CN219114549U - Resin matrix composite reaction process temperature monitoring device - Google Patents

Abstract

The utility model relates to a temperature monitoring device for a resin matrix composite material reaction process. This resin matrix combined material reaction process temperature monitoring device includes sealed monitoring case, be equipped with the mould in the monitoring case, slidable mounting has the slider in the monitoring case, can dismantle the installed part that is used for installing the monitoring first temperature sensor of temperature in the mould on the slider, be equipped with the second temperature sensor that is used for monitoring incasement temperature in the monitoring case, the bottom of monitoring case is equipped with temperature regulator, and temperature regulator includes semiconductor refrigeration piece and actuating assembly, be equipped with on the monitoring case and be used for semiconductor refrigeration piece orientation to the radiating radiator of hot junction when monitoring incasement one end is the cold junction, be equipped with temperature controller on the monitoring case, temperature controller with second temperature sensor, temperature regulator and radiator electricity are connected. The utility model reduces the research cost of the curing effect of the temperature on the carbon nano tube/epoxy resin composite material.

Description

A temperature monitoring device for the reaction process of resin-based composite materials

technical field

The utility model belongs to the technical field of production equipment for resin-based composite materials, in particular to a temperature monitoring device for the reaction process of resin-based composite materials.

Background technique

With the development of nanotechnology, the emergence of nanomaterials such as carbon nanotubes (CNTs), makes insulating composite materials can become electrical conductors. Pipeline smart composites are formed by mixing carbon nanotubes (CNTs) with epoxy resins commonly used in trenchless pipeline restoration. The composite material has stronger electrical properties, not only can better repair the damage in the pipeline, but also can use the change of the electrical signal of the composite material in the pipeline to monitor the real-time force status of the pipeline. Since the curing degree of the composite material has a great influence on its service state in the pipeline, it is necessary to study the effect of temperature on the curing effect of the carbon nanotube/epoxy resin composite material.

At present, the equipment used to study the effect of temperature on the curing of carbon nanotube/epoxy resin composites is a differential scanning calorimeter. However, the cost of using the differential scanning calorimeter is relatively high, and most of the functions of the differential scanning calorimeter were not used in the study of the effect of temperature on the curing of carbon nanotubes/epoxy resin composites, resulting in a waste of resources. Therefore, it is necessary to develop a temperature monitoring device for the reaction process of the resin-based composite material that is specially used to study the effect of temperature on the curing of the carbon nanotube/epoxy resin composite material.

Utility model content

In order to achieve the above purpose, the utility model provides a temperature monitoring device for the reaction process of resin-based composite materials.

The technical scheme of the temperature monitoring device for the reaction process of a resin-based composite material of the present utility model is:

A temperature monitoring device for the reaction process of resin-based composite materials, including a sealed monitoring box, a mold for placing resin-based composite materials is arranged in the monitoring box, a slider is slidably installed in the monitoring box, and a slider is mounted on the slider A mounting piece for installing a first temperature sensor for monitoring the temperature in the mold is detachably connected, a second temperature sensor for monitoring the temperature in the monitoring box is provided in the monitoring box, and the bottom of the monitoring box is provided with an adjustment device. A temperature regulator for monitoring the temperature in the box. The temperature regulator includes a semiconductor cooling chip and a drive assembly for switching the hot and cold ends of the semiconductor cooling chip. A heat sink that dissipates heat from the hot end when the inner end is the cold end.

As a further improvement to the above technical solution, the monitoring box includes a box body and a base, the box body is in a rectangular structure, the upper side, the lower side and the front side of the box are respectively provided with an upper opening, a lower opening and front side opening, the rear side of the box body is inserted with an upper drawing door for blocking the upper side opening, and the left side of the box body is inserted with a door for blocking the front side opening For the front drawing door, the base is provided with an installation groove communicating with the lower opening, and the semiconductor cooling chip is installed in the installation groove.

As a further improvement to the above technical solution, the box body includes a square frame, a U-shaped frame, a connecting plate and a sealing plate, the horizontal part of the U-shaped frame is located at the front end, and the two vertical parts of the U-shaped frame Located at the left and right ends, the connecting plate is fixedly connected between the square frame and the right front corner of the U-shaped frame. There are three sealing plates, and the three sealing plates are respectively connected to the square frame and the U-shaped frame. Between the left, right and rear ends of the U-shaped frame.

As a further improvement to the above technical solution, the two vertical parts and the horizontal part of the U-shaped frame are F-shaped, and the horizontal sections of the two vertical parts of the U-shaped frame are provided with a first A slot, the vertical section of the horizontal portion of the U-shaped frame is provided with a second slot extending left and right, and the horizontal section of the vertical portion of the U-shaped frame is provided with a third slot extending in the left-right direction. Slots, the two first slots and the third slots form an upper drawing slot matching the upper drawing door, and the upper side of the zigzag frame is provided with a zigzag slot, so The second slot and the zigzag slot form a front drawing slot matched with the front drawing door, the lower ends of the three sealing plates are respectively inserted in the zigzag slots, and the three The upper ends of the sealing plates are respectively fixedly connected to the inner sides of the vertical sections of the vertical parts of the U-shaped frame.

As a further improvement to the above technical solution, the upper sliding door includes an upper door body and an upper door panel fixedly connected to the rear end of the upper door body, the upper door body is T-shaped, and the horizontal part of the upper door body is in contact with the upper door body. The drawing groove is matched, and the front drawing door includes a front door body and a front door panel fixedly connected to the left end of the front door body. The front door body is T-shaped, and the horizontal part of the front door body is connected match.

As a further improvement to the above technical solution, the left and right ends of the front side of the upper door panel are respectively provided with first upper electromagnetic sheets, and the front sealing plate is provided with two first upper electromagnetic sheets respectively matched with the two first upper electromagnetic sheets. Two upper electromagnetic sheets; the upper and lower ends of the right side of the front door panel are respectively provided with a first front electromagnetic sheet, and the left end of the sealing plate is provided with two respectively matched with the two first front electromagnetic sheets Second front electromagnetic sheet.

As a further improvement to the above technical solution, a connecting plate is fixedly connected between the inner surfaces of the sealing plates at the left and right ends, and a capsule-shaped chute is provided on the connecting plate, and the upper sides of the chute are respectively provided with The guide groove, the slider is capsule-shaped, the upper and lower sides of the slider are respectively provided with guide blocks matching the guide groove, and the front side of the slider is provided with two fixed rods arranged in parallel and spaced up and down , the mounting part includes two mounting plates, the mounting plate is provided with a long hole for placing the first temperature sensor, and one end of the two mounting plates is fixed between the two fixing rods by bolts .

As a further improvement to the above technical solution, the front side of the base is provided with a slot for installing the temperature regulator, the rear side of the base is provided with a communication hole communicating with the installation slot, and the radiator Installed in the communication hole, a support edge is provided on the inner wall of the upper end of the installation groove of the base, and a heat conduction net is provided on the support edge, and the heat conduction net includes a fixed frame that matches the support edge and is connected to The mesh body in the fixed frame.

As a further improvement to the above technical solution, the heat sink includes heat dissipation fins, a fixing plate and a heat dissipation fan, the heat dissipation fins are installed in the communicating holes, and the fixing plate fixes the heat dissipation fins on the In the communication hole, the cooling fan is installed on the fixing plate.

The utility model provides a temperature monitoring device for the reaction process of a resin-based composite material. Compared with the prior art, the utility model has the following beneficial effects:

When the resin-based composite material reaction process temperature monitoring device of the utility model is used, the driving component drives the semiconductor refrigeration chip to work, and the second temperature sensor monitors the temperature change in the monitoring box in real time. The temperature controller controls the driving components and the power of the radiator according to the real-time temperature of the second temperature sensor, and then controls the working state of the semiconductor refrigeration chip, so as to achieve the purpose of controlling the initial temperature of resin curing. Taking the measurement of the curing temperature of the resin at the initial temperature of 25 degrees Celsius in summer as an example, the second temperature sensor monitors the temperature change in the monitoring box in real time, and transmits the data back to the temperature controller to set the initial temperature, and the drive component adjusts the temperature of the semiconductor refrigeration sheet. At the hot and cold ends, the semiconductor refrigeration sheet starts to cool, and the radiator starts to cool down the hot end of the semiconductor refrigeration sheet to improve the cooling effect of the semiconductor refrigeration sheet and reduce its workload. When the set temperature is reached, the mold with solidified material is placed on the heat conducting online. At this time, close the upper drawing door and the front drawing door, the first upper electromagnetic sheet and the second upper electromagnetic sheet, the first front electromagnetic sheet and the second front electromagnetic sheet are energized, and the upper drawing door and the front drawing door are connected with each other. The monitoring box is fixed.

Since the first temperature sensor and the mold have a certain height, and because the first sensor is placed on the mounting plate, it is not conducive to placing a single door. A sliding door facilitates easy placement of the mold and first temperature sensor.

The upper drawing door and the front drawing door of the temperature monitoring device for the reaction process of resin-based composite materials of the utility model adopt electromagnetic sheet magnetic suction to open the door. Tightly closed, the setting of the electromagnetic sheet is not only convenient and economical, but also conducive to the airtightness of the monitoring box.

In the temperature monitoring device for the reaction process of the resin-based composite material of the utility model, a plurality of first temperature sensors are placed on the mounting plate of the sliding component through the long holes, and multiple temperature data can be measured in each set of molds to form a comparison and improve the temperature measurement. the accuracy rate. Since the first temperature sensor is slidable, it can adapt to the shapes of different molds, and a plurality of first temperature sensors can be arranged to realize batch measurement of curing temperature under different mass fractions of materials.

The temperature monitoring device of the resin-based composite material reaction process of the utility model uses a semiconductor refrigeration chip to regulate temperature. The semiconductor refrigeration chip is driven by a driving component to form a hot end and a cold end, and the positions of the cold and hot ends can be changed by changing the direction of the current. According to the set temperature, the temperature controller controls the drive assembly to adjust the position of the cold and hot ends of the semiconductor refrigeration sheet, so that the required end faces the inside of the monitoring box, which is conducive to temperature conduction. In addition, the semiconductor cooling chip is small in size, and it has the cooling function compared with the traditional heating resistor, so there is no need to set up another cooling system.

The temperature monitoring device of the resin-based composite material reaction process of the utility model uses a radiator composed of a heat dissipation fin and a heat dissipation fan to dissipate heat. Since the semiconductor refrigeration sheet itself generates heat when it works, which affects the cooling effect, the heat at the hot end is transferred through the radiator. , to reduce the temperature difference, so that the cold end absorbs more heat from the measurement chamber, thereby enhancing the cooling effect and reaching the set temperature.

Description of drawings

Fig. 1 is the structure schematic diagram one of the temperature monitoring device of the resin-based composite material reaction process of the present utility model;

Fig. 2 is the structure schematic diagram II of the temperature monitoring device of the resin-based composite material reaction process of the present invention;

Fig. 3 is the structural representation of the temperature monitoring device of the resin-based composite material reaction process (excluding the upper drawing door and the front drawing door) of the utility model;

Fig. 4 is a partial structural diagram of the cabinet in the resin-based composite material reaction process temperature monitoring device of the present invention;

Fig. 5 is a structural schematic diagram 1 of the box body (excluding the sealing plate) in the resin-based composite material reaction process temperature monitoring device of the present utility model;

Fig. 6 is the structure schematic diagram II of the casing (excluding the sealing plate) in the temperature monitoring device of the resin-based composite material reaction process of the present invention;

Fig. 7 is a structural schematic diagram of a base in a temperature monitoring device for a resin-based composite material reaction process of the present invention;

Fig. 8 is a structural schematic diagram of the base (excluding the heat conduction net) in the temperature monitoring device of the resin-based composite material reaction process of the present invention;

Fig. 9 is a structural schematic diagram of the radiator in the temperature monitoring device of the resin-based composite material reaction process of the present invention;

In the figure: 1. Box body; 2. Base; 3. Upper sliding door; 4. Front sliding door; 5. Radiator; 6. Heat conduction net; 7. Temperature regulator; 8. U-shaped frame; 9. 10, connecting plate; 11, sealing plate; 12, the first slot; 13, the second slot; 14, the third slot; 15, back-shaped slot; 16, the first front electromagnetic sheet; 17. The second front electromagnetic sheet; 18. The first upper electromagnetic sheet; 19. The second upper electromagnetic sheet; 20. Connecting plate; 21. Chute; 22. Slider; 23. Guide slot; 24. Fixed rod; 25 , mounting plate; 26, long hole; 27, first temperature sensor; 28, second temperature sensor; 29, mould; 30, installation groove; 31, support edge; 32, semiconductor refrigeration sheet; 33, fixed plate; 34, Radiating fan; 35, cooling fins.

Detailed ways

Below in conjunction with accompanying drawing and specific embodiment the utility model is described in further detail:

The specific embodiment of the temperature monitoring device for the reaction process of resin-based composite materials of the present utility model, as shown in Figures 1 to 9, includes a sealed monitoring box, which is provided with a mold 29 for placing resin-based composite materials, and the monitoring box A slide block 22 is installed in the slide, and the slide block 22 is detachably connected with a mounting part for installing a first temperature sensor 27 for monitoring the temperature in the mold 29. The monitoring box is provided with a second temperature sensor 28 for monitoring the temperature in the box. The bottom of the monitoring box is provided with a temperature regulator for adjusting the temperature in the monitoring box. The temperature regulator includes a semiconductor cooling chip 32 and a drive assembly for switching the cold and hot ends of the semiconductor cooling chip 32. One end inside the monitoring box is a radiator 5 that dissipates heat to the hot end when the cold end is used. The monitoring box is provided with a temperature controller, and the temperature controller is electrically connected with the second temperature sensor 28, the temperature regulator and the radiator 5.

In this embodiment, the monitoring box includes a box body 1 and a base 2. The box body 1 has a rectangular structure. The upper side, the lower side, and the front side of the box body 1 are respectively provided with an upper side opening, a lower side opening, and a front side opening. The rear side of the box body 1 is equipped with an upper drawing door 3 for blocking the upper opening, and the left side of the box body 1 is equipped with a front drawing door 4 for blocking the front opening. The base 2 is provided with a The lower side opening communicates with the installation groove 30 , and the semiconductor cooling chip 32 is installed in the installation groove 30 . The box body 1 comprises a square frame 9, a U-shaped frame 8, a connecting plate 2010 and a sealing plate 11, the horizontal part of the U-shaped frame 8 is located at the front end, and the two vertical parts of the U-shaped frame 8 are located at the left and right ends, and the connecting plate 2010 Fixedly connected between the square frame 9 and the right front corner of the U-shaped frame 8, there are three sealing plates 11, and the three sealing plates 11 are respectively connected between the left end, the right end and the rear end of the square frame 9 and the U-shaped frame 8 between.

In this embodiment, the two vertical parts and the horizontal parts of the U-shaped frame 8 are F-shaped, and the horizontal sections of the two vertical parts of the U-shaped frame 8 are provided with first slots 12 extending forward and backward. The vertical section of the horizontal portion of the U-shaped frame 8 is provided with a second slot 13 extending left and right, and the horizontal section of the vertical portion of the U-shaped frame 8 is provided with a third slot 14 extending in the left-right direction. The first slot 12 and the third slot 14 form an upper drawing groove matched with the upper drawing door 3. The upper side of the square frame 9 is provided with a back-shaped slot 15, and the second slot 13 is connected with the back-shaped plug. The slot 15 forms a front drawing slot matched with the front drawing door 4, the lower ends of the three sealing plates 11 are respectively inserted in the back-shaped slots 15, and the upper ends of the three sealing plates 11 are fixedly connected to the U-shaped frame 8 respectively. On the inner side of the vertical section of the vertical section. The upper drawing door 3 includes an upper door body and an upper door panel fixedly connected to the rear end of the upper door body. The upper door body is T-shaped, and the horizontal part of the upper door body matches the upper drawing groove. The front door panel at the left end of the front door body is T-shaped, and the horizontal part of the front door body matches the front drawing groove.

In this embodiment, the left and right ends of the front side of the upper door panel are respectively provided with a first upper electromagnetic sheet 18, and the front end sealing plate 11 is provided with two second upper electromagnetic sheets 18 matched with the two first upper electromagnetic sheets 18 respectively. Sheet 19; the upper and lower ends of the right side of the front door panel are respectively provided with a first front electromagnetic sheet 16, and the sealing plate 11 at the left end is provided with two second front electromagnetic sheets that match the two first front electromagnetic sheets 16 respectively 17. A connecting plate 2010 is fixedly connected between the inner surfaces of the sealing plates 11 at the left and right ends. The connecting plate 2010 is provided with a capsule-shaped chute 21. The upper sides of the chute 21 are respectively provided with guide grooves 23. The slider 22 is capsule-shaped. , the upper and lower sides of the slider 22 are respectively provided with guide blocks that match the guide groove 23, and the front side of the slider 22 is provided with two fixed rods 24 arranged in parallel and spaced up and down. The mounting parts include two mounting plates 25, the mounting plate 25 is provided with a long hole 26 for placing the first temperature sensor 27, and one end of the two mounting plates 25 is fixed between the two fixing rods 24 by bolts. The front side of the base 2 is provided with an embedded groove for installing a temperature regulator, the rear side of the base 2 is provided with a communication hole communicating with the installation groove 30, the radiator 5 is installed in the communication hole, and the installation groove 30 upper end inner wall of the base 2 A support edge 31 is provided, and a heat conduction net 6 is arranged on the support edge 31. The heat conduction net 6 includes a fixed frame matched with the support edge 31 and a mesh body connected in the fixed frame. The radiator 5 includes cooling fins 35 , a fixing plate 33 and a cooling fan 34 , the cooling fins 35 are installed in the communicating holes, the fixing plate 33 fixes the cooling fins 35 in the communicating holes, and the cooling fans 34 are installed on the fixing plates 33 .

When the resin-based composite material reaction process temperature monitoring device of the utility model is used, the driving component drives the semiconductor refrigeration chip 32 to work, and the second temperature sensor 28 monitors the temperature change in the monitoring box in real time. The temperature controller controls the power of the drive assembly and the radiator 5 according to the real-time temperature of the second temperature sensor 28, and then controls the working state of the semiconductor cooling chip 32 to achieve the purpose of controlling the initial temperature of resin curing. Taking the measurement of the curing temperature of the resin under the initial temperature of 25 degrees Celsius simulated in summer as an example, the second temperature sensor 28 monitors the temperature change in the monitoring box in real time, and sends back the data to the temperature controller to set the initial temperature, and the driving component adjusts the semiconductor refrigeration chip 32 cold and hot end, semiconductor refrigeration sheet 32 starts refrigeration, and radiator 5 starts, and semiconductor refrigeration sheet 32 hot ends are cooled down, improves semiconductor refrigeration sheet 32 refrigeration effects, alleviates its work burden, reaches set temperature, will be equipped with and solidify. A mold 29 of material is placed on the heat conducting mesh 6 . Now, close the upper drawing door 3 and the front drawing door 4, the first upper electromagnetic sheet 18 and the second upper electromagnetic sheet 19, the first front electromagnetic sheet 16 and the second front electromagnetic sheet 17 are energized to realize the upper drawing door 3 and the front sliding door 4 are fixed with the monitoring box.

Because the first temperature sensor 27 and the mold 29 have a certain height, and because the first sensor is placed on the mounting plate 25, it is not conducive to placing a single door. The temperature monitoring device for the reaction process of resin-based composite materials of the utility model is provided with an upper drawer door. 3 and the front drawing door 4 help to place the mold 29 and the first temperature sensor 27 conveniently.

The upper drawing door 3 and the front drawing door 4 of the temperature monitoring device for the reaction process of resin-based composite materials of the utility model adopt electromagnetic sheet magnetic suction to open the door. The sliding door is tightly closed, and the setting of the electromagnetic sheet is not only convenient and economical, but also conducive to the airtightness of the monitoring box.

A plurality of first temperature sensors 27 are placed on the mounting plate 25 of the sliding assembly in the temperature monitoring device for the reaction process of the resin-based composite material of the present invention through the long holes 26, and a plurality of temperature data can be measured in each set of molds 29 for comparison. Improve the accuracy of temperature measurement. Since the first temperature sensor 27 is slidable, it can adapt to the shapes of different molds 29, and a plurality of first temperature sensors 27 can be arranged to realize batch measurement of curing temperature under different mass fractions of materials.

The temperature monitoring device of the resin-based composite material reaction process of the utility model uses a semiconductor refrigeration chip 32 to adjust the temperature. The semiconductor refrigeration chip 32 forms a hot end and a cold end under the drive of the driving component, and the cold and hot ends can be changed by changing the direction of the current. Location. According to the set temperature, the temperature controller controls the drive assembly to adjust the positions of the cold and hot ends of the semiconductor refrigeration sheet 32, so that the required end faces the inside of the monitoring box, which is beneficial to temperature conduction. In addition, the semiconductor cooling chip 32 is small in size, and has a cooling function compared with a traditional heating resistor, and no additional cooling system is required.

The temperature monitoring device for the reaction process of resin-based composite materials of the present utility model uses the heat sink 5 composed of heat dissipation fins 35 and heat dissipation fans 34 to dissipate heat. Because the semiconductor refrigeration sheet 32 itself will generate heat when it works, which affects the cooling effect. 5 Transfer the heat from the hot end, reduce the temperature difference, and make the cold end absorb more heat from the measurement chamber, thereby strengthening the cooling effect and reaching the set temperature.

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present utility model shall be included in this utility model. within the scope of protection of utility models.

Claims (9)

1. The utility model provides a resin matrix composite reaction process temperature monitoring device, its characterized in that, includes sealed monitoring case, be equipped with the mould that is used for placing resin matrix composite in the monitoring case, slidable mounting has the slider in the monitoring case, detachable the connection has the installed part that is used for installing the monitoring the first temperature sensor of temperature in the mould on the slider, be equipped with the second temperature sensor who is used for monitoring incasement temperature in the monitoring case, the bottom of monitoring case is equipped with the regulation temperature regulator of monitoring incasement temperature, temperature regulator includes the semiconductor refrigeration piece and is used for switching the drive assembly of the cold and hot end of semiconductor refrigeration piece, be equipped with on the monitoring case and be used for the semiconductor refrigeration piece orientation to the radiating radiator of hot end when the inside one end of monitoring case is the cold junction.

2. The resin matrix composite reaction process temperature monitoring device of claim 1, wherein the monitoring box comprises a box body and a base, the box body is of a rectangular structure, an upper side surface, a lower side surface and a front side surface of the box body are respectively provided with an upper side opening, a lower side opening and a front side opening, an upper drawing door for blocking the upper side opening is inserted into the rear side surface of the box body, a front drawing door for blocking the front side opening is inserted into the left side surface of the box body, a mounting groove communicated with the lower side opening is formed in the base, and the semiconductor refrigerating sheet is mounted in the mounting groove.

3. The resin matrix composite reaction process temperature monitoring device of claim 2, wherein the box comprises a square frame, a U-shaped frame, a connecting plate and a sealing plate, the horizontal part of the U-shaped frame is positioned at the front end, the two vertical parts of the U-shaped frame are positioned at the left end and the right end, the connecting plate is fixedly connected between the square frame and the right front corner of the U-shaped frame, the sealing plate is provided with three sealing plates, and the three sealing plates are respectively connected between the left end, the right end and the rear end of the square frame and the U-shaped frame.

4. The resin matrix composite reaction process temperature monitoring device according to claim 3, wherein the two vertical portions and the horizontal portion of the U-shaped frame are all in an F shape, a first slot extending along the front and back is arranged on the horizontal section of the two vertical portions of the U-shaped frame, a second slot extending along the left and right is arranged on the vertical section of the horizontal portion of the U-shaped frame, a third slot extending along the left and right direction is arranged on the horizontal section of the vertical portion of the U-shaped frame, two first slots and the third slots form an upper drawing slot matched with the upper drawing door, a back-shaped slot is arranged on the upper side face of the square frame, the second slots and the back-shaped slots form a front drawing slot matched with the front drawing door, the lower ends of the three sealing plates are respectively inserted into the back-shaped slots, and the upper ends of the three sealing plates are respectively and fixedly connected to the inner side face of the vertical section of the vertical portion of the U-shaped frame.

5. The resin matrix composite reaction process temperature monitoring device of claim 4, wherein the upper sliding door comprises an upper door body and an upper door plate fixedly connected to the rear end of the upper door body, the upper door body is in a T shape, the horizontal part of the upper door body is matched with the upper sliding groove, the front sliding door comprises a front door body and a front door plate fixedly connected to the left end of the front door body, the front door body is in a T shape, and the horizontal part of the front door body is matched with the front sliding groove.

6. The resin matrix composite reaction process temperature monitoring device according to claim 5, wherein the left and right ends of the front side surface of the upper door plate are respectively provided with a first upper electromagnetic sheet, and the sealing plate at the front end is provided with two second upper electromagnetic sheets which are respectively matched with the two first upper electromagnetic sheets; the upper end and the lower end of the right side surface of the front door plate are respectively provided with a first front electromagnetic sheet, and the sealing plate at the left end is provided with two second front electromagnetic sheets which are respectively matched with the two first front electromagnetic sheets.

7. The resin matrix composite reaction process temperature monitoring device according to claim 3, wherein a connecting plate is fixedly connected between the inner side surfaces of the sealing plates at the left end and the right end, a capsule-shaped chute is arranged on the connecting plate, guide grooves are respectively arranged on the upper side surfaces of the chute, the sliding block is capsule-shaped, guide blocks matched with the guide grooves are respectively arranged on the upper side surface and the lower side surface of the sliding block, two fixing rods which are arranged in parallel and at intervals are arranged on the front side surface of the sliding block, the mounting piece comprises two mounting plates, long holes for placing the first temperature sensor are formed in the mounting plates, and one ends of the two mounting plates are fixed between the two fixing rods through bolts.

8. The resin matrix composite reaction process temperature monitoring device according to claim 2, wherein the front side of the base is provided with a caulking groove for installing the temperature regulator, the rear side of the base is provided with a communication hole communicated with the installation groove, the radiator is installed in the communication hole, the inner wall of the upper end of the installation groove of the base is provided with a supporting edge, the supporting edge is provided with a heat conducting net, and the heat conducting net comprises a fixing frame matched with the supporting edge and a net body connected in the fixing frame.

9. The resin matrix composite reaction process temperature monitoring device of claim 8, wherein the radiator comprises radiating fins, a fixing plate and a radiating fan, the radiating fins are installed in the communication holes, the fixing plate fixes the radiating fins in the communication holes, and the radiating fan is installed on the fixing plate.

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