CN219151870U

CN219151870U - Rotary marking device

Info

Publication number: CN219151870U
Application number: CN202223019685.3U
Authority: CN
Inventors: 黄能权
Original assignee: Suzhou Ouyim Semiconductor Equipment Technology Co ltd
Current assignee: Suzhou Ouyim Semiconductor Equipment Technology Co ltd
Priority date: 2022-11-15
Filing date: 2022-11-15
Publication date: 2023-06-09
Anticipated expiration: 2032-11-15

Abstract

The utility model aims to provide a rotary marking device which solves the problem of accuracy of marking a semiconductor part to be detected, and comprises a feeding system, a rotary disc and a laser, wherein a tray for installing various accessories is arranged on the rotary disc, the tray extends along the outer edge of the rotary disc, a blanking hole for loading materials is arranged on the rotary disc, a laser hole for laser to pass through is arranged on the tray, the laser for marking is arranged above the tray, the laser is arranged on a three-coordinate moving platform capable of adjusting the distance, due to the feeding system, enough semiconductor parts to be detected enter the blanking hole on the rotary disc, the blanking hole passes through a position sensor when rotating, and the laser accurately marks the semiconductor part to be detected through the laser hole after obtaining signals, so that the problem of accuracy of marking the semiconductor part to be detected is solved.

Description

Rotary marking device

Technical Field

The utility model relates to a rotary marking device, in particular to the semiconductor industry.

Background

At present, semiconductor products are developed in the direction of precise small size, and the laser marking of semiconductor accessories like small particles is not suitable for the current setting, because the size is small, time and labor are wasted during clamping, the position is difficult to determine during marking, and the expected effect is difficult to achieve.

Disclosure of Invention

The utility model aims to provide a rotary marking device which solves the problem of accuracy of marking a semiconductor part to be detected.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a rotary marking device which comprises a feeding system, a rotary disc and a laser, wherein a tray for installing various accessories is arranged on the rotary disc, the tray extends along the outer edge of the rotary disc, a blanking hole for loading materials is formed in the rotary disc, a laser hole for laser to pass through is formed in the tray, the laser for marking is arranged above the tray, the laser is arranged on a three-coordinate moving platform capable of adjusting the distance, the feeding system further comprises a material storage tank, a vibration disc and an absorber, the vibration disc is located between the material storage tank and the absorber, and the absorber is arranged at a position corresponding to the blanking hole.

Optionally, a plurality of blanking holes are distributed on the rotating disc, and distances between adjacent blanking holes are equal.

Optionally, the tray has an upper layer and a lower layer, and the rotating disc is located between the upper layer and the lower layer of the tray.

Optionally, the direction of the blanking hole opening is towards the adsorber.

Optionally, the blanking hole is a cube, and a side of the front side of the blanking hole in the clockwise direction is chamfered with an arc-shaped side of the rotating disc.

Optionally, a plurality of laser holes are arranged on the upper layer of the tray, distances between adjacent laser holes are equal, and the laser holes are positioned above the rotation track of the blanking holes.

Optionally, a position sensor is arranged beside the laser hole, the position sensor is positioned in the anticlockwise direction of the laser hole, and the number of the position sensors is consistent with the carding of the laser hole.

Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:

according to the rotary marking device, as the feeding system is arranged, enough semiconductor to-be-detected pieces enter the blanking holes on the rotary disc, the blanking holes pass through the position sensor when rotating, and after signals are obtained by the laser, the laser holes are used for marking the semiconductor to-be-detected pieces, so that the problem of accuracy of marking the semiconductor to-be-detected pieces is solved.

Drawings

Some specific embodiments of the utility model will be described in detail hereinafter by way of example and not by way of limitation with reference to the accompanying drawings. The same reference numbers will be used throughout the drawings to refer to the same or like parts or portions. It will be appreciated by those skilled in the art that the drawings are not necessarily drawn to scale. In the accompanying drawings:

FIG. 1 is a schematic perspective view of a rotary marking apparatus according to a preferred embodiment of the present utility model;

FIG. 2 is an enlarged view of the adsorber and blanking aperture components of FIG. 1;

fig. 3 is an enlarged view of the laser hole and position sensor shown in fig. 1.

Wherein reference numerals are as follows:

1. a feeding system;

11. a material storage tank;

12. a vibration plate;

13. an adsorber;

2. a rotating disc;

3. a laser;

4. a tray;

5. a blanking hole;

6. a laser hole;

7. a three-coordinate mobile platform;

8. a sensor.

Detailed Description

The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In addition, the technical features of the different embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.

As shown in fig. 1, 2 and 3, a rotary marking device comprises a feeding system 1, a rotary disk 2 and a laser 3, wherein a tray 4 for installing various accessories or various detection devices is arranged on the rotary disk 2, the tray 4 does not rotate along with the rotary disk 2, the tray 4 extends along the outer edge of the rotary disk 2, the rotary disk 2 is a cylinder, that is, the tray 4 extends along the arc edge of the rotary disk 2, a blanking hole 5 for loading materials is arranged on the rotary disk 2, the shape of the blanking hole 5 can be round, cubic or other suitable materials, a laser hole 6 for passing laser is arranged on the tray 4, when the rotary disk 2 rotates, the blanking hole 5 passes below the laser hole 6, the laser 3 for marking is arranged above the tray 4, the laser of laser 3 waits to detect the piece from laser hole 6 to the semiconductor on the blanking hole 5, laser 3 sets up on can adjust three-dimensional moving platform 7 of distance, three-dimensional moving platform 7 can accurate location, laser 3 just can accurate marking like this, feeding system 1 still includes material storage jar 11, vibration dish 12 and adsorber 13, material storage jar 11 is used for adorning the semiconductor and waits to detect the piece, it reaches vibration dish 12 to wait to detect the piece through material storage jar 11 semiconductor, vibration dish 12 is ordered the bulk cargo in the dish through the arrangement of feeding system, carry the separation unit, finally inhale the blanking hole 5 on the rotary disk 2 through adsorber 13 in, vibration dish 12 is located between material storage jar 11 and adsorber 13, adsorber 13 sets up in the position that corresponds to blanking hole 5, be convenient for wait to detect the piece with the semiconductor and adsorb in the blanking hole 5.

There are a plurality of blanking holes 5 to distribute on rotary disk 2, and the distance between the adjacent blanking holes 5 equals, and a plurality of blanking holes 5 can load more semiconductor and wait to detect the piece, and is fast, efficient.

The tray 4 has two layers from top to bottom, and the rotary disk 2 is located between two layers from top to bottom of tray 4, and tray 4 is along rotary disk 2 arc limit simultaneously, has the fixed effect to the semiconductor in blanking hole 5 waiting to detect the piece.

The direction of the opening of the blanking hole 5 faces the absorber 13, so that the absorber 13 can absorb the semiconductor to be detected and enter the blanking hole 5.

In this example, the blanking hole 5 is a cube, the edge of the clockwise front side of the blanking hole 5 forms a chamfer with the arc edge of the rotating disk 2, and in actual use, the blanking hole 5 can be correspondingly provided with two chamfers, namely, the edge of the counterclockwise front side of the blanking hole 5 also forms a chamfer with the arc edge of the rotating disk 2, and the chamfer is equivalent to enlarging the inlet of the blanking hole 5, thereby being more beneficial to the semiconductor to be detected to enter the blanking hole 5.

There are a plurality of laser holes 6 to set up in tray 4 upper strata, and the distance between the adjacent laser holes 6 is equal to laser hole 6 is located blanking hole 5 rotation track top, and when the semiconductor in the blanking hole 5 is waited to detect the piece and arrives the position in laser hole 6 to laser hole 6 with the laser hole 6, the laser of laser instrument 3 begins to beat the mark on the semiconductor wait to detect the piece.

The position sensor 8 is arranged beside the laser hole 6, the position sensor 8 is positioned in the anticlockwise direction of the laser hole 6, the number of the position sensor 8 is consistent with that of the laser holes 6, when the laser hole 6 carries a semiconductor to-be-detected piece in the blanking hole 5 to pass through the position sensor 8, the position sensor 8 sends an instruction to the laser 3, the laser 3 sends laser, and at the moment, the blanking hole 5 is positioned below the laser hole 6, so that accurate marking can be completed.

Because various accessories such as detection accessory electrical property detection and visual appearance detection and defective product removal equipment can be arranged on the rotary disk 2, the detection equipment can be concentrated on the rotary disk 2 for sequential detection, defective product removal and defective product collection to the next process.

The above embodiments are only for illustrating the technical concept and features of the present utility model, and are intended to enable those skilled in the art to understand the present utility model and to implement the same, but are not intended to limit the scope of the present utility model, and all equivalent changes or modifications made according to the spirit of the present utility model should be included in the scope of the present utility model.

Claims

1. The utility model provides a rotation type marking device, its characterized in that, including feeding system (1), rotary disk (2) and laser instrument (3), be provided with tray (4) that are used for installing the accessory on rotary disk (2), tray (4) are followed the outer fringe of rotary disk (2) is provided with blanking hole (5) that are used for loading the material on rotary disk (2) be provided with laser hole (6) that are used for laser to pass through on tray (4), the top of tray (4) is provided with laser instrument (3) that are used for marking, laser instrument (3) set up on can adjust three-dimensional moving platform (7) of distance, feeding system (1) still include material storage tank (11), vibration dish (12) and adsorber (13), vibration dish (12) are located between material storage tank (11) and adsorber (13), adsorber (13) set up in the position that corresponds to blanking hole (5).

2. Rotary marking device according to claim 1, characterized in that a plurality of blanking holes (5) are distributed on the rotary disc (2), the distances between adjacent blanking holes (5) being equal.

3. Rotary marking apparatus according to claim 1, characterized in that the tray (4) has an upper and a lower layer, the rotary disc (2) being located between the upper and lower layers of the tray (4).

4. Rotary marking apparatus according to claim 1, characterized in that the blanking aperture (5) is open in a direction towards the adsorber (13).

5. Rotary marking apparatus according to claim 1, characterized in that the blanking hole (5) is a cube, the clockwise front side of the blanking hole (5) forming a chamfer with the arc-shaped side of the rotating disc (2).

6. The rotary marking device according to claim 1, characterized in that a plurality of laser holes (6) are provided in the upper layer of the tray (4), the distances between adjacent laser holes (6) are equal, and the laser holes (6) are located above the rotation track of the blanking hole (5).

7. Rotary marking apparatus according to claim 1, characterized in that a position sensor (8) is arranged beside the laser holes (6), the position sensor (8) being located counter-clockwise to the laser holes (6), the number of position sensors (8) being consistent with the combing of the laser holes (6).