CN219075133U - Semiconductor wafer surface treatment device - Google Patents
Semiconductor wafer surface treatment device Download PDFInfo
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- CN219075133U CN219075133U CN202222900056.5U CN202222900056U CN219075133U CN 219075133 U CN219075133 U CN 219075133U CN 202222900056 U CN202222900056 U CN 202222900056U CN 219075133 U CN219075133 U CN 219075133U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a semiconductor wafer surface treatment device, which belongs to the technical field of wafers, and comprises a bracket and a semiconductor wafer, and further comprises: the clamping assembly for carrying out clamping and fixing to the semiconductor wafer, and the clamping assembly is installed on the support, is used for carrying out the grinding machanism who polishes simultaneously to the upper and lower surface of semiconductor wafer, and the grinding machanism is installed on the support, the support includes: the polishing device comprises a bottom plate and side plates, wherein the side plates are fixedly arranged at the two ends of the top of the bottom plate, and the side plates are fixedly arranged at the two ends of the bottom of the top plate.
Description
Technical Field
The utility model relates to the technical field of wafers, in particular to a semiconductor wafer surface treatment device.
Background
A wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer has a circular shape. Various circuit element structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions.
Current wafers require polishing of their surfaces during processing to ensure the surface smoothness of the wafer. However, the current polishing device only can polish one side surface of the wafer, and cannot polish two sides of the wafer at the same time, so that the polishing efficiency of the wafer can be greatly reduced.
Disclosure of Invention
The present utility model has been made in view of the above and/or problems occurring in the prior art of a semiconductor wafer surface treatment apparatus.
Accordingly, an object of the present utility model is to provide a semiconductor wafer surface treatment apparatus that can solve the above-mentioned problems.
In order to solve the technical problems, according to one aspect of the present utility model, the following technical solutions are provided:
a semiconductor wafer surface treatment apparatus comprising a carrier and a semiconductor wafer, further comprising:
the clamping assembly is used for clamping and fixing the semiconductor wafer and is arranged on the bracket;
and the polishing mechanism is used for polishing the upper surface and the lower surface of the semiconductor wafer simultaneously, and the polishing mechanism is arranged on the bracket.
As a preferable mode of the semiconductor wafer surface treatment apparatus according to the present utility model, wherein: the bracket comprises:
a bottom plate;
the two ends of the top of the bottom plate are fixedly provided with side plates;
the roof, the bottom both ends of roof are all fixed mounting curb plate.
As a preferable mode of the semiconductor wafer surface treatment apparatus according to the present utility model, wherein: the clamping assembly includes:
the hydraulic cylinders are symmetrically and fixedly arranged at the opposite ends of the two groups of side plates;
the extrusion plate, the output of pneumatic cylinder passes through piston rod fixed mounting extrusion plate, and is equipped with the semiconductor wafer between two sets of extrusion plates.
As a preferable mode of the semiconductor wafer surface treatment apparatus according to the present utility model, wherein: the polishing mechanism comprises:
a first grinding assembly for grinding the lower surface of the semiconductor wafer, the first grinding assembly being mounted on top of the base plate;
and a second polishing assembly for polishing the upper surface of the semiconductor wafer, the second polishing assembly being mounted on the bottom of the top plate.
As a preferable mode of the semiconductor wafer surface treatment apparatus according to the present utility model, wherein: the first grinding assembly includes:
the first air cylinder is fixedly arranged on the top of the bottom plate;
the output end of the first cylinder is fixedly provided with a supporting plate through a piston rod.
As a preferable mode of the semiconductor wafer surface treatment apparatus according to the present utility model, wherein: the first abrasive assembly further comprises:
the first box body is fixedly arranged on the top of the supporting plate;
the first servo motor is fixedly arranged on the inner wall of the first box body;
the output shaft of the first servo motor is fixedly provided with the first rotating plate;
the first abrasive paper is fixedly installed on the top of the first rotating plate, a semiconductor wafer is arranged right above the first abrasive paper, and the first abrasive paper can be in contact with the semiconductor wafer.
As a preferable mode of the semiconductor wafer surface treatment apparatus according to the present utility model, wherein: the second grinding assembly includes:
the second cylinder is fixedly arranged on the bottom of the top plate;
the output end of the second cylinder is fixedly provided with a supporting plate through a piston rod.
As a preferable mode of the semiconductor wafer surface treatment apparatus according to the present utility model, wherein: the second grinding assembly further includes:
the second box body is fixedly arranged on the bottom of the supporting plate;
the second servo motor is fixedly arranged on the inner wall of the second box body;
the output shaft of the second servo motor is fixedly provided with the second rotating plate;
the second abrasive paper is fixedly arranged on the bottom of the second rotating plate, a semiconductor wafer is arranged right below the second abrasive paper, and the second abrasive paper can be in contact with the semiconductor wafer.
Compared with the prior art:
the clamping assembly is arranged to clamp and fix the semiconductor wafer, and the polishing mechanism is arranged to polish the upper surface and the lower surface of the semiconductor wafer simultaneously, so that the problem that the conventional polishing device can only polish one side surface of the wafer is solved, and the polishing efficiency is greatly improved.
Drawings
FIG. 1 is a schematic elevational view of the structure of the present utility model;
FIG. 2 is a schematic top view of a clamping assembly of the present utility model;
FIG. 3 is a schematic front view of a first abrasive component of the present utility model;
fig. 4 is a schematic front view of a second sanding assembly in accordance with the present utility model.
In the figure: the base plate 10, the side plates 11, the top plate 12, the clamping assembly 20, the hydraulic cylinder 21, the pressing plate 22, the semiconductor wafer 30, the first grinding assembly 40, the first cylinder 41, the support plate 42, the first box 43, the first servo motor 44, the first rotating plate 45, the first sand paper 46, the second grinding assembly 50, the second cylinder 51, the support plate 52, the second box 53, the second servo motor 54, the second rotating plate 55, and the second sand paper 56.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, embodiments of the present utility model will be described in further detail below with reference to the accompanying drawings.
The utility model provides a semiconductor wafer surface treatment device, please refer to fig. 1-4, comprising a bracket and a semiconductor wafer 30;
further comprises: a clamping assembly 20 for clamping and securing the semiconductor wafer 30, and the clamping assembly 20 is mounted on a support.
The support includes: a bottom plate 10, side plates 11, and a top plate 12;
the top both ends of bottom plate 10 all fixed mounting curb plate 11, the bottom both ends of roof 12 all fixed mounting curb plate 11.
The clamping assembly 20 includes: a hydraulic cylinder 21 and a squeeze plate 22;
the opposite ends of the two groups of side plates 11 are symmetrically and fixedly provided with hydraulic cylinders 21, the output ends of the hydraulic cylinders 21 are fixedly provided with squeeze plates 22 through piston rods, and a semiconductor wafer 30 is arranged between the two groups of squeeze plates 22.
Working principle: after the semiconductor wafer 30 is placed on the first sandpaper 46, the support plate 42 is lifted by the first cylinder 41 until the semiconductor wafer 30 is positioned between the two sets of pressing plates 22, at which time the pressing plates 22 are moved toward the semiconductor wafer 30 by the hydraulic cylinder 21 until the semiconductor wafer 30 is held and fixed by the two sets of pressing plates 22.
Example 2:
on the basis of embodiment 1, a polishing mechanism for polishing both the upper and lower surfaces of the semiconductor wafer 30 is provided, and the polishing mechanism is mounted on a stand.
The polishing mechanism comprises: a first polishing assembly 40 for polishing the lower surface of the semiconductor wafer 30, a second polishing assembly 50 for polishing the upper surface of the semiconductor wafer 30;
and a first abrasive assembly 40 is mounted on top of the base plate 10 and a second abrasive assembly 50 is mounted on the bottom of the top plate 12.
The first grinding assembly 40 includes: a first cylinder 41, a support plate 42, a first box 43, a first servo motor 44, a first rotating plate 45, and first sand paper 46;
the first cylinder 41 is fixedly installed on the top of the base plate 10, the first cylinder 41 is a cylinder in chinese patent CN105402197a, the output end of the first cylinder 41 is fixedly installed on the support plate 42 through a piston rod, the first housing 43 is fixedly installed on the top of the support plate 42, the first servo motor 44 is fixedly installed on the inner wall of the first housing 43, the output shaft of the first servo motor 44 is fixedly installed on the first rotating plate 45, the first abrasive paper 46 is fixedly installed on the top of the first rotating plate 45, the semiconductor wafer 30 is disposed right above the first abrasive paper 46, and the first abrasive paper 46 can be in contact with the semiconductor wafer 30.
The second sharpening assembly 50 includes: a second cylinder 51, a support plate 52, a second housing 53, a second servo motor 54, a second rotating plate 55, and second sandpaper 56;
the second cylinder 51 is fixedly installed on the bottom of the top plate 12, the second cylinder 51 is a cylinder in chinese patent CN105402197a, an output end of the second cylinder 51 is fixedly installed on the support plate 52 through a piston rod, the second housing 53 is fixedly installed on the bottom of the support plate 52, the second servo motor 54 is fixedly installed on an inner wall of the second housing 53, an output shaft of the second servo motor 54 is fixedly installed on the second rotating plate 55, the second abrasive paper 56 is fixedly installed on the bottom of the second rotating plate 55, the semiconductor wafer 30 is disposed under the second abrasive paper 56, and the second abrasive paper 56 can contact with the semiconductor wafer 30.
Working principle: after the semiconductor wafer 30 is clamped and fixed, the second air cylinder 51 drives the support plate 52 to drive the second sand paper 56 to descend until the second sand paper 56 contacts with the upper surface of the semiconductor wafer 30, and after the second sand paper 56 contacts with the upper surface of the semiconductor wafer 30, the first rotary plate 45 and the second rotary plate 55 drive the first sand paper 46 and the second sand paper 56 to rotate respectively through the first servo motor 44 and the second servo motor 54, and when the first sand paper 46 and the second sand paper 56 rotate, the upper surface and the lower surface of the semiconductor wafer 30 are polished simultaneously.
Although the utility model has been described hereinabove with reference to embodiments, various modifications thereof may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the features of the disclosed embodiments may be combined with each other in any manner as long as there is no structural conflict, and the exhaustive description of these combinations is not given in this specification merely for the sake of omitting the descriptions and saving resources. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.
Claims (8)
1. A semiconductor wafer surface treatment apparatus comprising a carrier and a semiconductor wafer (30), characterized by further comprising:
a clamping assembly (20) for clamping and fixing the semiconductor wafer (30), and the clamping assembly (20) is mounted on the bracket;
and the polishing mechanism is used for polishing the upper surface and the lower surface of the semiconductor wafer (30) simultaneously, and the polishing mechanism is arranged on the bracket.
2. The semiconductor wafer surface processing apparatus of claim 1, wherein the support comprises:
a bottom plate (10);
the side plates (11) are fixedly arranged at the two ends of the top of the bottom plate (10);
the top plate (12), both ends of the bottom of top plate (12) are all fixed mounting curb plate (11).
3. A semiconductor wafer surface processing apparatus according to claim 2, wherein the clamping assembly (20) comprises:
the hydraulic cylinders (21) are symmetrically and fixedly arranged at the opposite ends of the two groups of side plates (11);
the extrusion plate (22), the output of pneumatic cylinder (21) passes through piston rod fixed mounting extrusion plate (22), and is equipped with semiconductor wafer (30) between two sets of extrusion plates (22).
4. A semiconductor wafer surface processing apparatus according to claim 2, wherein the polishing mechanism comprises:
a first grinding assembly (40) for grinding a lower surface of the semiconductor wafer (30), and the first grinding assembly (40) is mounted on top of the base plate (10);
a second polishing assembly (50) for polishing the upper surface of the semiconductor wafer (30), and the second polishing assembly (50) is mounted on the bottom of the top plate (12).
5. A semiconductor wafer surface processing apparatus according to claim 4, wherein the first grinding assembly (40) comprises:
a first cylinder (41), the first cylinder (41) being fixedly mounted on top of the base plate (10);
the output end of the first air cylinder (41) is fixedly provided with the supporting plate (42) through a piston rod.
6. The semiconductor wafer surface processing apparatus of claim 5, wherein said first grinding assembly (40) further comprises:
a first case (43), the first case (43) being fixedly installed on top of the support plate (42);
the first servo motor (44), the said first servo motor (44) is fixedly mounted on inner wall of the first box (43);
a first rotating plate (45), wherein the output shaft of the first servo motor (44) is fixedly provided with the first rotating plate (45);
the first abrasive paper (46), first abrasive paper (46) fixed mounting is on the top of first rotor plate (45), be equipped with semiconductor wafer (30) directly over first abrasive paper (46), and first abrasive paper (46) can be with semiconductor wafer (30) contact.
7. A semiconductor wafer surface processing apparatus according to claim 4, wherein the second polishing assembly (50) comprises:
a second cylinder (51), the second cylinder (51) being fixedly mounted on the bottom of the top plate (12);
and the output end of the second cylinder (51) is fixedly provided with the supporting plate (52) through a piston rod.
8. A semiconductor wafer surface processing apparatus according to claim 7, wherein the second polishing assembly (50) further comprises:
the second box body (53), the said second box body (53) is fixedly mounted on bottom of the supporting plate (52);
the second servo motor (54) is fixedly arranged on the inner wall of the second box body (53);
a second rotating plate (55), wherein the output shaft of the second servo motor (54) is fixedly provided with the second rotating plate (55);
and the second sand paper (56), the second sand paper (56) is fixedly arranged on the bottom of the second rotating plate (55), the semiconductor wafer (30) is arranged right below the second sand paper (56), and the second sand paper (56) can be contacted with the semiconductor wafer (30).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222900056.5U CN219075133U (en) | 2022-11-01 | 2022-11-01 | Semiconductor wafer surface treatment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222900056.5U CN219075133U (en) | 2022-11-01 | 2022-11-01 | Semiconductor wafer surface treatment device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219075133U true CN219075133U (en) | 2023-05-26 |
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ID=86406820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222900056.5U Active CN219075133U (en) | 2022-11-01 | 2022-11-01 | Semiconductor wafer surface treatment device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219075133U (en) |
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2022
- 2022-11-01 CN CN202222900056.5U patent/CN219075133U/en active Active
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