CN219066836U

CN219066836U - MiniLED backlight die bonding device

Info

Publication number: CN219066836U
Application number: CN202320108185.2U
Authority: CN
Inventors: 廖梓成
Original assignee: Guangdong Liangyou Technology Co ltd
Current assignee: Guangdong Liangyou Technology Co ltd
Priority date: 2023-02-03
Filing date: 2023-02-03
Publication date: 2023-05-23
Anticipated expiration: 2033-02-03

Abstract

The utility model relates to the technical field of LED die bonding, in particular to a MiniLED backlight die bonding device, which comprises supporting legs, wherein a supporting plate is penetrated and fixedly connected between the left and right supporting legs, the left side positions of the tops of the two supporting plates are fixedly connected with a first bracket, the center position of the top of the first bracket is fixedly connected with a dust filtering box, the front end position of the top of the first bracket is fixedly connected with a dust suction pump, the bottom position of a driving motor is rotationally connected with a die bonding gun head, and the rear end position of the top of the front end of the extending plate is fixedly provided with a storage disc; this solid brilliant device of miniLED backlight drives the conveyer belt through starting servo motor and rotates the transportation, starts the dust absorption pump simultaneously, transmits suction to dust absorption mouth department through the dust absorption pipe, absorbs the dust on the miniLED backlight unit surface that needs solid brilliant, and the dust can be filtered the dirt box and filter the storage, effectively guarantees the cleanness on miniLED backlight unit surface, promotes miniLED backlight unit solid brilliant back product quality greatly.

Description

MiniLED backlight die bonding device

Technical Field

The utility model relates to the technical field of LED die bonding, in particular to a MiniLED backlight die bonding device.

Background

With the rapid development of Mini LED display technology, the Mini LED display product is applied to super-large screen high-definition display, such as commercial fields of monitoring command, high-definition performance, high-end cinema, medical diagnosis, advertisement display, conference, office display, virtual reality and the like.

However, in the prior art, when the MiniLED backlight module is subjected to die bonding, dust remains on the surface of the MiniLED backlight module, so that the dust cannot be well removed, and the product quality of the MiniLED backlight module after die bonding is affected. In view of this, we propose a MiniLED backlight die bonding device.

Disclosure of Invention

In order to make up for the defects, the utility model provides a MiniLED backlight die bonding device.

The technical scheme of the utility model is as follows:

a MiniLED backlight die attach apparatus comprising:

the dust collecting device comprises supporting legs, driving rollers, a front supporting leg, a rear supporting leg, a driving motor, a front supporting leg, a rear supporting leg, a front end left side supporting leg, a front supporting leg front end top position fixedly installed with a power source, a left supporting leg and a right supporting leg, a supporting plate, a first support, a dust filtering box, a dust collecting pump, a second support, an extension plate, a driving motor, a crystal fixing gun head, a storage tray and a storage tray.

Preferably, a conveyor belt is arranged on both driving rollers.

Preferably, the bottom of the first bracket is provided with a dust collection nozzle.

Preferably, a wafer storage tray is mounted on the front end of the top of the extension board at the rear end.

Preferably, the middle position of the front end of the outer surface of the second bracket is fixedly connected with a telescopic motor.

Preferably, the power source adopts a servo motor, and the servo motor can drive the left driving roller to rotate.

Compared with the prior art, the utility model has the beneficial effects that:

this solid brilliant device of miniLED backlight drives the conveyer belt through starting servo motor and rotates the transportation, starts the dust absorption pump simultaneously, transmits suction to dust absorption mouth department through the dust absorption pipe, absorbs the dust on the miniLED backlight unit surface that needs solid brilliant, and the dust can be filtered the dirt box and filter the storage, effectively guarantees the cleanness on miniLED backlight unit surface, promotes miniLED backlight unit solid brilliant back product quality greatly.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic diagram of a conveyor belt structure according to the present utility model;

FIG. 3 is a schematic view of a dust collection nozzle according to the present utility model;

FIG. 4 is a schematic view of the structure of the tray of the present utility model.

The meaning of each reference numeral in the figures is:

1. support legs; 2. a first bracket; 3. a driving motor; 4. a second bracket; 5. die bonding gun head; 6. a wafer storage tray; 7. an extension plate; 8. a telescopic motor; 9. a support plate; 10. a conveyor belt; 11. a servo motor; 12. a driving roller; 13. a dust suction nozzle; 14. a dust collection pump; 15. a dust filtering box; 16. a clamping plate; 17. a storage tray.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Referring to fig. 1-4, the present utility model is described in detail by the following embodiments:

a MiniLED backlight die attach apparatus comprising:

the top of each supporting leg 1 penetrates through and is rotationally connected with a driving roller 12, a power source is fixedly installed at the top position of the front end of each supporting leg 1 on the left side of the front end, each supporting leg 1 on the right side of the front end is fixedly connected with a supporting plate 9, the left side positions of the tops of the two supporting plates 9 are fixedly connected with a first bracket 2, the center position of the tops of the first bracket 2 is fixedly connected with a dust filtering box 15, the front end position of the tops of the first bracket 2 is fixedly connected with a dust suction pump 14, the center position of the tops of the two supporting plates 9 is fixedly connected with a second bracket 4, extension plates 7 are fixedly installed at the middle positions of inner walls of the front end and the rear end of the second bracket 4, a driving motor 3 penetrates through and is fixedly connected with a crystal fixing gun head 5, and the center position of the top of the front end extension plate 7 is fixedly installed with a storage disc 17.

A conveyor belt 10 is provided on both drive rollers 12.

The bottom of the first bracket 2 is provided with a dust collection nozzle 13.

The front end of the top of the rear extension plate 7 is provided with a wafer storage disk 6.

The middle position of the front end of the outer surface of the second bracket 4 is fixedly connected with a telescopic motor 8, the output end of the telescopic motor 8 is slidably connected with a telescopic rod, and the other end of the telescopic rod is fixedly connected with a clamping plate 16.

The power source adopts a servo motor 11, and the servo motor 11 can drive a left driving roller 12 to rotate.

It should be noted that, through the friction between the driving roller 12 and the conveyor belt 10, the driving roller 12 rotates to drive the conveyor belt 10 to rotate and transport, and the dust suction pump 14, the dust filtering box 15 and the dust suction nozzle 13 sequentially penetrate through and communicate through the dust suction pipe, and the clamping plate 16 is located in the object placing disc 17 and can clamp and fix the MiniLED backlight module.

According to the MiniLED backlight die bonding device, firstly, a MiniLED backlight module is placed on a conveyor belt 10, a servo motor 11 is started to drive the conveyor belt 10 to rotate and transport, a dust suction pump 14 is started simultaneously, suction force is transmitted to a dust suction nozzle 13 through a dust suction pipe, dust on the surface of the MiniLED backlight module needing die bonding is sucked, the dust can be filtered and stored by a dust filter box 15, the surface of the MiniLED backlight module is effectively guaranteed to be clean, the product quality of the MiniLED backlight module after die bonding is greatly improved, then the MiniLED backlight module is placed on a placement disc 17, a telescopic motor 8 is started to drive a clamping plate 16 to move, the MiniLED backlight module is clamped, a driving motor 3 and a die bonding gun head 5 are started, die bonding is carried out on the MiniLED backlight module, products after die bonding are transported through the conveyor belt 10, and the manual transportation cost is reduced.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a miniLED backlight die bonding device which characterized in that: comprising the following steps:

supporting legs (1), front and back two all run through and rotate between supporting legs (1) drive roller (12), front end left side supporting legs (1) front end top position fixed mounting has the power supply, control two all run through and fixedly connected with backup pad (9) between supporting legs (1), two backup pad (9) top left side position all fixedly connected with first support (2), first support (2) top central point puts fixedly connected with dust filtration box (15), first support (2) top front end position fixedly connected with dust absorption pump (14), two backup pad (9) top intermediate position all fixedly connected with second support (4), both ends inner wall intermediate position all fixedly mounted has extension board (7) around second support (4), second support (4) top central point put run through and fixedly connected with driving motor (3), driving motor (3) bottom position rotates and is connected with brilliant rifle head (5), front end extension board (7) top rear end position fixed mounting has thing (17).

2. The MiniLED backlight die bonding device of claim 1, wherein: the driving rollers (12) are provided with a conveyor belt (10).

3. The MiniLED backlight die bonding device of claim 1, wherein: the bottom of the first bracket (2) is provided with a dust collection nozzle (13).

4. The MiniLED backlight die bonding device of claim 1, wherein: the front end of the top of the extension plate (7) at the rear end is provided with a wafer storage disk (6).

5. The MiniLED backlight die bonding device of claim 1, wherein: the middle position of the front end of the outer surface of the second bracket (4) is fixedly connected with a telescopic motor (8).

6. The MiniLED backlight die bonding device of claim 1, wherein: the power source adopts a servo motor (11), and the servo motor (11) can drive the left driving roller (12) to rotate.