CN219064754U - Parallel pressure measurement and vibration feedback sensor module - Google Patents
Parallel pressure measurement and vibration feedback sensor module Download PDFInfo
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- CN219064754U CN219064754U CN202223407896.4U CN202223407896U CN219064754U CN 219064754 U CN219064754 U CN 219064754U CN 202223407896 U CN202223407896 U CN 202223407896U CN 219064754 U CN219064754 U CN 219064754U
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Abstract
The utility model discloses a sensor module for parallel pressure measurement and vibration feedback, which comprises an FPC board and a piezoelectric ceramic piece which is arranged together with the FPC board, wherein the FPC board is provided with a hollowed-out part and a round part which are connected, the circuit printed surface of the round part is printed with a Wheatstone bridge circuit, the Wheatstone bridge circuit comprises a plurality of first resistors and a plurality of second resistors, and the centers of the round parts of the plurality of first resistor rings are distributed at equal angles. The second resistors are symmetrically distributed around the center of the circular portion. According to the sensor module, four groups of parallel resistor groups are arranged on the FPC board, each resistor group is formed by printing pressure sensing ink, piezoelectric ceramic plates are arranged at gaps of the FPC board, and the whole module structure is of a thin structure, so that the volume is reduced. The resistor group consists of a plurality of resistors connected in parallel, the plurality of resistors in the central area are uniformly stressed, and the pressure can be accurately sensed.
Description
Technical Field
The utility model relates to the technical field of tactile feedback, in particular to a sensor module for parallel pressure measurement and vibration feedback.
Background
Haptic feedback technology is a currently popular technology, in which a pressure measurement technology and a vibration feedback technology are core parts of the haptic feedback technology.
1. Pressure measurement techniques in haptic feedback applications fall into two broad categories:
the first type uses the piezoelectric effect of piezoelectric ceramics, that is, mechanical deformation generates alternating voltage, and the deformation size is determined by measuring the voltage.
And secondly, forming a Wheatstone bridge by using strain foil or piezoresistive ink, changing the resistance value of one or more resistors by using deformation, and calculating the deformation by measuring the tiny voltage change of the Wheatstone bridge.
The first of which has obvious drawbacks: the piezoelectric effect is only obvious when the deformation speed is high; when the pressure is kept unchanged, the output voltage of the piezoelectric ceramic is zero. Therefore, it is impossible to accurately measure the pressure change or the pressure retention failure.
The second category overcomes the drawbacks of the first category: the second type is an electronic scale that can measure small changes in pressure and keep the pressure unchanged, and is typically used in daily life.
2. Vibration feedback techniques are also divided into two main categories:
the first kind of linear motor is that the magnetic material such as iron block is driven by the electromagnetic effect in Z-axis direction or X-axis or Y-axis direction of the linear motor to start and stop rapidly to generate specific vibration, so as to realize vibration feedback.
And in the second type, a high voltage, such as 60-300V voltage, is applied to two electrodes of the piezoelectric ceramic to generate mechanical energy for the piezoelectric ceramic, so that vibration feedback is realized.
The linear motor requires a large volume to generate a sufficiently large mechanical shock and requires a longer running time and a longer shock period than the piezoelectric ceramic and requires more relative electric energy. Therefore, it is difficult to make the product driven by the linear motor thin and light.
In addition, piezoelectric ceramics are advantageous in terms of being lightweight and thin in volume and also being more power efficient, however piezoelectric ceramics require higher voltages and therefore require dedicated circuitry to manage.
In order to achieve accurate pressure measurements, more resistance formed by the pressure sensing ink is required to sense pressure.
Disclosure of Invention
Aiming at the defects in the prior art, the utility model aims to provide a sensor module for parallel pressure measurement and vibration feedback, and the sensor module is designed to transmit pressure change received by a piezoelectric ceramic plate to an FPC (flexible printed Circuit) with piezoelectric sensing ink on the back surface of the FPC for pressure measurement so as to realize vibration feedback after the pressure reaches a threshold value.
In order to solve the technical problems, the utility model is realized by the following scheme: the utility model relates to a sensor module for parallel pressure measurement and vibration feedback, which comprises an FPC board and a piezoelectric ceramic piece which is arranged together with the FPC board, wherein the FPC board is provided with a hollowed part and a round part which are connected, the electric inlet end of a printed circuit of the hollowed part is provided with a VS electric contact, an S1 electric contact, an S2 electric contact, a GND electric contact, a VH1 electric contact and a VH2 electric contact, and the circuit printed surface of the round part is printed with a Wheatstone bridge circuit, and the Wheatstone bridge circuit comprises:
the first resistors are printed in the central area of the round part and are distributed at equal angles around the center of the round part, the first resistors comprise a third parallel resistor group electrically connected with the VS electric contact and a second parallel resistor group electrically connected with the S1 electric contact, and the other end of the second parallel resistor group is grounded;
the second resistors are printed on the edge of the round part and are distributed symmetrically in the center of the round part, the second resistors comprise a first parallel resistor group electrically connected with the VS electric contact and a fourth parallel resistor group electrically connected with the S2 electric contact, and the fourth parallel resistor group is connected with the grounding end of the second parallel resistor group.
Further, the round part subjected to pressure deformation is thermally pressed and attached to the back copper sheet of the piezoelectric ceramic sheet.
Furthermore, the first resistor and the second resistor are both printed by pressure sensing ink.
Further, the first parallel resistor group is formed by connecting a plurality of second resistors in parallel.
Further, the second parallel resistor group is formed by connecting a plurality of first resistors in parallel.
Further, the third parallel resistor group is formed by connecting a plurality of first resistors in parallel.
Further, the fourth parallel resistor group is formed by connecting a plurality of second resistors in parallel.
Further, the circuit printed surface of the round part is stuck with a buffer pad, and the buffer pad surrounds a plurality of first resistors in the central area of the round part.
Further, the buffer pad is of a circular ring structure.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the sensor module, four groups of parallel resistor groups are arranged on the FPC board, each resistor group is formed by printing pressure sensing ink, piezoelectric ceramic plates are arranged at gaps of the FPC board, and the whole module structure is of a thin structure, so that the volume is reduced.
2. The resistor group consists of a plurality of resistors connected in parallel, the plurality of resistors in the central area are uniformly stressed, and the pressure can be accurately sensed.
Drawings
FIG. 1 is an exploded view of a sensor module according to the present utility model.
Fig. 2 is an expanded view of the FPC board of the present utility model having a printed circuit surface.
Fig. 3 is a rear structure view of the FPC board according to the present utility model.
FIG. 4 is a schematic diagram of a Wheatstone bridge circuit layout according to one embodiment of the present utility model.
Fig. 5 is a circuit structure diagram of a power supply end of a hollowed-out portion of the FPC board according to the present utility model.
FIG. 6 is a circuit diagram of a Wheatstone bridge in accordance with the present utility model.
FIG. 7 is a block diagram showing the mounting position of the cushion pad of the present utility model.
Fig. 8 is a perspective view of the assembled sensor module of the present utility model.
Fig. 9 is a structural view of a piezoelectric ceramic sheet according to the present utility model.
FIG. 10 is a schematic diagram of another Wheatstone bridge circuit layout of the present utility model.
The reference numerals in the drawings: the piezoelectric ceramic chip 1, the FPC board 2, the cushion pad 3, the first conductive double faced adhesive tape 7, the second conductive double faced adhesive tape 8, the pressing sheet 9, the annular copper surface 11, the electrode metal contact 12, the hollowed-out part 21, the round part 22, the first resistor 100 and the second resistor 200.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described in the following with reference to the drawings in the embodiments of the present utility model, so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, and thus the protection scope of the present utility model is more clearly and clearly defined. It should be apparent that the described embodiments of the utility model are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In addition, the technical features of the different embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.
Example 1: the specific structure of the utility model is as follows:
referring to fig. 1-9, the sensor module for parallel pressure measurement and vibration feedback of the present utility model includes an FPC board 2 and a piezoelectric ceramic sheet 1 mounted on the FPC board 2, where the FPC board 2 has a hollow portion 21 and a round portion 22 connected to each other, the hollow portion 21 and the round portion 22 are bent at a connection portion to form a structure with a gap, the piezoelectric ceramic sheet 1 is disposed in the gap, a front surface of the round portion 22 is fixed to a back surface of the piezoelectric ceramic sheet 1 by bonding, and the hollow portion 21 and the front surface of the piezoelectric ceramic sheet 1 are fixed by bonding with a first conductive double sided tape 7 and a second conductive double sided tape 8.
The power supply end of the printed circuit of the hollowed-out part 21 is provided with a VS electric contact, an S1 electric contact, an S2 electric contact, a GND electric contact, a VH1 electric contact and a VH2 electric contact, and the circuit printed surface of the round part 22 is printed with a Wheatstone bridge circuit which comprises:
the first resistors 100 are printed in the central area of the round portion 22, the first resistors 100 are distributed around the center of the round portion 22 at equal angles, the first resistors 100 comprise a third parallel resistor group electrically connected with the VS electrical contact and a second parallel resistor group electrically connected with the S1 electrical contact, and the other end of the second parallel resistor group is grounded;
the second resistors 200 printed on the edge of the round portion 22 are distributed symmetrically about the center of the round portion 22, the second resistors 200 include a first parallel resistor group electrically connected to the VS electrical contact and a fourth parallel resistor group electrically connected to the S2 electrical contact, and the fourth parallel resistor group is connected to the ground terminal of the second parallel resistor group.
As shown in fig. 4, fig. 4 is a schematic circuit layout diagram of a wheatstone bridge in the present utility model, and each resistor group in fig. 4 has two resistors, wherein the second resistor group is formed by parallel connection of a resistor R21 and a resistor R22, the third resistor group is formed by parallel connection of a resistor R31 and a resistor R32, the first resistor group is formed by parallel connection of a resistor R11 and a resistor R12, and the fourth resistor group is formed by parallel connection of a resistor R41 and a resistor R42. The resistors R21, R22, R31, and R32 are formed in a ring array layout with the center of the circular portion 22 as a center point during printing. The resistors R11, R12, R41, R42 are distributed at the edge of the circular portion 22 and are symmetrically arranged with respect to the center of the circular portion 22.
The four resistors in the central area of the round part 22 are deformed greatly after being stressed, and the resistance value of the four resistors is changed greatly. The four resistors at the outer edge of the round part 22 are small in deformation after being stressed, and the resistance value is small in change.
When the sensor module is pressed by external force, the four resistors (the resistor R21, the resistor R22, the resistor R31 and the resistor R32) in the central area of the round part 22 deform, so that the resistance value changes, and the pressure can be accurately calculated through the change of the resistance value.
A preferred technical scheme of the embodiment is as follows: the round part 22 receiving the pressure deformation is bonded on the back copper sheet of the piezoelectric ceramic sheet 1 by hot pressing.
A preferred technical scheme of the embodiment is as follows: the first resistor 100 and the second resistor 200 are both printed by pressure sensing ink.
A preferred technical scheme of the embodiment is as follows: the first parallel resistor group is formed by connecting a plurality of second resistors 200 in parallel.
A preferred technical scheme of the embodiment is as follows: the second parallel resistor group is formed by connecting a plurality of first resistors 100 in parallel.
A preferred technical scheme of the embodiment is as follows: the third parallel resistor group is formed by connecting a plurality of first resistors 100 in parallel.
A preferred technical scheme of the embodiment is as follows: the fourth parallel resistor group is formed by connecting a plurality of second resistors 200 in parallel.
A preferred technical scheme of the embodiment is as follows: the circuit printed surface of the round portion 22 is attached with a cushion pad 3, and the cushion pad 3 surrounds a plurality of first resistors 100 in the central area of the round portion 22.
A preferred technical scheme of the embodiment is as follows: the cushion pad 3 is of a circular ring structure.
The sensor module of the utility model is also provided with a pressing sheet 9, wherein the pressing sheet 9 is adhered to the center of the hollowed-out part 21, and the pressing sheet 9 is opposite to the center of the round part 22.
Example 2:
as shown in fig. 10, fig. 10 is a schematic diagram of another wheatstone bridge circuit layout of the present utility model, and fig. 6 is a circuit diagram of the wheatstone bridge of the present utility model.
In fig. 6, the number of parallel resistors of each resistor set is plural, and the parallel resistors are distributed in the central area of the circular portion 22 through the ring array, so as to achieve a more accurate measurement effect.
In summary, according to the sensor module disclosed by the utility model, four resistor groups connected in parallel are arranged on the FPC board, each resistor group is formed by printing pressure sensing ink, and the piezoelectric ceramic plates are arranged at the gaps of the FPC board, so that the whole module structure is of a thin structure, and the volume is reduced. The resistor group consists of a plurality of resistors connected in parallel, the plurality of resistors in the central area are uniformly stressed, and the pressure can be accurately sensed.
The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present utility model or directly or indirectly applied to other related technical fields are included in the scope of the utility model.
Claims (9)
1. The utility model provides a sensor module of parallelly connected pressure measurement and vibrations feedback, includes FPC board (2) and with piezoceramics piece (1) that FPC board (2) are installed together, FPC board (2) have fretwork portion (21) and circle portion (22) that are connected, the advance electric end of the printed circuit of fretwork portion (21) has VS electric contact, S1 electric contact, S2 electric contact, GND electric contact, VH1 electric contact and VH2 electric contact, the circuit printed surface of circle portion (22) is printed and is had wheatstone bridge circuit, its characterized in that, this wheatstone bridge circuit includes:
a plurality of first resistors (100) printed on the central area of the round part (22), wherein the first resistors (100) are distributed around the center of the round part (22) in an equiangular manner, the first resistors (100) comprise a third parallel resistor group electrically connected with the VS electric contact and a second parallel resistor group electrically connected with the S1 electric contact, and the other end of the second parallel resistor group is grounded;
the second resistors (200) are printed on the edge of the round part (22), the second resistors (200) are distributed symmetrically around the center of the round part (22), the second resistors (200) comprise a first parallel resistor group electrically connected with the VS electric contact and a fourth parallel resistor group electrically connected with the S2 electric contact, and the fourth parallel resistor group is connected with the grounding end of the second parallel resistor group.
2. The parallel pressure measurement and vibration feedback sensor module according to claim 1, wherein the round portion (22) receiving the pressure deformation is thermally pressed and attached to the back copper sheet of the piezoelectric ceramic sheet (1).
3. The parallel pressure measurement and vibration feedback sensor module of claim 1, wherein the first resistor (100) and the second resistor (200) are each printed from pressure sensing ink.
4. The parallel pressure measurement and vibration feedback sensor module of claim 1, wherein the first parallel resistor group is formed by a plurality of second resistors (200) connected in parallel.
5. The parallel pressure measurement and vibration feedback sensor module according to claim 1, wherein the second parallel resistor group is formed by connecting a plurality of first resistors (100) in parallel.
6. The parallel pressure measurement and vibration feedback sensor module according to claim 1, wherein the third parallel resistor group is formed by connecting a plurality of first resistors (100) in parallel.
7. The parallel pressure measurement and vibration feedback sensor module according to claim 1, wherein the fourth parallel resistor group is formed by connecting a plurality of second resistors (200) in parallel.
8. The parallel pressure measurement and vibration feedback sensor module according to claim 1, characterized in that the circular portion (22) has a circuit printed surface with a cushion (3), the cushion (3) surrounding a plurality of first resistors (100) in a central area of the circular portion (22).
9. The parallel pressure measurement and vibration feedback sensor module according to claim 8, characterized in that the cushion pad (3) is of a circular ring structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223407896.4U CN219064754U (en) | 2022-12-20 | 2022-12-20 | Parallel pressure measurement and vibration feedback sensor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223407896.4U CN219064754U (en) | 2022-12-20 | 2022-12-20 | Parallel pressure measurement and vibration feedback sensor module |
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| Publication Number | Publication Date |
|---|---|
| CN219064754U true CN219064754U (en) | 2023-05-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223407896.4U Active CN219064754U (en) | 2022-12-20 | 2022-12-20 | Parallel pressure measurement and vibration feedback sensor module |
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| CN (1) | CN219064754U (en) |
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- 2022-12-20 CN CN202223407896.4U patent/CN219064754U/en active Active
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