CN219144154U

CN219144154U - Transfer device for wafer processing

Info

Publication number: CN219144154U
Application number: CN202222569969.3U
Authority: CN
Inventors: 吴继勇
Original assignee: Jiangsu Suxin Semiconductor Co ltd
Current assignee: Jiangsu Suxin Semiconductor Co ltd
Priority date: 2022-09-28
Filing date: 2022-09-28
Publication date: 2023-06-06
Anticipated expiration: 2032-09-28

Abstract

The utility model discloses a transfer device for wafer processing, which comprises a placing box and a transport frame, wherein a clamping frame is arranged in the placing box, a plurality of through grooves are formed in the clamping frame, wafer bodies are clamped in the through grooves, clamping mechanisms are arranged on two sides of the placing box, the transport frame is provided with two placing plates, placing grooves are formed in the two placing plates, and the placing box is placed in the placing grooves; the clamping mechanism comprises clamping blocks, mounting grooves are formed in two sides of the placing box, two reset springs are fixedly arranged in the mounting grooves, the other ends of the two reset springs are fixedly connected with the clamping blocks, one ends of the clamping blocks are connected with the placing plate in a clamping mode, and the wafer body can be better fixed through the arrangement of the silica gel gasket, the first rubber gasket and the second rubber gasket, so that the wafer body is prevented from vibrating and crushing in the transportation process, and the placing box can be prevented from falling in the transportation process by the clamping mechanism.

Description

Transfer device for wafer processing

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a transfer device for wafer processing.

Background

A wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer is circular in shape; various circuit element structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. The wafer needs to be transferred and transported in the process of processing the wafer, the transfer and transportation device needs to be used for transferring the wafer in the process of transferring and transportation, the wafer is usually stored in the wafer box by the conventional transfer and transportation device, each wafer can be separately placed through the groove, however, the inside of the wafer boat is provided with the groove, but the bottom of the wafer boat is of a hollow structure, the bottom of the wafer is not supported at all, when the wafer is impacted or wild operated, the wafer often breaks away from the original groove, even the wafer breaks, the wafer cannot be placed well, in addition, the wafer box is usually directly placed on the transportation frame in the transportation process, the wafer box is easy to move and drop in the transportation process, and the wafer transportation effect is affected.

Disclosure of Invention

The utility model aims to provide a transfer device for wafer processing, which has better wafer clamping and fixing effects and is convenient for clamping and fixing for transportation so as to solve the problems in the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the transfer device for wafer processing comprises a placement box and a transport frame, wherein a clamping frame is arranged in the placement box, a plurality of through grooves are formed in the clamping frame, wafer bodies are clamped in the through grooves, clamping mechanisms are arranged on two sides of the placement box, two placement plates are arranged on the transport frame, placement grooves are formed in the placement plates, and the placement box is placed in the placement grooves;

the clamping mechanism comprises clamping blocks, mounting grooves are formed in two sides of the placing box, two reset springs are fixedly mounted in the mounting grooves, the other ends of the reset springs are fixedly connected with the clamping blocks, and one ends of the clamping blocks are connected with the placing plates in a clamping mode.

Preferably, a plurality of support columns are fixedly arranged between the two placing plates, and a plurality of self-locking universal wheels are fixedly arranged at the lower end of one placing plate.

Preferably, the clamping grooves are formed in two sides of the placing groove, and one end of the clamping block is clamped in the clamping grooves.

Preferably, the clamping block is a -shaped clamping block, and the other end of the clamping block is fixedly connected with a pushing handle.

Preferably, a plurality of silica gel gaskets are fixedly arranged on two sides of the through groove, and the silica gel gaskets are in contact connection with the wafer body.

Preferably, the upper end of the placement box is hinged with a box cover, a first rubber gasket is arranged on the inner side of the box cover, and the first rubber gasket is in contact connection with the wafer body.

Preferably, second rubber gaskets are arranged on two sides of the placement box, and the second rubber gaskets are in contact connection with the wafer body.

Compared with the prior art, the utility model has the beneficial effects that:

1. the wafer body can be clamped by the clamping frame through the arrangement of the through grooves, and the placing box can better fix the wafer body through the arrangement of the silica gel gasket, the first rubber gasket and the second rubber gasket, so that the wafer body is prevented from vibrating and crushing in the transportation process;

2. according to the clamping mechanism, one end of the clamping block can be clamped in the clamping groove through the arrangement of the reset spring, the placing box and the placing plate can be clamped and fixed, and the placing box can be prevented from falling off in the transportation process.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic side cross-sectional view of the present utility model;

FIG. 3 is an enlarged view of FIG. 2A in accordance with the present utility model;

fig. 4 is a schematic view of a clamping frame according to the present utility model.

In the figure: 1. placing a box; 2. a transport rack; 3. a clamping frame; 4. a through groove; 401. a silica gel pad; 5. a wafer body; 6. a clamping mechanism; 601. a clamping block; 602. a return spring; 603. a clamping groove; 604. a push handle; 605. a mounting groove; 7. placing a plate; 8. a placement groove; 9. a support column; 10. self-locking universal wheels; 11. a box cover; 1101. a first rubber gasket; 12. and a second rubber gasket.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, the present utility model provides a technical solution:

the transfer device for wafer processing comprises a placing box 1 and a transport frame 2, wherein a clamping frame 3 is arranged in the placing box 1, a plurality of through grooves 4 are formed in the clamping frame 3, wafer bodies 5 are clamped in the through grooves 4, clamping mechanisms 6 are arranged on two sides of the placing box 1, two placing plates 7 are arranged on the transport frame 2, placing grooves 8 are formed in the two placing plates 7, and the placing box 1 is placed in the placing grooves 8;

the clamping mechanism 6 comprises clamping blocks 601, mounting grooves 605 are formed in two sides of the placing box 1, two reset springs 602 are fixedly mounted in the mounting grooves 605, the other ends of the two reset springs 602 are fixedly connected with the clamping blocks 601, and one end of each clamping block 601 is in clamping connection with the placing plate 7.

Referring to fig. 1, since a plurality of support columns 9 are fixedly arranged between two placing plates 7, and a plurality of self-locking universal wheels 10 are fixedly arranged at the lower end of one placing plate 7, the placing plates 7 can be supported by the plurality of support columns 9, and the self-locking universal wheels 10 are convenient for the placing frame to move.

Referring to fig. 3, since the engaging grooves 603 are formed on both sides of the placement groove 8, one end of the engaging block 601 is engaged in the engaging groove 603, and thus the placement case 1 and the placement plate 7 can be engaged and fixed by the arrangement of the engaging groove 603.

Referring to fig. 3, the engaging block 601 is -shaped engaging block 601, and the pushing handle 604 is fixedly connected to the other end of the engaging block 601, so that the pushing handle 604 is convenient for pushing the engaging block 601 to move.

Referring to fig. 4, since the silica gel gaskets 401 are fixedly arranged at two sides of the through grooves 4, the silica gel gaskets 401 are in contact connection with the wafer body 5, the wafer body 5 can be clamped and fixed by the arrangement of the silica gel gaskets 401, and abrasion during fixing the wafer body 5 is reduced.

Referring to fig. 1 and 2, since the upper end of the placement box 1 is hinged with the box cover 11, the inner side of the box cover 11 is provided with the first rubber gasket 1101, and the first rubber gasket 1101 is in contact connection with the wafer body 5, the upper end of the wafer body 5 can be fixed by the box cover 11, and the abrasion to the wafer body 5 can be reduced by the first rubber gasket 1101.

Referring to fig. 2, since the second rubber gaskets 12 are disposed at two sides of the placement box 1, the second rubber gaskets 12 are in contact connection with the wafer body 5, two sides of the wafer body 5 can be fixed by the arrangement of the second rubber gaskets 12, so as to avoid the vibration and damage of the wafer body 5.

Structural principle: during the use, place wafer body 5 in logical inslot 4, silica gel gasket 401 is with wafer body 5 centre gripping, place the back with lid 11 block after accomplishing, first rubber gasket 1101 and second rubber gasket 12 are connected with wafer body 5 contact, wafer body 5 places more firmly when, avoid taking place in the transportation wafer body 5 and shake the damage, push away handle 604 is pressed afterwards, place box 1 in standing groove 8, loosen push away handle 604, under reset spring 602's effort, block 601 one end block is in block groove 603, can be fixed with placing box 1 and placing plate 7 block, avoid placing box 1 removal when transporting and drop, press push away handle 604 can.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a transfer device for wafer processing, includes places box (1) and transportation frame (2), its characterized in that: a clamping frame (3) is arranged in the placement box (1), a plurality of through grooves (4) are formed in the clamping frame (3), a plurality of wafer bodies (5) are clamped in the through grooves (4), clamping mechanisms (6) are arranged on two sides of the placement box (1), two placement plates (7) are arranged on the transportation frame (2), placement grooves (8) are formed in the two placement plates (7), and the placement box (1) is placed in the placement grooves (8);

the clamping mechanism (6) comprises clamping blocks (601), mounting grooves (605) are formed in two sides of the placing box (1), two reset springs (602) are fixedly mounted in the mounting grooves (605), the other ends of the reset springs (602) are fixedly connected with the clamping blocks (601), and one ends of the clamping blocks (601) are connected with the placing plates (7) in a clamping mode.

2. The transfer device for wafer processing according to claim 1, wherein: a plurality of support columns (9) are fixedly arranged between the two placing plates (7), and a plurality of self-locking universal wheels (10) are fixedly arranged at the lower ends of the placing plates (7).

3. The transfer device for wafer processing according to claim 1, wherein: clamping grooves (603) are formed in two sides of the placing groove (8), and one end of each clamping block (601) is clamped in each clamping groove (603).

4. The transfer device for wafer processing according to claim 1, wherein: the clamping block (601) is a -shaped clamping block, and the other end of the clamping block (601) is fixedly connected with a pushing handle (604).

5. The transfer device for wafer processing according to claim 1, wherein: a plurality of silica gel gaskets (401) are fixedly arranged on two sides of the through groove (4), and the silica gel gaskets (401) are in contact connection with the wafer body (5).

6. The transfer device for wafer processing according to claim 1, wherein: the upper end of the placement box (1) is hinged with a box cover (11), a first rubber gasket (1101) is arranged on the inner side of the box cover (11), and the first rubber gasket (1101) is in contact connection with the wafer body (5).

7. The transfer device for wafer processing according to claim 1, wherein: two sides of the placement box (1) are provided with second rubber gaskets (12), and the second rubber gaskets (12) are in contact connection with the wafer body (5).