CN219096046U - PCB gong board mould - Google Patents
PCB gong board mould Download PDFInfo
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- CN219096046U CN219096046U CN202223385854.5U CN202223385854U CN219096046U CN 219096046 U CN219096046 U CN 219096046U CN 202223385854 U CN202223385854 U CN 202223385854U CN 219096046 U CN219096046 U CN 219096046U
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Abstract
The utility model discloses a routing die for a PCB, which has the technical scheme that: including the lower mould, two lower die cavities have been seted up to the inside lower mould, two spouts have all been seted up to lower die cavity one side, the die cavity has been seted up at the lower mould top, the die cavity inside is equipped with down the contour plate, contour plate both sides all are equipped with the elastic component down, and a PCB board gong board mould has the beneficial effect: the auxiliary upper pressing plate and the main upper pressing plate are matched with the lower pressing plate to carry out milling pressing on the PCB during die assembly, when the pressing is finished to open the die, the auxiliary upper pressing plate and the main upper pressing plate are staggered to push the PCB, so that the situation that the PCB is adhered to the auxiliary upper pressing plate and the main upper pressing plate and needs manual cleaning is prevented, the situation that the PCB is not adhered is similarly caused, the spring is contracted, the lower pressing plate drives the PCB to move out of the pressing cavity, the purpose of automatically ejecting the PCB is achieved, manual removal from the pressing cavity is not needed, labor intensity is reduced, and safety is improved.
Description
Technical Field
The utility model relates to the technical field of PCB routing, in particular to a PCB routing die.
Background
The PCB board needs to be processed out the recess through gong board technology, and the mould generally includes two parts of movable mould and cover half, and both can divide and close, processes the work piece when folding, takes out the finished piece when dividing, and the mould has high accuracy batch production's characteristics, can carry out batch processing to the PCB board through the mould to improve PCB board production efficiency and production quality.
When the existing PCB routing die is used for processing a PCB, a workpiece needs to be manually taken out of a die cavity, meanwhile, the PCB is easy to adhere to the die due to extrusion during the pressing of the PCB, manual cleaning is needed, the working strength is increased, and meanwhile, potential safety hazards are increased.
Disclosure of Invention
Therefore, the utility model provides the PCB routing die, which solves the problem that the workpiece needs to be taken out of the die cavity manually by automatically ejecting and pushing the workpiece, and the PCB is adhered to the upper die due to extrusion.
In order to achieve the above object, the present utility model provides the following technical solutions: the utility model provides a PCB board gong board mould, includes the lower mould, two lower die cavities have been seted up to the lower mould inside, two spout has all been seted up to lower die cavity one side, the die cavity has been seted up at the lower mould top, die cavity inside is equipped with down the contour plate, lower contour plate both sides all are equipped with the material subassembly, the material subassembly includes two connecting blocks, two connecting block one end is fixed to be equipped with the connecting plate, the connecting plate bottom is equipped with two spring one, the lower mould top is equipped with the upper mould, the upper die cavity has been seted up to the upper mould inside, a plurality of mounting holes have been seted up to the upper die cavity inside, a plurality of the mounting hole is inside all to be equipped with the spring two, the inside movable frame that is equipped with of upper die cavity, the fixed vice top board that is equipped with in movable frame bottom, two stoppers are all fixed to be equipped with in vice top board both sides, two spacing grooves have all been seted up to main top board bottom the upper die.
Preferably, a plurality of damping assemblies are arranged between the lower die and the upper die, each damping assembly comprises a guide pillar and a sleeve, the top of each guide pillar is fixedly connected with the upper die, the bottom of each sleeve is fixedly connected with the lower die, the guide pillars are in sliding connection with the sleeves, and damping springs are arranged inside the sleeves.
Preferably, the sliding groove is respectively communicated with the lower die cavity and the compression cavity.
Preferably, the bottom of the first spring is fixedly connected with the bottom of the lower die cavity, and the top of the first spring is fixedly connected with the connecting plate.
Preferably, the connecting plate is arranged in the lower die cavity and is in sliding connection with the lower die cavity.
Preferably, the connecting block is arranged in the chute and is in sliding connection with the chute.
Preferably, the lower profiled plate is in sliding connection with the profiling cavity.
Preferably, the top of the second spring is fixedly connected with the top of the mounting hole, the bottom of the second spring is fixedly connected with the movable frame, and the movable frame is in sliding connection with the upper die cavity.
Preferably, the auxiliary upper pressing plate is sleeved outside the main upper pressing plate and is in sliding connection with the main upper pressing plate.
Preferably, the limiting blocks respectively extend into the limiting grooves and are in sliding connection with the limiting grooves.
The embodiment of the utility model has the following advantages:
1. the bottom of the auxiliary upper pressing plate is flush with the bottom of the main upper pressing plate, and meanwhile, the PCB at the top of the lower pressing plate is pressed, so that the lower pressing plate drives the PCB to slide towards the inside of the pressing cavity, meanwhile, the lower pressing plate drives the connecting plate to move through the connecting block, so that the spring is contracted, when the bottom of the lower pressing plate contacts with the bottom of the pressing cavity, the lower die and the upper die are matched, and the auxiliary upper pressing plate and the main upper pressing plate are matched with the lower pressing plate to perform milling pressing on the PCB;
2. through the elasticity of spring two and the gravity of movable frame and vice top board for vice top board and main top board dislocation top move the PCB board, prevent that the PCB board from adhering the condition that needs artifical clearance on vice top board and main top board, the same principle is as the PCB board does not take place to adhere, the elasticity of spring one shrink makes down the contour plate drive the PCB board shift out press the die cavity inside, reaches the purpose with PCB board automatic pop-up, need not artifical manual follow die cavity and takes out, reduces intensity of labour, improves the potential safety hazard.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It will be apparent to those of ordinary skill in the art that the drawings in the following description are exemplary only and that other implementations can be obtained from the extensions of the drawings provided without inventive effort.
The structures, proportions, sizes, etc. shown in the present specification are shown only for the purposes of illustration and description, and are not intended to limit the scope of the utility model, which is defined by the claims, so that any structural modifications, changes in proportions, or adjustments of sizes, which do not affect the efficacy or the achievement of the present utility model, should fall within the ambit of the technical disclosure.
FIG. 1 is a perspective view of the whole body provided by the present utility model;
FIG. 2 is an exploded perspective view of the elastomeric component of the present utility model;
FIG. 3 is a partially cut-away perspective view of an upper die provided by the utility model;
FIG. 4 is a partially cut-away exploded perspective view of the upper die provided by the utility model;
fig. 5 is a cut-away perspective view of a sleeve provided by the present utility model.
In the figure: the die comprises a lower die, a lower die cavity, a 3 sliding chute, a 4-pressure die cavity, a first spring, a 6 connecting plate, a 7 connecting block, a 8-lower contour plate, a 9 upper die, a 10 mounting hole, a 11 upper die cavity, a second spring, a 13 movable frame, a 14 pair of upper pressing plates, a 15 limiting block, a 16 limiting groove, a 17 main upper pressing plate, a 18 guide pillar, a 19 sleeve and a 20 damping spring.
Detailed Description
Other advantages and advantages of the present utility model will become apparent to those skilled in the art from the following detailed description, which, by way of illustration, is to be read in connection with certain specific embodiments, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-5, the utility model provides a routing die for a PCB board, which comprises a lower die 1, wherein two lower die cavities 2 are formed in the lower die 1, two sliding grooves 3 are formed in one side of each lower die cavity 2, a pressing die cavity 4 is formed in the top of each lower die 1, a lower pressing plate 8 is arranged in each pressing die cavity 4, elastic material components are arranged on two sides of each lower pressing plate 8, each elastic material component comprises two connecting blocks 7, one end of each connecting block 7 is fixedly provided with a connecting plate 6, two springs 5 are arranged at the bottom of each connecting plate 6, an upper die 9 is arranged at the top of each lower die 1, an upper die cavity 11 is formed in each upper die cavity 9, a plurality of mounting holes 10 are formed in each upper die cavity 11, springs 12 are formed in each mounting hole 10, a movable frame 13 is fixedly arranged in each upper die cavity 11, a pair of upper pressing plates 14 are fixedly arranged at the bottom of each movable frame 13, two limiting blocks 15 are fixedly arranged on two side walls in each pair of upper pressing plates 14, a main upper pressing plate 17 is fixedly arranged at the bottom of each upper die 9, and two limiting grooves 16 are formed in each side of the main pressing plate 17;
in this embodiment, in order to realize that the profiled PCB board can be automatically ejected from the profiling cavity 4 and prevent the problem that the PCB board adheres to the upper die, when the PCB board is profiled, the PCB board is placed on top of the lower profiling plate 8, the upper die 9 moves downward, when the auxiliary upper pressing plate 14 contacts with the PCB board on top of the lower profiling plate 8, the auxiliary upper pressing plate 14 drives the movable frame 13 to slide upward inside the upper die cavity 11 and enable the spring two 12 to shrink, when the bottom of the auxiliary upper pressing plate 14 is flush with the bottom of the main upper pressing plate 17, the PCB board on top of the lower profiling plate 8 is simultaneously pressed, the lower profiling plate 8 drives the PCB board to slide inside the profiling cavity 4, meanwhile, the lower profiling plate 8 drives the connecting plate 6 to move through the connecting block 7, and further enables the spring one 5 to shrink, when the bottom of the lower profiling plate 8 contacts with the bottom of the profiling cavity 4, the lower die 1 and the upper die 9 complete die assembly, the auxiliary upper pressing plate 14 and the main upper pressing plate 17 are matched with the lower pressing plate 8 to perform milling pressing on the PCB, after the pressing is finished, the upper die 9 moves upwards, the elastic force of the spring II 12 and the gravity of the movable frame 13 and the auxiliary upper pressing plate 14 in the moving process enable the auxiliary upper pressing plate 14 to move downwards, the falling distance of the auxiliary upper pressing plate 14 is limited through the matching of the limiting block 15 and the limiting groove 16, the auxiliary upper pressing plate 14 and the main upper pressing plate 17 push the PCB in a dislocation mode, the PCB automatically falls, the PCB is prevented from being adhered to the auxiliary upper pressing plate 14 and the main upper pressing plate 17, and similarly when the PCB is not adhered, the lower pressing plate 8 loses pressure, the elastic force of the first spring template 5 drives the PCB to move out of the pressing cavity 4 through the matching of the connecting plate 6 and the connecting block 7, and the purpose of automatically popping up the PCB is achieved;
in order to achieve the purpose of reducing impact vibration when the lower die 1 and the upper die 9 are clamped, the device is realized by adopting the following technical scheme: a plurality of damping components are arranged between the lower die 1 and the upper die 9, each damping component comprises a guide pillar 18 and a sleeve 19, the top of each guide pillar 18 is fixedly connected with the upper die 9, the bottom of each sleeve 19 is fixedly connected with the lower die 1, the guide pillar 18 is slidably connected with the sleeve 19, a damping spring 20 is arranged in each sleeve 19, the upper die 9 moves downwards, and the guide pillar 18 moves downwards along the sleeve 19 to enable the damping spring 20 to shrink, so that the impact force during die assembly is reduced;
in order to achieve the purpose of automatic material ejection, the device is achieved by adopting the following technical scheme: the chute 3 is respectively communicated with the lower die cavity 2 and the profiling cavity 4, the bottom of the first spring 5 is fixedly connected with the bottom of the lower die cavity 2, the top of the first spring 5 is fixedly connected with the connecting plate 6, the connecting plate 6 is arranged in the lower die cavity 2 and is in sliding connection with the lower die cavity 2, the connecting plate 7 is arranged in the chute 3 and is in sliding connection with the chute 3, the lower profiling plate 8 is in sliding connection with the profiling cavity 4, when the PCB is not adhered, the lower profiling plate 8 loses pressure, the elasticity of shrinkage of the first spring 5 drives the PCB to move out of the profiling cavity 4 through the cooperation of the connecting plate 6 and the connecting plate 7, the purpose of automatically ejecting the PCB is achieved, manual taking out of the profiling cavity 4 is not needed, labor intensity is reduced, and safety is improved;
wherein, in order to realize preventing when the PCB board does not take place to adhere, when lower contour plate 8 loses pressure, the elasticity of the first 5 shrink of spring passes through connecting plate 6 and the cooperation of connecting block 7 for lower contour plate 8 drives the PCB board and shifts out inside the die cavity 4, reaches the purpose of popping up the PCB board voluntarily, need not manual taking out from die cavity 4, reduces intensity of labour, improves the potential safety hazard and adheres the purpose on vice top board 14 and main top board 17, and this device adopts following technical scheme to realize: the top of the second spring 12 is fixedly connected with the top of the mounting hole 10, the bottom of the second spring 12 is fixedly connected with the movable frame 13, the movable frame 13 is in sliding connection with the upper die cavity 11, the auxiliary upper die plate 14 is sleeved outside the main upper die plate 17 and is in sliding connection with the main upper die plate 17, the limiting blocks 15 respectively extend into the limiting grooves 16 and are in sliding connection with the limiting grooves 16, the upper die 9 moves upwards, the elastic force of the second spring 12 and the gravity of the movable frame 13 and the auxiliary upper die plate 14 in the moving process enable the auxiliary upper die plate 14 to move downwards, the falling distance of the auxiliary upper die plate 14 is limited through the matching of the limiting blocks 15 and the limiting grooves 16, so that the auxiliary upper die plate 14 and the main upper die plate 17 are in dislocation propping up with the PCB, the PCB is prevented from automatically falling, and the PCB is prevented from being adhered to the auxiliary upper die plate 14 and the main upper die plate 17, and the condition of manual cleaning is prevented.
The application process of the utility model is as follows: when the utility model is used, the lower die 1 and the upper die 9 are fixed with the press, when the PCB is pressed, the PCB is placed on the top of the lower pressing plate 8, the upper die 9 moves downwards, the guide post 18 moves downwards along the sleeve 19 to enable the damping spring 20 to shrink, the impact force during die assembly is reduced, when the auxiliary upper pressing plate 14 contacts with the PCB on the top of the lower pressing plate 8, the auxiliary upper pressing plate 14 drives the movable frame 13 to slide towards the inside of the upper die cavity 11 and enable the second spring 12 to shrink, meanwhile, the auxiliary upper pressing plate 14 drives the limiting block 15 to slide along the limiting groove 16, when the movable frame 13 contacts with the top of the upper die cavity 11, the bottom of the auxiliary upper pressing plate 14 is flush with the bottom of the main upper pressing plate 17, and simultaneously, the PCB on the top of the lower pressing plate 8 is pressed, the lower pressing plate 8 drives the PCB to slide towards the inside of the pressing cavity 4, and the lower pressing plate 8 drives the connecting plate 6 to move through the connecting block 7, and then the spring I5 is contracted, when the bottom of the lower pressing plate 8 contacts with the bottom of the pressing cavity 4, the lower die 1 and the upper die 9 complete die assembly, the auxiliary upper pressing plate 14 and the main upper pressing plate 17 cooperate with the lower pressing plate 8 to perform milling and pressing on the PCB, after the pressing is finished, the upper die 9 moves upwards, the elastic force of the spring II 12 and the gravity of the movable frame 13 and the auxiliary upper pressing plate 14 in the moving process lead the auxiliary upper pressing plate 14 to move downwards, the falling distance of the auxiliary upper pressing plate 14 is limited through the cooperation of the limiting block 15 and the limiting groove 16, so that the auxiliary upper pressing plate 14 and the main upper pressing plate 17 dislocation prop up the PCB, the PCB is prevented from automatically falling off, the adhesion of the PCB on the auxiliary upper pressing plate 14 and the main upper pressing plate 17 is prevented from being caused, and when the PCB is not adhered, and when the lower pressing plate 8 loses pressure, the elastic force of the spring I5 is contracted through the cooperation of the connecting plate 6 and the connecting block 7, the lower contour plate 8 drives the PCB to move out of the inside of the molding cavity 4, so that the purpose of automatically ejecting the PCB is achieved, the PCB does not need to be manually taken out of the molding cavity 4, the labor intensity is reduced, and the safety is improved.
The above description is only of the preferred embodiments of the present utility model, and any person skilled in the art may modify the present utility model or make modifications to the present utility model equivalent thereto using the technical solutions described above. Therefore, any simple modification or equivalent made according to the technical solution of the present utility model falls within the scope of the protection claimed by the present utility model.
Claims (10)
1. The utility model provides a PCB board gong board mould, includes lower mould (1), its characterized in that: two lower die cavities (2) have been seted up to lower mould (1) inside, two lower die cavities (2) one side has all been seted up two spout (3), press die cavity (4) have been seted up at lower mould (1) top, press die cavity (4) inside to be equipped with down contour plate (8), lower contour plate (8) both sides all are equipped with the elastic component, the elastic component includes two connecting blocks (7), two connecting block (7) one end is fixed connecting plate (6) being equipped with, connecting plate (6) bottom is equipped with two spring one (5), lower mould (1) top is equipped with mould (9), go up mould cavity (11) have been seted up to mould (9) inside, a plurality of mounting holes (10) have been seted up to go up mould cavity (11) inside all be equipped with spring two (12), go up mould cavity (11) inside to be equipped with movable frame (13), movable frame (13) bottom is fixed and is equipped with vice top board (14), vice top board (14) inside both sides wall is fixed and is equipped with connecting plate (15), two main press plates (17) are all seted up to two main press plates (17) bottom, two main press plates (17) are all seted up to main press plate (17).
2. A PCB routing die as set forth in claim 1, wherein: be equipped with a plurality of damper between lower mould (1) and last mould (9), damper includes guide pillar (18) and sleeve (19), guide pillar (18) top and last mould (9) fixed connection, sleeve (19) bottom and lower mould (1) fixed connection, guide pillar (18) and sleeve (19) sliding connection, sleeve (19) inside is equipped with damping spring (20).
3. A PCB routing die as set forth in claim 1, wherein: the sliding groove (3) is respectively communicated with the lower die cavity (2) and the profiling cavity (4).
4. A PCB routing die as set forth in claim 1, wherein: the bottom of the first spring (5) is fixedly connected with the bottom of the lower die cavity (2), and the top of the first spring (5) is fixedly connected with the connecting plate (6).
5. A PCB routing die as set forth in claim 1, wherein: the connecting plate (6) is arranged in the lower die cavity (2) and is in sliding connection with the lower die cavity (2).
6. A PCB routing die as set forth in claim 1, wherein: the connecting block (7) is arranged inside the sliding groove (3) and is in sliding connection with the sliding groove (3).
7. A PCB routing die as set forth in claim 1, wherein: the lower contour plate (8) is in sliding connection with the contour cavity (4).
8. A PCB routing die as set forth in claim 1, wherein: the top of the second spring (12) is fixedly connected with the top of the mounting hole (10), the bottom of the second spring (12) is fixedly connected with the movable frame (13), and the movable frame (13) is slidably connected with the upper die cavity (11).
9. A PCB routing die as set forth in claim 1, wherein: the auxiliary upper pressing plate (14) is sleeved outside the main upper pressing plate (17) and is in sliding connection with the main upper pressing plate (17).
10. A PCB routing die as set forth in claim 1, wherein: the limiting blocks (15) extend into the limiting grooves (16) respectively and are connected with the limiting grooves (16) in a sliding mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223385854.5U CN219096046U (en) | 2022-12-16 | 2022-12-16 | PCB gong board mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223385854.5U CN219096046U (en) | 2022-12-16 | 2022-12-16 | PCB gong board mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219096046U true CN219096046U (en) | 2023-05-30 |
Family
ID=86462900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223385854.5U Active CN219096046U (en) | 2022-12-16 | 2022-12-16 | PCB gong board mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219096046U (en) |
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2022
- 2022-12-16 CN CN202223385854.5U patent/CN219096046U/en active Active
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