CN217194633U - Preparation device for polishing silicon carbide wafer - Google Patents

Abstract

The utility model discloses a preparation device for polishing a silicon carbide wafer, which comprises a processing machine table and support rods fixed on two sides of the top surface of the processing machine table, wherein the top end of each support rod is fixedly connected with a guide rail, an electric slide seat is arranged on the guide rail in a sliding way, polishing equipment is arranged on the bottom surface of the electric slide seat, a placing disc for placing a wafer is fixedly connected at the central position of the top surface of the processing machine table, jacking components are arranged at two ends of a clamping shell, a ball body is embedded on the inner wall of the bottom of the clamping shell, when the clamping shells on two sides are drawn close to the inner side, the wafer can be jacked up by the ball body, so that the wafer keeps a certain distance with the placing disc, a pin for jacking the wafer overcomes the elasticity of a spring and is contacted with the inner wall of the clamping shell, the wafer is pressed downwards by the pin, the wafer is clamped between the clamping shells on two sides, the contact area of the wafer and the placing disc and other fixed structures is reduced, thereby avoiding the condition that the wafer is scratched due to relative friction in the polishing process.

Description

Preparation device for polishing silicon carbide wafer

Technical Field

The utility model belongs to the technical field of the silicon wafer polishing is relevant, concretely relates to preparation facilities that silicon carbide wafer polishing was used.

Background

Silicon carbide also has rare minerals in nature. Silicon carbide is also known as carbo-silica. Among the non-oxide high-tech refractory materials such as C, N, B, silicon carbide is the most widely used and economical one, and may be called as corundum or refractory sand. The silicon carbide wafer needs to be subjected to a polishing procedure in the processing process, and then needs polishing equipment to polish the surface of the silicon carbide wafer so as to ensure the flatness and smoothness.

Through CN201920990419.4 discloses a fixing device that carborundum wafer polishing was used, comprises a workbench, the both sides inner wall of workstation has same baffle through the bolt fastening, and the both sides of baffle top outer wall all have electric telescopic handle through the bolt fastening, the mounting groove has been seted up to workstation top outer wall, and the inner wall of mounting groove has the open-ended polishing case through the bolt fastening at the top, and the device drives the clamp plate through electronic slide rail in the fixed establishment and presss from both sides tight wafer, supports tight board and supports tight wafer in the wafer bottom, avoids the wafer to take place the displacement at the in-process of polishing, has solved the problem that current carborundum wafer rocked easily at the polishing in-process.

The prior silicon carbide wafer polishing preparation device has the following problems: the existing silicon carbide wafer polishing preparation device needs to clamp and fix the silicon wafer by the fixing device after the silicon wafer is manually straightened in the using process, the fault tolerance rate is low, the processing efficiency of the silicon wafer is influenced, in addition, the contact area of the wafer fixing structure is large, and the wafer is easily scratched due to relative friction in the polishing process.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a preparation facilities that carborundum wafer polishing was used to solve the fault-tolerant rate of the silicon wafer clamping that proposes among the above-mentioned background art low, the great problem that easily causes the fish tail of area of contact of wafer fixed knot structure.

In order to achieve the above object, the utility model provides a following technical scheme: preparation facilities that carborundum wafer polishing was used, including processing board and fixing the bracing piece in processing board top surface both sides, the top fixedly connected with guide rail of bracing piece, it is provided with electronic slide to slide on the guide rail, polishing equipment is installed to the bottom surface of electronic slide, the top surface central point of processing board puts the dish of placing that fixedly connected with is used for placing the wafer, the bilateral symmetry of placing the dish is provided with two press from both sides the shell, the inboard of processing board is provided with the actuating mechanism who is used for ordering about two press from both sides shell clamping wafers, the both ends of pressing from both sides the shell are provided with the roof pressure subassembly that is used for the tight wafer in top.

Preferably, actuating mechanism includes the motor, motor fixed mounting is in one side of processing board, the output fixedly connected with lead screw of motor, be equipped with two sections screw thread sections that screw thread opposite direction on the outer wall of lead screw, the both ends outside cover of lead screw is equipped with the thread bush, two the thread bush respectively with two sections screw thread section threaded connection.

Preferably, the bottom surface fixedly connected with limit slide block of press from both sides the shell, the spout has been seted up to the left and right sides up end of processing board, limit slide block and spout sliding connection, limit slide block's bottom and thread bush fixed connection.

Preferably, the clamping shell is of an arc-shaped structure, the inner wall of the clamping shell is fixedly connected with a soft cotton pad, and a ball body is embedded in the inner wall of the bottom of the clamping shell.

Preferably, the top pressure assembly comprises a sleeve, the sleeve is fixedly connected with the clamping shell, a pin is slidably connected to the inner side of the sleeve, a spring is fixedly connected to the inner wall of the sleeve, and the bottom end of the spring is fixedly connected with the pin.

Preferably, the bottom end of the pin extends out of the sleeve and extends to the inner side of the clamping shell, and the bottom end of the pin is of a hemispherical structure.

Compared with the prior art of silicon carbide wafer polishing preparation devices, the utility model provides a preparation facilities that silicon carbide wafer polishing was used possesses following beneficial effect:

1. the utility model discloses a both sides symmetry at placing the dish sets up two press from both sides shells, and sets up actuating mechanism in placing the inboard of dish, after will treating the silicon wafer of processing to place on placing the dish, accessible motor drive lead screw rotation, through the screw thread relation of lead screw both ends screw thread section and thread bush, simultaneously under the spout is to the slip spacing of spacing slider, and then can order to both sides press from both sides the shell and slide to placing the dish direction level in step, and then make the press from both sides shell clamp cover both sides at the silicon wafer, the utility model discloses fault-tolerant rate when clamping the wafer is higher, can realize the quick clamping to the silicon wafer, improve machining efficiency;

2. the utility model discloses a set up the roof pressure subassembly at the both ends of press from both sides the shell, and inlay on the bottom inner wall of press from both sides the shell and be equipped with the spheroid, when both sides press from both sides the shell and draw close to the inboard, can be by the spheroid with the wafer jack-up, and then make the wafer keep the certain distance with placing the dish, and make the elasticity that the wafer jack-up pin overcome the spring and with the inner wall contact of press from both sides the shell, and then press down the wafer by the pin, make the wafer clamping between the both sides press from both sides the shell, reduce the wafer and place the area of contact of dish and other fixed knot constructs, and then avoid the wafer to receive the relative friction in the polishing process and cause the condition of fish tail.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description, do not constitute a limitation of the invention, in which:

FIG. 1 is a schematic view of a manufacturing apparatus for polishing a silicon carbide wafer according to the present invention;

fig. 2 is a schematic view of a front cross-sectional structure of a processing machine provided by the present invention;

fig. 3 is an enlarged schematic structural view of a point a in fig. 2 according to the present invention;

fig. 4 is a schematic view of a top view structure of the processing machine of the present invention;

in the figure: 1. a support bar; 2. processing a machine table; 3. a guide rail; 4. an electric slide; 5. a polishing device; 6. placing a tray; 7. a clamping shell; 71. a sphere; 72. a soft cotton pad; 8. a chute; 9. a drive mechanism; 91. a motor; 92. a screw rod; 93. a threaded sleeve; 94. a limiting slide block; 10. a jacking component; 101. a sleeve; 102. a spring; 103. a pin.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: preparation facilities that carborundum wafer polishing was used, including processing board 2 and fix the bracing piece 1 in processing board 2 top surface both sides, the top fixedly connected with guide rail 3 of bracing piece 1, it is provided with electronic slide 4 to slide on the guide rail 3, polishing equipment 5 is installed to the bottom surface of electronic slide 4, the top surface central point of processing board 2 puts fixedly connected with and is used for placing the dish 6 of placing of wafer, can carry out polishing treatment by polishing equipment 5 to the silicon wafer after fixed on placing dish 6 through placing the silicon wafer that will treat processing, and then guarantee the smoothness and the roughness on silicon wafer surface.

It should be noted that two clamping shells 7 are symmetrically arranged on two sides of the placing tray 6, each clamping shell 7 is of an arc-shaped structure, a soft cotton pad 72 is fixedly connected to the inner wall of each clamping shell 7, and a ball 71 is embedded in the inner wall of the bottom of each clamping shell 7, so that when the clamping shells 7 on the two sides are closed inwards, the wafer can be jacked up by the ball 71, and further, a certain distance is kept between the wafer and the placing tray 6.

It is worth proposing that a driving mechanism 9 for driving the two clamping shells 7 to clamp the wafer is arranged on the inner side of the processing machine table 2, the driving mechanism 9 comprises a motor 91, the motor 91 is fixedly arranged on one side of the processing machine table 2, the output end of the motor 91 is fixedly connected with a screw rod 92, two thread sections with opposite thread directions are arranged on the outer wall of the screw rod 92, thread sleeves 93 are sleeved on the outer sides of the two ends of the screw rod 92, the two thread sleeves 93 are respectively in threaded connection with the two thread sections, a limit slide block 94 is fixedly connected with the bottom surface of the clamping shell 7, slide grooves 8 are arranged on the upper end surfaces of the left side and the right side of the processing machine table 2, the limit slide block 94 is in sliding connection with the slide grooves 8, the bottom end of the limit slide block 94 is fixedly connected with the thread sleeves 93, one end of the screw rod 92 is rotatably connected with the processing machine table 2, the screw rod 92 is driven to rotate by the motor 91, under the threaded relation between the thread sections of the two ends of the screw rod 92 and the thread sleeves 93, meanwhile, under the sliding limit of the sliding chute 8 to the limit sliding block 94, the clamping shells 7 on the two sides can be driven to synchronously and horizontally slide.

It should be noted that, two ends of the clamping shell 7 are provided with a top pressing component 10 for tightly pressing the wafer, the top pressing component 10 includes a sleeve 101, the sleeve 101 is fixedly connected with the clamping shell 7, a pin 103 is slidably connected to an inner side of the sleeve 101, a spring 102 is fixedly connected to an inner wall of the sleeve 101, a bottom end of the spring 102 is fixedly connected to the pin 103, a bottom end of the pin 103 extends out of the sleeve 101 and extends to an inner side of the clamping shell 7, a bottom end of the pin 103 is of a hemispherical structure, when the ball 71 lifts the wafer and keeps the wafer at a certain distance from the placing tray 6, the wafer can lift the pin 103 to overcome an elastic force of the spring 102 and contact with the inner wall of the clamping shell 7, and then the pin 103 presses the wafer downwards to clamp the wafer between the clamping shells 7 on two sides.

The utility model discloses a theory of operation and use flow: when the silicon wafer processing device is used, a silicon wafer to be processed is placed on the placing disc 6, the screw rod 92 is driven to rotate through the motor 91, under the threaded relation between the thread sections at the two ends of the screw rod 92 and the thread sleeve 93, and under the sliding limit of the sliding chute 8 on the limiting sliding block 94, the clamping shells 7 at the two sides can be driven to synchronously horizontally slide towards the direction of the placing disc 6, and then the clamping shells 7 are clamped at the two sides of the silicon wafer;

because the ball 71 is embedded on the inner wall of the bottom of the clamping shell 7, when the clamping shells 7 on the two sides are closed inwards, the ball 71 can jack the wafer, so that the wafer keeps a certain distance from the placing disc 6, the wafer jacking pin 103 overcomes the elastic force of the spring 102 and contacts with the inner wall of the clamping shell 7, and the pin 103 presses the wafer downwards, so that the wafer is clamped between the clamping shells 7 on the two sides;

then the electric sliding seat 4 can slide left and right on the guide rail 3 to adjust the polishing position, and then the polishing device 5 can polish the silicon wafer, so as to ensure the smoothness and the flatness of the surface of the silicon wafer.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. Preparation facilities of carborundum wafer polishing usefulness, including processing board (2) and fixing bracing piece (1) in processing board (2) top surface both sides, the top fixedly connected with guide rail (3) of bracing piece (1), the slip is provided with electronic slide (4) on guide rail (3), polishing equipment (5), its characterized in that are installed to the bottom surface of electronic slide (4): the wafer clamping device is characterized in that a placing disc (6) used for placing wafers is fixedly connected to the center of the top face of the processing machine table (2), two clamping shells (7) are symmetrically arranged on two sides of the placing disc (6), a driving mechanism (9) used for driving the two clamping shells (7) to clamp the wafers is arranged on the inner side of the processing machine table (2), and jacking components (10) used for jacking the wafers are arranged at two ends of each clamping shell (7).

2. The manufacturing apparatus for polishing a silicon carbide wafer according to claim 1, characterized in that: actuating mechanism (9) include motor (91), motor (91) fixed mounting is in one side of processing board (2), the output fixedly connected with lead screw (92) of motor (91), be equipped with two sections screw thread sections opposite in direction on the outer wall of lead screw (92), the both ends outside cover of lead screw (92) is equipped with thread bush (93), two thread bush (93) respectively with two sections screw thread section threaded connection.

3. The manufacturing apparatus for polishing a silicon carbide wafer according to claim 2, characterized in that: the bottom surface fixedly connected with spacing slider (94) of press from both sides shell (7), spout (8) have been seted up to the left and right sides up end of processing board (2), spacing slider (94) and spout (8) sliding connection, the bottom and the thread bush (93) fixed connection of spacing slider (94).

4. The manufacturing apparatus for polishing a silicon carbide wafer according to claim 1, characterized in that: the clamping shell (7) is of an arc-shaped structure, the inner wall of the clamping shell is fixedly connected with a soft cotton pad (72), and a ball body (71) is embedded in the inner wall of the bottom of the clamping shell (7).

5. The manufacturing apparatus for polishing a silicon carbide wafer according to claim 1, characterized in that: the jacking assembly (10) comprises a sleeve (101), the sleeve (101) is fixedly connected with the clamping shell (7), a pin (103) is connected to the inner side of the sleeve (101) in a sliding mode, a spring (102) is fixedly connected to the inner wall of the sleeve (101), and the bottom end of the spring (102) is fixedly connected with the pin (103).

6. The manufacturing apparatus for polishing a silicon carbide wafer according to claim 5, characterized in that: the bottom end of the pin (103) extends out of the sleeve (101) and extends to the inner side of the clamping shell (7), and the bottom end of the pin (103) is of a hemispherical structure.

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