CN219131747U - Edge polishing device for aluminum plate wafer production - Google Patents
Edge polishing device for aluminum plate wafer production Download PDFInfo
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- CN219131747U CN219131747U CN202223404281.6U CN202223404281U CN219131747U CN 219131747 U CN219131747 U CN 219131747U CN 202223404281 U CN202223404281 U CN 202223404281U CN 219131747 U CN219131747 U CN 219131747U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
The utility model discloses an edge polishing device for producing aluminum plate wafers, which comprises a workbench, wherein supporting bases are symmetrically arranged at the lower end of the workbench, and a plate-shaped structure at the upper end of the workbench is connected with a first electric telescopic rod; further comprises: the movable sliding block is arranged at the lower end of the movable plate and is in sliding connection with the workbench through a groove formed in the workbench; and a first motor provided on the moving plate. This aluminum plate disk production is with edge grinding device, through first limiting plate, first antiskid ribbed tile, second limiting plate and control sucking disc, can realize spacing fixedly to aluminum plate disk body, can effectually avoid the in-process of polishing, and aluminum plate disk body takes place to remove and the circumstances of skew, drives the movable plate through an electric telescopic handle and removes, and can realize removing the position of holding the board through the regulating plate to can realize processing the aluminum plate disk body of different thickness and polish.
Description
Technical Field
The utility model relates to the technical field of aluminum plate wafer edge polishing, in particular to an edge polishing device for aluminum plate wafer production.
Background
The aluminum plate can cut the department disk through circular cutting device to be convenient for follow-up use, but at the in-process to aluminum plate cutting into the disk, need polish the edge of disk, thereby avoid follow-up in-process to use the aluminum plate disk, the aluminum plate disk is with workman's hand fish tail, and very easily influence the effect of follow-up installation butt joint.
But there are some problems in the process of polishing an aluminum plate wafer, for example, a common aluminum plate wafer polishing device is difficult to firmly fix the aluminum plate wafer, so that the aluminum plate wafer is very easy to move and deviate in the polishing process, and the common aluminum plate wafer polishing device adopts an integrated structure, so that polishing of aluminum plate wafers with different thicknesses is difficult to realize in the polishing process.
Aiming at the problems, innovative design is urgently needed on the basis of the original aluminum plate wafer edge polishing device.
Disclosure of Invention
The utility model aims to provide an edge polishing device for aluminum plate wafer production, which solves the problems that in the background technology, aluminum plate wafers are easy to move and deviate in the polishing process, and polishing processing of aluminum plate wafers with different thicknesses is difficult to realize.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the edge polishing device for producing the aluminum plate wafer comprises a workbench, wherein supporting bases are symmetrically arranged at the lower end of the workbench, a plate-shaped structure at the upper end of the workbench is connected with a first electric telescopic rod, and the first electric telescopic rod is connected with a first movable plate;
further comprises:
the movable sliding block is arranged at the lower end of the first movable plate and is in sliding connection with the workbench through a groove formed in the workbench;
a first motor provided on the first moving plate;
the grinding wheel is connected with the output end of the first motor through a rotating shaft, and the grinding wheel and the first movable plate form a rotating mechanism through the rotating shaft;
the second motor is arranged on the workbench, the output end of the second motor is connected with the rotating shaft, and the rotating shaft and the workbench form a rotating mechanism through a bearing arranged on the workbench;
the lower end of the first limiting plate is connected with the rotating shaft, the upper end of the first limiting plate is provided with a first antiskid plate, and the first antiskid plate is made of rubber with a fog surface;
the aluminum plate wafer body is mutually attached to the first antiskid plate, and the aluminum plate wafer body is mutually attached to the second antiskid plate;
the lower end of the second limiting plate is provided with the second antiskid plate, and the upper end of the second limiting plate is connected with the bearing plate;
the support backboard is arranged at the upper end of the workbench and is in an inverted L shape.
Preferably, the control sucking disc is installed to accept board lower extreme, just control sucking disc symmetry is provided with 2 groups, and every group control sucking disc is provided with 3 altogether, through above-mentioned structure, is convenient for adsorb fixedly to aluminum plate disk body through the control sucking disc.
Preferably, the adjusting plate is symmetrically arranged at the upper end of the bearing plate, the adjusting plate and the fixed sleeve form sliding connection, the fixed sleeve is symmetrically arranged at the lower end of the second movable plate, and the adjusting plate can slide in the fixed sleeve conveniently through the structure.
Preferably, the fixing sleeve is penetrated with a mounting screw, the mounting screw is in threaded connection with the adjusting plate through threaded holes formed in the adjusting plate at equal intervals, and the fixing sleeve is convenient for fixing the position of the adjusting plate under the action of the mounting screw.
Preferably, the second electric telescopic rod is installed to the second movable plate upper end, just second electric telescopic rod and fixed plate interconnect, and the fixed plate constitutes slewing mechanism through fixed pivot and support backplate, through above-mentioned structure, is convenient for not influencing the rotation of fixed plate when supporting the fixed plate.
Preferably, the fixed rolling rods are arranged on the support backboard at equal angles, the outer surfaces of the fixed rolling rods are smooth, the fixed rolling rods are connected with the fixed plates in a sliding mode through grooves formed in the fixed plates, and the fixed plates are supported and limited under the action of the fixed rolling rods.
Compared with the prior art, the utility model has the beneficial effects that:
(1) The edge polishing device for the aluminum plate wafer production is provided with a polishing wheel, a second motor, a rotating shaft, a first limiting plate, a first antiskid plate, an aluminum plate wafer body, a second antiskid plate, a second limiting plate, a receiving plate and a control sucker, and at the moment, the situation that the aluminum plate wafer body moves and deviates in the polishing process can be effectively avoided by the aid of the first limiting plate, the first antiskid plate, the second limiting plate and the control sucker;
(2) This aluminum plate disk production is with edge grinding device is provided with first electric telescopic handle, first movable plate, the grinding wheel, the regulating plate, fixed sleeve and mounting screw, drives first movable plate through an electric telescopic handle and removes this moment, and can realize removing the position of accepting the board through the regulating plate to can realize processing the aluminum plate disk body of different thickness and polish.
Drawings
FIG. 1 is a schematic view of a front view of a stage according to the present utility model;
FIG. 2 is a schematic view of a rear cross-sectional structure of a support back plate according to the present utility model;
FIG. 3 is a schematic top view of a control chuck according to the present utility model;
FIG. 4 is a schematic side view of a receiving plate according to the present utility model;
fig. 5 is an enlarged schematic view of the structure of fig. 1 a according to the present utility model.
In the figure: 1. a work table; 2. a support base; 3. a first electric telescopic rod; 4. a first moving plate; 5. moving the slide block; 6. a first motor; 7. grinding wheel; 8. a second motor; 9. a rotating shaft; 10. a first limiting plate; 11. a first cleat; 12. an aluminum plate wafer body; 13. a second cleat; 14. a second limiting plate; 15. a receiving plate; 16. controlling the sucking disc; 17. an adjusting plate; 18. a fixed sleeve; 19. installing a screw; 20. a second moving plate; 21. a second electric telescopic rod; 22. a fixing plate; 23. fixing the rotating shaft; 24. a support back plate; 25. and fixing the rolling rod.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-5, the present utility model provides a technical solution: the edge polishing device for producing the aluminum plate wafer comprises a workbench 1, wherein a supporting base 2 is symmetrically arranged at the lower end of the workbench, a plate-shaped structure at the upper end of the workbench 1 is connected with a first electric telescopic rod 3, and the first electric telescopic rod 3 is connected with a first movable plate 4;
further comprises:
the movable slide block 5 is arranged at the lower end of the first movable plate 4, and the movable slide block 5 is in sliding connection with the workbench 1 through a groove formed in the workbench 1;
a first motor 6 provided on the first moving plate 4;
the grinding wheel 7 is connected with the output end of the first motor 6 through a rotating shaft, and the grinding wheel 7 and the first moving plate 4 form a rotating mechanism through the rotating shaft;
a second motor 8 arranged on the workbench 1, wherein the output end of the second motor 8 is connected with a rotating shaft 9, and the rotating shaft 9 and the workbench 1 form a rotating mechanism through a bearing arranged on the workbench 1;
the lower end of the first limiting plate 10 is connected with the rotating shaft 9, the upper end of the first limiting plate 10 is provided with a first antiskid plate 11, and the first antiskid plate 11 is made of rubber with a fog surface;
the aluminum plate wafer body 12 is mutually attached to the first antiskid plate 11, and the aluminum plate wafer body 12 is mutually attached to the second antiskid plate 13;
the second limiting plate 14 is provided with a second antiskid plate 13 at the lower end, and the upper end of the second limiting plate 14 is connected with the bearing plate 15;
a support back plate 24 mounted on the upper end of the table 1, and the support back plate 24 is arranged in an inverted L shape;
in the embodiment, the lower end of the bearing plate 15 is provided with control suckers 16, 2 groups of control suckers 16 are symmetrically arranged, and 3 control suckers 16 are arranged in each group; the upper end of the bearing plate 15 is symmetrically provided with an adjusting plate 17, the adjusting plate 17 and a fixed sleeve 18 form sliding connection, and the fixed sleeve 18 is symmetrically arranged at the lower end of the second movable plate 20; the fixing sleeve 18 is penetrated with a mounting screw 19, and the mounting screw 19 is in threaded connection with the adjusting plate 17 through threaded holes formed in the adjusting plate 17 at equal intervals;
when the aluminum plate wafer bodies 12 with different sizes are required to be processed, the aluminum plate wafer bodies 12 are placed at the upper ends of the first limiting plates 10, then the mounting screws 19 are rotated, so that the mounting screws 19 start to move towards the direction away from the fixing sleeve 18 until the mounting screws 19 are no longer connected with threaded holes formed in the adjusting plates 17, at the moment, the position of the adjusting plates 17 can be adjusted until the lower ends of the second anti-skid plates 13 are tightly attached to the upper ends of the aluminum plate wafer bodies 12, then the mounting screws 19 are rotated until the mounting screws 19 are connected with the threaded holes formed in the adjusting plates 17 again, and therefore the positions of the adjusting plates 17 are fixed, at the moment, the aluminum plate wafer bodies 12 with different thicknesses can be attached, extruded and fixed, and the situation that the aluminum plate wafer bodies 12 move and deviate in the polishing process is avoided;
the second electric telescopic rod 21 is arranged at the upper end of the second moving plate 20, the second electric telescopic rod 21 is connected with the fixed plate 22, and the fixed plate 22 and the supporting backboard 24 form a rotating mechanism through the fixed rotating shaft 23; the fixed rolling rods 25 are arranged on the support backboard 24 at equal angles, the outer surfaces of the fixed rolling rods 25 are smooth, and the fixed rolling rods 25 are in sliding connection with the fixed plate 22 through grooves formed in the fixed plate 22;
when the edge of the aluminum plate wafer body 12 needs to be polished, the first electric telescopic rod 3 starts to work, the first electric telescopic rod 3 starts to be connected with the first movable plate 4, at the moment, the first movable plate 4 starts to move under the action of the movable sliding block 5 until the polishing wheel 7 is connected with the aluminum plate wafer body 12, then the first motor 6 starts to work, because the output end of the first motor 6 is connected with the polishing wheel 7 through the rotating shaft, the polishing wheel 7 starts to rotate clockwise at the moment, then the second motor 8 starts to work, the second motor 8 drives the rotating shaft 9 to rotate anticlockwise, because the rotating shaft 9 is connected with the first limiting plate 10, at the moment, the first limiting plate 10 starts to rotate anticlockwise, and accordingly the aluminum plate wafer body 12 is driven to rotate anticlockwise, and the edge of the aluminum plate wafer body 12 is polished.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The edge polishing device for producing the aluminum plate wafer comprises a workbench (1), wherein supporting bases (2) are symmetrically arranged at the lower end of the workbench, a plate-shaped structure at the upper end of the workbench (1) is connected with a first electric telescopic rod (3), and the first electric telescopic rod (3) is connected with a first movable plate (4);
characterized by further comprising:
the movable sliding block (5) is arranged at the lower end of the first movable plate (4), and the movable sliding block (5) is in sliding connection with the workbench (1) through a groove formed in the workbench (1);
a first motor (6) provided on the first moving plate (4);
the grinding wheel (7) is connected with the output end of the first motor (6) through a rotating shaft, and the grinding wheel (7) and the first movable plate (4) form a rotating mechanism through the rotating shaft;
the second motor (8) is arranged on the workbench (1), the output end of the second motor (8) is connected with the rotating shaft (9), and the rotating shaft (9) and the workbench (1) form a rotating mechanism through a bearing arranged on the workbench (1);
the lower end of the first limiting plate (10) is connected with the rotating shaft (9), a first antiskid plate (11) is arranged at the upper end of the first limiting plate (10), and the first antiskid plate (11) is made of rubber with a fog surface on the outer surface;
the aluminum plate wafer body (12) is mutually attached to the first antiskid plate (11), and the aluminum plate wafer body (12) is mutually attached to the second antiskid plate (13);
the lower end of the second limiting plate (14) is provided with the second antiskid plate (13), and the upper end of the second limiting plate (14) is connected with the bearing plate (15) mutually;
and the support backboard (24) is arranged at the upper end of the workbench (1), and the support backboard (24) is arranged in an inverted L shape.
2. The edge grinding device for producing aluminum plate wafers according to claim 1, wherein: the control sucking discs (16) are arranged at the lower ends of the bearing plates (15), 2 groups of the control sucking discs (16) are symmetrically arranged, and 3 control sucking discs (16) are arranged in each group.
3. The edge grinding device for producing aluminum plate wafers according to claim 1, wherein: the adjusting plate (17) is symmetrically arranged at the upper end of the bearing plate (15), the adjusting plate (17) and the fixed sleeve (18) form sliding connection, and the fixed sleeve (18) is symmetrically arranged at the lower end of the second moving plate (20).
4. An edge grinding device for producing aluminum plate wafers according to claim 3, wherein: the fixing sleeve (18) is penetrated with a mounting screw (19), and the mounting screw (19) is in threaded connection with the adjusting plate (17) through threaded holes formed in the adjusting plate (17) at equal intervals.
5. An edge grinding device for producing aluminum plate wafers according to claim 3, wherein: the second electric telescopic rod (21) is arranged at the upper end of the second movable plate (20), the second electric telescopic rod (21) is connected with the fixed plate (22), and the fixed plate (22) and the supporting backboard (24) form a rotating mechanism through the fixed rotating shaft (23).
6. The edge grinding device for producing aluminum plate wafers according to claim 5, wherein: the support backboard (24) is provided with fixed rolling rods (25) at equal angles, the outer surfaces of the fixed rolling rods (25) are smooth, and the fixed rolling rods (25) are in sliding connection with the fixed plates (22) through grooves formed in the fixed plates (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223404281.6U CN219131747U (en) | 2022-12-19 | 2022-12-19 | Edge polishing device for aluminum plate wafer production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223404281.6U CN219131747U (en) | 2022-12-19 | 2022-12-19 | Edge polishing device for aluminum plate wafer production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219131747U true CN219131747U (en) | 2023-06-06 |
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ID=86595026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223404281.6U Active CN219131747U (en) | 2022-12-19 | 2022-12-19 | Edge polishing device for aluminum plate wafer production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219131747U (en) |
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2022
- 2022-12-19 CN CN202223404281.6U patent/CN219131747U/en active Active
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