CN219113752U - Resin grinding pad - Google Patents

Abstract

The application relates to the technical field of grinding tools, and discloses a resin grinding pad, including the grinding pad body, the grinding pad body is including grinding resin layer, heat conduction resin layer and reinforcing resin layer, the upper end on grinding resin layer is located the fixed setting of heat conduction resin layer, the upper end on heat conduction resin layer is located the fixed setting of reinforcing resin layer, the bottom on reinforcing resin layer still an organic whole is provided with the installation arch. This application can ensure the connection stability of polishing pad to bear most frictional resistance, reduce the possibility of grinding resin layer distortion, improve grinding quality, and can reduce the temperature of grinding face, can guarantee lapping liquid make full use of simultaneously, and avoid the granule to lead to the fact wearing and tearing to accurate device surface in continuous grinding in-process.

Description

Resin grinding pad

Technical Field

The application relates to the technical field of grinding tools, in particular to a resin grinding pad.

Background

The resin polishing pad is mainly used for planarization treatment of precision devices such as magnetic disk substrates, optical lenses, semiconductor wafers and the like, is precise to polish, is not easy to damage the surfaces of the precision devices, and is generally formed by compression molding.

In the process of realizing the application, the inventor finds that at least the following problems exist in the technology, the resin grinding pad is a grinding tool formed by adopting compression molding through a resin material, during grinding, a proper amount of grinding liquid is added on the surfaces of the grinding pad and a device to be ground, the resin grinding pad is matched with the grinding particles in the grinding liquid in a rotating way to grind the surfaces of precision devices, in order to avoid hard impact friction to damage the surfaces of the devices, the molded resin grinding pad usually has a certain softness, but when the resin grinding pad is subjected to high-speed rotation grinding, the friction resistance is affected, the whole resin grinding pad is distorted and uneven, so that the grinding effect is easily influenced, and the connection stability between the grinding pad and a grinding driving piece is easily improved.

Disclosure of Invention

The purpose of this application is in order to solve among the prior art when the rotatory grinding of resin grinding pad high speed, receives frictional resistance influence, leads to whole resin grinding pad distortion unevenness to easily influence the grinding effect, and the problem of the connection stability between grinding pad and the grinding driving piece, and the resin grinding pad that proposes.

In order to achieve the above purpose, the present application adopts the following technical scheme:

the utility model provides a resin grinding pad, includes the grinding pad body, the grinding pad body includes grinding resin layer, heat conduction resin layer and reinforcing resin layer, the fixed setting in upper end on grinding resin layer is located the heat conduction resin layer, the fixed setting in upper end on reinforcing resin layer is located to the heat conduction resin layer, the bottom on reinforcing resin layer still integrally provided with the installation arch.

Preferably, a plurality of hexagon grooves are formed in the end face of the grinding resin layer, the hexagon grooves are uniformly distributed on the end face of the grinding resin layer, and the hexagon grooves are arranged on one side, away from the reinforcing resin layer.

Preferably, the side wall of the grinding pad body is fixedly sleeved with a plastic rubber sleeve.

Preferably, two ends of the upper end of the plastic rubber sleeve are fixedly connected with the side wall of the grinding resin layer and the side wall of the reinforced resin layer respectively, the upper end of the plastic rubber sleeve is lower than the upper end of the grinding resin layer, and the lower end of the plastic rubber sleeve is higher than the lower end of the reinforced resin layer.

Preferably, the distance between the upper end of the grinding resin layer and the lower end of the reinforced resin layer is 7.0mm to 9.0mm, the thickness ratio of the grinding resin layer, the heat conducting resin layer and the reinforced resin layer is 2:1:2, and the thickness of the mounting protrusion is smaller than that of the reinforced resin layer.

Preferably, the thickness of the plastic rubber sleeve is arranged in the range of 1.0mm to 1.5 mm.

Compared with the prior art, the application provides a resin grinding pad, possesses following beneficial effect:

1. this resin grinding pad through the grinding pad body that sets up, can regard as the surface grinding of accurate device to use, through the grinding resin layer that sets up, can regard as the grinding surface of grinding pad to use, through the heat conduction resin layer, can in time derive the heat that the grinding pad grinding during operation produced to can avoid grinding resin layer and accurate device's contact surface temperature to a certain extent excessively, and through reinforcing resin layer cooperation installation arch, can increase the joint strength between grinding pad and the grinding driving piece, can ensure the connection stability of grinding pad on the one hand, on the other hand can bear most frictional resistance, reduce grinding resin layer distortion's possibility, improve grinding quality.

2. According to the resin grinding pad, the hexagonal grooves are formed, so that the grinding liquid can be effectively stored, the full utilization of the grinding liquid is guaranteed, the storage space of the ground particles is reserved, and abrasion of the particles to the surface of a precise device in the continuous grinding process is avoided.

The device does not involve the part and all is the same with prior art or can adopt prior art to realize, and this application can ensure the connection stability of lapping pad to bear most frictional resistance, reduce the possibility of lapping resin layer distortion, improve grinding quality, and can reduce the temperature of lapping surface, can guarantee lapping liquid make full use of simultaneously, and avoid the granule to cause wearing and tearing to accurate device surface in continuous grinding in-process.

Drawings

FIG. 1 is a schematic view of a resin polishing pad according to the present application;

fig. 2 is a schematic top view of the polishing pad body of fig. 1.

In the figure: 1. a polishing pad body; 2. grinding the resin layer; 3. a heat conductive resin layer; 4. a reinforcing resin layer; 5. mounting the bulge; 6. hexagonal grooves; 7. a plastic rubber sleeve.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application.

Referring to fig. 1-2, a resin polishing pad, including polishing pad body 1, polishing pad body 1 includes grinding resin layer 2, heat conduction resin layer 3 and reinforcing resin layer 4, grinding resin layer 2 is located the fixed setting of upper end on heat conduction resin layer 3, heat conduction resin layer 3 is located the fixed setting of upper end on reinforcing resin layer 4, reinforcing resin layer 4's bottom still integrally provided with installation arch 5, distance between the upper end on grinding resin layer 2 and the lower extreme of reinforcing resin layer 4 is 7.0mm to 9.0mm in the within range, the thickness ratio of grinding resin layer 2, heat conduction resin layer 3 and reinforcing resin layer 4 is 2:1:2 setting, the thickness of installation arch 5 is less than the thickness setting of reinforcing resin layer 4, wherein grinding resin layer 2 is made in polyurethane resin through the impregnation of PET resin fiber, heat conduction resin layer 3 is made through polyurethane resin mixing right amount of aluminium powder, not only good heat conduction, and possess certain intensity, and reinforcing resin layer 4 and installation arch 5 are all made for resin material, simultaneously, grinding pad body 1 adopts the tape casting shaping technology to replace traditional die casting shaping technology in place, can make the whole tape casting resin layer 2, the productivity of grinding resin layer 1 can be in proper order, the whole tape casting technology is carried out through the whole tape casting technology, the grinding resin layer 1 is finished, the productivity is good, and the grinding pad 1 is finished.

A plurality of hexagon recesses 6 have been seted up to the terminal surface of grinding resin layer 2, and each hexagon recess 6 all is located the terminal surface evenly distributed setting of grinding resin layer 2, and each hexagon recess 6 all is located one side setting of keeping away from reinforcing resin layer 4, through hexagon recess 6, can make the abrasive surface possess certain accommodation space to can effectually follow-up grinding fluid, guarantee grinding fluid make full use of, and give the storage space of the granule that polishes down, thereby avoid the granule to lead to the fact wearing and tearing to accurate device surface in the grinding process that lasts.

The plastic rubber sleeve 7 is fixedly sleeved on the side wall of the grinding pad body 1, the thickness of the plastic rubber sleeve 7 is arranged in the range from 1.0mm to 1.5mm, and the connection strength among the grinding resin layer 2, the heat conducting resin layer 3 and the reinforcing resin layer 4 can be increased through the plastic rubber sleeve 7, so that the connection stability is ensured.

The upper end both ends of plastic gum cover 7 respectively with grind the lateral wall of resin layer 2 and the lateral wall fixed connection of reinforcing resin layer 4, the upper end of plastic gum cover 7 is less than the upper end setting of grinding resin layer 2, and the lower extreme of plastic gum cover 7 is higher than the lower extreme setting of reinforcing resin layer 4, can prevent that plastic gum cover 7 from causing wearing and tearing to accurate device surface, ensures that plastic gum cover 7 can not cause the influence to the grinding.

In this application, during the use, through grinding pad body 1, can regard as the surface grinding of accurate device to use, through grinding resin layer 2, can regard as the grinding surface of grinding pad body 1 to use, through heat conduction resin layer 3, can in time derive the heat that grinding pad body 1's during operation produced, thereby can avoid grinding resin layer 2 to a certain extent and accurate device's contact surface temperature excessively, and through reinforcing resin layer 4 cooperation installation arch 6, utilize reinforcing resin layer 4 and the intensity of installation arch 6, can increase the joint strength between grinding pad body 1 and the grinding driving piece, on the one hand can ensure the connection stability of grinding pad body 1, on the other hand can bear most frictional resistance, reduce grinding resin layer 2 distortion's possibility, improve the grinding quality.

The foregoing is only a preferred embodiment of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art, within the scope of the present application, should apply to the present application, and all equivalents and modifications as fall within the scope of the present application.

Claims (6)

1. The utility model provides a resin polishing pad, includes polishing pad body (1), its characterized in that, polishing pad body (1) is including grinding resin layer (2), heat conduction resin layer (3) and reinforcing resin layer (4), grinding resin layer (2) are located the fixed setting of upper end on heat conduction resin layer (3), heat conduction resin layer (3) are located the fixed setting of upper end on reinforcing resin layer (4), the bottom on reinforcing resin layer (4) still is integrally provided with installation arch (5).

2. The resin polishing pad according to claim 1, wherein a plurality of hexagonal grooves (6) are formed in the end face of the polishing resin layer (2), the hexagonal grooves (6) are uniformly distributed on the end face of the polishing resin layer (2), and the hexagonal grooves (6) are formed on the side far away from the reinforcing resin layer (4).

3. The resin polishing pad according to claim 1, wherein a plastic rubber sleeve (7) is fixedly sleeved on the side wall of the polishing pad body (1).

4. A resin polishing pad according to claim 3, wherein two ends of the upper end of the plastic rubber sleeve (7) are fixedly connected with the side wall of the polishing resin layer (2) and the side wall of the reinforcing resin layer (4), respectively, the upper end of the plastic rubber sleeve (7) is lower than the upper end of the polishing resin layer (2), and the lower end of the plastic rubber sleeve (7) is higher than the lower end of the reinforcing resin layer (4).

5. The resin polishing pad according to claim 1, wherein a distance between an upper end of the polishing resin layer (2) and a lower end of the reinforcing resin layer (4) is set in a range of 7.0mm to 9.0mm, a thickness ratio of the polishing resin layer (2), the heat conductive resin layer (3) and the reinforcing resin layer (4) is set at 2:1:2, and a thickness of the mounting boss (5) is set smaller than a thickness of the reinforcing resin layer (4).

6. A resin polishing pad according to claim 4, wherein the thickness of the plastic rubber sleeve (7) is set in the range of 1.0mm to 1.5 mm.

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