, the fixing mechanism comprises a sliding groove, a sliding block, a clamping plate and a fastening knob, wherein the sliding groove is formed in the bottom plate, the sliding block is arranged in the sliding groove, the clamping plate is arranged on the outer side of the sliding block, and the fastening knob is arranged in the sliding block.

Preferably, the sliding block is in sliding connection with the sliding groove, and the outer diameter of the sliding block is matched with the inner diameter of the sliding groove in size.

Preferably, the fastening knob is in threaded connection with the sliding block, and the outer diameter of the fastening knob is matched with the inner diameter of the sliding block in size.

Preferably, the lifting mechanism comprises a connecting column, an L-shaped lifting column, a stopping knob and a connecting plate, wherein the connecting column is arranged at the rear part of the bottom plate, the L-shaped lifting column is arranged inside the connecting column, the stopping knob is arranged outside the L-shaped lifting column, and the connecting plate is arranged at the bottom of the L-shaped lifting column.

Preferably, the connecting column is in sliding connection with the L-shaped lifting column, and the inner diameter of the connecting column is matched with the outer diameter of the L-shaped lifting column.

Preferably, the display screen is connected with the temperature detector through a clamping groove, and the display screen is tightly attached to the temperature detector.

Compared with the prior art, the utility model has the beneficial effects that: this heat dissipation chip heat dispersion check out test set, when using, place heat dissipation chip in bottom plate top central authorities position, then through the setting of spout, slider, splint and fastening knob in the fixed establishment, the slider passes through the spout and controls the removal, be the welding between splint and the slider, the slider drives splint and presss from both sides tightly with the both sides of heat dissipation chip to it is stable fixed with heat dissipation chip, thereby reach when the in-process of chip work detects, avoid radiator fan to produce some vibrations and lead to the chip to take place the skew, make monitoring data more accurate, the effect that detection efficiency is high.

Drawings

FIG. 1 is a schematic diagram of the overall structure of a device for detecting heat dissipation performance of a chip according to the present utility model;

FIG. 2 is a schematic view of a cross-sectional connection of a slider, chute and tightening knob of the present utility model;

FIG. 3 is a schematic cross-sectional view of the connecting column and L-shaped lifting column of the present utility model;

fig. 4 is a schematic view of a connection cross-section structure of the temperature detector of the present utility model.

Reference numerals in the drawings: 1. a bottom plate; 2. a heat dissipation chip; 3. a fixing mechanism; 301. a chute; 302. a slide block; 303. a clamping plate; 304. fastening a knob; 4. a lifting mechanism; 401. a connecting column; 402. l-shaped lifting columns; 403. a stop knob; 404. a connecting plate; 5. a temperature detector; 6. a display screen; 7. a buzzer.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, the present utility model provides a technical solution: the utility model provides a chip heat dispersion check out test set, includes bottom plate 1 and fixed establishment 3, and fixed establishment 3 includes spout 301, slider 302, splint 303 and fastening knob 304, and base 1 top is equipped with heat dissipation chip 2, and the heat dissipation chip 2 outside is provided with fixed establishment 3, and bottom plate 1 rear portion is provided with elevating system 4, and elevating system 4 bottom is equipped with temperature detector 5, and temperature detector 5 front end is provided with display screen 6, and temperature detector 5 inside is provided with buzzer 7.

Further, fixed establishment 3 includes spout 301, slider 302, splint 303 and fastening knob 304, the spout 301 has been seted up to bottom plate 1 inside, the inside slider 302 that is provided with of spout 301, the slider 302 outside is provided with splint 303, slider 302 inside is provided with fastening knob 304, through the setting of spout 301 in fixed establishment 3, slider 302, splint 303 and fastening knob 304, slider 302 moves about through spout 301, be the welding between splint 303 and the slider 302, slider 302 drives splint 303 and presss from both sides tightly the both sides of thermal conductivity chip 2, thereby with thermal conductivity chip 2 stable fixation, thereby when the in-process of chip work detects, avoid radiator fan to produce some vibrations and lead to the chip to take place the skew, make monitoring data more accurate, detection efficiency is high.

Further, the sliding connection is adopted between the sliding block 302 and the sliding groove 301, the outer diameter of the sliding block 302 is matched with the inner diameter of the sliding groove 301, through the arrangement, the sliding block 302 can move left and right through the sliding groove 301, the sliding block 302 drives the clamping plates 303 to clamp the two sides of the heat dissipation chip 2, and the heat dissipation chip is simple to operate and high in practicability.

Further, the fastening knob 304 is in threaded connection with the sliding block 302, and the outer diameter of the fastening knob 304 is matched with the inner diameter of the sliding block 302 in size, so that the sliding block 302 can be fixed in position and is more stable through the arrangement.

Further, elevating system 4 includes spliced pole 401, L type elevating column 402, stop knob 403 and connecting plate 404, bottom plate 1 rear portion is provided with spliced pole 401, the inside L type elevating column 402 that is provided with of spliced pole 401, L type elevating column 402 outside is provided with stop knob 403, L type elevating column 402 bottom is provided with connecting plate 404, through the setting of spliced pole 401, L type elevating column 402, stop knob 403 and connecting plate 404, be sliding connection between spliced pole 401 and the L type elevating column 402, can make L type elevating column 402 reciprocate in spliced pole 401, stop knob 403 can be with L type elevating column 402 position fixation, it is fixed stable, connecting plate 404 is convenient for temperature detector 5 be connected with L type elevating column 402.

Further, the connecting column 401 is in sliding connection with the L-shaped lifting column 402, the inner diameter of the connecting column 401 is matched with the outer diameter of the L-shaped lifting column 402, through the arrangement, the L-shaped lifting column 402 can move up and down in the connecting column 401, the L-shaped lifting column 402 moves up, the temperature detector moves up together, and the operator can conveniently take and install the heat dissipation chip 2.

Further, be the draw-in groove and be connected between display screen 6 and the temperature detector 5, display screen 6 closely laminates with temperature detector 5, through such setting, can make the real-time temperature display of heat dissipation chip 2 on display screen 6, and the data is accurate directly perceived.

Working principle: when the chip heat radiation performance detection device is used, the heat radiation chip 2 is placed at the center position of the top of the bottom plate 1 in the first step, the slide block 302 moves left and right through the slide groove 301 in the fixing mechanism 3, the slide block 302 moves left and right through the slide groove 301, welding is carried out between the slide block 302 and the slide block 303, the slide block 302 drives the slide block 303 to clamp two sides of the heat radiation chip 2, so that the heat radiation chip 2 is stably fixed, when the chip is detected in the working process, the chip is prevented from being deviated due to some vibration generated by a heat radiation fan, the monitoring data is more accurate, the detection efficiency is high, the third step is carried out through the arrangement of the connecting column 401, the L-shaped lifting column 402, the stop knob 403 and the connecting plate 404 in the lifting mechanism 4, the connecting column 401 and the L-shaped lifting column 402 are in sliding connection, the L-shaped lifting column 402 can move up and down in the connecting column 401, the L-shaped lifting column 402 is lifted to a proper height, the stop knob 403 can fix the position of the L-shaped lifting column 402, the fixing is stable, the connecting plate 404 is convenient for the temperature detector 5 to be connected with the L-shaped lifting column 402, the temperature detector 5 is attached to the surface of the heat dissipation chip 2 to detect at a proper height, the real-time temperature of the heat dissipation chip 2 can be displayed on the display screen 6 through the arrangement of the display screen 6, the data is accurate and visual, when the temperature is too high, the buzzer 7 can make sound to indicate that the heat dissipation performance is poor, and thus the use process of the chip heat dissipation performance detection device is completed.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a chip heat dispersion check out test set, includes bottom plate (1) and fixed establishment (3), and fixed establishment (3) include spout (301), slider (302), splint (303) and fastening knob (304), its characterized in that: the utility model discloses a temperature sensor, including bottom plate (1), temperature detector (5) front end, temperature detector (5) inside is provided with buzzer (7), bottom plate (1) top is equipped with heat dissipation chip (2), heat dissipation chip (2) outside is provided with fixed establishment (3), bottom plate (1) rear portion is provided with elevating system (4), elevating system (4) bottom is equipped with temperature detector (5), temperature detector (5) front end is provided with display screen (6).

2. The chip heat dissipation performance detection device according to claim 1, wherein the fixing mechanism (3) comprises a sliding groove (301), a sliding block (302), a clamping plate (303) and a fastening knob (304), the sliding groove (301) is formed in the bottom plate (1), the sliding block (302) is arranged in the sliding groove (301), the clamping plate (303) is arranged on the outer side of the sliding block (302), and the fastening knob (304) is arranged in the sliding block (302).

3. The device for detecting the heat dissipation performance of a chip according to claim 2, wherein the sliding connection is formed between the sliding block (302) and the sliding groove (301), and the outer diameter of the sliding block (302) is matched with the inner diameter of the sliding groove (301).

4. The device for detecting the heat dissipation performance of a chip according to claim 2, wherein the fastening knob (304) is in threaded connection with the slider (302), and the outer diameter of the fastening knob (304) is matched with the inner diameter of the slider (302).

5. The chip heat dissipation performance detection device according to claim 1, wherein the lifting mechanism (4) comprises a connecting column (401), an L-shaped lifting column (402), a stop knob (403) and a connecting plate (404), the connecting column (401) is arranged at the rear of the bottom plate (1), the L-shaped lifting column (402) is arranged inside the connecting column (401), the stop knob (403) is arranged outside the L-shaped lifting column (402), and the connecting plate (404) is arranged at the bottom of the L-shaped lifting column (402).

6. The device for detecting the heat dissipation performance of a chip according to claim 5, wherein the connecting column (401) is in sliding connection with the L-shaped lifting column (402), and the inner diameter of the connecting column (401) is matched with the outer diameter of the L-shaped lifting column (402).

7. The device for detecting the heat dissipation performance of the chip according to claim 1, wherein the display screen (6) is connected with the temperature detector (5) through a clamping groove, and the display screen (6) is tightly attached to the temperature detector (5).