CN219107893U - Integrated circuit design simulation device - Google Patents

Integrated circuit design simulation device Download PDF

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Publication number
CN219107893U
CN219107893U CN202223206863.3U CN202223206863U CN219107893U CN 219107893 U CN219107893 U CN 219107893U CN 202223206863 U CN202223206863 U CN 202223206863U CN 219107893 U CN219107893 U CN 219107893U
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integrated circuit
opening cylinder
assembly
circuit design
component
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Chinese (zh)
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陈超
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Shenzhen Hongguang Shengye Electronics Co ltd
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Shenzhen Hongguang Shengye Electronics Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation

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Abstract

The utility model discloses an integrated circuit design simulation device, and relates to the technical field of integrated circuit related devices. The utility model comprises a simulation cavity component, a carrying component and a rotating component, wherein the carrying component is connected to the right lower side of the simulation cavity component, the rotating component is connected to the right lower side of the carrying component, the lifting component is connected to the right lower side of the rotating component, and the supporting component is connected to the right lower side of the lifting component. According to the utility model, the simulation cavity assembly is arranged, the lower opening cylinder is divided into two parts through the arranged lower partition plate, so that the cold and hot sides inside the lower opening cylinder are obviously distinguished, the integrated circuit is subjected to simulation experiments in the areas with obvious two environment distinction, and the object carrying assembly and the rotating assembly are arranged, so that the integrated circuit design simulation device is used for carrying out the simulation experiments on a plurality of integrated circuits in different environments at one time, and the working efficiency of the integrated circuit design simulation device in simulating the integrated circuits is improved.

Description

Integrated circuit design simulation device
Technical Field
The utility model belongs to the technical field of integrated circuit related devices, and particularly relates to an integrated circuit design simulation device.
Background
An integrated circuit is a microelectronic device or component; after the design of the integrated circuit is completed, the integrated circuit needs to be simulated by a worker, so that the worker can conveniently judge whether the designed integrated circuit meets the standard or not, and currently, the worker places the integrated circuit in a simulation device for simulation.
Through retrieving, disclosed in patent document CN215647814U is an integrated circuit design simulator, which comprises a simulation box body and a simulation box cover, the rear end of the top of the simulation box body is rotationally connected with the simulation box cover, the two sides of the front end of the simulation box body are respectively and fixedly connected with a voltmeter and an ammeter, the bottom of the outer wall of one side of the simulation box body is fixedly connected with a communication interface, the outer surface of the top of the simulation box cover is fixedly connected with a plurality of load devices, and the bottom of the front end of the simulation box cover is fixedly connected with a connecting lock. The utility model generates cold air through the refrigerating fan and generates hot air through the heating fan, thereby being convenient for simulating the low-temperature environment and the high-temperature environment when the integrated circuit works; the two box cover partition boards and the box body partition board are mutually clamped, so that the working environment temperature of an integrated circuit is conveniently changed, and the box cover partition board and the box body partition board which are made of rock wool boards have good heat preservation effect; the two compacting cylinders drive the compacting plates to press downwards, so that the pins of the integrated circuit are connected with the connecting columns more tightly.
However, the following drawbacks still exist in practical use:
1. an integrated circuit design simulation device disclosed in patent publication number CN215647814U can simulate an integrated circuit under different environments, but still simulate the integrated circuit under different environments in the same area, so that inconvenience exists in the process of changing different environments, and the integrated circuit is inconvenient to simulate under different environments;
2. an integrated circuit design simulation apparatus disclosed in patent publication No. CN215647814U can simulate only a single integrated circuit at a time, increasing the number of simulations performed on a plurality of integrated circuits, and reducing the operating efficiency of an integrated circuit design simulation apparatus disclosed in patent publication No. CN 215647814U.
Therefore, an integrated circuit design simulation device disclosed in patent publication CN215647814U cannot meet the practical requirements, so there is a strong need for an improved technology in the market to solve the above-mentioned problems.
Disclosure of Invention
The utility model aims to provide an integrated circuit design simulation device, which solves the problems that the integrated circuit design simulation device disclosed in the patent document with the patent publication number of CN215647814U is inconvenient to simulate an integrated circuit under different environments and has low working efficiency by arranging a simulation cavity assembly, a carrying assembly and a rotating assembly.
In order to solve the technical problems, the utility model is realized by the following technical scheme:
the utility model relates to an integrated circuit design simulation device, which comprises a simulation cavity component, a carrying component and a rotating component, wherein the carrying component is connected to the right lower side of the simulation cavity component, the rotating component is connected to the right lower side of the carrying component, and the lifting component is connected to the right lower side of the rotating component, so that the lower opening cylinder is divided into two parts by the arranged lower partition board through the simulation cavity component, the integrated circuit is subjected to simulation experiments in two areas with obvious environment distinction, and the carrying component and the rotating component are arranged, so that the integrated circuit design simulation device is beneficial to accelerating the working efficiency of the integrated circuit design simulation device when simulating the integrated circuit in different environments, and the problems of inconvenience in simulating the integrated circuit in different environments and low working efficiency in the integrated circuit design simulation device disclosed in the patent document with the patent publication number of CN215647814U are solved.
Further, the simulation cavity assembly comprises a lower opening cylinder, a voltmeter, an ammeter, a load device and an upper partition plate; the middle of the upper part of the lower opening cylinder is symmetrically penetrated and connected with a load device in a left-right symmetry manner, one side of the upper part of the lower opening cylinder is symmetrically penetrated and connected with a voltmeter in a front-back symmetry manner, the other side of the upper part of the lower opening cylinder is symmetrically penetrated and connected with an ammeter in a front-back symmetry manner, and the middle part of the lower side of the lower opening cylinder is connected with an upper partition plate from front to back;
specifically, the voltmeter and the ammeter are used for a user to know the voltage and the current of the analog integrated circuit when in operation, so that the user can conveniently judge whether the integrated circuit meets the standard.
Further, the supporting component comprises a round bottom plate and supporting legs; the circular bottom plate is positioned right below the lower opening cylinder, the outer side of the upper part of the circular bottom plate is provided with supporting feet in an annular array, and the upper sides of the four supporting feet are distributed on the outer side of the lower part of the lower opening cylinder in an annular array;
specifically, the existence of the supporting feet enables a moving distance to exist between the circular bottom plate and the lower opening cylinder, which is beneficial to the up-and-down movement of the upper opening cylinder box, namely, the height of the integrated circuit inside the carrying component is adjusted.
Further, the upper part of one side of the periphery of the simulation cavity component is connected with a cold guide component, and the cold guide component comprises a second guide pipe, a second mounting seat and a second pump body; the inner side of a second installation seat at the lower side of the second pump body is connected with the upper part of one side of the periphery of the lower opening cylinder, a second guide pipe at the inner side of the second pump body extends into the lower opening cylinder, and a spray head is connected at the inner side end of the second guide pipe;
specifically, the cold guide assembly is used for guiding cold air into the simulation cavity assembly, so that the integrated circuit performs simulation experiments in a space with a low temperature.
Further, the upper part of the other side of the periphery of the simulation cavity component is connected with a heat conduction component, and the heat conduction component comprises a first pump body and a first mounting seat; the inner side of a first mounting seat at the lower side of the first pump body is connected with the upper part of the other side of the periphery of the lower opening cylinder, a first guide pipe at the inner side of the first pump body extends into the lower opening cylinder, and a spray head is connected at the inner side end of the first guide pipe;
specifically, the heat conduction assembly is used for guiding hot air into the simulation cavity assembly, so that the integrated circuit performs simulation experiments in a space with a high temperature.
Further, the carrying component comprises an upper opening cylinder box, a lower partition plate, a communication control board and a communication data line; the upper opening cylinder box is positioned at the right lower side of the lower opening cylinder, the middle part of the upper side of the upper opening cylinder box is connected with a lower partition plate from front to back, the left and right sides of the upper side of the upper opening cylinder box are symmetrically connected with a communication control board, the middle of the front side of the communication control board is connected with a communication data wire, the left and right sides of the front side of the periphery of the upper opening cylinder box are symmetrically provided with communication interfaces, and the front ends of the communication data wires are connected with the communication interfaces;
specifically, the object carrying component is used for communicating the communication control board with an external computer, so that relevant data of the integrated circuit simulation experiment are input into the external computer, and a user can conveniently control the communication control board to work.
Further, the upper side of the carrying component is symmetrically connected with a storage component, and the storage component comprises an upper opening groove plate and a connecting column; the two upper opening groove plates are positioned right above the communication control plate, pin holes are formed in the upper sides of the upper opening groove plates in a rectangular array, connecting columns penetrate through the inner sides of the pin holes, and the lower ends of the connecting columns are connected with the upper sides of the communication control plate;
specifically, the existence of pin hole is used for limiting the pin of integrated circuit, and the position of integrated circuit in upper shed frid is limited, and the existence of spliced pole is used for limiting the integrated circuit pin to be connected with communication control panel, and the user of being convenient for controls the integrated circuit through communication control panel and carries out the simulation experiment.
Further, the lifting assembly comprises a hydraulic cylinder and a circular seat; the round seat is positioned right above the round bottom plate, the lower side of the round seat is symmetrically connected with a hydraulic cylinder in a left-right manner, and the lower side of the hydraulic cylinder is connected with the upper side of the round bottom plate;
specifically, the hydraulic cylinder is used for adjusting the height of the circular seat, adjusting the height of the rotating assembly and adjusting the height of the carrying assembly, so that an integrated circuit in the carrying assembly leaks out, and a user can conveniently load and unload the integrated circuit board.
Further, the rotating assembly comprises a supporting frame and a motor; the motor is positioned in the middle of the upper side of the circular seat, the supporting frames are distributed on the periphery of the rotating shaft of the upper side of the motor in an annular array, and the outer parts of the upper sides of the three supporting frames are connected with the outer parts of the lower sides of the upper opening cylinder boxes;
the motor is used for rotating and adjusting the position of the upper opening cylinder box and the position of the integrated circuit inside the upper opening groove plate, so that the integrated circuit board can carry out simulation experiments in different environments.
The utility model has the following beneficial effects:
1. according to the utility model, the simulation cavity assembly is arranged, the lower opening cylinder is divided into two parts by the arranged lower partition plate, so that one side of the inside of the lower opening cylinder is positioned on one side of the heat conduction assembly, and the other side of the inside of the lower opening cylinder is positioned on one side of the heat conduction assembly, so that the cold and hot sides of the inside of the lower opening cylinder are obviously distinguished, and the integrated circuit performs a simulation experiment in the area with obvious environmental distinction.
2. According to the utility model, the object carrying assembly and the rotating assembly are arranged, so that the integrated circuit design simulation device can perform simulation experiments on a plurality of integrated circuits in different environments at one time, and the working efficiency of the integrated circuit design simulation device in simulating the integrated circuits is improved.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present utility model, the drawings used for describing the embodiments will be briefly described below.
FIG. 1 is a schematic diagram of an integrated circuit design simulation device;
FIG. 2 is a schematic bottom view of the structure of FIG. 1;
FIG. 3 is a schematic illustration of the connection of the analog chamber assembly and the support assembly;
FIG. 4 is a schematic bottom view of the structure of FIG. 3;
FIG. 5 is a schematic illustration of the connection of the lower open cylinder, the heat conduction assembly and the cold conduction assembly;
FIG. 6 is a schematic bottom view of the structure of FIG. 5;
FIG. 7 is a schematic view of a carrier assembly;
FIG. 8 is a schematic illustration of the connection of the open top cartridge and the storage assembly;
FIG. 9 is a schematic illustration of the connection of a circular base plate to a raw lift assembly;
fig. 10 is a schematic view of the connection of the rotating assembly and the open-top cartridge.
In the drawings, the list of components represented by the various numbers is as follows:
1. a simulation chamber assembly; 11. a lower opening cylinder; 12. a voltmeter; 13. an ammeter; 14. a load device; 15. an upper partition plate; 2. a heat conducting component; 21. a first pump body; 22. a first mount; 23. a spray head; 24. a first conduit; 3. a support assembly; 31. a circular bottom plate; 32. supporting feet; 4. a lifting assembly; 41. a hydraulic cylinder; 42. a circular seat; 5. a carrier assembly; 51. an upper open-ended cartridge; 52. a lower partition plate; 53. a communication control board; 54. a communication data line; 55. a communication interface; 6. a cold guide assembly; 61. a second conduit; 62. a second mounting base; 63. a second pump body; 7. a rotating assembly; 71. a motor; 72. a support frame; 8. a storage assembly; 81. pin holes; 82. an upper open slot plate; 83. and (5) connecting the columns.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.
Referring to fig. 1 to 10, the present utility model is an integrated circuit design simulation device, which comprises a simulation cavity assembly 1, a carrying assembly 5 and a rotating assembly 7, wherein the carrying assembly 5 is connected to the right lower side of the simulation cavity assembly 1, the rotating assembly 7 is connected to the right lower side of the carrying assembly 5, the lifting assembly 4 is connected to the right lower side of the rotating assembly 7, and the supporting assembly 3 is connected to the right lower side of the lifting assembly 4;
specifically, the user places the support assembly 3 on the working surface smoothly, so that the integrated circuit design simulation device is located on the working surface smoothly, the user communicates with an external power supply of the integrated circuit design simulation device, the user connects one end of a cable on the computer with the communication interface 55, and the computer is connected with the communication control board 53;
the user starts the hydraulic cylinder 41 by using the external control end, the hydraulic cylinder 41 is contracted, the rotating assembly 7 moves downwards, the carrying assembly 5 moves downwards, and the storage assembly 8 moves downwards;
the user puts the integrated circuit into the inner side of the upper open slot plate 82, and the pins of the integrated circuit enter the pin holes 81, and the lower ends of the pins penetrate through the connecting posts 83 to be connected with the communication control board 53;
the user starts the hydraulic cylinder 41 again, the hydraulic cylinder 41 stretches, the rotating assembly 7 moves upwards, the carrying assembly 5 moves upwards, the storage assembly 8 moves upwards, and the integrated circuit moves upwards;
the user sequentially starts the second pump body 63 and the first pump body 21 by using the external control end to heat one side of the interior of the lower opening cylinder 11 and cool the other side;
the user controls the external computer to control the communication control board 53 to work, the integrated circuit performs simulation experiments, the ammeter 13 displays the current when the integrated circuit works, and the voltmeter 12 displays the voltage when the integrated circuit works;
the user starts the motor 71, the carrying assembly 5 rotates, the storage assembly 8 rotates, the integrated circuit inside the storage assembly 8 rotates and adjusts, namely the environment where the integrated circuit is located is replaced, and simulation experiments are carried out on the integrated circuit under different environments;
after the simulation experiment is completed, a user starts the hydraulic cylinder 41 by using the external control end, the hydraulic cylinder 41 is contracted, the rotating assembly 7 moves downwards, the carrying assembly 5 moves downwards, the storage assembly 8 moves downwards, and the integrated circuit is fed and discharged.
As shown in fig. 3 and 4, the simulation chamber assembly 1 comprises a lower opening cylinder 11, a voltmeter 12, an ammeter 13, a load device 14 and an upper partition 15; the middle of the upper part of the lower opening cylinder 11 is symmetrically and transversely penetrated and connected with a load device 14, one side of the upper part of the lower opening cylinder 11 is symmetrically and longitudinally penetrated and connected with a voltmeter 12, the other side of the upper part of the lower opening cylinder 11 is symmetrically and longitudinally penetrated and connected with an ammeter 13, and the middle of the lower side of the lower opening cylinder 11 is connected with an upper partition 15 from front to back;
the supporting component 3 comprises a circular bottom plate 31 and supporting feet 32; the round bottom plate 31 is positioned right below the lower opening cylinder 11, the outer sides of the upper parts of the round bottom plate 31 are distributed with supporting legs 32 in an annular array, and the upper sides of the four supporting legs 32 are distributed on the outer sides of the lower parts of the lower opening cylinder 11 in an annular array;
specifically, the user stably places the circular bottom plate 31 on the work surface, the support assembly 3 is stably located on the work surface, the lower opening cylinder 11 is stably located on the work surface, and the simulation chamber assembly 1 is stably located on the work surface, i.e., the integrated circuit design simulation device is stably located on the work surface.
As shown in fig. 5 and 6, the upper part of one side of the periphery of the simulation cavity assembly 1 is connected with a cold guide assembly 6, and the cold guide assembly 6 comprises a second conduit 61, a second mounting seat 62 and a second pump body 63; the inner side of a second mounting seat 62 at the lower side of the second pump body 63 is connected with the upper part of one side of the periphery of the lower opening cylinder 11, a second conduit 61 at the inner side of the second pump body 63 extends into the lower opening cylinder 11, and the inner side end of the second conduit 61 is connected with a spray head 23;
specifically, the user starts the second pump body 63 by using the external control end, and the second pump body 63 is communicated with an external cold air box, cold air in the external cold air box is pumped into the second guide pipe 61 through the second pump body 63, and the cold air in the second guide pipe 61 enters one side of the interior of the lower opening cylinder 11 through the spray head 23, and the temperature of one side of the interior of the lower opening cylinder 11 is reduced;
the upper part of the other side of the periphery of the simulation cavity assembly 1 is connected with a heat conduction assembly 2, and the heat conduction assembly 2 comprises a first pump body 21 and a first mounting seat 22; the inner side of a first mounting seat 22 at the lower side of the first pump body 21 is connected with the upper part of the other side of the periphery of the lower opening cylinder 11, a first conduit 24 at the inner side of the first pump body 21 extends into the lower opening cylinder 11, and a spray head 23 is connected at the inner side end of the first conduit 24;
specifically, the user starts the first pump body 21 using the external control terminal, and the first pump body 21 is communicated with the external cold air box, the cold air in the external cold air box is pumped into the first conduit 24 through the first pump body 21, the cold air in the first conduit 24 enters the other side of the interior of the lower opening cylinder 11 through the spray head 23, and the temperature of the other side of the interior of the lower opening cylinder 11 rises.
As shown in fig. 7, the carrying component 5 includes an upper opening barrel box 51, a lower partition plate 52, a communication control board 53 and a communication data line 54; the upper opening cylinder box 51 is positioned right below the lower opening cylinder 11, the middle part of the upper side of the upper opening cylinder box 51 is connected with a lower partition plate 52 from front to back, the upper side of the upper opening cylinder box 51 is symmetrically connected with a communication control plate 53 in a left-right manner, the middle of the front side of the communication control plate 53 is connected with a communication data wire 54, the front side of the periphery of the upper opening cylinder box 51 is symmetrically provided with a communication interface 55 in a left-right manner, and the front end of the communication data wire 54 is connected with the communication interface 55;
specifically, the user connects one end of the cable on the computer with the communication interface 55, the computer is connected with the communication control board 53, and the user controls the communication control board 53 to work by manipulating the computer.
As shown in fig. 8, the storage component 8 is symmetrically connected to the upper side of the carrying component 5, and the storage component 8 includes an upper open slot plate 82 and a connecting column 83; the two upper opening groove plates 82 are positioned right above the communication control plate 53, pin holes 81 are formed in the upper sides of the upper opening groove plates 82 in a rectangular array, connecting columns 83 are connected to the inner sides of the pin holes 81 in a penetrating manner, and the lower ends of the connecting columns 83 are connected with the upper sides of the communication control plate 53;
specifically, the user puts the integrated circuit inside the upper open slot plate 82, and the pins of the integrated circuit enter the pin holes 81, and the lower ends of the pins penetrate through the connecting posts 83 to be connected with the communication control board 53, so as to control the operation of the integrated circuit by controlling the communication control board 53.
Wherein, as shown in fig. 9, the lifting assembly 4 comprises a hydraulic cylinder 41 and a circular seat 42; the circular seat 42 is positioned right above the circular bottom plate 31, the lower side of the circular seat 42 is symmetrically connected with the hydraulic cylinder 41 left and right, and the lower side of the hydraulic cylinder 41 is connected with the upper side of the circular bottom plate 31;
specifically, when the hydraulic cylinder 41 is contracted, the circular seat 42 moves downwards, the rotating assembly 7 moves downwards, the carrying assembly 5 moves downwards, the storage assembly 8 moves downwards, integrated circuits in the storage assembly 8 leak out, and the user performs loading and unloading on the integrated circuits; when the hydraulic cylinder 41 is extended, the circular seat 42 moves upward, the rotating assembly 7 moves upward, the carrying assembly 5 moves upward, and the storage assembly 8 moves upward.
As shown in fig. 10, the rotating assembly 7 includes a supporting frame 71 and a motor 72; the motor 72 is positioned in the middle of the upper side of the circular seat 42, the supporting frames 71 are distributed on the periphery of the rotating shaft on the upper side of the motor 72 in an annular array, and the outer parts of the upper sides of the three supporting frames 71 are connected with the outer parts of the lower sides of the upper opening cylinder boxes 51;
specifically, the user uses the external control terminal to start the motor 72, the support frame 71 rotates, the carrying component 5 rotates, the storage component 8 rotates, and the integrated circuit inside the storage component 8 moves, i.e. the position of the integrated circuit is adjusted.
The foregoing is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, and any modification, equivalent replacement, and improvement of some of the technical features described in the foregoing embodiments are all within the scope of the present utility model.

Claims (9)

1. An integrated circuit design simulation device, includes simulation chamber subassembly (1), year thing subassembly (5) and rotation subassembly (7), its characterized in that: the simulation chamber assembly (1) is connected with the year thing subassembly (5) directly under, it is connected with rotation subassembly (7) to carry thing subassembly (5) directly under, rotation subassembly (7) directly under side is connected with lifting unit (4), lifting unit (4) directly under side is connected with supporting component (3).
2. An integrated circuit design simulation apparatus according to claim 1, wherein: the simulation cavity assembly (1) comprises a lower opening cylinder (11), a voltmeter (12), an ammeter (13), a load device (14) and an upper partition plate (15); the load device (14) is connected in a penetrating way in the middle of the upper part of the lower opening cylinder (11), the voltmeter (12) is connected in a penetrating way in the front-back symmetry on one side of the upper part of the lower opening cylinder (11), the ammeter (13) is connected in a penetrating way in the front-back symmetry on the other side of the upper part of the lower opening cylinder (11), and the upper partition plate (15) is connected in the middle of the lower side of the lower opening cylinder (11) from front to back.
3. An integrated circuit design simulation apparatus according to claim 1, wherein: the supporting component (3) comprises a round bottom plate (31) and supporting feet (32); the circular bottom plate (31) is located under the lower opening cylinder (11), the supporting legs (32) are distributed on the outer side of the upper portion of the circular bottom plate (31) in an annular array mode, and the four supporting legs (32) are distributed on the outer side of the lower portion of the lower opening cylinder (11) in an annular array mode.
4. An integrated circuit design simulation apparatus according to claim 2, wherein: the upper part of one side of the periphery of the simulation cavity assembly (1) is connected with a cold guide assembly (6), and the cold guide assembly (6) comprises a second guide pipe (61), a second mounting seat (62) and a second pump body (63); the inner side of the second mounting seat (62) at the lower side of the second pump body (63) is connected with the upper part of one side of the periphery of the lower opening cylinder (11), the second guide pipe (61) at the inner side of the second pump body (63) extends into the lower opening cylinder (11), and the inner side end of the second guide pipe (61) is connected with a spray head (23).
5. An integrated circuit design simulation apparatus according to claim 2, wherein: the upper part of the other side of the periphery of the simulation cavity assembly (1) is connected with a heat conduction assembly (2), and the heat conduction assembly (2) comprises a first pump body (21) and a first mounting seat (22); the inner side of the first mounting seat (22) at the lower side of the first pump body (21) is connected with the upper part of the other side of the periphery of the lower opening cylinder (11), a first guide pipe (24) at the inner side of the first pump body (21) extends into the lower opening cylinder (11), and a spray head (23) is connected at the inner side end of the first guide pipe (24).
6. An integrated circuit design simulation apparatus according to claim 1, wherein: the carrying component (5) comprises an upper opening cylinder box (51), a lower partition plate (52), a communication control board (53) and a communication data line (54); the upper opening cylinder box (51) is located the downside of the lower opening cylinder (11), be connected with in the middle of upper opening cylinder box (51) upside from front to back direction baffle (52) down, upper opening cylinder box (51) upside bilateral symmetry is connected with communication control board (53), be connected with communication data line (54) in the middle of communication control board (53) front side, communication interface (55) have been seted up to upper opening cylinder box (51) periphery front side bilateral symmetry, communication data line (54) front end is connected with communication interface (55).
7. The integrated circuit design simulation apparatus of claim 6, wherein: the upper side of the carrying component (5) is symmetrically connected with a storage component (8) left and right, and the storage component (8) comprises an upper opening groove plate (82) and a connecting column (83); two upper opening frid (82) are located communication control panel (53) directly over, pin hole (81) have been seted up to upper opening frid (82) upside in rectangular array, pin hole (81) inboard through-connection has spliced pole (83), spliced pole (83) lower extreme with communication control panel (53) upside is connected.
8. An integrated circuit design simulation apparatus according to claim 1, wherein: the lifting assembly (4) comprises a hydraulic cylinder (41) and a circular seat (42); the round base (42) is located right above the round base plate (31), the hydraulic cylinders (41) are symmetrically connected to the lower side of the round base (42) in a left-right mode, and the lower sides of the hydraulic cylinders (41) are connected to the upper side of the round base plate (31).
9. An integrated circuit design simulation apparatus according to claim 1, wherein: the rotating assembly (7) comprises a supporting frame (71) and a motor (72); the motor (72) is located in the middle of the upper side of the circular seat (42), the supporting frames (71) are distributed on the periphery of a rotating shaft on the upper side of the motor (72) in an annular array mode, and the outer parts of the upper sides of the three supporting frames (71) are connected with the outer parts of the lower sides of the upper opening cylinder boxes (51).
CN202223206863.3U 2022-11-29 2022-11-29 Integrated circuit design simulation device Active CN219107893U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223206863.3U CN219107893U (en) 2022-11-29 2022-11-29 Integrated circuit design simulation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223206863.3U CN219107893U (en) 2022-11-29 2022-11-29 Integrated circuit design simulation device

Publications (1)

Publication Number Publication Date
CN219107893U true CN219107893U (en) 2023-05-30

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Application Number Title Priority Date Filing Date
CN202223206863.3U Active CN219107893U (en) 2022-11-29 2022-11-29 Integrated circuit design simulation device

Country Status (1)

Country Link
CN (1) CN219107893U (en)

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