CN219117589U - Plating layer structure for nickel plating, wire drawing and trivalent chromium plating of copper alloy piece - Google Patents
Plating layer structure for nickel plating, wire drawing and trivalent chromium plating of copper alloy piece Download PDFInfo
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- CN219117589U CN219117589U CN202221515573.4U CN202221515573U CN219117589U CN 219117589 U CN219117589 U CN 219117589U CN 202221515573 U CN202221515573 U CN 202221515573U CN 219117589 U CN219117589 U CN 219117589U
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Abstract
The utility model discloses a plating structure for plating nickel, drawing and trivalent chromium on a copper alloy part, which comprises a copper alloy substrate, and an acid copper plating layer, a drawing nickel plating layer, a trivalent chromium plating layer and a rare earth electrolytic protection film which are sequentially prepared on the copper alloy substrate from inside to outside. The preparation process is environment-friendly, the nickel-plated, wire-drawn and trivalent chromium-plated coating structure is free of corrosions on the surface of the nickel-plated, wire-drawn, trivalent chromium-plated white chromium-plated coating for 120 hours in a neutral salt spray test, the nickel-plated, wire-drawn, trivalent chromium-plated black chromium-plated coating for 96 hours in a neutral salt spray test, and the prepared coating structure has high corrosion resistance and good appearance.
Description
Technical Field
The utility model belongs to the field of metal electroplating, and particularly relates to a plating structure for plating nickel, wiredrawing and trivalent chromium on a copper alloy piece.
Background
The trivalent chromium plating is used for replacing the hexavalent chromium plating with high toxicity, so that good environmental benefit and social benefit are obtained. The trivalent chromium coating has low corrosion resistance, and the color is easy to darken in natural environment, so how to improve the corrosion resistance is a hot spot of current research in the industry.
The nickel plating wire drawing is a traditional electroplating processing technology, and the nickel plating wire drawing is required to be protected by adopting a coating method under normal conditions because the corrosion resistance of the nickel plating is not high enough and the color of the nickel plating wire drawing is easy to darken in natural environment. However, the prior art uses solvent-based paint for spraying, which is a hazard to the health of operators.
Disclosure of Invention
In order to solve the pollution problem of solvent-based paint and further improve the corrosion resistance and appearance quality of a wire drawing nickel plating layer, the utility model provides a plating layer structure for plating nickel, wire drawing and trivalent chromium on a copper alloy part. In order to achieve the above purpose, the utility model adopts the following technical scheme:
the plating structure comprises a copper alloy substrate, an acid copper plating layer, a wire drawing nickel plating layer, a trivalent chromium plating layer and a rare earth electrolytic protection film, wherein the acid copper plating layer, the wire drawing nickel plating layer, the trivalent chromium plating layer and the rare earth electrolytic protection film are sequentially prepared on the copper alloy substrate from inside to outside;
the trivalent chromium plating layer comprises a trivalent chromium white chromium plating layer and a trivalent chromium black chromium plating layer.
In some of these embodiments, the acid copper plating has a thickness of 6 to 22 μm.
In some embodiments, the thickness of the wiredrawing nickel plating layer is 10-15 μm.
In some of these embodiments, the trivalent chromium plating layer has a thickness ranging from 0.05 to 0.25 μm.
The trivalent chromium plating layer has a thinner thickness, and still has the appearance of the wire drawing plating layer after the wire drawing plating layer is plated with trivalent chromium, but the appearance of the wire drawing plating layer is more beautiful than that of the wire drawing plating layer after the wire drawing plating layer is plated with trivalent chromium. The rare earth electrolytic protection technology is adopted to prepare the protective film on the trivalent chromium plating layer, so that the corrosion resistance and the anti-discoloration capability of the plating layer can be effectively improved.
Compared with the prior art, the utility model has the following beneficial effects:
1. the plating structure for plating nickel, drawing and trivalent chromium on the copper alloy part disclosed by the utility model adopts trivalent chromium plating to replace the traditional spraying process, so that the pollution problem caused by an organic solvent is eliminated;
2. the trivalent chromium plating layer is used for replacing the traditional coating protective layer, so that the appearance quality of the wire drawing nickel plating layer is obviously improved;
3. rare earth electrolytic protection is implemented on the trivalent chromium plating layer, so that the corrosion resistance and the anti-discoloration capability of the plating layer can be effectively improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this application, illustrate and do not limit the utility model, and together with the description serve to explain the principle of the utility model:
fig. 1 is a schematic diagram of the plating structure of examples 1 and 2 of the present utility model.
Detailed Description
The present utility model will now be described in detail with reference to the drawings and the specific embodiments thereof, wherein the exemplary embodiments and descriptions of the present utility model are provided for illustration of the utility model and are not intended to be limiting.
The plating structure comprises a copper alloy substrate, an acid copper plating layer, a wire drawing nickel plating layer, a trivalent chromium plating layer and a rare earth electrolytic protection film, wherein the acid copper plating layer, the wire drawing nickel plating layer, the trivalent chromium plating layer and the rare earth electrolytic protection film are sequentially prepared on the copper alloy substrate from inside to outside; the trivalent chromium plating layer comprises a trivalent chromium white chromium plating layer and a trivalent chromium black chromium plating layer.
The copper alloy piece is subjected to rust removal, oil removal and activation by adopting the existing pretreatment process.
The thickness of the acid copper plating layer is 6-22 mu m after the pretreatment of the workpiece, and the acid copper plating layer is prepared by adopting the current acid copper plating technology.
The work piece is plated with bright nickel after acid copper plating, the thickness of the bright nickel plating layer is 10-15 mu m, and the work piece is prepared by adopting the current bright nickel plating technology.
And (5) drawing after plating the workpiece with bright nickel, and drawing by using a traditional felt wheel drawing machine.
After the nickel plating layer of the workpiece is drawn, the existing pretreatment process is adopted to carry out oil removal and acid washing activation.
And preparing a trivalent chromium white chromium plating layer on the pretreated wiredrawing nickel plating layer by adopting the existing trivalent chromium white chromium plating process, wherein the thickness of the trivalent chromium white chromium plating layer is 0.05-0.25 mu m.
Preferably, the trivalent chromium white chromium plating process adopts a Trich-9551 sulfate trivalent chromium plating process of super-nation chemical industry: trich-9551M cylinder-opening salt 8-12 mL/L, trich-9551B supplement 260-300 mL/L, trich-9551 CS conductive salt 260-300 g/L, wherein the mass concentration of trivalent chromium is 12-18 g/L, the mass concentration of boric acid is 65-75 g/L, the pH range is 3.4-3.8, the operating temperature is 50-55 ℃, the cathode current density is 8-15A/dm 2, and the electroplating time is 1-5 min by slight air stirring or cathode movement.
And preparing a trivalent chromium black chromium plating layer on the pretreated wiredrawing nickel plating layer by adopting the current trivalent chromium black chromium plating process, wherein the thickness of the trivalent chromium black chromium plating layer is 0.05-0.25 mu m.
Preferably, the trivalent chromium black plating process is prepared by adopting a Trich-7677 sulfate trivalent black plating process developed by the super-nation chemical industry: trich-7677S initiator 8-12 mL/L, trich-7677M cylinder opener 260-300 mL/L, trich-7677 CS conductive salt 260-300 g/L, trich-7677C stabilizer 3-4 mL/L, trich-7677D toner 1-4 mL/L, wherein the mass concentration of trivalent chromium is 12-18 g/L, the mass concentration of boric acid is 60-70 g/L, the pH range is 3.3-3.7, the operating temperature is 25-40 ℃, the cathode current density is 8-14A/dm 2, the cathode moves for 2-3 m/min, or the electroplating time is 2-8 min by slight air stirring.
And (3) performing rare earth electrolytic protection after trivalent chromium plating on the workpiece to prepare the rare earth electrolytic protection film.
Preferably, the rare earth electrolytic protection film is prepared by adopting a rare earth electrolytic protection process developed by super-nation chemical industry: lanthanum acetate 1-10 g/L, HEDP complexing agent 5-50 g/L, anhydrous sodium carbonate 80-150 g/L, pH range 11.5-12.5 (pH is regulated by sodium hydroxide solution), cathode current density 0.5-1.5A/dm 2, room temperature operation, using trivalent chromium plating pearl chromium workpiece as cathode, using stainless steel plate as anode, and electrolysis for 10-30 s.
Example 1:
as shown in fig. 1, the plating structure of the nickel plating, wire drawing and trivalent chromium plating of the copper alloy part comprises a copper alloy substrate 1, an acid copper plating layer 2, a wire drawing nickel plating layer 3, a trivalent chromium white chromium plating layer 4 and a rare earth electrolytic protection film 5 which are sequentially prepared on the copper alloy substrate 1 from inside to outside.
The copper alloy piece is derusted, deoiled and activated by adopting the existing pretreatment process.
The thickness of the acid copper plating layer is 12 mu m after the pretreatment of the workpiece, and the acid copper plating layer is prepared by adopting the current acid copper plating technology.
The work piece is plated with bright nickel after bright copper plating, the thickness of the bright nickel plating layer is 12 mu m, and the work piece is prepared by adopting the current bright nickel plating technology.
And (5) drawing after plating the workpiece with bright nickel, and drawing by using a traditional felt wheel drawing machine.
After the nickel plating layer of the workpiece is drawn, the existing pretreatment process is adopted to carry out oil removal and acid washing activation.
And preparing a trivalent chromium white chromium coating on the pretreated wiredrawing nickel-plated layer by adopting a Trich-9551 sulfate trivalent chromium chromeplating process in the super-bonding chemical industry, wherein the thickness of the coating is 0.1 mu m.
Trich-9551M, 10mL/L of open-jar salt, 280mL/L of Trich-9551B supplement, 290g/L of Trich-9551 CS conductive salt, 15g/L of trivalent chromium, 70g/L of boric acid, pH=3.6, operating temperature of 52 ℃, cathode current density of 10A/dm2, slight air stirring, and electroplating time of 2min.
And preparing the rare earth electrolytic protection film by adopting a rare earth electrolytic protection process developed by the super-nation chemical industry after plating white chromium on trivalent chromium on the workpiece.
Lanthanum acetate 5g/L, HEDP complexing agent 25g/L, anhydrous sodium carbonate 100g/L, pH=12 (pH adjusted with sodium hydroxide solution), cathodic current density 0.8A/dm2, room temperature operation, trivalent chromium chromeplate work piece as cathode, stainless steel plate as anode, electrolysis for 20s.
The embodiment is divided into the following steps in specific operation:
1. pretreatment: the copper alloy workpiece 1 is subjected to the steps of chemical degreasing, pickling and rust removal, washing, ultrasonic degreasing, washing, pickling and activating and washing.
2. Copper plating: an acid copper plating layer 2 is prepared on the copper alloy piece after the pretreatment.
3. Plating bright nickel: a bright nickel plating layer is prepared on the acid copper plating layer 2.
4. And (3) wiredrawing: and drawing the wire on the bright nickel plating layer by using a felt wheel machine to prepare a wire drawing nickel plating layer 3.
5. Deoiling and activating: the wire drawing nickel plating layer 3 is subjected to the steps of alkaline cathode electrolysis degreasing, water washing, alkaline anode electrolysis degreasing, water washing, acid washing activation and water washing.
6. Trivalent chromium plating white chromium: and preparing a trivalent chromium white chromium coating 4 on the wiredrawing nickel plating layer 3 after degreasing and pickling activation.
5. Electrolytic protection: preparing a rare earth electrolytic protective film 5 on the trivalent chromium white chromium coating 4, washing with water and drying.
Example 2:
as shown in fig. 1, the plating structure of the nickel plating, wire drawing and trivalent chromium plating of the copper alloy part comprises a copper alloy substrate 1, an acid copper plating layer 2, a wire drawing nickel plating layer 3, a trivalent chromium black chromium plating layer 4 and a rare earth electrolytic protection film 5 which are sequentially prepared on the copper alloy substrate 1 from inside to outside.
The copper alloy piece is derusted, deoiled and activated by adopting the existing pretreatment process.
The thickness of the acid copper plating layer is 8 mu m after the pretreatment of the workpiece, and the acid copper plating layer is prepared by adopting the current acid copper plating technology.
The work piece is plated with bright nickel after bright copper plating, the thickness of the bright nickel plating layer is 15 mu m, and the work piece is prepared by adopting the current bright nickel plating technology.
And (5) drawing after plating the workpiece with bright nickel, and drawing by using a traditional felt wheel drawing machine.
After the nickel plating layer of the workpiece is drawn, the existing pretreatment process is adopted to carry out oil removal and acid washing activation.
And preparing a trivalent chromium black chromium plating layer on the pretreated wiredrawing nickel plating layer by adopting a Trich-7677 sulfate trivalent chromium electroplating process developed by the ultra-high chemical industry, wherein the thickness of the trivalent chromium black chromium plating layer is 0.1 mu m.
10mL/L of Trich-7677S initiator, 280mL/L of Trich-7677M cylinder opener, 280g/L of Trich-7677 CS conductive salt, 3.5mL/L of Trich-7677C stabilizer, 2.5mL/L of Trich-7677D toner, wherein the mass concentration of trivalent chromium is 15g/L, the mass concentration of boric acid is 65g/L, the pH=3.4, the operating temperature is 35 ℃, the cathode current density is 10A/dm2, the air stirring is slight, and the electroplating time is 3min.
And preparing the rare earth electrolytic protection film by adopting a rare earth electrolytic protection process developed by the super-nation chemical industry after the trivalent chromium of the workpiece is plated with black chromium.
Lanthanum acetate 7g/L, HEDP complexing agent 35g/L, anhydrous sodium carbonate 100g/L, pH=12 (pH adjusted by sodium hydroxide solution), cathodic current density 0.8A/dm2, room temperature operation, trivalent chromium black chromium plating work piece as cathode, stainless steel plate as anode, electrolysis for 20s.
The embodiment is divided into the following steps in specific operation:
1. pretreatment: the copper alloy workpiece 1 is subjected to the steps of chemical degreasing, pickling and rust removal, washing, ultrasonic degreasing, washing, pickling and activating and washing.
2. Copper plating: an acid copper plating layer 2 is prepared on the copper alloy piece after the pretreatment.
3. Plating bright nickel: a bright nickel plating layer is prepared on the acid copper plating layer 2.
4. And (3) wiredrawing: and drawing the wire on the bright nickel plating layer by using a felt wheel machine to prepare a wire drawing nickel plating layer 3.
5. Deoiling and activating: the wire drawing nickel plating layer 3 is subjected to the steps of alkaline cathode electrolysis degreasing, water washing, alkaline anode electrolysis degreasing, water washing, acid washing activation and water washing.
6. Trivalent chromium plating: and preparing a trivalent chromium black chromium plating layer 4 on the wiredrawing nickel plating layer 3 after degreasing and pickling activation.
5. Electrolytic protection: and preparing a rare earth electrolytic protective film 5 on the trivalent chromium black chromium coating 4, washing with water and drying.
Test example 1:
the nickel-plated, wiredrawing, white-chromium-plated piece prepared in the embodiment 1 is subjected to a neutral salt spray test for 120 hours according to GB/T10125-2012 salt spray test for artificial atmosphere corrosion test, and no corrosive substances are generated on the surface of the plated piece.
Test example 2:
the nickel-plated, wiredrawn, black-plated and chrome-plated piece prepared in the embodiment 2 is subjected to a neutral salt spray test for 96 hours according to GB/T10125-2012 salt spray test for artificial atmosphere corrosion test, and no corrosive substances are generated on the surface of the plated piece.
The foregoing has outlined the detailed description of the embodiments of the present utility model, and the detailed description of the embodiments and the embodiments of the present utility model has been provided herein by way of illustration of specific examples, which are intended to be merely illustrative of the principles of the embodiments of the present utility model. Variations in detailed description and scope of the embodiments will occur to those skilled in the art upon consideration of the teachings of the present utility model. In view of the foregoing, this description should not be construed as limiting the utility model.
Claims (4)
1. A plating layer structure for plating nickel, wire drawing and trivalent chromium on a copper alloy piece is characterized in that: the copper alloy plating film comprises a copper alloy substrate, and an acid copper plating layer, a wire drawing nickel plating layer, a trivalent chromium plating layer and a rare earth electrolytic protection film which are sequentially prepared on the copper alloy substrate from inside to outside, wherein the trivalent chromium plating layer comprises a trivalent chromium white chromium plating layer and a trivalent chromium black chromium plating layer.
2. The plating structure for plating nickel, drawing and trivalent chromium on a copper alloy piece according to claim 1, wherein: the thickness of the acid copper plating layer is 6-22 mu m.
3. The plating structure for plating nickel, drawing and trivalent chromium on a copper alloy piece according to claim 1, wherein: the thickness of the wiredrawing nickel plating layer is 10-15 mu m.
4. The plating structure for plating nickel, drawing and trivalent chromium on a copper alloy piece according to claim 1, wherein: the thickness of the trivalent chromium plating layer is 0.05-0.25 mu m.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221515573.4U CN219117589U (en) | 2022-06-17 | 2022-06-17 | Plating layer structure for nickel plating, wire drawing and trivalent chromium plating of copper alloy piece |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221515573.4U CN219117589U (en) | 2022-06-17 | 2022-06-17 | Plating layer structure for nickel plating, wire drawing and trivalent chromium plating of copper alloy piece |
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| CN219117589U true CN219117589U (en) | 2023-06-02 |
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| CN202221515573.4U Active CN219117589U (en) | 2022-06-17 | 2022-06-17 | Plating layer structure for nickel plating, wire drawing and trivalent chromium plating of copper alloy piece |
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