CN219161268U - Measuring probe structure of copper thickness measuring instrument of rigid circuit board - Google Patents
Measuring probe structure of copper thickness measuring instrument of rigid circuit board Download PDFInfo
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- CN219161268U CN219161268U CN202223479471.4U CN202223479471U CN219161268U CN 219161268 U CN219161268 U CN 219161268U CN 202223479471 U CN202223479471 U CN 202223479471U CN 219161268 U CN219161268 U CN 219161268U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The application provides a measuring probe structure of rigid circuit board copper thickness measuring apparatu, including first installation shell and second installation shell, the inside of first installation shell and second installation shell is provided with the probe body, and the surface connection of probe body has the wire, the surface of first installation shell and second installation shell is provided with the installation section of thick bamboo, and is provided with installation mechanism between installation section of thick bamboo and first installation shell and the second installation shell. The utility model discloses a through the use of protection machanism, connected mode between spacing ring and the lag is fixed connection, and the inside sliding connection of spacing ring and the equal spout of lag to fixed mounting has the spring between the surface of spacing ring and lag and the inner wall of spout, when using probe mechanism to measure the circuit board, can make the rubber circle on lag surface laminate with the surface of circuit board mutually, can effectually avoid the probe to slide when contacting with the circuit board body, makes surface roughness increase, leads to sensitivity decline.
Description
Technical Field
The utility model relates to the related field of rigid circuit boards, in particular to a measuring probe structure of a copper thickness measuring instrument of a rigid circuit board.
Background
The rigid circuit board is a printed circuit board, also called a printed circuit board, is an important electronic component, is a support body of an electronic component, and is a carrier for electrical connection of the electronic component. Because it is made by electronic printing, it is called "printed" circuit board, and copper thickness measuring instrument is needed in the process of producing rigid circuit board, and the probe structure of the existing copper thickness measuring instrument still has some problems in use.
The surface of current copper thickness measuring apparatu probe is the propylene resin material generally, after long-time use, can make surface roughness increase, leads to sensitivity decline, influences copper thickness measuring apparatu's use to current copper thickness measuring apparatu uses for a long time, and when the part of inside damaged, inconvenient dismantles the probe structure, reduces the result of use, consequently we do this improvement, propose a measuring probe structure of rigid circuit board copper thickness measuring apparatu.
Disclosure of Invention
The utility model aims at: the surface of solving current copper thickness measuring apparatu probe is the propylene resin material generally, after long-time use, can make surface roughness increase, leads to sensitivity decline, influences copper thickness measuring apparatu's use to current copper thickness measuring apparatu uses for a long time, and when the part of inside damaged, inconvenient dismantles the probe structure, reduces the problem of result of use.
In order to achieve the above object, the present utility model provides the following technical solutions:
the measuring probe structure of the copper thickness measuring instrument of the rigid circuit board is used for improving the problems.
The application is specifically such that:
including first installation shell and second installation shell, the inside of first installation shell and second installation shell is provided with the probe body, and the surface connection of probe body has the wire, the surface of first installation shell and second installation shell is provided with the installation section of thick bamboo, and is provided with installation mechanism between installation section of thick bamboo and first installation shell and the second installation shell, the table of installation section of thick bamboo just is provided with protection machanism.
As the preferred technical scheme of this application, installation mechanism includes screw thread and screw thread groove, and screw thread fixed mounting is at the surface of first installation shell and second installation shell to the inner wall at the installation section of thick bamboo is seted up to the screw thread groove, carry out threaded connection through screw thread and screw thread groove between installation section of thick bamboo and first installation shell and the second installation shell.
As the preferred technical scheme of this application, the fixed surface of first installation shell installs the lug, and the surface of second installation shell is even has seted up flutedly, the connected mode between lug and the recess is the block and connects, and is the block structure between first installation shell and the second installation shell.
As the preferred technical scheme of this application, the inside of first installation shell and second installation shell is all fixed mounting has the limiting plate, and the inside of first installation shell and second installation shell is provided with solid fixed ring, gu fixed ring fixed mounting is at the surface of probe body, the mounting groove has all been seted up on the surface of first installation shell and second installation shell, and the surface block of mounting groove is connected with the connecting piece to connecting piece fixed mounting is at the surface of wire.
As the preferred technical scheme of this application, protection machanism includes the spout, and the spout is seted up on the surface of installation section of thick bamboo, the inside sliding connection of spout has lag and spacing ring, and the connected mode fixed connection of lag and spacing ring.
As the preferred technical scheme of this application, fixed mounting has the spring between the surface of lag and spacing ring and the inner wall of spout, and the surface fixed mounting of lag opposite side has the rubber circle.
Compared with the prior art, the utility model has the beneficial effects that:
in the scheme of the application:
1. through the use of protection machanism, the connected mode between spacing ring and the lag is fixed connection, and the inside sliding connection of spacing ring and the equal spout of lag to fixed mounting has the spring between spacing ring and the surface of lag and the inner wall of spout, when using probe mechanism to measure the circuit board, can make the rubber circle on lag surface laminate mutually with the surface of circuit board, can effectually avoid the probe to slide when contacting with the circuit board body, makes surface roughness increase, leads to sensitivity decline.
2. Through the use of installation mechanism, the surface of first installation shell and second installation shell is provided with lug and recess respectively, and the connected mode between lug and the recess is the block and is connected, conveniently carries out the block to first installation shell and second installation shell and connects, and the fixed surface of first installation shell and second installation shell installs the screw thread, and the inner wall of a section of thick bamboo has seted up the screw thread groove, carries out threaded connection through screw thread and screw thread groove between installation section of thick bamboo and first installation shell and the second installation shell, conveniently fixes first installation shell and second installation shell.
Description of the drawings:
fig. 1 is a schematic structural view of a measuring probe structure of a copper thickness measuring instrument for a rigid circuit board provided by the application;
fig. 2 is a schematic structural diagram of the surfaces of a first mounting shell and a second mounting shell of a measuring probe structure of a copper thickness measuring instrument for a rigid circuit board provided by the application;
FIG. 3 is a schematic structural view of the inside of a measuring probe structure mounting cylinder of the rigid circuit board copper thickness measuring instrument provided by the application;
FIG. 4 is a schematic structural view of a section of a measuring probe structure mounting cylinder of the copper thickness measuring instrument for a rigid circuit board;
FIG. 5 is an enlarged schematic view of the structure of the portion A in FIG. 5 of the measuring probe of the copper thickness measuring instrument for rigid circuit board provided by the present application;
fig. 6 is a schematic structural diagram of the inside of the first mounting shell and the second mounting shell of the measuring probe structure of the copper thickness measuring instrument for the rigid circuit board.
The figures indicate:
1. a first mounting case; 2. a second mounting case; 3. a probe body; 4. a wire; 5. a mounting cylinder;
6. a mounting mechanism; 601. a thread tooth; 602. a thread groove; 603. a limiting plate; 604. a fixing ring;
605. a bump; 606. a groove; 607. a connecting piece; 608. a mounting groove; 7. a protective mechanism; 701. a chute; 702. a protective sleeve; 703. a limiting ring; 704. a spring; 705. a rubber ring.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. It will be apparent that the described examples are some, but not all, embodiments of the utility model.
Thus, the following detailed description of the embodiments of the utility model is not intended to limit the scope of the utility model, as claimed, but is merely representative of some embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that, under the condition of no conflict, the embodiments of the present utility model and the features and technical solutions in the embodiments may be combined with each other.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present utility model, it should be noted that, the terms "upper", "lower", and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, or an azimuth or a positional relationship conventionally put in use of the inventive product, or an azimuth or a positional relationship conventionally understood by those skilled in the art, such terms are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or element to be referred must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
As shown in fig. 1, 2, 3, 4, 5 and 6, the present embodiment proposes a measuring probe structure of a copper thickness measuring apparatus for a rigid circuit board, which includes a first mounting shell 1 and a second mounting shell 2, a probe body 3 is disposed inside the first mounting shell 1 and the second mounting shell 2, a wire 4 is connected to a surface of the probe body 3, mounting barrels 5 are disposed on surfaces of the first mounting shell 1 and the second mounting shell 2, a mounting mechanism 6 is disposed between the mounting barrels 5 and the first mounting shell 1 and the second mounting shell 2, and a protection mechanism 7 is disposed on a surface of the mounting barrels 5.
As a preferred embodiment, on the basis of the above-mentioned mode, further, the mounting mechanism 6 includes a thread 601 and a thread groove 602, and the thread 601 is fixedly mounted on the surfaces of the first mounting shell 1 and the second mounting shell 2, and the thread groove 602 is formed in the inner wall of the mounting cylinder 5, and the mounting cylinder 5 is in threaded connection with the first mounting shell 1 and the second mounting shell 2 through the thread 601 and the thread groove 602, so that the first mounting shell 1 and the second mounting shell 2 are conveniently and fixedly connected through the mounting cylinder 5.
As a preferred embodiment, on the basis of the above manner, further, the surface of the first installation shell 1 is fixedly provided with the protruding block 605, the surface of the second installation shell 2 is uniformly provided with the grooves 606, the protruding block 605 and the grooves 606 are connected in a clamping manner, and the first installation shell 1 and the second installation shell 2 are in a clamping structure, so that the first installation shell 1 and the second installation shell 2 are convenient to assemble.
As a preferred embodiment, on the basis of the above manner, further, limiting plates 603 are fixedly installed inside the first installation shell 1 and the second installation shell 2, fixing rings 604 are arranged inside the first installation shell 1 and the second installation shell 2, the fixing rings 604 are fixedly installed on the surface of the probe body 3, mounting grooves 608 are formed in the surfaces of the first installation shell 1 and the second installation shell 2, connecting pieces 607 are connected to the surfaces of the mounting grooves 608 in a clamping mode, the connecting pieces 607 are fixedly installed on the surfaces of the wires 4, limiting installation of the probe body 3 through the limiting plates 603 and the fixing rings 604 is facilitated, and fixing of the wires 4 through the connecting pieces 607 and the mounting grooves 608 is facilitated.
As a preferred embodiment, on the basis of the above manner, the protection mechanism 7 further includes a chute 701, the chute 701 is formed on the surface of the mounting cylinder 5, the inside of the chute 701 is slidably connected with a protection sleeve 702 and a limit ring 703, and the protection sleeve 702 is fixedly connected with the limit ring 703 in a connection manner, so that the protection sleeve 702 is conveniently limited by the limit ring 703, and the protection sleeve 702 is prevented from sliding out of the chute 701.
As a preferred embodiment, on the basis of the above mode, a spring 704 is fixedly installed between the surfaces of the protecting sleeve 702 and the limiting ring 703 and the inner wall of the chute 701, and a rubber ring 705 is fixedly installed on the surface of the other side of the protecting sleeve 702, so that the protecting sleeve 702 is conveniently buffered by the elastic force of the spring 704, and the rubber ring 705 on the surface of the protecting sleeve 702 is contacted with the circuit board in advance, so that the probe body 3 can be effectively protected.
Specifically, the working principle of this scheme is: when the novel probe is used, the probe body 3 is conveniently installed and limited through the limiting plates 603 inside the first installation shell 1 and the second installation shell 2 and the fixing rings 604 on the surface of the probe body 3, the connecting piece 607 is connected with the installation groove 608 in a clamping mode, the wire 4 is conveniently limited and fixed, the convex blocks 605 on the surface of the first installation shell 1 are connected with the grooves 606 on the surface of the second installation shell 2 in a clamping mode, the first installation shell 1 and the second installation shell 2 are conveniently assembled, then the installation barrel 5 is sleeved on the surfaces of the first installation shell 1 and the second installation shell 2, the thread teeth 601 on the surfaces of the first installation shell 1 and the second installation shell 2 are in threaded connection with the thread grooves 602 inside the installation barrel 5, and the first installation shell 1 and the second installation shell 2 are conveniently fixed through the installation barrel 5.
When the copper thickness measuring instrument is used, the probe body 3 is required to be contacted with the surface of the circuit board, before the surface of the probe body 3 is contacted with the surface of the circuit board, the rubber ring 705 on the surface of the protective sleeve 702 is contacted with the circuit board, and the internal spring 704 is deformed, so that the protective sleeve 702 is conveniently buffered, the probe body 3 is prevented from being contacted with the circuit board before the probe body 3 is contacted, the probe body 3 is rubbed, the sensitivity of the test is influenced, the working process of the whole device is realized, and the content which is not described in detail in the specification belongs to the prior art known by the person skilled in the art.
The above embodiments are only for illustrating the present utility model and not for limiting the technical solutions described in the present utility model, and although the present utility model has been described in detail in the present specification with reference to the above embodiments, the present utility model is not limited to the above specific embodiments, and thus any modifications or equivalent substitutions are made to the present utility model; all technical solutions and modifications thereof that do not depart from the spirit and scope of the utility model are intended to be included in the scope of the appended claims.
Claims (6)
1. The utility model provides a measuring probe structure of thick measuring apparatu of rigid circuit board copper, includes first installation shell (1) and second installation shell (2), its characterized in that: the probe is characterized in that the probe body (3) is arranged in the first mounting shell (1) and the second mounting shell (2), the lead (4) is connected to the surface of the probe body (3), the mounting cylinders (5) are arranged on the surfaces of the first mounting shell (1) and the second mounting shell (2), the mounting mechanisms (6) are arranged between the mounting cylinders (5) and the first mounting shell (1) and the second mounting shell (2), and the protection mechanisms (7) are arranged on the surfaces of the mounting cylinders (5).
2. The measurement probe structure of the copper thickness measuring instrument for the rigid circuit board according to claim 1, wherein: the mounting mechanism (6) comprises thread teeth (601) and thread grooves (602), the thread teeth (601) are fixedly mounted on the surfaces of the first mounting shell (1) and the second mounting shell (2), the thread grooves (602) are formed in the inner wall of the mounting cylinder (5), and the mounting cylinder (5) is in threaded connection with the first mounting shell (1) and the second mounting shell (2) through the thread teeth (601) and the thread grooves (602).
3. The measurement probe structure of the copper thickness measuring instrument for the rigid circuit board according to claim 1, wherein: the surface fixed mounting of first installation shell (1) has lug (605), and the surface of second installation shell (2) is even has seted up recess (606), the connected mode between lug (605) and recess (606) is the block and connects, and is the block structure between first installation shell (1) and the second installation shell (2).
4. The measurement probe structure of the copper thickness measuring instrument for the rigid circuit board according to claim 1, wherein: the inside of first installation shell (1) and second installation shell (2) is all fixed mounting has limiting plate (603), and the inside of first installation shell (1) and second installation shell (2) is provided with solid fixed ring (604), gu fixed ring (604) fixed mounting is at the surface of probe body (3), mounting groove (608) have all been seted up on the surface of first installation shell (1) and second installation shell (2), and the surface block of mounting groove (608) is connected with connecting piece (607) to connecting piece (607) fixed mounting is at the surface of wire (4).
5. The measurement probe structure of the copper thickness measuring instrument for the rigid circuit board according to claim 1, wherein: the protection mechanism (7) comprises a chute (701), the chute (701) is arranged on the surface of the mounting cylinder (5), a protection sleeve (702) and a limit ring (703) are connected in a sliding manner in the chute (701), and the protection sleeve (702) is fixedly connected with the limit ring (703) in a connection manner.
6. The measurement probe structure of the rigid circuit board copper thickness measuring instrument according to claim 5, wherein: a spring (704) is fixedly arranged between the surfaces of the protective sleeve (702) and the limiting ring (703) and the inner wall of the chute (701), and a rubber ring (705) is fixedly arranged on the surface of the other side of the protective sleeve (702).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223479471.4U CN219161268U (en) | 2022-12-26 | 2022-12-26 | Measuring probe structure of copper thickness measuring instrument of rigid circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223479471.4U CN219161268U (en) | 2022-12-26 | 2022-12-26 | Measuring probe structure of copper thickness measuring instrument of rigid circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219161268U true CN219161268U (en) | 2023-06-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223479471.4U Active CN219161268U (en) | 2022-12-26 | 2022-12-26 | Measuring probe structure of copper thickness measuring instrument of rigid circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219161268U (en) |
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2022
- 2022-12-26 CN CN202223479471.4U patent/CN219161268U/en active Active
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