CN219068720U - Heat dissipation shell - Google Patents

Abstract

The utility model relates to the technical field of shell structures, and discloses a heat dissipation shell. The heat dissipation case includes: the heat-conducting structure is arranged between the heat-radiating fin and the working cavity; the first heat insulation coating is arranged on one side of the radiating fin, which is opposite to the heat conducting structure. The heat of the heating element is transferred to the first shell through the heat conducting structure and the radiating fins to radiate, so that the heat inside the radiating shell is directly transferred to the outside of the radiating shell to radiate through physical contact, and the radiating efficiency is improved.

Description

Heat dissipation shell

Technical Field

The utility model relates to the technical field of shell structures, in particular to a heat dissipation shell.

Background

In the existing electronic equipment heat dissipation technology, most of heat generated by an electrical element is transferred to other devices in the electronic equipment through a heat dissipation structure to dissipate heat, and the heat dissipation mode is carried out in the electronic equipment, so that the temperature of air in the electronic equipment is synchronously increased due to the fact that all heat is transferred in the electronic equipment, the effect of cooling the electrical element cannot be really achieved finally, the environmental conditions of all components in the electronic equipment are severe, and the aging of all components is accelerated.

Disclosure of Invention

The utility model mainly aims to provide a heat dissipation shell, which aims to solve the technical problem of low internal heat dissipation efficiency of electronic equipment.

To achieve the above object, the present utility model provides a heat dissipation case comprising:

a heat sink;

the heat conduction structure is arranged between the radiating fin and the working cavity;

the first heat insulation coating is arranged on one side of the radiating fin, which is opposite to the heat conducting structure.

Further, in an embodiment, the heat dissipation casing further includes a heat conduction laminating coating and a heat conduction coating, the heat conduction laminating coating set up in the fin is dorsad the one side of heat conduction structure, the heat conduction coating set up in on the heat conduction laminating coating, the first thermal-insulated coating embedding set up in the heat conduction laminating coating, and with the heat conduction coating is connected.

Further, in an embodiment, the first thermal insulation coating is disposed on a side of the heat sink facing away from the heat conducting structure, and the heat dissipation housing further includes a heat conducting lamination coating, and the heat conducting lamination coating is disposed on a side of the first thermal insulation coating facing away from the heat sink.

Further, in an embodiment, the heat dissipation housing further includes a first housing, and the first housing is disposed on a side of the heat conductive coating facing away from the heat conductive bonding coating.

Further, in an embodiment, the heat dissipation shell further includes a first shell, and the first shell is disposed on a side of the heat conductive bonding coating facing away from the first thermal insulation coating.

Further, in an embodiment, the heat dissipation casing further includes a second casing, the second casing set up in between the working chamber with the heat conduction laminating coating, the fin with the heat conduction structure embedding set up in the second casing, the fin with the heat conduction laminating coating is connected, the heat conduction structure is in the fin corresponds the position range, and is located the working chamber.

Further, in an embodiment, the heat dissipation casing further includes a second casing, the second casing set up in between the work chamber with the heat conduction laminating coating, first thermal-insulated coating the fin with the heat conduction structure all imbeds set up in on the second casing, the fin laminating set up in between the first thermal-insulated coating with the heat conduction structure, first thermal-insulated coating with the heat conduction coating is connected, the heat conduction structure is located the work intracavity.

Further, in an embodiment, the first housing includes a protective layer, a color layer, a texture layer, and a substrate layer stacked in order, where the protective layer is disposed on a side of the thermally conductive bonding coating opposite to the first thermal insulation coating.

Further, in an embodiment, the heat dissipation shell further includes a second thermal insulation coating, the second thermal insulation coating is disposed on a side of the second shell facing away from the heat conducting lamination coating, and an end of the heat conducting structure facing away from the heat sink penetrates through the second thermal insulation coating and is exposed out of the second thermal insulation coating.

The utility model also provides a heat dissipation shell, which comprises a first shell;

the heat-conducting laminating coating is arranged on the first shell;

the second shell is arranged on one side, away from the first shell, of the heat-conducting lamination coating;

and the radiating fin is arranged on the second shell.

Further, in an embodiment, the heat dissipation housing further includes a heat conduction structure, and the heat conduction structure is disposed on a side of the heat dissipation fin facing away from the first housing.

Further, in an embodiment, the heat dissipating shell further includes a first thermal insulation coating layer disposed on a side of the heat sink facing the first housing.

Further, in an embodiment, the heat dissipation shell further includes a second heat insulation coating, the second heat insulation coating and the heat dissipation fin are both disposed on a side of the second housing facing away from the heat conduction lamination coating, and the heat dissipation fin passes through the second heat insulation coating and is exposed out of the second heat insulation coating to be connected with the heat conduction structure;

or, the heat dissipation shell further comprises a second heat insulation coating, the second heat insulation coating is arranged on one side, facing away from the heat conduction attaching coating, of the second shell, one end of the radiating fin is embedded in the second shell, the other end of the radiating fin is embedded in the second heat insulation coating and attached to the heat conduction structure, and one end, facing away from the radiating fin, of the heat conduction structure is exposed out of the second heat insulation coating.

Further, in an embodiment, the second housing includes a substrate layer, a texture layer, and a color layer stacked in sequence, where the color layer faces one side of the thermally conductive lamination coating;

and/or, the material of the first shell is glass.

According to the technical scheme provided by the utility model, the radiating fin, the heat conducting structure, the heat conducting coating and the first heat insulating coating are arranged between the first shell and the second shell (namely between the radiating shells), the heat conducting structure is in contact with the heating element, and the heat of the heating element is transferred to the first shell to radiate through the heat conducting structure and the radiating fin, so that the heat in the radiating shell is directly transferred to the outside of the radiating shell to radiate through physical contact, the radiating efficiency is improved, the aim of reducing the internal temperature of the electronic equipment is fulfilled, the environmental working condition of each component in the electronic equipment is improved, and the performance of each chip under the condition of long-time use is improved. The first heat-insulating coating is correspondingly arranged above the radiating fins, so that heat transferred to the radiating fins is forced to be transferred to the heat-conducting coating through the positions except the first heat-insulating coating, and local touch sense high temperature is prevented from occurring at the positions of the first shell on the surface of the radiating shell, which correspond to the first heat-insulating coating.

Drawings

One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which the figures of the drawings are not to scale, unless expressly stated otherwise.

FIG. 1 is a schematic view of an exploded structure of a heat dissipating housing according to a first embodiment of the present utility model;

FIG. 2 is a schematic view showing a partial cross-sectional structure of a heat dissipation case according to a first embodiment of the present utility model;

fig. 3 is an exploded view of a heat dissipating housing and an electronic device according to a first embodiment of the present utility model;

FIG. 4 is a schematic view showing a partial cross-sectional structure of a heat dissipation case according to a second embodiment of the present utility model;

FIG. 5 is a schematic view showing a partial cross-sectional structure of a heat dissipation case according to a third embodiment of the present utility model;

fig. 6 is a schematic partial sectional view of a heat dissipating casing according to a fourth embodiment of the present utility model.

10, a heat dissipation shell; 11. a heat sink; 12. a thermally conductive structure; 13. a first thermal barrier coating; 14. a thermally conductive conformable coating; 15. a thermally conductive coating; 16. a first housing; 161. a protective layer; 162. a color layer; 163. a texture layer; 164. a substrate layer; 17. a second housing; 171. a first groove; 172. a first through hole; 18. a second thermal barrier coating; 181. a second through hole; 20. an electronic device; 21. a heating element; 22. a working chamber.

Detailed Description

In order that the utility model may be readily understood, a more particular description thereof will be rendered by reference to specific embodiments that are illustrated in the appended drawings. It will be understood that when an element is referred to as being "fixed" to another element, it can be directly on the other element or one or more intervening elements may be present therebetween. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or one or more intervening elements may be present therebetween. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and the like are used in this specification for purposes of illustration only. In the description of the present utility model, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or implicitly indicating the number of technical features indicated. Thus, unless otherwise indicated, features defining "first", "second" may include one or more such features either explicitly or implicitly; the meaning of "plurality" is two or more. The terms "comprises," "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or groups thereof may be present or added.

Furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other. All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used in this specification includes any and all combinations of one or more of the associated listed items.

In addition, the technical features mentioned in the different embodiments of the utility model described below can be combined with one another as long as they do not conflict with one another.

In the embodiments of the present utility model, the mobile phone is taken as an example, and certainly, the present utility model is not limited to the mobile phone, the tablet computer, the vehicle-mounted computer, the personal digital assistant and other electronic devices, and the present utility model is also applicable, and the present utility model is also understood to be within the scope of the technical solutions of the embodiments of the present utility model.

As shown in fig. 1-3, the embodiment of the utility model discloses a heat dissipation shell 10, which is applied to an electronic device 20 (mobile phone), wherein the electronic device 20 is provided with a working cavity 22 and a heating element 21, the heating element 21 is positioned in the working cavity 22, the heat dissipation shell 10 comprises a first shell 16, a second shell 17, a heat dissipation sheet 11, a heat conduction structure 12, a first heat insulation coating 13, a second heat insulation coating 18, a heat conduction coating 15 and a heat conduction attaching coating 14, and the first shell 16 is the outermost layer of the heat dissipation shell 10 and is in contact with the outside; the heat-conducting coating 15 is fixed on the first shell 16 in a coating, spraying or silk-screen mode, and the heat-conducting coating 15 is formed by coating the heat-conducting coating 15 on the inner surface of the first shell 16 in a coating, spraying or silk-screen mode after solidification, so that the heat-conducting coating 15 can cover the curved surface, the defect that the radiating fin 11 cannot be made into the curved surface is overcome, the whole surface can be soaked, the radiating area is increased, and the radiating efficiency is improved; fixing the first thermal insulation coating 13 on the surface of the thermal conduction coating 15, which is opposite to the first shell 16, through a 3M high-temperature-resistant double-sided adhesive tape, fixing the thermal conduction bonding coating 14 on the surface of the thermal conduction coating 15, which is opposite to the first shell 16, wrapping the first thermal insulation coating 13 by the thermal conduction bonding coating 14, routing a first groove 171 with the same size as the radiating fin 11 through a computer routing process at the position of the second shell 17, which corresponds to the first thermal insulation coating 13, routing a first through hole 172 at the position, which corresponds to the first groove 171, and fixing the radiating fin 11 in the first groove 171, wherein the cross section area of the first thermal insulation coating 13 is larger than or equal to the cross section area of the radiating fin 11 and smaller than the cross section area of the first shell 16, thereby being beneficial to isolating the radiating fin 11 from the highest heat conduction Wen Dianwei of the radiating shell 10, and not affecting the radiating efficiency of the radiating shell 10; then, the second shell 17 with the fixed cooling fin 11 is fixed on the surface of the heat conducting attaching coating 14 facing away from the heat conducting coating 15, the opening of the first groove 171 faces the heat conducting attaching coating 14, the first heat insulating coating 13 is correspondingly arranged above the cooling fin 11, so that the heat transferred to the cooling fin 11 is forced to be transferred to the heat conducting coating 15 through the position except the first heat insulating coating 13 (namely, the highest Wen Dianwei of the cooling fin 11 is isolated), the local touch sense high temperature is prevented from occurring at the position of the first shell 16 on the surface of the cooling shell 10 corresponding to the first heat insulating coating 13, and the uneven cooling effect leads to poor user experience; the second thermal insulation coating 18 is fixed on the surface of the second shell 17, which is opposite to the thermal conduction bonding coating 14, the second thermal insulation coating 18 prevents heat of the second shell 17 from being reversely conducted into the heat dissipation shell 10, a second through hole 181 is formed in the second thermal insulation coating 18 at a position corresponding to the first through hole 172, the heat conduction structure 12 is sequentially embedded into the second through hole 181 and the first through hole 172, the heat conduction structure 12 positioned in the first through hole 172 is connected with the heat dissipation plate 11, the point of the heat conduction structure 12 is changed into the surface of the heat dissipation plate 11 to dissipate heat, the heat dissipation efficiency is improved, and the other end of the heat conduction structure 12 penetrates through the second through hole 181 and protrudes out of the second thermal insulation coating 18 and is connected with the heating element 21. The heat of the heating element 21 is transferred to the radiating fin 11 through the heat conducting structure 12, the radiating fin 11 transfers the heat to the heat conducting laminating coating 14 and the heat conducting coating 15, the heat conducting coating 15 transfers the heat to the first shell 16, and the heat in the heat radiating shell 10 is directly transferred to the outside of the heat radiating shell 10 for radiating through physical contact, so that the radiating efficiency is improved, namely the aim of reducing the internal temperature of the mobile phone is achieved, the environmental working condition of each component in the mobile phone is improved, and the performance of each chip under the condition of long-time use is improved.

Specifically, the material of the first housing 16 may be solid Polyurethane (PU), animal leather, or solid silicone leather; the material of the heat conductive coating 15 may be a mixture of high heat conductive rubber resin and graphene powder or a mixture of high heat conductive rubber resin and boron nitride powder; the material of the first thermal insulation coating 13 can be nano aerogel, which is used for isolating the highest Wen Dianwei of the heat dissipation layer and preventing the decorative layer on the surface of the heat dissipation shell 10 from locally touching and having high temperature; the material of the heat-conducting bonding coating 14 may be a mixture of high heat-conducting rubber resin and graphene powder, or a mixture of high heat-conducting rubber resin and boron nitride powder, and the high heat-conducting rubber tree has viscosity and heat conductivity, and the graphene powder or the boron nitride powder is a material with excellent heat conductivity, so that the heat-conducting bonding coating 14 has bonding (adhesion) function and heat-conducting function; the material of the second case 17 may be a mixture of epoxy glass beads and graphene powder, a mixture of epoxy glass beads and boron nitride powder, injection molded rice (polycarbonate (PC), acrylonitrile-butadiene-styrene plastic (ABS), polyamide (PA), polymethyl methacrylate (PMMA)), and graphene powder or a mixture of injection molded rice (PC, ABS, PA, PMMA) and boron nitride powder for providing the external shape structure of the heat dissipation case 10; the heat sink 11 may be a VC heat sink, where the VC heat sink has a vacuum cavity, and a cooling liquid is disposed in the vacuum cavity, and the cooling liquid begins to generate vaporization after being heated in a vacuum environment, and the vaporization needs to absorb a large amount of heat energy, so as to be beneficial to heat dissipation; the material of the second thermal barrier coating 18 can be a nano aerogel; the material of the heat conducting structure 12 may be a high heat conducting back glue; the heating element 21 may be a CPU, GPU or a chip of a mobile phone.

As shown in fig. 4, the embodiment of the utility model further discloses a heat dissipation case 10, which is applied to an electronic device 20 (mobile phone), wherein the electronic device 20 is provided with a working cavity 22 and a heating element 21, the heating element 21 is located in the working cavity 22, the heat dissipation case 10 comprises a first shell 16, a second shell 17, a heat dissipation sheet 11, a heat conduction structure 12, a first heat insulation coating 13, a second heat insulation coating 18 and a heat conduction attaching coating 14, and the first shell 16 is the outermost layer of the heat dissipation case 10 and is in contact with the outside; fixing the heat-conducting bonding coating 14 on the surface of the first shell 16, routing a second groove on the second shell 17 through a computer routing process, routing a first through hole 172 at a position corresponding to the second groove, sequentially embedding the heat-radiating fin 11 and the first heat-insulating coating 13 into the second groove, bonding the heat-radiating fin 11 and the first heat-insulating coating 13 to each other, fixing the second shell 17 with the heat-conducting bonding coating 14 and the first heat-insulating coating 13 fixed on the surface of the heat-conducting bonding coating 14 facing away from the first shell 16, positioning the first heat-insulating coating 13 between the first shell 16 and the heat-radiating fin 11, correspondingly bonding the first heat-insulating coating 13 above the heat-radiating fin 11, so that heat transferred to the heat-radiating fin 11 is forced to be transferred to the heat-conducting bonding coating 14 through the position of the second shell 17 except the first heat-insulating coating 13, and then transferring the heat to the first shell 16 (namely isolating the heat-radiating fin 11 by Wen Dianwei at the highest), and preventing the first shell 16 on the surface of the heat-radiating shell 10 from being partially high in correspondence to the position of the first heat-insulating coating 13, thereby causing uneven heat-radiating effect to feel; the second thermal insulation coating 18 is fixed on the surface of the second shell 17, which is opposite to the thermal conduction bonding coating 14, the second thermal insulation coating 18 prevents heat of the second shell 17 from being reversely conducted into the heat dissipation shell 10, a second through hole 181 is formed in the second thermal insulation coating 18 at a position corresponding to the first through hole 172, the heat conduction structure 12 is sequentially embedded into the second through hole 181 and the first through hole 172, the heat conduction structure 12 positioned in the first through hole 172 is connected with the heat dissipation plate 11, the point of the heat conduction structure 12 is changed into the surface of the heat dissipation plate 11 to dissipate heat, the heat dissipation efficiency is improved, and the other end of the heat conduction structure 12 penetrates through the second through hole 181 and protrudes out of the second thermal insulation coating 18 and is connected with the heating element 21. The heat of the heating element 21 is transferred to the radiating fin 11 through the heat conducting structure 12, the radiating fin 11 transfers the heat to the heat conducting attaching coating 14, the heat conducting attaching coating 14 transfers the heat to the first shell 16, and the heat inside the heat radiating shell 10 is directly transferred to the outside of the heat radiating shell 10 for radiating through physical contact, so that the radiating efficiency is improved, namely the aim of reducing the internal temperature of the mobile phone is achieved, the environmental working condition of each component inside the mobile phone is improved, and the performance of each chip under the long-time use condition is improved.

Further, the first casing includes a protective layer 161, a color layer 162, a texture layer 163 and a substrate layer 164 stacked in sequence, where the protective layer 161 is disposed on a surface of the heat-conducting lamination coating 14 opposite to the first thermal insulation coating 13, and is used for protecting the color layer 162, and the color layer 162 is used for providing an appearance color for the heat dissipation casing 10 and protecting the texture layer 163, so as to enrich the appearance effect of the heat dissipation casing 10; the texture layer 163 further enriches the appearance effect of the heat dissipation case 10; the base material layer 164 is located on the outermost surface of the heat dissipation case 10 and contacts the outside.

Specifically, the material of the substrate layer 164 may be Polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), PC composite board or epoxy glass beads, with a thickness of 0.05mm to 0.2mm; the material of the texture layer 163 may be acrylate with a thickness of 0.01mm-0.02mm; the material of the color layer 162 may be silicon dioxide or titanium dioxide, and the thickness is 0.0001-0.0006mm; the material of the protective layer 161 may be a mixture of polyester ink and graphene powder or a mixture of polyester ink and boron nitride powder, and the thickness is 0.003mm to 0.006mm.

As shown in fig. 5, the embodiment of the utility model further discloses a heat dissipation case 10, which is applied to an electronic device 20 (mobile phone), wherein the electronic device 20 is provided with a working cavity 22 and a heating element 21, the heating element 21 is located in the working cavity 22, the heat dissipation case 10 comprises a first shell 16, a heat conduction fit coating 14, a second shell 17, a second heat insulation coating 18, heat dissipation fins 11 and a heat conduction structure 12, and the first shell 16 is the outermost layer of the heat dissipation case 10 and is in contact with the outside; the heat conducting attaching coating 14 is fixed on the first shell 16, then the second heat insulating coating 18 is fixed on the surface of the second shell 17, the second heat insulating coating 18 prevents the heat of the second shell 17 from being reversely conducted into the heat radiating shell 10, a third through hole is formed in the second heat insulating coating 18, the radiating fin 11 is embedded into the third through hole of the second heat insulating coating 18, one end of the radiating fin 11 is connected with the second shell 17, the other end of the radiating fin 11 protrudes out of the second heat insulating coating 18 and is connected with one end of the heat conducting structure 12, the radiating fin 11 is connected with the heat conducting structure 12 so that the point of the heat conducting structure 12 is changed into the surface of the radiating fin 11 to radiate heat, the heat radiating efficiency is improved, the other end of the heat conducting structure 12 is connected with the heating element 21, and the second shell 17 with the fixed radiating fin 11, the heat conducting structure 12 and the second heat insulating coating 18 is fixed on the surface of the heat conducting attaching coating 14, which is opposite to the first shell 16, so that the heat radiating shell 10 is formed. The heat conduction structure 12 is connected with the heating element 21, so that the heat of the heating element 21 is transferred to the radiating fin 11 through the heat conduction structure 12, the radiating fin 11 sequentially transfers the heat to the first shell 16 through the second shell 17 and the heat conduction laminating coating 14, and the heat inside the radiating shell 10 is directly transferred to the outside of the radiating shell 10 for radiating through physical contact, so that the radiating efficiency is improved, namely the aim of reducing the internal temperature of the mobile phone is fulfilled, the environmental working condition of each component inside the mobile phone is improved, and the performance of each chip under the condition of long-time use is improved.

Specifically, the material of the first housing 16 may be glass, for providing the structural shape of the heat dissipation case 10 with a thickness of 0.4mm to 0.6mm; the material of the heat-conducting fit coating 14 can be hot melt adhesive, pressure sensitive adhesive or UV adhesive, and the thickness is 0.025mm-0.05mm; the material of the heat conductive structure 12 may be a highly heat conductive adhesive.

Further, the second housing 17 includes a substrate layer 164, a texture layer 163 and a color layer 162 stacked in order, the color layer 162 is located between the thermally conductive bonding coating 14 and the texture layer 163, and the substrate layer 164 is located between the texture layer 163 and the second thermal barrier coating 18; by providing the texture layer 163 with the texture, the color layer 162 is provided with the color, and the appearance effect of the heat dissipation case 10 is enriched.

Specifically, the material of the base material layer 164 may be a boron nitride film for providing a carrier for the texture layer 163 and the color layer 162, diffusing heat of the heat dissipation layer to the surface of the entire heat dissipation case 10, and glass explosion-proof, with a thickness of 0.1mm to 0.3mm; the material of the texture layer 163 may be acrylate or polyurethane, and is used for providing the appearance effect for the heat dissipation shell 10, enriching the appearance effect of the heat dissipation shell 10, and the thickness is 0.01mm-0.02mm; the material of the color layer 162 may be silicon dioxide or titanium dioxide to provide the appearance color and the protective texture layer 163 with a thickness of 0.0001mm to 0.0006mm.

As shown in fig. 6, the embodiment of the utility model further discloses a heat dissipation case 10, which is applied to an electronic device 20 (mobile phone), wherein the electronic device 20 is provided with a working cavity 22 and a heating element 21, the heating element 21 is positioned in the working cavity 22, the heat dissipation case 10 comprises a first shell 16, a heat conduction fit coating 14, a second shell 17, a first heat insulation coating 13, a second heat insulation coating 18, a heat dissipation sheet 11 and a heat conduction structure 12, and the first shell 16 is the outermost layer of the heat dissipation case 10 and is in contact with the outside; the heat conducting attaching coating 14 is fixed on the first shell 16, then the second heat insulating coating 18 is fixed on the surface of the second shell 17, the second heat insulating coating 18 prevents heat of the second shell 17 from being reversely conducted to the inside of the heat radiating shell 10, a fourth through hole is formed in the second heat insulating coating 18, a third groove is formed in a position, corresponding to the fourth through hole, of the second shell 17, the fourth through hole is communicated with the third groove, the first heat insulating coating 13 and the heat radiating fin 11 are sequentially embedded in the third groove, one end of the heat radiating fin 11 protrudes out of the third groove and is embedded in the fourth through hole, the heat conducting structure 12 is embedded in the fourth through hole, one end of the heat conducting structure 12 is connected with one end of the heat radiating fin 11 located at the fourth through hole, the heat radiating fin 11 is connected with the heat conducting structure 12, the point of the heat conducting structure 12 is changed into the surface of the heat radiating fin 11, the efficiency is improved, the other end of the heat conducting structure 12 protrudes out of the second heat insulating coating 18 and the heat generating element 21, the fixed fin 11, the heat conducting structure 12, the first heat insulating coating 13 and the second heat radiating coating 18 are fixedly arranged on the second shell 17, and the heat radiating shell 17 is attached to the surface of the heat radiating shell 10, and the heat radiating shell 16 is formed. The heat conduction structure 12 is connected with the heating element 21, so that the heat of the heating element 21 is transferred to the radiating fin 11 through the heat conduction structure 12, the radiating fin 11 sequentially transfers the heat to the first shell 16 through the second shell 17 and the heat conduction laminating coating 14, and the heat inside the radiating shell 10 is directly transferred to the outside of the radiating shell 10 for radiating through physical contact, so that the radiating efficiency is improved, namely the aim of reducing the internal temperature of the mobile phone is fulfilled, the environmental working condition of each component inside the mobile phone is improved, and the performance of each chip under the condition of long-time use is improved.

Specifically, the material of the first housing 16 may be glass, for providing the structural shape of the heat dissipation case 10 with a thickness of 0.4mm to 0.6mm; the material of the heat-conducting fit coating 14 can be hot melt adhesive, pressure sensitive adhesive or UV adhesive, and the thickness is 0.025mm-0.05mm; the material of the heat conductive structure 12 may be a highly heat conductive adhesive.

Further, the second housing 17 includes a substrate layer 164, a texture layer 163 and a color layer 162 stacked in order, the color layer 162 is located between the thermally conductive bonding coating 14 and the texture layer 163, and the substrate layer 164 is located between the texture layer 163 and the second thermal barrier coating 18; by providing the texture layer 163 with the texture, the color layer 162 is provided with the color, and the appearance effect of the heat dissipation case 10 is enriched.

Specifically, the material of the base material layer 164 may be a boron nitride film for providing a carrier for the texture layer 163 and the color layer 162, diffusing heat of the heat dissipation layer to the surface of the entire heat dissipation case 10, and glass explosion-proof, with a thickness of 0.1mm to 0.3mm; the material of the texture layer 163 may be acrylate or polyurethane, and is used for providing the appearance effect for the heat dissipation shell 10, enriching the appearance effect of the heat dissipation shell 10, and the thickness is 0.01mm-0.02mm; the material of the color layer 162 may be silicon dioxide or titanium dioxide to provide the appearance color and the protective texture layer 163 with a thickness of 0.0001mm to 0.0006mm.

The above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; the technical features of the above embodiments or in the different embodiments may also be combined within the idea of the utility model, the steps may be implemented in any order, and there are many other variations of the different aspects of the utility model as described above, which are not provided in detail for the sake of brevity; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model.

Claims (15)

1. A heat-dissipating housing for an electronic device having a working chamber, the heat-dissipating housing comprising:

a heat sink;

the heat conduction structure is arranged between the radiating fin and the working cavity;

the first heat insulation coating is arranged on one side of the radiating fin, which is opposite to the heat conducting structure.

2. The heat dissipating housing of claim 1 further comprising a thermally conductive conformable coating disposed on a side of the heat sink opposite the thermally conductive structure and a thermally conductive coating disposed on the thermally conductive conformable coating, the first thermal barrier coating being embedded in the thermally conductive conformable coating and connected to the thermally conductive coating.

3. The heat dissipating housing of claim 1, wherein the first thermal barrier coating is disposed on a side of the heat sink facing away from the thermally conductive structure, the heat dissipating housing further comprising a thermally conductive conformable coating disposed on a side of the first thermal barrier coating facing away from the heat sink.

4. The heat dissipating housing of claim 2, further comprising a first housing disposed on a side of the thermally conductive coating facing away from the thermally conductive conformable coating.

5. The heat dissipating housing of claim 3 further comprising a first housing disposed on a side of said thermally conductive conformable coating facing away from said first thermal barrier coating.

6. The heat dissipating housing of claim 4 further comprising a second housing disposed between said working chamber and said thermally conductive conformable coating, said heat sink and said thermally conductive structure being embedded within said second housing, said heat sink being connected to said thermally conductive conformable coating, said thermally conductive structure being within a range of positions corresponding to said heat sink and within said working chamber.

7. The heat dissipating housing of claim 2 further comprising a second housing disposed between said working chamber and said thermally conductive bonding coating, said first thermal barrier coating, said heat sink and said thermally conductive structure being embedded in said second housing, said heat sink being bonded between said first thermal barrier coating and said thermally conductive structure, said first thermal barrier coating being connected to said thermally conductive coating, said thermally conductive structure being located within said working chamber.

8. The heat dissipating housing of claim 5 wherein said first housing comprises a protective layer, a color layer, a texture layer and a substrate layer stacked in sequence, said protective layer being disposed on a side of said thermally conductive conformable coating facing away from said first thermal barrier coating.

9. The heat dissipating housing of claim 6 or 7, further comprising a second thermal barrier coating disposed on a side of the second housing facing away from the thermally conductive conformable coating, wherein an end of the thermally conductive structure facing away from the heat sink passes through the second thermal barrier coating and is exposed to the second thermal barrier coating.

10. The heat dissipating housing of claim 1, wherein the electronic device further comprises a heat generating element disposed within the working chamber, and wherein the thermally conductive structure is attached to the heat generating element.

11. A heat-dissipating housing for an electronic device having a working chamber, the heat-dissipating housing comprising:

a first housing;

the heat-conducting laminating coating is arranged on the first shell;

the second shell is arranged on one side, away from the first shell, of the heat-conducting lamination coating;

and the radiating fin is arranged on the second shell.

12. The heat dissipating housing of claim 11, further comprising a thermally conductive structure disposed on a side of the heat sink facing away from the first housing.

13. The heat dissipating housing of claim 11, further comprising a first thermal barrier coating disposed on a side of the heat sink facing the first shell.

14. The heat dissipating housing of claim 12, further comprising a second thermal barrier coating, wherein the second thermal barrier coating and the heat sink are disposed on a side of the second housing facing away from the thermally conductive conformable coating, wherein the heat sink passes through the second thermal barrier coating and is exposed to the second thermal barrier coating to connect with the thermally conductive structure;

or, the heat dissipation shell further comprises a second heat insulation coating, the second heat insulation coating is arranged on one side, facing away from the heat conduction attaching coating, of the second shell, one end of the radiating fin is embedded in the second shell, the other end of the radiating fin is embedded in the second heat insulation coating and attached to the heat conduction structure, and one end, facing away from the radiating fin, of the heat conduction structure is exposed out of the second heat insulation coating.

15. The heat dissipating housing of claim 11, wherein the second shell comprises a substrate layer, a texture layer, and a color layer stacked in sequence, the color layer facing one side of the thermally conductive conformable coating;

and/or, the material of the first shell is glass.

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