CN219170816U - Vacuum adsorption workbench and circuit board processing equipment - Google Patents

Vacuum adsorption workbench and circuit board processing equipment Download PDF

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Publication number
CN219170816U
CN219170816U CN202223260038.1U CN202223260038U CN219170816U CN 219170816 U CN219170816 U CN 219170816U CN 202223260038 U CN202223260038 U CN 202223260038U CN 219170816 U CN219170816 U CN 219170816U
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adsorption
vacuum
support frame
guide plate
plate
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CN202223260038.1U
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Chinese (zh)
Inventor
侯林坚
林潇俊
陈国栋
吕洪杰
杨朝辉
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Shenzhen Hans CNC Technology Co Ltd
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Shenzhen Hans CNC Technology Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
    • Y02W30/50Reuse, recycling or recovery technologies
    • Y02W30/82Recycling of waste of electrical or electronic equipment [WEEE]

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Abstract

The application discloses vacuum adsorption workstation and circuit board processing equipment relates to circuit board processing technology field. The vacuum adsorption workbench comprises a support frame and an adsorption table top arranged on the support frame, wherein the adsorption table top comprises a guide plate and an adsorption plate which are arranged in a stacked mode, the adsorption table top is connected with the support frame through the guide plate, the guide plate is used for being connected with a vacuum generator through an air pipe, an avoidance space far away from the adsorption plate is arranged on the guide plate, and the air pipe is located in the coverage range of the avoidance space. By adopting the mode, the safety in use can be improved.

Description

Vacuum adsorption workbench and circuit board processing equipment
Technical Field
The application relates to the technical field of circuit board processing, in particular to a vacuum adsorption workbench and circuit board processing equipment.
Background
The adsorption table for fixing a substrate by vacuum adsorption is widely used at present. For example, in a substrate processing apparatus that patterns a plurality of electronic components on a glass substrate or a semiconductor substrate and divides the electronic components into individual electronic components, scribing lines are formed on the substrate by mechanical scribing using a cutter wheel or the like or laser scribing using a laser beam. At this time, the substrate needs to be fixed on the workbench first so as to facilitate subsequent process.
The side or lower side of the existing adsorption platform is connected with a plurality of air pipes which enable the workbench to keep vacuum, so that the air pipes extending from the workbench are more complicated and messy, and the risk of ignition caused by laser irradiation on the air pipes is easily generated in the debugging and processing process.
Disclosure of Invention
An object of the application is to provide a vacuum adsorption workstation and circuit board processing equipment, security when can promote the use.
Embodiments of the present application are implemented as follows:
in one aspect, the embodiment of the application provides a vacuum adsorption workbench, which comprises a supporting frame, and an adsorption table surface arranged on the supporting frame, wherein the adsorption table surface comprises a guide plate and an adsorption plate which are arranged in a stacked mode, the adsorption table surface is connected with the supporting frame through the guide plate, the guide plate is used for being connected with a vacuum generator through an air pipe, the guide plate is provided with a space away from the adsorption plate, and the air pipe is located in a coverage area of the space.
Optionally, the orthographic projection of the adsorption plate on the guide plate is located in the guide plate, the adsorption plate is flush with the first side of the guide plate, a notch is formed on the second side, opposite to the first side, of the guide plate, so that the avoidance space is formed, and an interface for connecting the air pipe is formed at the bottom of the notch.
Optionally, the vacuum adsorption workbench further comprises a vacuum generator arranged on the support frame, and the air pipe comprises a plurality of air pipes; the support frame is also provided with a shunt tube connected with the vacuum generator; be provided with a plurality of first joints on the shunt tubes, a plurality of the interface with a plurality of first joint one-to-one sets up, and each be provided with the second on the interface connects, every group first joint with the second connects through the trachea is connected, wherein, the trachea is perpendicular to the setting of absorption mesa.
Optionally, the second connector is L-shaped, and an end of the second connector away from the deflector is disposed towards the first connector.
Optionally, a guide channel communicated with the interface is arranged on the guide plate, a cavity communicated with the guide channel is arranged on one side of the adsorption plate, which faces the guide plate, and a plurality of adsorption holes communicated with the cavity are arranged on the adsorption plate.
Optionally, the vacuum adsorption workbench further comprises a fixing frame, the support frame is in sliding connection with the fixing frame, and a linear sliding module is further connected between the support frame and the fixing frame.
Optionally, the linear sliding module comprises a driving piece arranged on the fixing frame and a screw rod connected with the driving piece, and the screw rod is connected with a first sliding block connected with the supporting frame.
Optionally, a sliding rail is arranged on the fixing frame, the sliding rail is located at two opposite sides of the linear sliding module, and a second sliding block in sliding connection with the sliding rail is arranged on the supporting frame.
Optionally, a slow flow cover is further arranged on the vacuum generator.
Optionally, a sponge layer is arranged on the inner wall of the slow flow cover.
In another aspect of the embodiments of the present application, a circuit board processing apparatus is provided, where the circuit board processing apparatus includes a laser processing component and a vacuum adsorption workbench according to any one of the above, where the laser processing component is disposed corresponding to an adsorption table top of the vacuum adsorption workbench.
The beneficial effects of the embodiment of the application include:
the embodiment of the application provides a vacuum adsorption workbench and circuit board processing equipment, through the absorption mesa that sets up on the support frame, absorption mesa is including guiding plate and the absorption board of range upon range of setting, when the guiding plate passes through trachea and vacuum generator intercommunication to provide the required vacuum of absorption mesa absorption work piece through vacuum generator. Meanwhile, the air pipe is arranged in the coverage range of the avoidance space, namely the air pipe is arranged to be hidden, so that the adsorption table top can realize the adsorption function without arranging any air pipe on the workbench, and the air pipe can be protected to a certain extent, so that the risk of ignition caused by laser irradiation is reduced. Thus, the safety in use can be improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a vacuum adsorption stage according to an embodiment of the present disclosure;
FIG. 2 is a second schematic diagram of a vacuum chuck table according to an embodiment of the present disclosure;
FIG. 3 is a cross-sectional view A-A of FIG. 2;
fig. 4 is a third schematic structural diagram of the vacuum adsorption table according to the embodiment of the present application.
Icon:
100-vacuum adsorption workbench; 110-supporting frames; 120-vacuum generator;
130-adsorbing the table top; 132—a deflector; 1322-a diversion channel; 1324-avoidance space; 134-adsorbing plate; 1342-cavity; 1344-adsorption wells;
136-a second linker; 138-trachea; 140-shunt; 142-first linker;
150-fixing frame; 152-sliding rails; 154-a second slider;
160-a linear sliding module; 162-driving member; 164-screw rod; 166-first slider; 168-coupling;
170-slow flow cover.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present application, it should be noted that, the azimuth or positional relationship indicated by the terms "inner", "outer", etc. are based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship that is commonly put when the product of the application is used, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and therefore should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.
The side or the downside of the current adsorption platform is connected with a plurality of air pipes which enable the workbench to keep vacuum degree, so that the air pipes extending from the workbench are more complicated and messy, and in actual application scenes, for example, when a workpiece is processed by laser processing equipment, laser is easy to generate in the debugging and processing process to irradiate on the air pipes, thereby causing the risk of ignition. In order to solve the above problems, the embodiments of the present application provide the following technical solutions to overcome the above problems.
Referring to fig. 1, the present embodiment provides a vacuum adsorption workbench 100, which includes a support frame 110, and an adsorption table 130 disposed on the support frame 110, wherein the adsorption table 130 includes a baffle 132 and an adsorption plate 134 that are stacked, and the stacked arrangement may be that the adsorption plate 134 is disposed on the baffle 132 to place a workpiece on the adsorption plate 134; wherein, the adsorption table 130 is connected with the support frame 110 through a guide plate 132, the guide plate 132 is used for being connected with the vacuum generator 120 through an air pipe 138, an avoidance space 1324 far away from the adsorption plate 130 is arranged on the guide plate 132, and the air pipe 138 is positioned in the coverage range of the avoidance space 1324.
Specifically, the adsorption table 130 is provided with the guide plate 132 and the adsorption plate 134 in a stacked manner, so that the space utilization rate is improved, the connection mode is more compact, and the occupied volume is smaller. Meanwhile, the deflector 132 and the adsorption plate 134 may be connected by screw fastening to secure the stability of connection. When the vacuum generator 120 is connected with the guide plate 132 through the air pipe 138, the vacuum generator 120, the guide plate 132 and the adsorption plate 134 form a vacuum passage so as to achieve the purpose of adsorbing the workpiece on the adsorption plate 134. In addition, through setting up the trachea 138 in dodging space 1324 department, can play certain guard action to the trachea 138 to reduce the risk that is lighted by laser irradiation and lead to igniting, thereby improve the security of processing on the absorption mesa.
The embodiment of the application provides a vacuum adsorption workbench 100, through the adsorption mesa 130 that sets up on support frame 110, adsorption mesa 130 is including guiding plate 132 and the adsorption plate 134 of range upon range of setting, when guiding plate 132 passes through trachea 138 and vacuum generator 120 intercommunication to provide the required vacuum of adsorption mesa 130 absorption work piece through vacuum generator 120. Meanwhile, the air pipe 138 is arranged in the coverage area of the avoidance space 1324, namely the air pipe 138 is arranged to be hidden, so that the adsorption table top 130 can realize the adsorption function without arranging any air pipe 138 on the workbench, and the air pipe 138 can be protected to a certain extent, so that the risk of ignition caused by laser irradiation is reduced. Thus, the safety in use can be improved.
As shown in fig. 1 and 2, the orthographic projection of the adsorption plate 134 on the deflector 132 is located inside the deflector 132, and the adsorption plate 134 is flush with the first side of the deflector 132, and a cutout is provided on a second side of the deflector 132 opposite to the first side to form an avoidance space 1324, and an interface for connecting the air pipe 138 is provided on the bottom of the cutout.
Specifically, the orthographic projection of the adsorption plate 134 on the guide plate 132 is arranged inside the guide plate 132, so that the occupied area between the adsorption plate and the guide plate is fully utilized, and the space utilization rate is improved. In a specific arrangement, the adsorption plate 134 may be flush with the first side of the baffle 132 and flush with two sides of the baffle 132 adjacent to the first side, so that when the interface for connecting the air pipe 138 is provided at the position of the second side incision of the baffle 132, a relatively long distance is provided between the air pipe 138 and the adsorption plate 134, so as to reduce the influence on the air pipe 138 when the area where the adsorption plate 134 is located has laser.
With continued reference to fig. 1 and 2, the vacuum adsorption stage 100 further includes a vacuum generator 120 disposed on the support frame 110, and the air tube 138 includes a plurality of air tubes; the support frame 110 is also provided with a shunt 140 connected with the vacuum generator 120; the shunt tube 140 is provided with a plurality of first connectors 142, a plurality of interfaces are arranged in one-to-one correspondence with the plurality of first connectors 142, each interface is provided with a second connector 136, each group of first connectors 142 and second connectors 136 are connected through an air tube 138, wherein the air tube 138 is arranged perpendicular to the adsorption table 130.
Specifically, the support frame 110, the vacuum generator 120 and the adsorption table 130 disposed on the support frame 110 are beneficial to ensuring stable support connection of the support frame 110 to the vacuum generator 120 and the adsorption table 130. At the same time, the vacuum generator 120 and the suction table 130 can be maintained in a specific relative positional relationship. When the vacuum generator 120 and the guide plate 132 are connected through the air pipe 138, the movement of the adsorption table 130 does not drive the air pipe 138 to shake, which is beneficial to ensuring the reliability in use.
In addition, by providing the shunt 140 connected to the vacuum generator 120 on the support frame 110, a plurality of first junctions 142 can be provided on the shunt 140, and the first junctions 142 can be provided at intervals along the length of the shunt 140. In order to ensure that the plurality of first connectors 142 can be connected to the plurality of connectors on the manifold in a one-to-one correspondence, a second connector 136 is required to be disposed on each connector, so that the first connectors 142 and the second connectors 136 can be connected to each other in a one-to-one correspondence through the air pipes 138. By adopting the mode, the vacuum source access area is widened, so that the required adsorption effect is improved. The first connector 142 and the second connector 136 may be quick connectors, which are not particularly limited in the embodiment of the present application, so long as a stable connection can be ensured.
Meanwhile, the air pipe 138 is perpendicular to the adsorption table 130, so that the air pipe 138 is prevented from extending in disorder, the exposed area of the air pipe 138 relative to the plane of the adsorption table 130 is reduced, and other elements are convenient to shield the air pipe 138 when the air pipe 138 is connected, so that the risk of ignition caused by laser irradiation is reduced.
It should be noted that, the air pipe 138 is disposed perpendicular to the adsorption table 130, and is not limited to an absolute perpendicular, and may have a certain inclination between the air pipe 138 and the adsorption table 130 due to factors such as processing precision and assembly environment.
In an alternative embodiment of the present application, second tab 136 is L-shaped, and an end of second tab 136 distal from baffle 132 is disposed toward first tab 142.
Specifically, by setting the second connector 136 to be L-shaped, when the air pipe 138 is connected, the air pipe 138 can be shielded, so that the air pipe 138 is prevented from being exposed on the plane of the adsorption table 130. Meanwhile, the second connector 136 can be in a straight line shape, so that the air pipe 138 does not need to be bent when being connected with the first connector 142 and the second connector 136, and the air pipe 138 is prevented from being too messy.
As shown in fig. 2 and 3, the deflector 132 is provided with a deflector channel 1322 communicated with the interface, a cavity 1342 communicated with the deflector channel 1322 is provided on a side of the adsorption plate 134 facing the deflector 132, and a plurality of adsorption holes 1344 communicated with the cavity 1342 are provided on the adsorption plate 134.
Specifically, through the above arrangement, it is beneficial to ensure that the plurality of flow guiding channels 1322 are respectively communicated with the cavity 1342, and are communicated with the adsorption hole 1344 through the cavity 1342. Wherein, sealing gasket can be arranged between the deflector 132 and the absorption plate 134 to ensure the air tightness between the absorption plate 134 and the deflector 132.
As shown in fig. 3, the vacuum adsorption workbench 100 further includes a fixing frame 150, the support frame 110 is slidably connected with the fixing frame 150, and a linear sliding module 160 is further connected between the support frame 110 and the fixing frame 150.
Specifically, through with support frame 110 and mount 150 sliding connection, can adjust the height of absorption mesa 130 when using, at this moment, can set up vacuum absorption workstation 100 a plurality of, when needs wholly remove laser generator place with vacuum absorption workstation 100, can make different vacuum absorption workstations 100 dodge each other through adjusting the height of absorption mesa 130 to promote work efficiency.
As shown in fig. 3, the linear sliding module 160 includes a driving member 162 disposed on the fixing frame 150, and a screw rod 164 connected to the driving member 162, and a first slider 166 connected to the supporting frame 110 is connected to the screw rod 164.
For example, the driving member 162 may be a rotating motor, where the rotating motor is connected to the screw rod 164 through a coupling 168, and when the screw rod 164 rotates, a first slider 166 disposed on the screw rod 164 moves relative to the screw rod 164, so as to drive the support frame 110 to move, and finally, adjust the height of the adsorption table 130.
Referring to fig. 4 again, the fixing frame 150 is provided with a sliding rail 152, the sliding rail 152 is located at two opposite sides of the linear sliding module 160, and the supporting frame 110 is provided with a second sliding block 154 slidably connected with the sliding rail 152.
Specifically, by arranging the sliding rails 152 on two opposite sides of the linear sliding module 160 and arranging the second sliding blocks 154 slidably connected with the sliding rails 152 on the supporting frame 110, the sliding of the supporting frame 110 can be more stable when the linear sliding module 160 drives the supporting frame 110 to move. It will be appreciated that two second slides 154 may be provided on each slide rail 152 in order to ensure stability of the sliding connection.
As shown in fig. 1, the vacuum generator 120 is further provided with a slow flow cover 170. The circulation cap is provided with a plurality of through holes, so that the air flow flowing out of the vacuum generator 120 can be dispersed, and the purpose of silencing can be achieved.
In an alternative embodiment of the present application, the inner wall of the slow flow cover 170 is provided with a sponge layer. Thus, the airflow flowing into the slow flow cover 170 can be further dispersed, the excessive concentration of the airflow is avoided, and the flow speed of the airflow at part of the through holes is excessive, so that the purpose of further silencing is achieved.
The embodiment of the application also discloses circuit board processing equipment, including laser processing subassembly to and vacuum adsorption workstation 100 in the preceding embodiment, wherein, laser processing subassembly corresponds the setting with vacuum adsorption workstation 100's adsorption mesa 130. The circuit board processing apparatus includes the same structure and advantageous effects as the vacuum adsorption stage 100 in the foregoing embodiment. The structure and advantageous effects of the vacuum adsorption stage 100 are described in detail in the foregoing embodiments, and are not described in detail herein.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims (11)

1. The utility model provides a vacuum adsorption workbench, its characterized in that, includes the support frame, and be in the absorption mesa that sets up on the support frame, absorption mesa is including range upon range of guide plate and the absorption board that sets up, wherein, absorption mesa passes through the guide plate with the support frame is connected, the guide plate is used for being connected with vacuum generator through the trachea, be provided with on the guide plate and keep away from the absorption board dodges the space, the trachea is located dodge the coverage in space.
2. The vacuum adsorption table of claim 1 wherein an orthographic projection of the adsorption plate on the baffle is positioned within the baffle and the adsorption plate is flush with a first side of the baffle, a second side of the baffle opposite the first side is provided with a cutout to form the avoidance space, and an interface for connecting the air tube is provided at a bottom of the cutout.
3. The vacuum adsorption table of claim 2 further comprising a vacuum generator disposed on the support frame, the air tube comprising a plurality of air tubes; the support frame is also provided with a shunt tube connected with the vacuum generator;
be provided with a plurality of first joints on the shunt tubes, a plurality of the interface respectively with a plurality of first joint one-to-one sets up, and each be provided with the second on the interface connects, every group first joint with the second connects through the trachea is connected, wherein, the trachea is perpendicular to the setting of absorption mesa.
4. A vacuum chuck table according to claim 3 wherein the second connector is L-shaped and an end of the second connector remote from the baffle is disposed towards the first connector.
5. The vacuum adsorption table of any one of claims 2-4, wherein a flow guide channel communicated with the interface is provided on the flow guide plate, a cavity communicated with the flow guide channel is provided on a side of the adsorption plate facing the flow guide plate, and a plurality of adsorption holes communicated with the cavity are provided on the adsorption plate.
6. The vacuum chuck table according to any one of claims 1 to 4, further comprising a fixing frame, wherein the support frame is slidably connected to the fixing frame, and a linear sliding module is further connected between the support frame and the fixing frame.
7. The vacuum suction table as claimed in claim 6, wherein the linear sliding module comprises a driving member provided on the fixing frame, and a screw rod connected to the driving member, and the screw rod is connected to a first slider connected to the support frame.
8. The vacuum adsorption table of claim 6, wherein the fixing frame is provided with a sliding rail, the sliding rail is positioned at two opposite sides of the linear sliding module, and the supporting frame is provided with a second sliding block in sliding connection with the sliding rail.
9. The vacuum adsorption table of any one of claims 1-4, wherein a slow flow cover is further provided on the vacuum generator.
10. The vacuum adsorption table of claim 9, wherein the inner wall of the slow flow cover is provided with a sponge layer.
11. A circuit board processing apparatus, characterized in that the circuit board processing apparatus comprises a laser processing assembly and the vacuum adsorption workbench according to any one of claims 1 to 10, wherein the laser processing assembly is arranged corresponding to an adsorption table top of the vacuum adsorption workbench.
CN202223260038.1U 2022-11-30 2022-11-30 Vacuum adsorption workbench and circuit board processing equipment Active CN219170816U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223260038.1U CN219170816U (en) 2022-11-30 2022-11-30 Vacuum adsorption workbench and circuit board processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223260038.1U CN219170816U (en) 2022-11-30 2022-11-30 Vacuum adsorption workbench and circuit board processing equipment

Publications (1)

Publication Number Publication Date
CN219170816U true CN219170816U (en) 2023-06-13

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223260038.1U Active CN219170816U (en) 2022-11-30 2022-11-30 Vacuum adsorption workbench and circuit board processing equipment

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CN (1) CN219170816U (en)

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