CN219112868U - Water tank for cooling copper mold - Google Patents
Water tank for cooling copper mold Download PDFInfo
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- CN219112868U CN219112868U CN202320117086.0U CN202320117086U CN219112868U CN 219112868 U CN219112868 U CN 219112868U CN 202320117086 U CN202320117086 U CN 202320117086U CN 219112868 U CN219112868 U CN 219112868U
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- water tank
- main body
- copper mold
- water
- tank main
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
The utility model discloses a water tank for cooling a copper mold, which comprises a water tank main body (7); the inside of the water tank main body (7) is hollow, the top of the water tank main body is provided with an opening, and the outer edge of the opening is provided with a square frame (8) extending outwards; the inside of the water tank main body (7) is used for containing copper mold cooling water; the lower part of the water tank main body (7) is provided with a water inlet pipe interface (6), and the water inlet pipe (1) is connected into the water tank main body (7) from the water inlet pipe interface (6); and the square frame (8) is provided with a mandril reflow hole. The utility model can keep the water inlet and outlet in the water tank main body balanced, and realize the effects of uniform copper mold cooling and effective reduction of copper mold temperature.
Description
Technical Field
The utility model relates to the technical field of copper mold production, in particular to a water tank for cooling a copper mold.
Background
At present, the copper mold cooling mode at home and abroad is generally carried out by adopting a spray pump to boost pressure and cooling through spraying water at the bottom and the upper part, and the mold temperature is generally controlled at 240-300 ℃. However, the condition that the temperature of the copper mold is higher and the copper mold is cooled unevenly is common in the cooling by adopting bottom spray water, so that the copper mold is easy to deform and crack after being used for a period of time, and the physical specification of the anode plate is seriously influenced and the service life of the copper mold is seriously restricted. The physical specification of the anode plate is not up to standard, the labor intensity of manual repair is high, and a large number of copper molds need to be cast each year due to the low service life of the copper molds, so that the copper mold metal on site is in a large stock, stock fund backlog is large, and the waste copper molds are high in furnace returning cost.
Disclosure of Invention
In view of the deficiencies of the prior art, the present utility model is directed to a water tank for copper mold cooling.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
a water tank for copper mold cooling includes a tank body; the inside of the water tank main body is hollow, the top of the water tank main body is provided with an opening, and the outer edge of the opening is provided with a square frame extending outwards; the inside of the water tank main body is used for containing copper mold cooling water; the lower part of the water tank main body is provided with a water inlet pipe interface, and the water inlet pipe is connected into the water tank main body from the water inlet pipe interface; and the square frame is provided with a mandril reflow hole.
Further, a first positioning hole and a second positioning hole are formed in one side of the square frame, a third positioning hole is formed in the other side of the square frame, and a top rod reflow hole is formed between the first positioning hole and the second positioning hole.
Further, the outer edge of the square frame is provided with a wrapping edge protruding upwards from the top surface of the square frame.
Further, the water tank body is of an inverted trapezoid structure.
The utility model has the beneficial effects that: the utility model can keep the water inlet and outlet in the water tank main body balanced, and realize the effects of uniform copper mold cooling and effective reduction of copper mold temperature.
Drawings
Fig. 1 is a top view of the water tank in embodiment 1 of the present utility model;
fig. 2 is a schematic side view of the water tank in embodiment 1 of the present utility model.
Detailed Description
The present utility model will be further described with reference to the accompanying drawings, and it should be noted that, while the present embodiment provides a detailed implementation and a specific operation process on the premise of the present technical solution, the protection scope of the present utility model is not limited to the present embodiment.
Example 1
The present embodiment provides a water tank for copper mold cooling, as shown in fig. 1-2, comprising a water tank body 7; the water tank body 7 is of an inverted trapezoid structure and hollow in the interior, an opening is formed in the top of the water tank body, a square frame 8 extending outwards is arranged at the outer edge of the opening, and a wrapping edge 9 protruding upwards from the top surface of the square frame 8 is arranged at the outer edge of the square frame 8; the inside of the water tank body 7 is used for containing copper mold cooling water; the lower part of the water tank main body 7 is provided with a water inlet pipe interface 6, and the water inlet pipe 1 is connected into the water tank main body 7 from the water inlet pipe interface 6; one side of the square frame 8 is provided with a first positioning hole 3 and a second positioning hole 4, the other side is provided with a third positioning hole 5, and a top rod reflow hole 2 is arranged between the first positioning hole 3 and the second positioning hole 4.
In the water tank, the first positioning hole 3, the second positioning hole 4 and the third positioning hole 5 are used for positioning and fixing the water tank body, and when the water tank is used, the water tank body is fixed below the copper mold, so that the bottom of the copper mold is positioned inside the water tank body 7. The copper mold is cooled by supplying cooling water into the water tank body 7 through the water inlet pipe. The water inlet pipe is filled in the water tank body after water enters, water flows continuously, and flows out to the square frame after being filled in the water tank body and flows out from the ejector rod backflow hole, so that the water quantity balance in the water tank body is maintained, the cooling water flow is controlled, and the cooling temperature of the copper mold is controlled (the flow can be measured through the flowmeter). The temperature of the position of the ejector rod reflow hole is lower, water can expand after being heated, and water flows towards the direction with small heating. Through making the whole water balance in the water tank body, can realize that the copper mould cooling is even, effectively reduce copper mould temperature.
Example 2
The water tank for cooling the copper mold described in the embodiment 1 is put into use in a certain copper smelting plant anode furnace, and the service condition of the copper mold is tracked and summarized, and the statistical analysis of relevant data shows that: after the water tank in the embodiment 1 is adopted, the copper mold is cooled uniformly, the temperature of the copper mold is reduced to about 200 ℃ from the original 280 ℃, the annual average casting copper modulus is reduced to 400 blocks, the annual average copper mold life is prolonged to more than 1500 tons/block, the copper mold life is effectively prolonged, the copper mold metal inventory is effectively reduced, and the production cost is saved.
Various modifications and variations of the present utility model will be apparent to those skilled in the art in light of the foregoing teachings and are intended to be included within the scope of the following claims.
Claims (4)
1. A water tank for copper mold cooling, characterized by comprising a tank body (7); the inside of the water tank main body (7) is hollow, the top of the water tank main body is provided with an opening, and the outer edge of the opening is provided with a square frame (8) extending outwards; the inside of the water tank main body (7) is used for containing copper mold cooling water; the lower part of the water tank main body (7) is provided with a water inlet pipe interface (6), and the water inlet pipe (1) is connected into the water tank main body (7) from the water inlet pipe interface (6); and the square frame (8) is provided with a mandril reflow hole.
2. The water tank for cooling copper molds according to claim 1, wherein one side of the square frame (8) is provided with a first positioning hole (3) and a second positioning hole (4), the other side is provided with a third positioning hole (5), and a top rod reflow hole (2) is arranged between the first positioning hole (3) and the second positioning hole (4).
3. The water tank for cooling copper molds according to claim 1, characterized in that the outer edge of said square frame (8) is provided with a wrapping edge (9) protruding upwards from the top surface of said square frame (8).
4. The water tank for copper mold cooling according to claim 1, characterized in that the tank body (7) has an inverted trapezoidal structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320117086.0U CN219112868U (en) | 2023-02-06 | 2023-02-06 | Water tank for cooling copper mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320117086.0U CN219112868U (en) | 2023-02-06 | 2023-02-06 | Water tank for cooling copper mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219112868U true CN219112868U (en) | 2023-06-02 |
Family
ID=86535338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320117086.0U Active CN219112868U (en) | 2023-02-06 | 2023-02-06 | Water tank for cooling copper mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219112868U (en) |
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2023
- 2023-02-06 CN CN202320117086.0U patent/CN219112868U/en active Active
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