CN219144135U

CN219144135U - Semiconductor packaging assembly

Info

Publication number: CN219144135U
Application number: CN202320184362.5U
Authority: CN
Inventors: 魏海强; 夏陈义; 魏广
Original assignee: Shenzhen Zhongxun Hengda Technology Co ltd
Current assignee: Shenzhen Zhongxun Hengda Technology Co ltd
Priority date: 2023-02-11
Filing date: 2023-02-11
Publication date: 2023-06-06
Anticipated expiration: 2033-02-11

Abstract

The utility model discloses a semiconductor packaging assembly, which belongs to the field of semiconductor packaging and comprises a fixed bottom plate, wherein two sides of the bottom end of the fixed bottom plate are fixedly connected with a supporting plate, the top end of the supporting plate is fixedly connected with a single-chip frame plate, the side surface of the single-chip frame plate is fixedly connected with a guide arc plate, two sliding vertical rods are arranged at two ends of the surface of the single-chip frame plate, a supporting slide plate is arranged at the outer side of the sliding vertical rod, a motor is arranged at the side surface of the fixed bottom plate, the tail end of an output shaft of the motor is connected with a driving gear, the supporting plate is fixedly connected with the single-chip frame plate, the single-chip frame plate is fixedly connected with the sliding vertical rod, the sliding vertical rod is in sliding connection with the supporting slide plate, the tail end of the supporting slide plate is fixedly connected with an element positioning plate, and the surface of the element positioning plate is provided with a positioning wire groove, so that the supporting slide plate extrudes a stress spring and moves downwards to align pins of an element with a hole site of a circuit board so as to perform tin soldering packaging.

Description

Semiconductor packaging assembly

Technical Field

The utility model belongs to the technical field of semiconductor packaging, and particularly relates to a semiconductor packaging assembly.

Background

When packaging a semiconductor, pins of a semiconductor chip with smaller size are required to be aligned and placed in corresponding hole sites of a circuit board, and a semiconductor element is connected into the circuit board through tin soldering packaging by smearing silicone oil and hot air treatment;

the prior semiconductor packaging assembly has the advantages of simple structure, good sealing performance and the like, but does not optimize the structure of how to align and put the pins of the semiconductor during packaging, and the positioning structure can not lead the circuit board to be in suspended placement, so that the pins can not be well protected.

Disclosure of Invention

The utility model aims to provide a semiconductor packaging assembly, which solves the problem that pins of a semiconductor are aimed and cannot be protected.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor package assembly, includes PMKD, PMKD's bottom both sides fixedly connected with backup pad, the top fixedly connected with monolithic frame board of backup pad, the side fixedly connected with direction arc board of monolithic frame board, the surface both ends of monolithic frame board all are provided with two slide montants, slide the outside of montant and be provided with the support slide, PMKD's side is provided with the motor, the output shaft end-to-end connection of motor has drive gear.

As a preferred implementation mode, backup pad and monolithic frame plate fixed connection, monolithic frame plate and slip montant fixed connection, slip montant and support slide sliding connection, the terminal fixedly connected with component locating plate of support slide, the location wire casing has been seted up to the surface of component locating plate, the surface cover of slip montant is equipped with the atress spring that both ends are connected with monolithic frame plate and support slide respectively.

By adopting the scheme, the components are placed on the corresponding positioning wire slots by utilizing the sucking discs of the external processing device, the positioning wire slots are pressed down by the external driving structure, the supporting sliding plates are connected to the side surfaces of the positioning wire slots to move downwards, the supporting sliding plates are further used for extruding the stress springs and moving downwards, and pins of the components are aligned with hole sites of the circuit board so as to perform soldering packaging.

As a preferred implementation mode, the bottom surface fixedly connected with slip end of supporting the slide, the inboard sliding connection of slip end has the direction slide bar, the outside of direction slide bar is provided with elastic spring, the terminal fixedly connected with slide bar solid end of direction slide bar, elastic spring one end and slip end fixed connection, and the elastic spring other end and slide bar solid end fixed connection.

By adopting the scheme, the external driving structure is utilized to prop against the side surface of the element positioning plate, when the element positioning plate drives and moves, the guide slide bar is driven by the fixed end of the slide bar, the fixed end of the slide bar is further led to extrude the elastic spring, the fixed end of the slide bar is enabled to be close to the sliding end, the element is moved to the correct position through the movement of the element positioning plate, the accuracy of element installation is improved, the elastic spring releases the elastic force after the force applied to the element positioning plate is removed, the element positioning plate is pulled out from the bottom of the element placed in the hole site of the circuit board, and the element is completely attached to the circuit board.

As a preferred implementation mode, the surface of the single-piece frame plate is fixedly connected with four fixed rod fixing blocks, the side surfaces of the fixed rod fixing blocks are slidably connected with positioning short rods, the tail ends of the positioning short rods are fixedly connected with positioning blocks, and the other ends of the positioning short rods are fixedly connected with linkage end rods.

By adopting the scheme, the linkage end rod is utilized to move to drive the positioning short rod to move, the positioning short rod slides with the penetrated fixed rod fixing block, the terminal positioning blocks are mutually close to achieve the purpose of clamping, the clamping is achieved through the structure contraction in different directions, the fixing of circuit boards in different sizes can be improved, and the packaging efficiency of semiconductors in circuits is improved.

As a preferable implementation mode, the side face of the positioning block is provided with a wedge groove, the whole shape of the wedge groove is a right trapezoid, and a triangle extends outwards by taking one short side of the right trapezoid as a bottom side.

As a preferred implementation mode, two sides of the linkage end rod are fixedly connected with a narrow toothed bar, sides of the narrow toothed bar are fixedly connected with side teeth, sides of the other two linkage end rods are fixedly connected with a wide toothed bar, a through rod transverse groove is formed in the sides of the wide toothed bar, a driving fluted disc is connected to the sides of the through rod transverse groove in a meshed mode, a crown gear is fixedly connected to the bottom side of the driving fluted disc, the crown gear is connected with the driving gear in a meshed mode, and the driving fluted disc is connected with a single-piece frame plate in a rotating mode.

By adopting the scheme, the driving gear is driven to rotate through the motor operation, the driving gear is further led to drive the crown gear to rotate, the crown gear is used for driving the mutually fixed driving fluted disc to rotate, the driving fluted disc is used for driving the meshed narrow toothed rod and wide toothed rod to move, and in the process of moving the narrow toothed rod, the through rod transverse groove on the side face of the wide toothed rod is penetrated.

Compared with the prior art, the utility model has the beneficial effects that:

according to the semiconductor packaging assembly, the element locating plate is arranged and pulled out from the bottom of the element placed in the hole site of the circuit board through the pin, so that the element is completely attached to the circuit board, the element locating plate is pulled out from the bottom of the element placed in the hole site of the circuit board through the pin, and the packaging effect is improved through improving the element locating precision and matching with the soldering structure;

according to the semiconductor packaging assembly, the positioning blocks are arranged, clamping is achieved through structure shrinkage in different directions, and the fixing of circuit boards in different sizes can be improved, so that the packaging efficiency of semiconductors in circuits is improved.

Drawings

FIG. 1 is a schematic view of a front perspective structure of the present utility model;

FIG. 2 is a schematic diagram of a linkage structure of the element positioning plate of the present utility model;

FIG. 3 is a schematic diagram of a linkage structure of a positioning block according to the present utility model;

fig. 4 is a schematic diagram of a crown gear de-driving structure according to the present utility model.

In the figure: 1. a fixed bottom plate; 2. a support plate; 3. a single piece shelf; 4. a motor; 5. sliding vertical rods; 6. a support slide plate; 7. a drive gear; 8. a force spring; 9. a component positioning plate; 10. positioning wire slots; 11. fixing ends of the slide bars; 12. an elastic spring; 13. a guide slide bar; 14. a sliding end; 15. a guide arc plate; 16. fixing the rod fixing block; 17. positioning a short rod; 18. a positioning block; 19. a wedge groove; 20. a link end lever; 21. a narrow toothed bar; 22. side teeth; 23. a wide toothed bar; 24. a rod penetrating transverse groove; 25. driving the fluted disc; 26. crown gears.

Description of the embodiments

Referring to fig. 1-4, the utility model provides a semiconductor package assembly, which comprises a fixed bottom plate 1, wherein two sides of the bottom end of the fixed bottom plate 1 are fixedly connected with a supporting plate 2, the top end of the supporting plate 2 is fixedly connected with a single-chip frame plate 3, the side surface of the single-chip frame plate 3 is fixedly connected with a guide arc plate 15, two sliding vertical rods 5 are arranged at two ends of the surface of the single-chip frame plate 3, a supporting sliding plate 6 is arranged at the outer side of the sliding vertical rods 5, a motor 4 is arranged at the side surface of the fixed bottom plate 1, and the tail end of an output shaft of the motor 4 is connected with a driving gear 7.

See fig. 2, backup pad 2 and monolithic frame plate 3 fixed connection, monolithic frame plate 3 and slip montant 5 fixed connection, slip montant 5 and support slide 6 sliding connection, the terminal fixedly connected with component locating plate 9 of support slide 6, the location wire casing 10 has been seted up on the surface of component locating plate 9, the surface cover of slip montant 5 is equipped with the both ends respectively with monolithic frame plate 3 and support the atress spring 8 that slide 6 is connected, through above-mentioned structure, utilize external processingequipment's sucking disc to place the component on the location wire casing 10 that corresponds, and push down location wire casing 10 through external drive structure, let location wire casing 10 be connected with support slide 6 through the side and move down, and then let support slide 6 extrusion atress spring 8 and move down, and then let the stitch of component and circuit board hole site align, so as to carry out the soldering encapsulation.

Referring to fig. 2, the bottom surface of the supporting slide plate 6 is fixedly connected with a sliding end 14, the inner side of the sliding end 14 is slidably connected with a guiding slide bar 13, the outer side of the guiding slide bar 13 is provided with an elastic spring 12, the tail end of the guiding slide bar 13 is fixedly connected with a slide bar fixing end 11, one end of the elastic spring 12 is fixedly connected with the sliding end 14, the other end of the elastic spring 12 is fixedly connected with the slide bar fixing end 11, through the structure, the side surface of the element positioning plate 9 is supported by an external driving structure, when the element positioning plate 9 drives to move, the guiding slide bar 13 is driven by the slide bar fixing end 11, the slide bar fixing end 11 is further pressed against the elastic spring 12, the slide bar fixing end 11 is close to the sliding end 14, the element is moved to a correct position by the movement of the element positioning plate 9, the installation accuracy of the element is improved, after the force applied by the element positioning plate 9 is removed, the elastic spring 12 is released, the element positioning plate 9 is pulled out from the bottom of the element placed in the hole position of the circuit board, and the element is further fully attached to the circuit board.

Referring to fig. 3, the surface of the single-piece shelf board 3 is fixedly connected with a fixed rod fixing block 16 everywhere, the side surface of the fixed rod fixing block 16 is slidably connected with a positioning short rod 17, the tail end of the positioning short rod 17 is fixedly connected with a positioning block 18, the other end of the positioning short rod 17 is fixedly connected with a linkage end rod 20, through the structure, the linkage end rod 20 is utilized to move to drive the positioning short rod 17 to move, the positioning short rod 17 slides with the penetrated fixed rod fixing block 16, the tail end positioning block 18 is mutually close to achieve the purpose of clamping, the clamping is achieved through the structure contraction in different directions, the fixing of circuit boards in different sizes can be promoted, and the packaging efficiency of semiconductors in circuits is improved.

Referring to fig. 3, a side surface of the positioning block 18 is provided with a wedge groove 19, the overall shape of the wedge groove 19 is a right trapezoid, and a triangle extends outwards by taking a short side of the right trapezoid as a bottom side.

Referring to fig. 4, the two sides of the linkage end bar 20 are fixedly connected with a narrow toothed bar 21, the sides of the narrow toothed bar 21 are fixedly connected with side teeth 22, the sides of the other two linkage end bars 20 are fixedly connected with a wide toothed bar 23, the sides of the wide toothed bar 23 are provided with a cross bar groove 24, the sides of the cross bar groove 24 are in meshed connection with a driving fluted disc 25, the bottom side of the driving fluted disc 25 is fixedly connected with a crown gear 26, the crown gear 26 is in meshed connection with the driving gear 7, the driving fluted disc 25 is in rotary connection with the single-chip frame plate 3, through the structure, the driving gear 7 is operated by a motor 4 to rotate, the driving fluted disc 25 is driven by the driving gear 7 to rotate, and the fixed driving fluted disc 25 is driven by the rotation of the driving fluted disc 25 to drive the meshed narrow toothed bar 21 and wide toothed bar 23, during the movement of the narrow toothed bar 21, the cross bar 24 passing through the side of the wide toothed bar 23 is in a meshed manner, the structure is in a common shrinkage manner, a fast fixing structure is realized, a tin soldering structure is matched, and the packaging efficiency of a semiconductor element can be improved

When the device is used, firstly, the component is placed on the corresponding positioning wire slot 10 by utilizing the sucking disc of the external processing device, the positioning wire slot 10 is pressed down through the external driving structure, the positioning wire slot 10 is connected with the supporting slide plate 6 through the side surface to move downwards, the supporting slide plate 6 is further used for extruding the stressed spring 8 and moving downwards, the pins of the component are aligned with the hole sites of the circuit board, then, the external driving structure is utilized to prop against the side surface of the component positioning plate 9, when the component positioning plate 9 is driven to move, the sliding rod fixing end 11 is utilized to drive the guide slide rod 13, the sliding rod fixing end 11 is further used for extruding the elastic spring 12, the sliding rod fixing end 11 is enabled to be close to the sliding end 14, the component is moved to the correct position through the movement of the component positioning plate 9, the elastic spring 12 is released, the component positioning plate 9 is pulled out from the bottom of the component in the hole sites through the side surface after the force applied to the component positioning plate 9 is removed, then, the motor 4 is used for driving the driving gear 7 to rotate, the crown gear 26 is further driven to rotate, the crown gear 26 is driven to rotate, the fixed driving gear 25 is driven to rotate through the crown gear 26, the crown gear 25 is driven to rotate, the driving gear plate 25 is driven to rotate the crown gear 25 and the narrow gear rod 21 is meshed with the narrow gear rod 17 to move with the narrow gear rod 17, the end 17 is driven to move close to the end of the sealing end 17, and the sealing end is matched with the end 17 is matched with the sealing end, and the purpose of the sealing rod is realized, and the sealing and the end is positioned and the end is moved to move the end is positioned by the sealing rod is positioned to move the sealing rod is close to the end 17.

Claims

1. A semiconductor package assembly, characterized in that: including PMKD (1), the bottom both sides fixedly connected with backup pad (2) of PMKD (1), the top fixedly connected with monolithic frame board (3) of backup pad (2), the side fixedly connected with direction arc board (15) of monolithic frame board (3), the surface both ends of monolithic frame board (3) all are provided with two slide montants (5), the outside of slide montant (5) is provided with supporting slide (6), the side of PMKD (1) is provided with motor (4), the output shaft end-to-end connection of motor (4) has drive gear (7).

2. The semiconductor package assembly of claim 1, wherein: the utility model discloses a support plate, including support plate (2), monolithic frame plate (3), slip montant (5) and support slide (6) sliding connection, the terminal fixedly connected with component locating plate (9) of support slide (6), location wire casing (10) have been seted up on the surface of component locating plate (9), the surface cover of slip montant (5) is equipped with atress spring (8) that both ends are connected with monolithic frame plate (3) and support slide (6) respectively.

3. The semiconductor package assembly of claim 1, wherein: the bottom surface fixedly connected with slip end (14) of support slide (6), the inboard sliding connection of slip end (14) has direction slide bar (13), the outside of direction slide bar (13) is provided with elastic spring (12), the end fixedly connected with slide bar solid (11) of direction slide bar (13), elastic spring (12) one end and slip end (14) fixed connection, and elastic spring (12) other end and slide bar solid (11) fixed connection.

4. The semiconductor package assembly of claim 1, wherein: the utility model discloses a single frame plate (3) fixed surface is connected with everywhere fixed pole fixed block (16), the side sliding connection of fixed pole fixed block (16) has location quarter butt (17), the terminal fixedly connected with locating piece (18) of location quarter butt (17), the other end fixedly connected with linkage end pole (20) of location quarter butt (17).

5. The semiconductor package assembly of claim 4, wherein: the side of locating piece (18) has offered and has agreeable with limit groove (19), agreeable with limit groove (19) holistic shape is right trapezoid, and uses right trapezoid a minor face to extend triangle-shaped outwards as the base.

6. The semiconductor package assembly of claim 4, wherein: two side fixedly connected with narrow rack bar (21) of linkage end pole (20), the side fixedly connected with side tooth (22) of narrow rack bar (21), the side fixedly connected with wide rack bar (23) of other two linkage end poles (20), wear pole transverse groove (24) have been seted up to the side of wide rack bar (23), the side meshing of wearing pole transverse groove (24) is connected with drive fluted disc (25), the bottom side fixedly connected with crown gear (26) of drive fluted disc (25), crown gear (26) are connected with drive gear (7) meshing, drive fluted disc (25) are connected with monolithic frame plate (3) rotation.