CN219106083U

CN219106083U - Semiconductor chip solidification processing box

Info

Publication number: CN219106083U
Application number: CN202223421452.6U
Authority: CN
Inventors: 施振潮
Original assignee: Guangdong Kehui Semiconductor Co ltd
Current assignee: Guangdong Kehui Semiconductor Co ltd
Priority date: 2022-12-19
Filing date: 2022-12-19
Publication date: 2023-05-30
Anticipated expiration: 2032-12-19

Abstract

The utility model discloses a semiconductor chip curing treatment box, and relates to the technical field of semiconductor chip production equipment. The automatic feeding device comprises a box body, feeding components and a material rack, wherein a supporting column is welded on the side wall of the bottom of the box body, the box body is connected with a base through the supporting column, the feeding components are arranged on the box body, curtains are arranged in the side walls of the left end and the right end of the box body, air discs are embedded in the centers of the side walls of the front end and the rear end of the box body, and the air discs are connected with an air pump through air pipes; a gear is sleeved on a rotating shaft of a driving motor in the feeding assembly and connected with a material plate through a rack, and a material rack is arranged in a material groove on the material plate in a clamping manner. According to the utility model, the bottom and top environments of the semiconductor chip can be heated respectively through the bottom heating plate and the top heating plate, and the hot gas in the cavity can form certain fluidity through the cooperation of the air pipe and the air pump, so that the purpose of uniform temperature in the box body is achieved, and the automatic feeding or discharging work of the semiconductor chip can be realized through the feeding component.

Description

Semiconductor chip solidification processing box

Technical Field

The utility model belongs to the technical field of semiconductor chip production equipment, and particularly relates to a semiconductor chip curing treatment box.

Background

With the development of chip technology, the semiconductor chip gradually becomes mainstream in the present stage, the performance and the service life of the semiconductor chip exceed those of the traditional chip, but the manufacturing difficulty of the semiconductor chip is also huge, and various technology type devices are needed to be matched with each other, wherein a curing box is included, the curing box is utilized to cure the semiconductor chip after injection molding and packaging, so that the chip performance is more complete, but the following defects still exist in the practical use:

1. the existing curing treatment box for processing the semiconductor chip has the problem that the temperature required by curing is 50-170 ℃ when in use, and the heating effect of the traditional curing treatment box is not cyclic, so that certain heating temperature is not uniform;

2. the existing curing treatment box for processing semiconductor chips is characterized in that when the curing treatment box is used, the chips are required to be manually stretched into the curing box to be placed on a curing table for heating and curing, and after the curing is finished, the chips are manually stretched into the curing box again to be taken out, and the box body still has higher heat, so that a certain risk of scalding and burning can be generated.

Therefore, the existing curing box for semiconductor chips cannot meet the requirements in practical use, so there is an urgent need for improved technology in the market to solve the above-mentioned problems.

Disclosure of Invention

The utility model aims to provide a semiconductor chip curing treatment box, and the cooperation of an air pipe and an air pump enables hot gas in the whole chamber to form certain fluidity, so that the aim of uniform temperature in the box body is fulfilled, the feeding assembly can realize automatic feeding or discharging of semiconductor chips, and the problems of the existing curing treatment box for processing semiconductor chips are solved.

In order to solve the technical problems, the utility model is realized by the following technical scheme:

the utility model relates to a semiconductor chip curing treatment box which comprises a box body, a feeding assembly and a material rack, wherein a supporting column is welded on the side wall of the bottom of the box body, the box body is connected with a base through the supporting column, the feeding assembly is arranged on the box body, curtains are arranged in the side walls of the left end and the right end of the box body, air discs are inlaid in the centers of the side walls of the front end and the rear end of the box body, and the air discs are connected with an air pump through air pipes.

The inside of the box body is provided with a curing groove, the centers of the left side wall and the right side wall of the curing groove are provided with air grooves, the bottom of the curing groove is provided with sliding grooves, and the number of the sliding grooves is two; specifically, the material plate can be driven to slide back and forth in the material plate through the sliding groove, so that the feeding and returning work of the material plate and the material frame on the material plate can be met.

The utility model has the following beneficial effects:

1. according to the utility model, the bottom heating plate, the top heating plate and the air pump are arranged, so that the bottom surface and the top surface of the semiconductor chip can be heated respectively through the bottom heating plate and the top heating plate when the semiconductor chip is used, meanwhile, the hot gas in the whole chamber forms certain fluidity through the cooperation of the air pipe and the air pump, the purpose of uniform temperature in the box body is achieved, the problem that the existing solidification treatment box for processing the semiconductor chip is not circulated due to the heating effect of the traditional solidification treatment box, and the problem of non-uniform heating due to the fact that the temperature required by solidification is 50-170 ℃ when the solidification treatment box is used is solved.

2. According to the utility model, the feeding assembly is arranged, when the device is used, the material plate and the material rack in the device can be driven to move back outside the box body through the cooperation of the driving motor and the gear and the rack, heating and solidifying treatment and cooling treatment can be carried out when the device moves into the box body, and feeding or discharging work can be carried out when the device moves out of the box body, so that the problem that the existing solidifying treatment box for processing the semiconductor chip needs to be manually stretched into the solidifying box to place the chip on the solidifying table for heating and solidifying is solved, and after solidification is completed, the chip is manually stretched into the solidifying box again to be taken out, and the box body still has higher heat, so that a certain risk of scalding and burning can be generated.

Drawings

Fig. 1 is a schematic view of a semiconductor chip curing process tank;

FIG. 2 is a structural exploded view of the case;

FIG. 3 is a structural exploded view of the feed assembly;

fig. 4 is a schematic structural view of the material rack.

In the drawings, the list of components represented by the various numbers is as follows:

1. a case; 101. a curing tank; 102. an air tank; 103. a chute; 104. a bottom heating plate; 105. a top heating plate; 2. a support column; 3. a base; 4. a feeding assembly; 401. a driving motor; 402. a gear; 403. a rack; 404. a material plate; 405. a material tank; 406. a material rack; 4061. a chassis; 4062. a first clamping groove; 4063. a second clamping groove; 4064. a spring post; 4065. a clamping plate; 4066. a rubber pad; 5. a curtain; 6. an air tray; 7. an air pipe; 8. an air pump.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.

Referring to fig. 1 to 4, the utility model discloses a curing processing box for semiconductor chips, which comprises a box body 1, a feeding assembly 4 and a material rack 406, wherein a supporting column 2 is welded on the side wall of the bottom of the box body 1, the box body 1 is connected with a base 3 through the supporting column 2, the feeding assembly 4 is installed on the box body 1, curtains 5 are installed in the side walls of the left end and the right end of the box body 1, air discs 6 are embedded in the centers of the side walls of the front end and the rear end of the box body 1, and the air discs 6 are connected with an air pump 8 through air pipes 7.

As shown in fig. 1 and 2, a curing tank 101 is arranged in the box 1, air tanks 102 are arranged at the centers of the left side wall and the right side wall of the curing tank 101, sliding grooves 103 are arranged at the bottom of the curing tank 101, and two sliding grooves 103 are arranged in total; specifically, the chute 103 can promote the material plate 404 to slide back and forth therein, so as to meet the requirement of feeding and discharging the material plate 404 and the material rack 406 thereon; a bottom heating plate 104 is embedded on the bottom inner wall of the curing tank 101, a top heating plate 105 is embedded on the top inner wall of the curing tank 101, and the box body 1 is in sliding connection with the bottom side wall of the material plate 404 through a sliding chute 103; the curtains 5 are arranged in a plurality, the curtains 5 are mutually staggered and laminated, and the top side wall of the curtain 5 is connected with the top inner wall of the material inlet and outlet slot on two sides of the box body 1 through bolts.

As shown in fig. 2 and 3, the feeding assembly 4 includes a driving motor 401, a material plate 404 and a material rack 406, a gear 402 is sleeved on a rotating shaft of the driving motor 401, the gear 402 is connected with the material plate 404 through a rack 403, and the material rack 406 is clamped in a material groove 405 on the material plate 404; a driving motor 401 in the feeding assembly 4 is connected with the bottom side wall of the box body 1 through a motor frame, and the driving motor 401 is meshed and connected with the bottom side wall of a rack 403 through a gear 402; specifically, the rack 403 can be driven to move back and forth by the driving motor 401 and the gear 402, so that the purpose of adjusting the positions of the material plate 404 and the material rack 406 is achieved; the top side wall of the rack 403 is connected with the bottom side wall of the material plate 404 in an adhesive manner through a connecting column, the upper side wall of the material plate 404 is provided with a material groove 405, and the material groove 405 is connected with a bottom frame 4061 on a material frame 406; specifically, when in use, the material rack 406 is directly placed in the material groove 405 of the material plate 404, and then gradually enters the box 1 under the action of the driving motor 401.

As shown in fig. 3 and 4, the top side wall of the rack 403 is adhesively connected with the bottom side wall of the material plate 404 through a connecting column, the upper side wall of the material plate 404 is provided with a material groove 405, the material groove 405 is connected with a bottom frame 4061 on a material frame 406, a first clamping groove 4062 and a second clamping groove 4063 are arranged in the material frame 406, the inner walls at the corners of the first clamping groove 4062 and the second clamping groove 4063 are connected with a clamping plate 4065 through a spring column 4064, and rubber pads 4066 are embedded in the inner walls of the clamping plate 4065; specifically, the clamping plate 4065 is clamped with the corner of the semiconductor chip through the rubber pad 4066, and the stability of the semiconductor chip can be maintained through the pressurizing and clamping work of the spring column 4064, so that the upper side surface and the lower side surface of the semiconductor chip are exposed.

When in use, the feeding work of the semiconductor chip is realized through the curtain 5 at one side of the box body 1, and the curtain 5 at the other side of the box body 1 realizes material returning; the semiconductor chip is placed on a material plate 404 on the feeding component 4 and is clamped with a material groove 405 on the material plate 404, then the material plate 404 with the semiconductor chip is input into a curing groove 101 in the box body 1 through a driving motor 401 under the cooperation of a gear 402 and a rack 403, the heating curing effect of the semiconductor chip is realized through a bottom heating plate 104 and a top heating plate 105 in the curing groove 101, after the heating curing is finished, the feeding component 4 works again, the feeding component continues to convey to a curtain 5 on the other side of the box body 1 under the action of the driving motor 401, and the heating curing process is finished after the curtain 5 is conveyed out of the box body 1, wherein in the curing heating process, an air pump 8 is always in a working state, and the air pump 8 forms certain fluidity through the flow guiding effect of an air pipe 7 and an air disc 6, so that the temperature in a chamber in the whole box body 1 is uniform.

The foregoing is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, and any modification, equivalent replacement, and improvement of some of the technical features described in the foregoing embodiments are all within the scope of the present utility model.

Claims

1. The utility model provides a semiconductor chip solidification processing case, includes box (1), feeding component (4) and material frame (406), its characterized in that: the utility model discloses a feeding device for a gas turbine, including box (1), support column (2) have been welded on the bottom lateral wall of box (1), box (1) is connected with base (3) through support column (2), install feeding subassembly (4) on box (1), all install curtain (5) in the left and right sides both ends lateral wall of box (1), inlay in the front and back both ends lateral wall center department of box (1) has gas dish (6), just gas dish (6) are connected with air pump (8) through trachea (7).

2. A semiconductor chip curing process kit as defined in claim 1, wherein: the novel curing box is characterized in that a curing groove (101) is formed in the box body (1), air grooves (102) are formed in the centers of the left side wall and the right side wall of the curing groove (101), sliding grooves (103) are formed in the bottom of the curing groove (101), and two sliding grooves (103) are formed in the center.

3. A semiconductor chip curing process kit as defined in claim 1, wherein: the feeding assembly (4) comprises a driving motor (401), a material plate (404) and a material frame (406), a gear (402) is sleeved on a rotating shaft of the driving motor (401), the gear (402) is connected with the material plate (404) through a rack (403), and the material frame (406) is arranged in a material groove (405) in the material plate (404) in a clamping mode.

4. A semiconductor chip curing process kit as defined in claim 2, wherein: bottom heating plate (104) is inlaid on the bottom inner wall of the solidification groove (101), and top heating plate (105) is inlaid on the top inner wall of the solidification groove (101), and the box body (1) is in sliding connection with the bottom side wall of the material plate (404) through the sliding groove (103).

5. A semiconductor chip curing process kit as defined in claim 3, wherein: the driving motor (401) in the feeding assembly (4) is connected with the bottom side wall of the box body (1) through a motor frame, and the driving motor (401) is connected with the bottom side wall of the rack (403) in a meshed mode through the gear (402).

6. A semiconductor chip curing process kit as defined in claim 5, wherein: the top lateral wall of rack (403) through linking post with the bottom lateral wall bonding of material board (404) is connected, material groove (405) have been seted up to the upper lateral wall of material board (404), just material groove (405) are connected with chassis (4061) on material frame (406).

7. The semiconductor chip curing process kit as defined in claim 6, wherein: the material rack (406) is provided with a first clamping groove (4062) and a second clamping groove (4063), the inner walls of the corners of the first clamping groove (4062) and the second clamping groove (4063) are connected with a clamping plate (4065) through spring columns (4064), and rubber pads (4066) are inlaid on the inner walls of the clamping plate (4065).

8. A semiconductor chip curing process kit as defined in claim 1, wherein: the curtain (5) is provided with a plurality of pieces, the curtains (5) are arranged in a staggered and attached mode, and the top end side wall of the curtain (5) is connected with the top end inner wall of the material inlet and outlet opening on two sides of the box body (1) through bolts.