CN219107790U - High-temperature-resistant multilayer printed circuit board - Google Patents

Abstract

The utility model discloses a high-temperature-resistant multilayer printed circuit board which comprises a first circuit board, a second circuit board and a third circuit board, wherein the first circuit board, the second circuit board and the third circuit board are vertically distributed from top to bottom, fixing plates are fixed on the side walls of the first circuit board and the third circuit board, fixing blocks are fixed on the side walls of the second circuit board, and grooves matched with the fixing plates are formed in the upper end and the lower end of each fixing block. This high temperature resistant multilayer printed circuit board through can insert the fixed plate in the inside recess of fixed block, when the inserted bar corresponds with the draw-in groove of fixed plate inside, the staff can loosen the handle, can drive the inserted bar under the elasticity reset effect of extension spring and insert inside the draw-in groove to can run through the fixed plate completely, reach the installation effect, this kind of mounting means is stronger under extension spring's effect stability, ensures difficult emergence and drops between first circuit board, second circuit board and the third circuit board.

Description

High-temperature-resistant multilayer printed circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a high-temperature-resistant multilayer printed circuit board.

Background

The double-sided board is a medium layer in the middle, the two sides are wiring layers, the multi-sided board is a multi-layer wiring layer, the medium layer is arranged between every two layers, the medium layer can be made thin, the multi-layer circuit board is at least provided with three conductive layers, two layers are arranged on the outer surface, the rest layer is combined in the insulating board, and the electrical connection between the layers is usually realized through plated through holes on the cross section of the circuit board.

For example, chinese issued patent, publication No.: the utility model provides a high temperature resistant multilayer printed circuit board of CN213244500U, includes first circuit board, second circuit board and third circuit board, the top of first circuit board is provided with the second circuit board, the top of second circuit board is provided with the third circuit board, the one end of slider is fixed with the fixture block, the top of third circuit board is provided with dustproof construction, can carry out the integral erection with the multilayer circuit board to guarantee the stability that equipment used.

But this kind of mounting means stability is lower, and the fixture block slides in the draw-in groove and installs, but still can lead to fixture block and draw-in groove to drop, and then leads to the three-layer circuit board to drop, causes the installation trouble, has reduced the installation effectiveness of equipment.

Disclosure of Invention

(one) solving the technical problems

Aiming at the defects of the prior art, the utility model provides the high-temperature-resistant multilayer printed circuit board, the fixing plate can be inserted into the groove in the fixing block, when the inserting rod corresponds to the clamping groove in the fixing plate, a worker can loosen the handle, the inserting rod can be driven to be inserted into the clamping groove under the elastic reset action of the telescopic spring, and the fixing plate can be completely penetrated, so that the installation effect is achieved, the installation mode has stronger stability under the action of the telescopic spring, the advantages of difficulty in falling off among the first circuit board, the second circuit board and the third circuit board and the like are ensured, and the problems proposed by the background technology are solved.

(II) technical scheme

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a high temperature resistant multilayer printed circuit board, includes first circuit board, second circuit board and third circuit board, first circuit board, second circuit board and third circuit board are vertical distribution from top to bottom, first circuit board and third circuit board lateral wall are fixed with the fixed plate, second circuit board lateral wall is fixed with the fixed block, both ends all have seted up the recess that mutually matches with the fixed plate about the fixed block;

the fixed plate is connected with the fixed block through a limiting component.

Preferably, the limiting component comprises a connecting plate, an inserting rod and a clamping groove, the connecting plate is fixed on the side wall of the second circuit board, the clamping grooves corresponding to the fixing plate and the fixing block are formed in the fixing plate, and the inserting rod matched with the clamping groove is penetrated in the connecting plate.

Preferably, two sets of inserted bars are close to the one end of connecting plate and are fixed with the fly leaf, the side that the fly leaf kept away from the inserted bar is fixed with the handle.

Preferably, two groups of the outer walls of the inserting rods are wound with telescopic springs, one ends of the telescopic springs are connected with the movable plate, and the other ends of the telescopic springs are connected with the connecting plate.

Preferably, the first circuit board, the second circuit board and the third circuit board are internally provided with corresponding first heat dissipation holes, and a heat dissipation part is arranged on one side surface of each of the first circuit board, the second circuit board and the third circuit board adjacent to each other.

Preferably, the heat dissipation component comprises a heat conduction column, a heat conduction sleeve and second heat dissipation holes, the heat conduction column is respectively fixed at the bottom ends of the first circuit board and the second circuit board, the heat conduction sleeve is respectively fixed at the top ends of the second circuit board and the third circuit board and is sleeved on the outer wall of the heat conduction column, and a plurality of groups of second heat dissipation holes are formed in the outer wall of the heat conduction sleeve.

(III) beneficial effects

Compared with the prior art, the utility model has the following beneficial effects:

1. this high temperature resistant multilayer printed circuit board through setting up fixed plate, the fixed block, the recess, the connecting plate, the inserted bar, the draw-in groove, the fly leaf, handle and extension spring, pull the handle earlier, thereby drive two inserted bars and remove, and drive extension spring and receive tensile, later with first circuit board and third circuit board to second circuit board one side promote, the fixed plate can insert in the inside recess of fixed block this moment, when the inserted bar corresponds with the draw-in groove of fixed plate inside, the staff can loosen the handle, can drive the inserted bar under extension spring's elasticity reset effect and insert the draw-in groove inside, and can run through the fixed plate completely, reach the installation effect, this kind of mounting means is stronger at extension spring's effect down stability, be difficult for taking place to drop between first circuit board, second circuit board and the third circuit board.

2. This high temperature resistant multilayer printed circuit board through setting up first louvre, heat conduction post, heat conduction sleeve and second louvre, and the outside air can flow through first louvre on first circuit board, second circuit board and the third circuit board, and heat conduction post and heat conduction sleeve can be the heat conduction silica gel, and the heat conduction silica gel is the heat conduction compound of high-end to and can not the solidification, can avoid the risk such as circuit short circuit by the electrically conductive characteristic, thereby can realize heat transmission, can also carry out further heat dissipation through the second louvre simultaneously, has strengthened the radiating efficiency of equipment.

Drawings

FIG. 1 is a schematic perspective view of the present utility model;

FIG. 2 is a schematic cross-sectional view of a mounting block of the present utility model;

FIG. 3 is an enlarged schematic view of the structure of FIG. 2A according to the present utility model;

fig. 4 is a schematic diagram of the left side view structure of the present utility model.

In the figure: 1. a first circuit board; 2. a second circuit board; 3. a third circuit board; 411. a fixing plate; 412. a fixed block; 413. a groove; 414. a connecting plate; 415. a rod; 416. a clamping groove; 417. a movable plate; 418. a handle; 419. a telescopic spring; 511. a first heat radiation hole; 512. a heat conducting column; 513. a thermally conductive sleeve; 514. and a second heat dissipation hole.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Examples

Referring to fig. 1-4, a high temperature resistant multi-layer printed circuit board comprises a first circuit board 1, a second circuit board 2 and a third circuit board 3, wherein the first circuit board 1, the second circuit board 2 and the third circuit board 3 are vertically distributed from top to bottom, a fixing plate 411 is fixed on the side walls of the first circuit board 1 and the third circuit board 3, a fixing block 412 is fixed on the side wall of the second circuit board 2, and grooves 413 matched with the fixing plate 411 are formed in the upper end and the lower end of the fixing block 412. The fixed plate 411 is connected with the fixed block 412 through a limiting component, and the fixed plate 411 on the first circuit board 1 and the third circuit board 3 can be inserted into the groove 413 inside the fixed block 412 for preliminary limiting, and can play a further stabilizing effect through the limiting component.

Spacing subassembly includes connecting plate 414, inserted bar 415 and draw-in groove 416, and connecting plate 414 is fixed in the 2 lateral walls of second circuit board, and fixed plate 411 and fixed block 412 are inside to be offered to corresponding draw-in groove 416, and connecting plate 414 inside runs through have with draw-in groove 416 mutually supporting inserted bar 415, inserted bar 415 can run through connecting plate 414, fixed block 412 and fixed plate 411 in proper order to realize the reinforcement effect, guarantee that fixed plate 411 can not appear reciprocating and drop, reach fine spacing purpose. Two sets of inserted bars 415 are close to the one end of connecting plate 414 and are fixed with fly leaf 417, and the side one side that the inserted bar 415 was kept away from to fly leaf 417 is fixed with handle 418, and fly leaf 417 can play the guard objective, ensures that inserted bar 415 can not drop with in the connecting plate 414, sets up handle 418 simultaneously and can be convenient for the staff and operate, has strengthened the travelling comfort that equipment used. The outer walls of the two groups of inserting rods 415 are wound with the telescopic springs 419, one end of each telescopic spring 419 is connected with the movable plate 417, the other end of each telescopic spring 419 is connected with the connecting plate 414, the telescopic springs 419 are arranged to play a role in elastic reset, after the handles 418 are pulled, the telescopic springs 419 can be driven to stretch, then the fixed plates 411 are inserted into the grooves 413 in the fixed blocks 412, the handles 418 are loosened finally, the inserting rods 415 can be driven to completely penetrate through the clamping grooves 416 under the elastic reset effect of the telescopic springs 419, the installation effect is achieved, and the installation mode is firmer and the operation is convenient.

Corresponding first radiating holes 511 are formed in the first circuit board 1, the second circuit board 2 and the third circuit board 3, radiating components are arranged on one adjacent side face of the first circuit board 1, the second circuit board 2 and the third circuit board 3, and the first radiating holes 511 can achieve a primary radiating effect. The heat dissipation component includes heat conduction post 512, heat conduction sleeve 513 and second louvre 514, heat conduction post 512 is fixed in first circuit board 1 and second circuit board 2 bottom respectively, heat conduction sleeve 513 is fixed in second circuit board 2 and third circuit board 3 top respectively and cup joints in heat conduction post 512 outer wall, a plurality of groups of second louvres 514 have been seted up to heat conduction sleeve 513 outer wall, heat conduction post 512 can insert in the heat conduction sleeve 513, preliminary location is carried out, and heat conduction post 512 and heat conduction sleeve 513 can be the heat conduction silica gel, the heat conduction silica gel is the heat conduction compound of high-end, and can not solidifie, the risk such as circuit short circuit can be avoided to can realize heat transmission, and set up a plurality of second louvres 514 at heat conduction sleeve 513 outer wall and can dispel the heat, further heat dissipation purpose has been reached, the safety in utilization of first circuit board 1, second circuit board 2 and third circuit board 3 has been strengthened.

Working principle: when the first circuit board 1, the second circuit board 2 and the third circuit board 3 are required to be installed, the handle 418 is pulled firstly, so that the two inserting rods 415 are driven to move, the telescopic springs 419 are driven to stretch, then the first circuit board 1 and the third circuit board 3 are pushed to one side of the second circuit board 2, at the moment, the fixing plate 411 can be inserted into the groove 413 in the fixing block 412, when the inserting rods 415 correspond to the clamping grooves 416 in the fixing plate 411, a worker can loosen the handle 418, the inserting rods 415 can be driven to be inserted into the clamping grooves 416 under the elastic reset action of the telescopic springs 419, the fixing plate 411 can be completely penetrated, the installation effect is achieved, the installation mode is higher in stability under the action of the telescopic springs 419, and the fact that falling of the first circuit board 1, the second circuit board 2 and the third circuit board 3 is difficult to occur is ensured.

When the heat dissipation device is used, external air can flow through the first heat dissipation holes 511 on the first circuit board 1, the second circuit board 2 and the third circuit board 3, heat can be conducted through the heat conduction columns 512 and the heat conduction sleeves 513, and meanwhile, further heat dissipation can be conducted through the second heat dissipation holes 514, so that the heat dissipation efficiency of the device is improved.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a high temperature resistant multilayer printed circuit board, includes first circuit board (1), second circuit board (2) and third circuit board (3), first circuit board (1), second circuit board (2) and third circuit board (3) top-down are vertical distribution, its characterized in that: the side walls of the first circuit board (1) and the third circuit board (3) are fixed with fixing plates (411), the side wall of the second circuit board (2) is fixed with fixing blocks (412), and grooves (413) matched with the fixing plates (411) are formed in the upper end and the lower end of each fixing block (412);

the fixing plate (411) is connected with the fixing block (412) through a limiting component.

2. The high temperature resistant multilayer printed circuit board of claim 1, wherein: the limiting assembly comprises a connecting plate (414), a plug rod (415) and a clamping groove (416), wherein the connecting plate (414) is fixed on the side wall of the second circuit board (2), the clamping groove (416) corresponding to the fixing plate (411) and the fixing block (412) are formed in the fixing plate, and the plug rod (415) matched with the clamping groove (416) is penetrated in the connecting plate (414).

3. The high temperature resistant multilayer printed circuit board of claim 2, wherein: two sets of inserted bars (415) are close to one end of connecting plate (414) and are fixed with fly leaf (417), side one side that fly leaf (417) kept away from inserted bar (415) is fixed with handle (418).

4. A high temperature resistant multilayer printed circuit board according to claim 3, wherein: the outer walls of the two groups of inserting rods (415) are wound with telescopic springs (419), one ends of the telescopic springs (419) are connected to the movable plate (417), and the other ends of the telescopic springs are connected to the connecting plate (414).

5. The high temperature resistant multilayer printed circuit board of claim 1, wherein: corresponding first radiating holes (511) are formed in the first circuit board (1), the second circuit board (2) and the third circuit board (3), and radiating components are arranged on one side face, adjacent to the first circuit board (1), the second circuit board (2) and the third circuit board (3).

6. The high temperature resistant multilayer printed circuit board of claim 5, wherein: the heat dissipation component comprises a heat conduction column (512), a heat conduction sleeve (513) and a second heat dissipation hole (514), wherein the heat conduction column (512) is respectively fixed at the bottom ends of the first circuit board (1) and the second circuit board (2), the heat conduction sleeve (513) is respectively fixed at the top ends of the second circuit board (2) and the third circuit board (3) and is sleeved on the outer wall of the heat conduction column (512), and a plurality of groups of second heat dissipation holes (514) are formed in the outer wall of the heat conduction sleeve (513).

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