CN219114549U - Resin matrix composite reaction process temperature monitoring device - Google Patents
Resin matrix composite reaction process temperature monitoring device Download PDFInfo
- Publication number
- CN219114549U CN219114549U CN202320125829.9U CN202320125829U CN219114549U CN 219114549 U CN219114549 U CN 219114549U CN 202320125829 U CN202320125829 U CN 202320125829U CN 219114549 U CN219114549 U CN 219114549U
- Authority
- CN
- China
- Prior art keywords
- temperature
- resin matrix
- monitoring
- reaction process
- matrix composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a temperature monitoring device for a resin matrix composite material reaction process. This resin matrix combined material reaction process temperature monitoring device includes sealed monitoring case, be equipped with the mould in the monitoring case, slidable mounting has the slider in the monitoring case, can dismantle the installed part that is used for installing the monitoring first temperature sensor of temperature in the mould on the slider, be equipped with the second temperature sensor that is used for monitoring incasement temperature in the monitoring case, the bottom of monitoring case is equipped with temperature regulator, and temperature regulator includes semiconductor refrigeration piece and actuating assembly, be equipped with on the monitoring case and be used for semiconductor refrigeration piece orientation to the radiating radiator of hot junction when monitoring incasement one end is the cold junction, be equipped with temperature controller on the monitoring case, temperature controller with second temperature sensor, temperature regulator and radiator electricity are connected. The utility model reduces the research cost of the curing effect of the temperature on the carbon nano tube/epoxy resin composite material.
Description
Technical Field
The utility model belongs to the technical field of resin matrix composite production equipment, and particularly relates to a temperature monitoring device for a resin matrix composite reaction process.
Background
With development of nano technology, nano materials such as Carbon Nanotubes (CNTs) are developed, so that the insulating composite material can become a conductor. Carbon Nanotubes (CNTs) are mixed with epoxy resin commonly used in non-excavation pipeline repair to form the intelligent composite material of the pipeline. The composite material has stronger electric and mechanical properties, not only can better repair damage in a pipeline, but also can monitor the real-time stress condition of the pipeline by utilizing the change of the electric signals of the composite material in the pipeline. Since the curing degree of the composite material has a great influence on the service state of the composite material in a pipeline, it is necessary to study the influence of temperature on the curing effect of the carbon nano tube/epoxy resin composite material.
At present, the equipment used for researching the curing effect of temperature on the carbon nano tube/epoxy resin composite material is a differential scanning calorimeter. However, the differential scanning calorimeter has higher use cost, and most functions of the differential scanning calorimeter are not used in the research process of researching the curing effect of the carbon nano tube/epoxy resin composite material at the research temperature, so that the problem of resource waste exists. Therefore, it is necessary to develop a temperature monitoring device for resin-based composite material reaction process, which is specially used for researching the curing effect of temperature on the carbon nano tube/epoxy resin composite material.
Disclosure of Invention
In order to achieve the above purpose, the utility model provides a temperature monitoring device for a resin matrix composite reaction process.
The utility model relates to a temperature monitoring device for a resin matrix composite reaction process, which comprises the following technical scheme:
the utility model provides a resin matrix combined material reaction process temperature monitoring device, includes sealed monitoring case, be equipped with the mould that is used for placing resin matrix combined material in the monitoring case, slidable mounting has the slider in the monitoring case, can dismantle on the slider and be connected with and be used for the installation monitoring the mounting of the first temperature sensor of temperature in the mould, be equipped with the second temperature sensor that is used for monitoring incasement temperature in the monitoring case, the bottom of monitoring case is equipped with the regulation temperature regulator of monitoring incasement temperature, temperature regulator includes the semiconductor refrigeration piece and is used for switching the cold and hot end's of semiconductor refrigeration piece drive assembly, be equipped with on the monitoring case and be used for the semiconductor refrigeration piece orientation to the radiating radiator of hot end when monitoring incasement one end is the cold junction.
As a further improvement to the technical scheme, the monitoring box comprises a box body and a base, wherein the box body is of a rectangular structure, an upper side surface, a lower side surface and a front side surface of the box body are respectively provided with an upper side opening, a lower side opening and a front side opening, an upper drawing door for blocking the upper side opening is inserted into the rear side surface of the box body, a front drawing door for blocking the front side opening is inserted into the left side surface of the box body, a mounting groove communicated with the lower side opening is formed in the base, and the semiconductor refrigerating sheet is mounted in the mounting groove.
As a further improvement to the technical scheme, the box comprises a square frame, a U-shaped frame, a connecting plate and sealing plates, wherein the horizontal part of the U-shaped frame is positioned at the front end, the two vertical parts of the U-shaped frame are positioned at the left end and the right end, the connecting plate is fixedly connected between the square frame and the right front corner of the U-shaped frame, the sealing plates are three, and the three sealing plates are respectively connected between the left end, the right end and the rear end of the square frame and the U-shaped frame.
As a further improvement to the technical scheme, two vertical parts and horizontal parts of the U-shaped frame are all F-shaped, a first slot extending along front and back is formed in the horizontal section of the two vertical parts of the U-shaped frame, a second slot extending along left and right is formed in the vertical section of the horizontal part of the U-shaped frame, a third slot extending along left and right directions is formed in the horizontal section of the vertical part of the U-shaped frame, two first slots and the third slots form an upper drawing slot matched with the upper drawing door, a back-shaped slot is formed in the upper side face of the mouth-shaped frame, a front drawing slot matched with the front drawing door is formed in the second slot and the back-shaped slot, the lower ends of the three sealing plates are respectively inserted in the back-shaped slots, and the upper ends of the three sealing plates are respectively and fixedly connected to the inner side faces of the vertical sections of the vertical parts of the U-shaped frame.
As a further improvement to the technical scheme, the upper sliding door comprises an upper door body and an upper door plate fixedly connected to the rear end of the upper door body, the upper door body is T-shaped, the horizontal part of the upper door body is matched with the upper sliding groove, the front sliding door comprises a front door body and a front door plate fixedly connected to the left end of the front door body, the front door body is T-shaped, and the horizontal part of the front door body is matched with the front sliding groove.
As a further improvement to the technical scheme, the left and right ends of the front side surface of the upper door plate are respectively provided with a first upper electromagnetic sheet, and the sealing plate at the front end is provided with two second upper electromagnetic sheets which are respectively matched with the two first upper electromagnetic sheets; the upper end and the lower end of the right side surface of the front door plate are respectively provided with a first front electromagnetic sheet, and the sealing plate at the left end is provided with two second front electromagnetic sheets which are respectively matched with the two first front electromagnetic sheets.
As a further improvement to the technical scheme, a connecting plate is fixedly connected between the inner side surfaces of the sealing plates at the left end and the right end, a capsule-shaped chute is arranged on the connecting plate, guide grooves are respectively arranged on the upper side surfaces of the chute, the sliding blocks are capsule-shaped, guide blocks matched with the guide grooves are respectively arranged on the upper side surface and the lower side surface of the sliding blocks, two fixing rods which are arranged in parallel and at intervals up and down are arranged on the front side surface of the sliding blocks, each mounting piece comprises two mounting plates, long holes for placing the first temperature sensor are formed in the mounting plates, and one ends of the two mounting plates are fixed between the two fixing rods through bolts.
As a further improvement to the technical scheme, the front side of the base is provided with the caulking groove for installing the temperature regulator, the rear side of the base is provided with a communication hole communicated with the installation groove, the radiator is installed in the communication hole, the inner wall of the upper end of the installation groove of the base is provided with a supporting edge, the supporting edge is provided with a heat conducting net, and the heat conducting net comprises a fixing frame matched with the supporting edge and a net body connected in the fixing frame.
As a further improvement to the above technical solution, the heat sink includes a heat radiating fin, a fixing plate, and a heat radiating fan, the heat radiating fin is mounted in the communication hole, the fixing plate fixes the heat radiating fin in the communication hole, and the heat radiating fan is mounted on the fixing plate.
The utility model provides a temperature monitoring device for a resin matrix composite reaction process, which has the beneficial effects that compared with the prior art:
when the resin matrix composite reaction process temperature monitoring device is used, the driving assembly drives the semiconductor refrigerating sheet to work, and the second temperature sensor monitors the temperature change in the monitoring box in real time. The temperature controller controls the power of the driving assembly and the radiator according to the real-time temperature of the second temperature sensor, so as to control the working state of the semiconductor refrigerating sheet, and achieve the purpose of controlling the initial temperature of resin curing. Taking the example of simulating the curing temperature measurement of the resin at the initial temperature of 25 ℃ in summer, the second temperature sensor monitors the temperature change in the monitoring box in real time and transmits the data back to the temperature controller, the initial temperature is set, the driving assembly adjusts the cold and hot ends of the semiconductor refrigerating sheet, the semiconductor refrigerating sheet begins to refrigerate, the radiator is started, the hot end of the semiconductor refrigerating sheet is cooled, the refrigerating effect of the semiconductor refrigerating sheet is improved, the work load of the semiconductor refrigerating sheet is lightened, the set temperature is reached, and the die filled with the curing material is placed on the heat conducting net. At this time, the upper sliding door and the front sliding door are closed, the first upper electromagnetic sheet and the second upper electromagnetic sheet are electrified, and the upper sliding door and the front sliding door are fixed with the monitoring box.
Because the first temperature sensor and the die have a certain height, and meanwhile, the first sensor is arranged on the mounting plate, so that the single-door mounting is not facilitated, and the upper pull door and the front pull door are arranged in the resin matrix composite material reaction process temperature monitoring device disclosed by the utility model, so that the die and the first temperature sensor can be conveniently placed.
The upper pull door and the front pull door of the resin matrix composite material reaction process temperature monitoring device adopt the electromagnetic sheet magnetic attraction door, when the device works, the electromagnetic sheet is electrified to have the magnetic attraction function, the two pull doors can be tightly closed, and the arrangement of the electromagnetic sheet is convenient and economical and is beneficial to monitoring the tightness of the box.
According to the resin matrix composite material reaction process temperature monitoring device, the plurality of first temperature sensors are placed on the mounting plate of the sliding component through the long holes, and the plurality of temperature data can be measured in each set of die, so that comparison is formed, and the accuracy of temperature measurement is improved. The first temperature sensors can slide, so that the device can adapt to the shapes of different dies, and a plurality of first temperature sensors are arranged, so that the batch measurement of the curing temperature of materials under different mass fractions can be realized.
The temperature monitoring device for the resin matrix composite reaction process uses the semiconductor refrigeration sheet to regulate the temperature, the semiconductor refrigeration sheet forms a hot end and a cold end under the drive of the driving component, and the positions of the hot end and the cold end can be changed by changing the current direction. According to the set temperature, the temperature controller controls the driving assembly to adjust the cold and hot end positions of the semiconductor refrigerating sheet, so that the required end faces the inside of the monitoring box, and the temperature conduction is facilitated. In addition, the semiconductor refrigerating sheet has small volume, has a refrigerating function compared with the traditional heating resistor, and does not need to be additionally provided with a refrigerating system.
The temperature monitoring device for the resin matrix composite reaction process uses the radiator consisting of the radiating fins and the radiating fans to radiate heat, and the semiconductor refrigerating sheet generates heat during working, so that the refrigerating effect is influenced, the heat of the hot end is transferred through the radiator, the temperature difference is reduced, and the cold end absorbs the heat of the measuring chamber more, so that the refrigerating effect is enhanced, and the set temperature is reached.
Drawings
FIG. 1 is a schematic diagram of a temperature monitoring device for a resin matrix composite reaction process according to the present utility model;
FIG. 2 is a schematic diagram II of a temperature monitoring device in the reaction process of the resin matrix composite material;
FIG. 3 is a schematic structural view of a resin matrix composite reaction process temperature monitoring device (without upper and front sliding doors) according to the present utility model;
FIG. 4 is a schematic view of a part of the structure of a tank body in the resin matrix composite reaction process temperature monitoring device of the utility model;
FIG. 5 is a schematic diagram of the structure of a tank (without a sealing plate) in the resin matrix composite reaction process temperature monitoring device of the utility model;
FIG. 6 is a schematic diagram II of the structure of a tank (without a sealing plate) in the resin matrix composite reaction process temperature monitoring device of the utility model;
FIG. 7 is a schematic view of the structure of the base in the resin matrix composite reaction process temperature monitoring device of the utility model;
FIG. 8 is a graph showing the reaction process temperature of the resin-based composite material of the present utility model a structural schematic diagram of a base (without a heat conducting net) in the monitoring device;
FIG. 9 is a schematic diagram of the structure of a heat sink in the resin matrix composite reaction process temperature monitoring device of the present utility model;
in the figure: 1. a case; 2. a base; 3. upper drawer a sliding door; 4. a front sliding door; 5. a heat sink; 6. a heat conducting net; 7. a temperature regulator; 8. a U-shaped frame; 9. a square frame; 10. a connecting plate; 11. a sealing plate; 12. a first slot; 13. a second slot; 14. a third slot; 15. a Chinese character 'Hui' shaped slot; 16. a first front electro-magnetic sheet; 17. a second front electro-magnetic sheet; 18. a first upper electromagnetic sheet; 19. a second upper electromagnetic sheet; 20. a connecting plate; 21. a chute; 22. a slide block; 23. a guide groove; 24. a fixed rod; 25. a mounting plate; 26. a long hole; 27. a first temperature sensor; 28. a second temperature sensor; 29. a mold; 30. a mounting groove; 31. a support edge; 32. a semiconductor refrigeration sheet; 33. a fixing plate; 34. a heat dissipation fan; 35. and a heat radiating fin.
Detailed Description
The utility model is described in further detail below with reference to the attached drawings and detailed description:
the specific embodiment of the temperature monitoring device for the resin matrix composite reaction process of the utility model is shown in fig. 1 to 9, and comprises a sealed monitoring box, wherein a mold 29 for placing the resin matrix composite is arranged in the monitoring box, a sliding block 22 is slidably arranged in the monitoring box, a mounting piece for mounting a first temperature sensor 27 for monitoring the temperature in the mold 29 is detachably connected on the sliding block 22, a second temperature sensor 28 for monitoring the temperature in the box is arranged in the monitoring box, a temperature regulator for regulating the temperature in the monitoring box is arranged at the bottom of the monitoring box, the temperature regulator comprises a semiconductor refrigerating sheet 32 and a driving component for switching the cold end and the hot end of the semiconductor refrigerating sheet 32, a radiator 5 for radiating the heat when the semiconductor refrigerating sheet 32 faces the cold end of the inner end of the monitoring box is arranged on the monitoring box, and a temperature controller is arranged on the monitoring box and is electrically connected with the second temperature sensor 28, the temperature regulator and the radiator 5.
In this embodiment, the monitoring box includes box 1 and base 2, box 1 is rectangular structure, and box 1's upside, downside and leading flank are equipped with upside opening, downside opening and front side opening respectively, and box 1's trailing flank cartridge has the last sliding door 3 that is used for shutoff upside open-ended, and box 1's left surface cartridge has the preceding sliding door 4 that is used for shutoff front side open-ended, and base 2 is equipped with the mounting groove 30 with downside open-ended intercommunication, and semiconductor refrigeration piece 32 is installed in mounting groove 30. The box 1 comprises a square frame 9, a U-shaped frame 8, a connecting plate 2010 and sealing plates 11, wherein the horizontal part of the U-shaped frame 8 is positioned at the front end, the two vertical parts of the U-shaped frame 8 are positioned at the left end and the right end, the connecting plate 2010 is fixedly connected between the square frame 9 and the right front corner of the U-shaped frame 8, the sealing plates 11 are three, and the three sealing plates 11 are respectively connected between the left end, the right end and the rear end of the square frame 9 and the U-shaped frame 8.
In this embodiment, the two vertical portions and the horizontal portion of the U-shaped frame 8 are all in an F shape, the horizontal sections of the two vertical portions of the U-shaped frame 8 are provided with first slots 12 extending along the front and back directions, the vertical sections of the horizontal portion of the U-shaped frame 8 are provided with second slots 13 extending along the left and right directions, the horizontal sections of the vertical portion of the U-shaped frame 8 are provided with third slots 14 extending along the left and right directions, the two first slots 12 and the third slots 14 form an upper drawing slot matched with the upper drawing door 3, the upper side surface of the square frame 9 is provided with a back square slot 15, the second slots 13 and the back square slot 15 form a front drawing slot matched with the front drawing door 4, the lower ends of the three sealing plates 11 are respectively inserted into the back square slots 15, and the upper ends of the three sealing plates 11 are respectively fixedly connected to the inner side surfaces of the vertical sections of the vertical portion of the U-shaped frame 8. The upper sliding door 3 comprises an upper door body and an upper door plate fixedly connected to the rear end of the upper door body, the upper door body is T-shaped, the horizontal part of the upper door body is matched with the upper sliding groove, the front sliding door 4 comprises a front door body and a front door plate fixedly connected to the left end of the front door body, the front door body is T-shaped, and the horizontal part of the front door body is matched with the front sliding groove.
In this embodiment, the left and right ends of the front side surface of the upper door plate are respectively provided with a first upper electromagnetic sheet 18, and the sealing plate 11 at the front end is provided with two second upper electromagnetic sheets 19 respectively matched with the two first upper electromagnetic sheets 18; the upper and lower both ends of the right side of preceding door plant are equipped with first preceding electromagnetic sheet 16 respectively, are equipped with two respectively with two first preceding electromagnetic sheet 16 assorted second preceding electromagnetic sheet 17 on the shrouding 11 of left end. A connecting plate 2010 is fixedly connected between inner side surfaces of the sealing plates 11 at the left end and the right end, a capsule-shaped sliding groove 21 is arranged on the connecting plate 2010, guide grooves 23 are respectively arranged on upper side surfaces of the sliding groove 21, a sliding block 22 is in a capsule shape, guide blocks matched with the guide grooves 23 are respectively arranged on upper side surfaces and lower side surfaces of the sliding block 22, two fixing rods 24 which are arranged in parallel and at intervals up and down are arranged on the front side surface of the sliding block 22, the mounting piece comprises two mounting plates 25, long holes 26 for placing a first temperature sensor 27 are formed in the mounting plates 25, and one ends of the two mounting plates 25 are fixed between the two fixing rods 24 through bolts. The leading flank of base 2 is equipped with the caulking groove that is used for installing temperature regulator, and the trailing flank of base 2 is equipped with the intercommunicating pore with mounting groove 30 intercommunication, and radiator 5 installs in the intercommunicating pore, is equipped with on the mounting groove 30 upper end inner wall of base 2 and supports along 31, is equipped with heat conduction net 6 on the support along 31, and heat conduction net 6 includes along 31 assorted fixed frame and the dictyosome of connection in fixed frame with the support. The radiator 5 includes a radiating fin 35, a fixing plate 33, and a radiating fan 34, the radiating fin 35 is mounted in the communication hole, the fixing plate 33 fixes the radiating fin 35 in the communication hole, and the radiating fan 34 is mounted on the fixing plate 33.
When the resin matrix composite reaction process temperature monitoring device is used, the driving assembly drives the semiconductor refrigerating sheet 32 to work, and the second temperature sensor 28 monitors the temperature change in the monitoring box in real time. The temperature controller controls the power of the driving assembly and the radiator 5 according to the real-time temperature of the second temperature sensor 28, thereby controlling the working state of the semiconductor refrigerating sheet 32 and achieving the purpose of controlling the initial temperature of resin curing. Taking the example of the measurement of the curing temperature of the resin at the initial temperature of 25 ℃ simulated in summer, the second temperature sensor 28 monitors the temperature change in the monitoring box in real time and transmits the data to the temperature controller, the initial temperature is set, the driving component adjusts the cold and hot ends of the semiconductor refrigerating sheet 32, the semiconductor refrigerating sheet 32 starts to refrigerate, the radiator 5 is started, the hot end of the semiconductor refrigerating sheet 32 is cooled, the refrigerating effect of the semiconductor refrigerating sheet 32 is improved, the workload of the semiconductor refrigerating sheet is reduced, the set temperature is reached, and the die 29 filled with the curing material is placed on the heat conducting net 6. At this time, the upper sliding door 3 and the front sliding door 4 are closed, the first upper electromagnetic sheet 18 and the second upper electromagnetic sheet 19, and the first front electromagnetic sheet 16 and the second front electromagnetic sheet 17 are electrified, so that the upper sliding door 3 and the front sliding door 4 are fixed with the monitoring box.
Because the first temperature sensor 27 and the die 29 have a certain height, and meanwhile, because the first sensor is arranged on the mounting plate 25 and is unfavorable for single-door placement, the resin matrix composite reaction process temperature monitoring device provided by the utility model is provided with the upper drawing door 3 and the front drawing door 4, which is favorable for conveniently placing the die 29 and the first temperature sensor 27.
The upper sliding door 3 and the front sliding door 4 of the resin matrix composite material reaction process temperature monitoring device adopt electromagnetic sheets to magnetically attract and open the doors, and when the device works, the electromagnetic sheets are electrified to have a magnetic attraction function, so that the two open sliding doors can be tightly closed, and the arrangement of the electromagnetic sheets is convenient and economical and is beneficial to monitoring the tightness of the box.
In the resin matrix composite reaction process temperature monitoring device, the mounting plate 25 of the sliding component is provided with the plurality of first temperature sensors 27 through the long holes 26, and a plurality of temperature data can be measured in each set of die 29 to form a comparison, so that the accuracy of temperature measurement is improved. Since the first temperature sensor 27 is slidable, it is possible to adapt to the shape of different molds 29, and to arrange a plurality of first temperature sensors 27, it is possible to realize batch measurement of the curing temperature at different mass fractions of the material.
The temperature monitoring device for the resin matrix composite reaction process uses the semiconductor refrigerating sheet 32 to regulate the temperature, the semiconductor refrigerating sheet 32 forms a hot end and a cold end under the drive of the driving component, and the positions of the hot end and the cold end can be changed by changing the current direction. According to the set temperature, the temperature controller controls the driving assembly to adjust the cold and hot end positions of the semiconductor refrigerating sheet 32, so that the required end faces the inside of the monitoring box, and the temperature conduction is facilitated. In addition, the semiconductor refrigerating sheet 32 has a small volume, and has a refrigerating function as compared with the conventional heating resistor, and a refrigerating system is not required to be additionally arranged.
The temperature monitoring device for the resin matrix composite reaction process uses the radiator 5 consisting of the radiating fins 35 and the radiating fans 34 to radiate heat, and the semiconductor refrigerating sheet 32 generates heat during working, so that the refrigerating effect is influenced, the heat of the hot end is transferred through the radiator 5, the temperature difference is reduced, and the cold end absorbs the heat of the measuring chamber more, so that the refrigerating effect is enhanced, and the set temperature is reached.
The foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the utility model are intended to be included within the scope of the utility model.
Claims (9)
1. The utility model provides a resin matrix composite reaction process temperature monitoring device, its characterized in that, includes sealed monitoring case, be equipped with the mould that is used for placing resin matrix composite in the monitoring case, slidable mounting has the slider in the monitoring case, detachable the connection has the installed part that is used for installing the monitoring the first temperature sensor of temperature in the mould on the slider, be equipped with the second temperature sensor who is used for monitoring incasement temperature in the monitoring case, the bottom of monitoring case is equipped with the regulation temperature regulator of monitoring incasement temperature, temperature regulator includes the semiconductor refrigeration piece and is used for switching the drive assembly of the cold and hot end of semiconductor refrigeration piece, be equipped with on the monitoring case and be used for the semiconductor refrigeration piece orientation to the radiating radiator of hot end when the inside one end of monitoring case is the cold junction.
2. The resin matrix composite reaction process temperature monitoring device of claim 1, wherein the monitoring box comprises a box body and a base, the box body is of a rectangular structure, an upper side surface, a lower side surface and a front side surface of the box body are respectively provided with an upper side opening, a lower side opening and a front side opening, an upper drawing door for blocking the upper side opening is inserted into the rear side surface of the box body, a front drawing door for blocking the front side opening is inserted into the left side surface of the box body, a mounting groove communicated with the lower side opening is formed in the base, and the semiconductor refrigerating sheet is mounted in the mounting groove.
3. The resin matrix composite reaction process temperature monitoring device of claim 2, wherein the box comprises a square frame, a U-shaped frame, a connecting plate and a sealing plate, the horizontal part of the U-shaped frame is positioned at the front end, the two vertical parts of the U-shaped frame are positioned at the left end and the right end, the connecting plate is fixedly connected between the square frame and the right front corner of the U-shaped frame, the sealing plate is provided with three sealing plates, and the three sealing plates are respectively connected between the left end, the right end and the rear end of the square frame and the U-shaped frame.
4. The resin matrix composite reaction process temperature monitoring device according to claim 3, wherein the two vertical portions and the horizontal portion of the U-shaped frame are all in an F shape, a first slot extending along the front and back is arranged on the horizontal section of the two vertical portions of the U-shaped frame, a second slot extending along the left and right is arranged on the vertical section of the horizontal portion of the U-shaped frame, a third slot extending along the left and right direction is arranged on the horizontal section of the vertical portion of the U-shaped frame, two first slots and the third slots form an upper drawing slot matched with the upper drawing door, a back-shaped slot is arranged on the upper side face of the square frame, the second slots and the back-shaped slots form a front drawing slot matched with the front drawing door, the lower ends of the three sealing plates are respectively inserted into the back-shaped slots, and the upper ends of the three sealing plates are respectively and fixedly connected to the inner side face of the vertical section of the vertical portion of the U-shaped frame.
5. The resin matrix composite reaction process temperature monitoring device of claim 4, wherein the upper sliding door comprises an upper door body and an upper door plate fixedly connected to the rear end of the upper door body, the upper door body is in a T shape, the horizontal part of the upper door body is matched with the upper sliding groove, the front sliding door comprises a front door body and a front door plate fixedly connected to the left end of the front door body, the front door body is in a T shape, and the horizontal part of the front door body is matched with the front sliding groove.
6. The resin matrix composite reaction process temperature monitoring device according to claim 5, wherein the left and right ends of the front side surface of the upper door plate are respectively provided with a first upper electromagnetic sheet, and the sealing plate at the front end is provided with two second upper electromagnetic sheets which are respectively matched with the two first upper electromagnetic sheets; the upper end and the lower end of the right side surface of the front door plate are respectively provided with a first front electromagnetic sheet, and the sealing plate at the left end is provided with two second front electromagnetic sheets which are respectively matched with the two first front electromagnetic sheets.
7. The resin matrix composite reaction process temperature monitoring device according to claim 3, wherein a connecting plate is fixedly connected between the inner side surfaces of the sealing plates at the left end and the right end, a capsule-shaped chute is arranged on the connecting plate, guide grooves are respectively arranged on the upper side surfaces of the chute, the sliding block is capsule-shaped, guide blocks matched with the guide grooves are respectively arranged on the upper side surface and the lower side surface of the sliding block, two fixing rods which are arranged in parallel and at intervals are arranged on the front side surface of the sliding block, the mounting piece comprises two mounting plates, long holes for placing the first temperature sensor are formed in the mounting plates, and one ends of the two mounting plates are fixed between the two fixing rods through bolts.
8. The resin matrix composite reaction process temperature monitoring device according to claim 2, wherein the front side of the base is provided with a caulking groove for installing the temperature regulator, the rear side of the base is provided with a communication hole communicated with the installation groove, the radiator is installed in the communication hole, the inner wall of the upper end of the installation groove of the base is provided with a supporting edge, the supporting edge is provided with a heat conducting net, and the heat conducting net comprises a fixing frame matched with the supporting edge and a net body connected in the fixing frame.
9. The resin matrix composite reaction process temperature monitoring device of claim 8, wherein the radiator comprises radiating fins, a fixing plate and a radiating fan, the radiating fins are installed in the communication holes, the fixing plate fixes the radiating fins in the communication holes, and the radiating fan is installed on the fixing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320125829.9U CN219114549U (en) | 2023-01-15 | 2023-01-15 | Resin matrix composite reaction process temperature monitoring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320125829.9U CN219114549U (en) | 2023-01-15 | 2023-01-15 | Resin matrix composite reaction process temperature monitoring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219114549U true CN219114549U (en) | 2023-06-02 |
Family
ID=86528078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320125829.9U Active CN219114549U (en) | 2023-01-15 | 2023-01-15 | Resin matrix composite reaction process temperature monitoring device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219114549U (en) |
-
2023
- 2023-01-15 CN CN202320125829.9U patent/CN219114549U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202974903U (en) | High/low-temperature testing equipment | |
| CN219114549U (en) | Resin matrix composite reaction process temperature monitoring device | |
| CN202506405U (en) | Constant-temperature box for miniature optical-fiber spectrometer | |
| CN201575657U (en) | Mechanical variable-temperature chamber and refrigerator provided with same | |
| CN116021687A (en) | Resin matrix composite reaction process temperature monitoring device | |
| CN207299271U (en) | Electric-controlled box and there is its air-conditioner outdoor unit | |
| CN113437429A (en) | Electric automobile battery thermal management device | |
| CN203718988U (en) | Air conditioning electric control box component and inverter air conditioner with same | |
| CN116185154A (en) | Immersed liquid cooling equipment | |
| CN215791366U (en) | Sunroof waterproof casing injection mold | |
| CN215356131U (en) | Multi-layer plate-level shielding part mold | |
| CN207907358U (en) | A kind of cabinet type radiator and thermal environmental control system | |
| CN2436935Y (en) | Standard holding box for cement specimen | |
| CN207651824U (en) | A kind of novel distribution cabinet | |
| CN220023453U (en) | High radiating LED switching power supply | |
| CN213364910U (en) | Mutual inductor characteristic comprehensive tester | |
| CN218072273U (en) | Measurement and control equipment heat radiation structure | |
| CN219876576U (en) | Power consumption measurement and control terminal | |
| CN220653890U (en) | Phase-change energy storage temperature control device of sealing equipment | |
| CN219623565U (en) | Interactive intelligent water conservancy management device | |
| CN220775140U (en) | Adjustable cooling mechanism of power distribution cabinet | |
| CN214581730U (en) | Central air conditioning tuber pipe installation gallows | |
| CN215679223U (en) | Efficient heat dissipation mechanism for computer CPU | |
| CN218630593U (en) | Temperature control system of thermistor testing machine | |
| CN116260060B (en) | Software and hardware protection device based on flexible direct current micro-grid electrolytic aluminum system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |