CN219130180U

CN219130180U - Flash removing device for semiconductor package

Info

Publication number: CN219130180U
Application number: CN202223565867.0U
Authority: CN
Inventors: 陈绍勇
Original assignee: Wuxi Xiang Hua Technology Co ltd
Current assignee: Wuxi Xiang Hua Technology Co ltd
Priority date: 2022-12-30
Filing date: 2022-12-30
Publication date: 2023-06-06
Anticipated expiration: 2032-12-30

Abstract

The utility model discloses a semiconductor packaging flash removing device in the technical field of semiconductors, which comprises a collecting barrel, wherein a suction pipe is arranged at the bottom of the collecting barrel, a suction needle is fixedly connected to the bottom of the suction pipe, a positioning sensor is arranged at the bottom of the periphery of the suction pipe, a suction pump is arranged on the side wall of one side of the collecting barrel, the output end of the suction pump is arranged towards one end of the collecting barrel, and the output end of the suction pump is in penetrating and detachable connection with the outer wall of the collecting barrel. The beneficial effects of the utility model are as follows: sucking the material in the flash area through the suction pipe and the suction pipe, so that excessive adhesive is removed when the semiconductor is packaged, and the effect of the semiconductor packaging is ensured; excess adhesive sucked by the suction needle enters the collecting barrel through the suction pipe for retention, so that the waste of the adhesive is reduced, and meanwhile, the adhesive can be prevented from scattering everywhere to cause secondary damage.

Description

Flash removing device for semiconductor package

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a flash removing device for semiconductor packaging.

Background

The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature, and is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device manufactured by adopting a semiconductor, when the semiconductor is put into use, the semiconductor is required to be packaged, when the semiconductor material is packaged, the semiconductor is bonded by adopting adhesive such as glue, and when the semiconductor is packaged, if the adhesive is placed excessively, the semiconductor is overflowed, the peripheral material of the semiconductor is bonded, the subsequent use is influenced, and the sensitivity of semiconductor equipment is reduced.

Disclosure of Invention

The utility model aims to provide a semiconductor packaging flash removing device, which can absorb redundant adhesive and retain the absorbed adhesive when packaging a semiconductor, thereby improving the packaging effect of semiconductor materials, reducing the waste of the adhesive and reducing the production cost, and solving the problems that if the adhesive is placed excessively, the adhesive overflows when packaging the semiconductor, the peripheral materials of the semiconductor are adhered, the subsequent use is influenced and the sensitivity of semiconductor equipment is reduced.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor encapsulation removes flash device, includes the collection storage bucket, the bottom of collection storage bucket is provided with the suction tube, the bottom fixedly connected with suction needle of suction tube, the suction tube is located the peripheral bottom of suction needle and is provided with positioning sensor, the lateral wall of collection storage bucket one side is provided with the suction pump, the output of suction pump sets up towards the one end of collection storage bucket, the output of suction pump runs through with the outer wall of collection storage bucket and can dismantle the connection.

As still further aspects of the utility model: the utility model discloses a material collecting barrel, including material collecting barrel, linear motor, guide rail, electric putter, top end plate, linear motor and guide rail sliding connection, the top of material collecting barrel can be dismantled and be connected with the electric putter, the top of electric putter can be dismantled and be connected with the top end plate, the top of top end plate is fixed with linear motor, linear motor's top is provided with the guide rail, linear motor and guide rail sliding connection.

As still further aspects of the utility model: the top of top end plate one side is fixed with the control box, the signal output part of control box is connected with the control end electricity of suction pump and linear motor respectively.

As still further aspects of the utility model: the top of suction pump can be dismantled and be connected with the spliced pole, the spliced pole top is the crooked structure setting in orientation collection storage bucket one side, one side that the spliced pole kept away from the suction pump can be dismantled with the outer wall of collection storage bucket and be connected.

As still further aspects of the utility model: the top outer wall of the suction pipe is fixedly provided with a connecting flange, and the suction pipe is detachably connected with the collecting barrel through the connecting flange.

As still further aspects of the utility model: the four positioning sensors are symmetrically distributed at the bottom of the suction pipe, and the output ends of the four positioning sensors are arranged towards the bottom direction of the suction needle.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the working area of the suction needle is positioned through the positioning sensor, namely, the overflow position of the adhesive is positioned when the semiconductor is packaged, so that the linear motor and the electric push rod are matched to drive the device to move until the suction pipe aims at the overflow area, the suction pump is started, and the suction pipe and the suction material aiming at the overflow area are used for sucking, so that the excessive adhesive is removed when the semiconductor is packaged, and the effect of the semiconductor packaging is ensured.

2. In the utility model, excessive adhesive sucked by the suction needle enters the collecting barrel through the suction pipe for retention, so that the waste of the adhesive is reduced, and the adhesive can be prevented from scattering everywhere and causing secondary damage.

Drawings

FIG. 1 is a schematic diagram of a front view of the present utility model;

FIG. 2 is an enlarged schematic view of the structure of the collecting barrel in the utility model;

fig. 3 is an enlarged schematic view of the bottom structure of the suction tube of the present utility model;

fig. 4 is an enlarged schematic view of the structure of fig. 3 a according to the present utility model.

In the figure: 1. a collecting barrel; 110. a top end plate; 111. a control box; 112. a linear motor; 113. a guide rail; 120. a suction pump; 121. a connecting column; 130. a suction tube; 131. a suction needle; 132. a connecting flange; 133. positioning a sensor; 140. an electric push rod.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the first embodiment, referring to fig. 1 and 2, when the device is used to remove the adhesive during semiconductor packaging, the guide rail 113 is only required to be installed in the semiconductor packaging equipment, so that the suction needle 131 faces the semiconductor packaging workbench, circuit connection is completed, power is supplied to the equipment, and the device can be put into use after debugging is finished. When the semiconductor is packaged, the situation that the adhesive is excessively used occurs, the excessive adhesive area is monitored through the positioning sensor 133, information is fed back to the control box 111, the linear motor 112 and the electric push rod 140 are started through the control box 111, the suction needle 131 is driven to move towards the adhesive overflow area until the suction needle 131 is opposite to the adhesive overflow area, at the moment, the suction pump 120 is started to cooperate with the suction tube 130 and the suction needle 131 to suck out the overflowed adhesive, the sucked-out adhesive is reserved through the collecting barrel 1, and the suction action of overflowing the adhesive is completed.

Referring to fig. 3, in the present embodiment, the suction tube 130 and the suction needle 131 are hollow, so that the overflowed adhesive is easily removed.

In this embodiment, the control box 111 only has a control effect, and can be completed by adopting a common electrical signal control PCB board in the market, and meanwhile, the positioning sensor 133, the electric push rod 140 and the linear motor 112 in this embodiment are all mature technologies, which will not be described again.

Referring to fig. 1 to 4, in an embodiment of the utility model, a semiconductor package flash removing device includes a collecting barrel 1, a suction tube 130 is disposed at the bottom of the collecting barrel 1, a suction needle 131 is fixedly connected to the bottom of the suction tube 130, a positioning sensor 133 is disposed at the bottom of the suction tube 130, a suction pump 120 is disposed on a side wall of one side of the collecting barrel 1, an output end of the suction pump 120 is disposed towards one end of the collecting barrel 1, and an output end of the suction pump 120 is connected with an outer wall of the collecting barrel 1 in a penetrating and detachable manner.

Specifically, the adhesive overflowed during packaging of the semiconductor is sucked off by the suction pump 120 in cooperation with the suction tube 130 and the suction needle 131, and the sucked-off adhesive is introduced into the aggregate bin 1 for retention

Wherein, the top of collection bucket 1 is dismantled and is connected with electric putter 140, and the top of electric putter 140 is dismantled and is connected with top end plate 110, and the top of top end plate 110 is fixed with linear motor 112, and linear motor 112's top is provided with guide rail 113, linear motor 112 and guide rail 113 sliding connection can drive collection bucket 1 and its external equipment through electric putter 140 cooperation linear motor 112 and move, ensures that suction needle 131 can move to the adhesive and overflows the position.

As still further aspects of the utility model: a control box 111 is fixed on the top of one side of the top end plate 110, and signal output ends of the control box 111 are respectively and electrically connected with control ends of the suction pump 120 and the linear motor 112, and circuit signals are processed through the control box 111, wherein a common circuit control PCB board can be adopted inside the control box 111 to achieve a control effect.

As still further aspects of the utility model: the top of suction pump 120 can be dismantled and be connected with spliced pole 121, and spliced pole 121 top is crooked 90 structure settings towards album storage bucket 1 one side, and one side that suction pump 120 was kept away from to spliced pole 121 can be dismantled with the outer wall of album storage bucket 1 and be connected, increases suction pump 120's joint strength through spliced pole 121, avoids causing the fracture of its output because of the tremble that suction pump 120 work took place.

As still further aspects of the utility model: a connecting flange 132 is fixed on the outer wall of the top end of the suction tube 130, the suction tube 130 is detachably connected with the collecting barrel 1 through the connecting flange 132, and the suction tube 130 and the collecting barrel 1 are connected and limited through the connecting flange 132.

As still further aspects of the utility model: the four positioning sensors 133 are arranged at the bottom of the suction tube 130 in a symmetrical distribution manner, the output ends of the four positioning sensors 133 are arranged towards the bottom direction of the suction needle 131, and the four uniformly distributed positioning sensors 133 are used for positioning the suction needle 131 so as to ensure that the suction needle 131 can be opposite to the adhesive overflowing position.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. The utility model provides a semiconductor encapsulation removes flash device, includes collection bucket (1), its characterized in that: the bottom of gathering barrel (1) is provided with suction tube (130), the bottom fixedly connected with suction needle (131) of suction tube (130), suction tube (130) are located peripheral bottom of suction needle (131) and are provided with positioning sensor (133), the lateral wall of gathering barrel (1) one side is provided with suction pump (120), the output of suction pump (120) sets up towards the one end of gathering barrel (1), the output of suction pump (120) runs through with the outer wall of gathering barrel (1) and can dismantle the connection.

2. The semiconductor package flash removal device of claim 1, wherein: the top of bucket (1) gathers materials is dismantled and is connected with electric putter (140), the top of electric putter (140) is dismantled and is connected with top end plate (110), the top of top end plate (110) is fixed with linear motor (112), the top of linear motor (112) is provided with guide rail (113), linear motor (112) and guide rail (113) sliding connection.

3. A semiconductor package flash removal apparatus as defined in claim 2, wherein: the top of top end board (110) one side is fixed with control box (111), the signal output part of control box (111) is connected with suction pump (120), linear motor (112) and the control end electricity of electric putter (140) respectively.

4. The semiconductor package flash removal device of claim 1, wherein: the top of suction pump (120) can be dismantled and be connected with spliced pole (121), spliced pole (121) top is crooked 90 structure settings towards collection bucket (1) one side, one side that suction pump (120) was kept away from to spliced pole (121) can be dismantled with the outer wall of collection bucket (1).

5. The semiconductor package flash removal device of claim 1, wherein: the top end outer wall of the suction pipe (130) is fixedly provided with a connecting flange (132), and the suction pipe (130) is detachably connected with the collecting barrel (1) through the connecting flange (132).

6. The semiconductor package flash removal device of claim 1, wherein: the four positioning sensors (133) are symmetrically distributed at the bottom of the suction tube (130), and the output ends of the four positioning sensors (133) are arranged towards the bottom direction of the suction needle (131).