CN219066760U

CN219066760U - Packaging testing device for integrated circuit production

Info

Publication number: CN219066760U
Application number: CN202221635169.0U
Authority: CN
Inventors: 马亮; 刘希萍
Original assignee: Shenzhen Ruizhixun Technology Co ltd
Current assignee: Shenzhen Ruizhixun Technology Co ltd
Priority date: 2022-06-27
Filing date: 2022-06-27
Publication date: 2023-05-23
Anticipated expiration: 2032-06-27

Abstract

The utility model discloses a packaging testing device for integrated circuit production, which comprises a workbench, a circuit testing mechanism, a movable plate and a telescopic rod, wherein a chip is arranged on the upper side of the workbench; the chip comprises a main body and pins, wherein a plurality of pins are arranged on the periphery of the main body; the lower side of the main body is provided with a first supporting plate, and the periphery of the first supporting plate is provided with a second supporting plate; the four corners of the lower surface of the first supporting plate are provided with first loop bars, and the periphery of each first loop bar is provided with a first spring; the four corners of the lower surface of the second supporting plate are provided with second loop bars, and the periphery of each second loop bar is provided with a second spring; the upper side of the chip is provided with the movable plate, the upper side of the movable plate is provided with the telescopic rod, and the front side of the upper surface of the movable plate is provided with the circuit testing mechanism; the lower surface of the movable plate is provided with a plurality of abutting mechanisms. The beneficial effects are that: the pins are prevented from being bent, and the yield is improved.

Description

Packaging testing device for integrated circuit production

Technical Field

The present utility model relates to the field of integrated circuit production, and in particular, to a package testing device for integrated circuit production.

Background

The integrated circuit is made up by using a certain technological process to interconnect the elements of transistor, resistor, capacitor and inductor, etc. required in a circuit together, and making them into a small block or several small blocks of semiconductor chip or dielectric substrate, then packaging them into a tube shell so as to obtain the invented miniature electronic device or component with the required circuit function.

After the integrated circuit is packaged, whether the welding between the pins and the integrated circuit is good or not needs to be tested in order to ensure the quality of products. At present, the existing packaging test device, for example, the publication number is CN212542356U, the name is chinese patent of integrated circuit packaging test device, this patent discloses technical scheme including detection case, integrated circuit chip and pin, the central point of detection case inner chamber bottom puts fixedly connected with brace table, the integrated circuit chip has been placed at the brace table top, and the fixed welding of the left and right sides of this integrated circuit chip has a plurality of pins along horizontal vertical equidistance, the position fixed connection original fixed baseplate that is close to the bottom on detection case right side, during the test, the roof contacts with the pin of integrated circuit chip one side and causes certain pressing to the pin, if the pin only produces normal deformation, its junction is not loosen and just be the yields, if the pin junction loosens or the pin drops and need retrieve it, this process is exerted the test force at the pin tip, and tests according to deformation degree, bumps the pin bending easily during the test to cause the condition emergence with originally intact chip destruction, make manufacturing cost increase.

Disclosure of Invention

The present utility model has been made to solve the above-mentioned problems, and an object of the present utility model is to provide a package testing device for integrated circuit production.

The utility model realizes the above purpose through the following technical scheme:

the packaging testing device for integrated circuit production comprises a workbench, a circuit testing mechanism, a movable plate and a telescopic rod, wherein a bottom plate is arranged on the lower side of the workbench, an upright post is arranged on the rear side of the workbench, and a chip is arranged on the upper side of the workbench; the chip comprises a main body and pins, wherein a plurality of pins are arranged on the periphery of the main body; the lower side of the main body is provided with a first supporting plate, and the periphery of the first supporting plate is provided with a second supporting plate; the four corners of the lower surface of the first supporting plate are provided with first loop bars, and the periphery of each first loop bar is provided with a first spring; the four corners of the lower surface of the second supporting plate are provided with second loop bars, and the periphery of each second loop bar is provided with a second spring; the upper side of the upright post is provided with a mounting plate, and the front side of the lower surface of the mounting plate is provided with the telescopic rod; the upper side of the telescopic rod is provided with an air cylinder, the lower side of the telescopic rod is provided with the movable plate, and the front side of the upper surface of the movable plate is provided with the circuit testing mechanism; the circuit testing mechanism comprises a circuit tester and a display screen, wherein the circuit tester is positioned on the upper side of the movable plate, and the display screen is positioned on the front side of the movable plate; the lower surface of the moving plate is provided with a plurality of abutting mechanisms, each abutting mechanism comprises an electrode plate, an inner hollow tube, an outer hollow tube and a third spring, the inner hollow tube is arranged on the upper side of each electrode plate, the third springs are arranged on the outer side of each inner hollow tube, and the outer hollow tube is arranged on the upper side of each inner hollow tube; the rear side of movable plate is provided with the lug, the downside of lug is provided with the stopper.

In the structure, the chip is placed above the first supporting plate, the pins are located above the second supporting plate, the air cylinder pushes the moving plate to descend, the electrode plates are in contact with the pins, and the circuit tester tests the pins and outputs results to the display screen.

Optionally, the bottom plate with the workstation passes through screw fixed connection, the bottom plate with the stand welding, the stand with the mounting panel welding, the mounting panel with the cylinder passes through screw connection, the pin with conflict mechanism position corresponds from top to bottom.

Optionally, the first loop bar is formed by sleeving a hollow bar and a solid bar, the second loop bar is formed by sleeving a solid bar and a hollow bar, the limiting block is welded with the upright post, and the protruding block is welded with the movable plate.

Optionally, the telescopic link with the fly leaf passes through screw fixed connection, the circuit tester with the electrode plate passes through wire connection, the circuit tester with the display screen passes through the data line to be connected, the internal diameter of outer hollow tube with the external diameter of interior hollow tube equals, interior hollow tube with outer hollow tube sliding connection, the outer hollow tube with the fly leaf passes through screw fixed connection.

The beneficial effects are that: when the integrated circuit chip is detected, the electrode plate can be contacted with the pins through the second spring and the third spring, the pins can be prevented from being bent, and the test requirements of chips with different pin heights can be met.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings that are necessary for the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.

FIG. 1 is a schematic diagram of a package testing apparatus for integrated circuit production according to the present utility model;

FIG. 2 is a left side view of a package testing apparatus for integrated circuit production according to the present utility model;

FIG. 3 is a front cross-sectional view of a package testing apparatus for integrated circuit production according to the present utility model;

fig. 4 is an enlarged schematic view at a in fig. 3.

The reference numerals are explained as follows:

1. a work table; 2. a chip; 21. a main body; 22. pins; 3. a column; 4. a cylinder; 5. a telescopic rod; 6. a circuit testing mechanism; 61. a circuit tester; 62. a display screen; 7. a bottom plate; 8. a mounting plate; 9. a limiting block; 10. a bump; 11. a moving plate; 12. a collision mechanism; 121. an electrode plate; 122. an inner hollow tube; 123. a third spring; 124. an outer hollow tube; 13. a first support plate; 14. a second support plate; 15. a first spring; 16. a second spring; 17. a first loop bar; 18. and a second loop bar.

Detailed Description

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art in a specific case.

The utility model is further described below with reference to the accompanying drawings:

as shown in fig. 1-4, a packaging testing device for integrated circuit production comprises a workbench 1, a circuit testing mechanism 6, a movable plate 11 and a telescopic rod 5, wherein a bottom plate 7 is arranged on the lower side of the workbench 1, a stand column 3 is arranged on the rear side of the workbench 1, and a chip 2 is arranged on the upper side of the workbench 1; the chip 2 comprises a main body 21 and pins 22, wherein a plurality of pins 22 are arranged on the periphery of the main body 21; the lower side of the main body 21 is provided with a first support plate 13, and the periphery of the first support plate 13 is provided with a second support plate 14; the four corners of the lower surface of the first supporting plate 13 are provided with first loop bars 17, and the periphery of the first loop bars 17 are provided with first springs 15; the four corners of the lower surface of the second supporting plate 14 are provided with second loop bars 18, and the periphery of each second loop bar 18 is provided with a second spring 16; the upper side of the upright post 3 is provided with a mounting plate 8, and the front side of the lower surface of the mounting plate 8 is provided with a telescopic rod 5; the upper side of the telescopic rod 5 is provided with an air cylinder 4, the lower side of the telescopic rod 5 is provided with a moving plate 11, and the front side of the upper surface of the moving plate 11 is provided with a circuit testing mechanism 6; the circuit testing mechanism 6 comprises a circuit tester 61 and a display screen 62, wherein the circuit tester 61 is positioned on the upper side of the movable plate 11, and the display screen 62 is positioned on the front side of the movable plate 11; the lower surface of the movable plate 11 is provided with a plurality of abutting mechanisms 12, each abutting mechanism 12 comprises an electrode plate 121, an inner hollow tube 122, an outer hollow tube 124 and a third spring 123, the inner hollow tube 122 is arranged on the upper side of the electrode plate 121, the third spring 123 is arranged on the outer side of the inner hollow tube 122, and the outer hollow tube 124 is arranged on the upper side of the inner hollow tube 122; the rear side of movable plate 11 is provided with lug 10, and the downside of lug 10 is provided with stopper 9, and electrode plate 121 is used for communicating pin 22 and circuit tester 61 and tests, and third spring 123 and second spring 16 are used for buffering and avoid pin 22 to bend, and first spring 15 is used for providing the buffering when pin 22 does not contact with second backup pad 14, and display screen 62 is used for conveniently observing the test result, and stopper 9 is used for limiting the maximum stroke of movable plate 11.

In the above structure, the chip 2 is placed above the first support plate 13, the pins 22 are above the second support plate 14, the cylinder 4 pushes the moving plate 11 to descend, the electrode plate 121 contacts with the pins 22, and the circuit tester 61 tests the pins 22 and outputs the result to the display screen 62.

Alternatively, the bottom plate 7 is fixedly connected with the workbench 1 through screws, the bottom plate 7 is welded with the upright post 3, the upright post 3 is welded with the mounting plate 8, the mounting plate 8 is connected with the air cylinder 4 through screws, the pin 22 corresponds to the position of the abutting mechanism 12 up and down, the first sleeve rod 17 is formed by sleeving the hollow rod with the solid rod, the second sleeve rod 18 is formed by sleeving the solid rod with the hollow rod, the limiting block 9 is welded with the upright post 3, the protruding block 10 is welded with the movable plate 11, the telescopic rod 5 is fixedly connected with the movable plate 11 through screws, the circuit tester 61 is connected with the electrode plate 121 through wires, the circuit tester 61 is connected with the display screen 62 through data wires, the inner diameter of the outer hollow tube 124 is equal to the outer diameter of the inner hollow tube 122, the inner hollow tube 122 is in sliding connection with the outer hollow tube 124, and the outer hollow tube 124 is fixedly connected with the movable plate 11 through screws.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.

Claims

1. An integrated circuit production is with encapsulation testing arrangement, its characterized in that: the automatic testing device comprises a workbench (1), a circuit testing mechanism (6), a movable plate (11) and a telescopic rod (5), wherein a bottom plate (7) is arranged on the lower side of the workbench (1), an upright post (3) is arranged on the rear side of the workbench (1), and a chip (2) is arranged on the upper side of the workbench (1); the chip (2) comprises a main body (21) and pins (22), wherein a plurality of pins (22) are arranged on the periphery of the main body (21); a first supporting plate (13) is arranged on the lower side of the main body (21), and a second supporting plate (14) is arranged on the periphery of the first supporting plate (13); the four corners of the lower surface of the first supporting plate (13) are provided with first loop bars (17), and the periphery of each first loop bar (17) is provided with a first spring (15); the four corners of the lower surface of the second supporting plate (14) are provided with second loop bars (18), and the periphery of each second loop bar (18) is provided with a second spring (16); the upper side of the upright post (3) is provided with a mounting plate (8), and the front side of the lower surface of the mounting plate (8) is provided with the telescopic rod (5); the upper side of the telescopic rod (5) is provided with an air cylinder (4), the lower side of the telescopic rod (5) is provided with the movable plate (11), and the front side of the upper surface of the movable plate (11) is provided with the circuit testing mechanism (6); the circuit testing mechanism (6) comprises a circuit tester (61) and a display screen (62), wherein the circuit tester (61) is positioned on the upper side of the movable plate (11), and the display screen (62) is positioned on the front side of the movable plate (11); the lower surface of the moving plate (11) is provided with a plurality of collision mechanisms (12), each collision mechanism (12) comprises an electrode plate (121), an inner hollow tube (122), an outer hollow tube (124) and a third spring (123), the inner hollow tube (122) is arranged on the upper side of the electrode plate (121), the third spring (123) is arranged on the outer side of the inner hollow tube (122), and the outer hollow tube (124) is arranged on the upper side of the inner hollow tube (122); the rear side of the movable plate (11) is provided with a lug (10), and the lower side of the lug (10) is provided with a limiting block (9).

2. The package testing apparatus for integrated circuit production of claim 1, wherein: the base plate (7) with workstation (1) pass through screw fixed connection, base plate (7) with stand (3) welding, stand (3) with mounting panel (8) welding, mounting panel (8) with cylinder (4) pass through screw connection, pin (22) with conflict mechanism (12) position corresponds from top to bottom.

3. The package testing apparatus for integrated circuit production of claim 1, wherein: the first loop bar (17) is formed by sleeving a hollow bar and a solid bar, the second loop bar (18) is formed by sleeving the solid bar and the hollow bar, the limiting block (9) is welded with the upright post (3), and the protruding block (10) is welded with the movable plate (11).

4. The package testing apparatus for integrated circuit production of claim 1, wherein: the telescopic rod (5) is fixedly connected with the movable plate (11) through a screw, the circuit tester (61) is connected with the electrode plate (121) through a wire, the circuit tester (61) is connected with the display screen (62) through a data wire, the inner diameter of the outer hollow tube (124) is equal to the outer diameter of the inner hollow tube (122), the inner hollow tube (122) is in sliding connection with the outer hollow tube (124), and the outer hollow tube (124) is fixedly connected with the movable plate (11) through a screw.