CN219059194U - Copper dissolving device and electroplating production line - Google Patents
Copper dissolving device and electroplating production line Download PDFInfo
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- CN219059194U CN219059194U CN202220881249.8U CN202220881249U CN219059194U CN 219059194 U CN219059194 U CN 219059194U CN 202220881249 U CN202220881249 U CN 202220881249U CN 219059194 U CN219059194 U CN 219059194U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The utility model discloses a copper dissolving device and an electroplating production line. The auxiliary groove is arranged between the copper dissolving structure and the electroplating structure, a circulation channel is arranged between the auxiliary groove and the copper dissolving structure, and the auxiliary groove receives the copper dissolving medium flowing out of the copper dissolving groove through the circulation channel. After the copper-dissolving medium in the copper-dissolving tank reacts with copper, a small amount of copper-dissolving medium is remained in the electroplating solution, the electroplating solution and the copper-dissolving medium enter the auxiliary tank through the circulating channel, a copper-containing co-plating plate is placed in the auxiliary tank, and the copper-dissolving medium in the auxiliary tank further reacts with the copper-containing co-plating plate to generate the electroplating solution. The copper dissolving device with the structure can fully utilize copper in the copper-containing co-plating plate, reduces the production cost and reduces the pollution to the environment.
Description
Technical Field
The utility model relates to the field of chemical plating, in particular to a copper dissolving device and an electroplating production line.
Background
With the recent rapid development of the field of electronic devices, the demands for the number and quality of printed wiring boards are increasing. Vertical Continuous Plating (VCP) is an important process in the fabrication of printed wiring boards, and the composition of the chemicals, electrode materials, electrolytic schemes and electrolytic equipment used in VCP directly affect the yield and quality of the product.
The traditional VCP mainly uses copper balls and insoluble materials as anodes, the copper balls are dissolved in the electrolysis process to generate anode mud, and the equipment is required to be maintained and cleaned regularly after the anode mud is piled up, so that the problems of copper balls waste, waste water generation, a great deal of manual labor, incapability of automation and the like are caused; the insoluble anode adopts copper oxide powder as copper ion supplement for electroplating, the copper oxide powder is slowly dissolved, the plating layer is easy to generate particles after electroplating, the product quality is affected, meanwhile, the powder is easy to leak in the adding process to pollute the environment, the cost for converting copper into the copper oxide powder is high, the process flow is long, and the air environment is polluted.
To solve the disadvantages of the traditional VCP, ferric iron copper dissolving technology has been developed. In the prior VCP technology, a ferric iron copper dissolving tank is connected with a VCP electroplating tank through a filtering pump, ferric iron ions are used as an oxidant in the ferric copper dissolving tank under an acidic condition, copper ions are obtained by oxidizing copper simple substances, dissolved copper ions supplement copper ions reduced in electrolyte, ferric iron is converted into ferrous iron simultaneously, electrolyte with high copper ion concentration is pumped to a VCP electroplating main tank, copper simple substances are separated out on the surface of a product, and electrolyte with relatively low copper ion concentration in the VCP main tank flows to the ferric iron copper dissolving tank to form a balanced circulating system.
However, in order to allow the solution in the copper-dissolving tank to enter the electroplating tank for reaction, such electroplating equipment is often only designed with the copper-dissolving tank and the electroplating tank and directly connected. In industrial production, a plurality of plating plates are placed in the electroplating tank at one time, and a certain amount of electroplated copper is attached to the accompanying plating plates for attaching the plating plates after electroplating is completed. Copper belongs to heavy metals, and if the copper-containing co-plating plate is directly discarded, raw materials cannot be fully utilized, and the environment is polluted.
Disclosure of Invention
Therefore, the technical problem to be solved by the utility model is that the raw materials in the prior art cannot be fully utilized and pollute the environment.
To this end, the utility model provides a copper dissolving device adapted to be connected to an electroplated structure, comprising: copper dissolving structure sequentially arranged along flowing direction of copper dissolving medium
The auxiliary groove is suitable for being arranged between the copper dissolving structure and the electroplating structure, a circulation channel is arranged between the auxiliary groove and the copper dissolving structure, and the auxiliary groove is used for receiving the copper dissolving medium flowing out of the copper dissolving structure through the circulation channel.
Optionally, the copper dissolving device further includes a third separator, the third separator is disposed between the auxiliary tank and the copper dissolving structure to separate the copper dissolving structure and the auxiliary tank, and the flow channel is disposed on the third separator.
Optionally, in the copper dissolving device, the flow channel is disposed at a side far away from the liquid inlet of the copper dissolving structure.
Optionally, in the copper dissolving device, the copper dissolving structure includes a first copper dissolving tank, a second copper dissolving tank and a third copper dissolving tank which are sequentially arranged along a flowing direction of a copper dissolving medium, and the third copper dissolving tank is communicated with the auxiliary tank;
still include first baffle and second baffle, first baffle sets up first dissolve the copper tank with between the second dissolves the copper tank, the second baffle sets up second dissolve the copper tank with between the third dissolves the copper tank.
Optionally, in the copper dissolving device, any one of the copper dissolving tanks is further provided with a screen, and any one of the screen is arranged close to the liquid inlet of the copper dissolving tank.
Optionally, in the copper dissolving device, the screen plate is provided with a plurality of filtering holes, and the filtering holes are square through holes or round through holes.
Optionally, in the copper dissolving device, the side length of the filtering hole is 0.5mm-3mm; or (b)
The diameter of the filtering holes is 0.5mm-3mm.
An electroplating production line comprises an electroplating structure and the copper dissolving device, wherein the auxiliary groove is suitable for being communicated with the electroplating structure.
Optionally, in the foregoing electroplating production line, the fourth partition is disposed between the auxiliary tank and the electroplating structure to separate the auxiliary tank from the electroplating structure, and the fourth partition is provided with a plurality of flow holes.
Optionally, the electroplating production line further includes:
the conveying pipeline is communicated with the electroplating structure and the copper dissolving structure;
and the pump is arranged on the conveying channel and is suitable for driving the medium in the electroplating structure to circulate into the copper dissolving structure through the conveying pipeline.
Optionally, the electroplating production line further includes:
the detection piece is arranged in the electroplating structure and is used for detecting the content concentration of first particles in the electroplating structure;
the control piece is electrically connected with the detection piece and the pump, and controls the opening and closing of the pump according to the first particle content concentration detected by the detection piece.
Alternatively, the above-mentioned electroplating line,
the detecting member is further configured to detect a second particle content concentration within the electroplated structure;
the control piece is also electrically connected with the starter of the electroplating structure, and the control piece controls the opening and closing of the pump according to the second particle content concentration detected by the detection piece.
The technical scheme provided by the utility model has the following advantages:
1. the copper dissolving device provided by the utility model comprises a copper dissolving structure and an auxiliary groove which are sequentially arranged along the flowing direction of a copper dissolving medium. The auxiliary groove is arranged between the copper dissolving structure and the electroplating structure, a circulation channel is arranged between the auxiliary groove and the copper dissolving structure, and the auxiliary groove receives the copper dissolving medium flowing out of the copper dissolving groove through the circulation channel. After the copper-dissolving medium in the copper-dissolving tank reacts with copper, a small amount of copper-dissolving medium is remained in the electroplating solution, the electroplating solution and the copper-dissolving medium enter the auxiliary tank through the circulating channel, a copper-containing co-plating plate is placed in the auxiliary tank, and the copper-dissolving medium in the auxiliary tank further reacts with the copper-containing co-plating plate to generate the electroplating solution. The copper dissolving device with the structure can fully utilize copper in the copper-containing co-plating plate, reduces the production cost and reduces the pollution to the environment.
2. The copper dissolving device provided by the utility model further comprises a screen plate, wherein the screen plate is arranged close to the liquid inlet of the copper dissolving tank. Raw material copper in the copper-dissolving structure reacts with a copper-dissolving medium, the raw material copper is continuously dissolved and becomes small in volume along with the progress of the reaction, accumulated raw material copper continuously falls down towards the bottom of the copper-dissolving structure along with the reaction, a large amount of fine particle raw material copper is deposited at a liquid inlet, and blockage is easy to occur. The screen plate structure arranged at the liquid inlet can bear fine-grain raw material copper larger than the mesh of the screen plate structure, so that the blockage of the liquid inlet caused by the accumulation of most fine-grain raw material copper is avoided.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of an electroplating line according to an embodiment of the present utility model;
reference numerals illustrate:
11-a first copper dissolution tank; 12-a second copper dissolving tank; 13-a third copper dissolving tank;
2-an auxiliary groove;
3-electroplating structure;
4-a flow-through channel;
51-a first screen; 52-a second screen; 53-a third screen;
61-a first separator; 62-a second separator; 63-a third separator; 64-fourth separator;
7-pumping.
Detailed Description
The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features of the different embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.
Example 1
The embodiment provides a copper dissolving device, as shown in fig. 1, including a copper dissolving structure and an auxiliary tank 2 sequentially arranged along a flowing direction of a copper dissolving medium, the auxiliary tank 2 is suitable for being arranged between the copper dissolving structure and an electroplating structure 3, a flowing channel 4 is arranged between the auxiliary tank 2 and the copper dissolving structure, and the auxiliary tank 2 is suitable for receiving the copper dissolving medium flowing out of the copper dissolving structure through the flowing channel 4.
After the copper-dissolving medium in the copper-dissolving structure reacts with copper, a small amount of copper-dissolving medium is remained in the electroplating solution, the electroplating solution and the copper-dissolving medium enter the auxiliary tank 2 through the circulating channel 4, a copper-containing co-plating plate is placed in the auxiliary tank 2, and the copper-dissolving medium in the auxiliary tank 2 further reacts with the copper-containing co-plating plate to generate the electroplating solution. The copper dissolving device with the structure can fully utilize copper in the copper-containing co-plating plate, reduces the production cost and reduces the pollution to the environment.
The copper dissolving device provided in this embodiment, as shown in fig. 1, further includes a third partition 63, where the third partition 63 is disposed between the auxiliary tank 2 and the copper dissolving structure to separate the copper dissolving structure and the auxiliary tank 2, and the flow channel 4 is disposed on the third partition 63. Through setting up third baffle 63 and being used for separating and dissolving copper structure and auxiliary tank 2 for it can dismantle freely, and such structure is convenient for to dissolve copper device's production and installation, and the copper device that dissolves of such structure also cleans more easily, and labour saving and time saving also more in the cost.
The copper dissolving device provided by the embodiment further comprises a circulation channel 4, wherein the circulation channel 4 is arranged on one side of the liquid inlet far away from the copper dissolving structure. In the copper-dissolving structure, the copper-dissolving medium reacts with raw copper from bottom to top through a liquid inlet arranged at the bottom of the copper-dissolving structure, so that the concentration of electroplating liquid in the copper-dissolving structure from bottom to top is gradually increased, and the concentration of residual copper-dissolving medium is gradually reduced. Through setting up the circulation passageway 4 that keeps away from the inlet for high concentration plating solution and low concentration that reaction generated in the dissolved copper structure are remained and are dissolved copper medium and get into auxiliary tank 2 with the overflow mode, make high concentration dissolve copper medium stay and dissolve copper structure in and continue to take place the reaction with raw materials copper, improved the utilization ratio of dissolving copper medium.
The copper dissolving device provided in this embodiment, as shown in fig. 1, the copper dissolving structure includes a first copper dissolving tank 11, a second copper dissolving tank 12 and a third copper dissolving tank 13 which are sequentially arranged along the flowing direction of the copper dissolving medium, the third copper dissolving tank 13 is communicated with the auxiliary tank 2, and raw copper in each copper dissolving tank can react with the copper dissolving medium in the corresponding tank independently through arranging a plurality of copper dissolving tanks.
The copper dissolution apparatus provided in this embodiment, as shown in fig. 1, further includes a first partition 61 and a second partition 62, the first partition 61 is disposed between the first copper dissolution tank 11 and the second copper dissolution tank 12, and the second partition 62 is disposed between the second copper dissolution tank 12 and the third copper dissolution tank 13. The copper dissolving structure with the structure forms three independent copper dissolving grooves by arranging the first baffle plate 61 and the second baffle plate 62 in the copper dissolving structure 1.
In other alternative embodiments, two independent copper-dissolving tanks may be formed by providing a partition plate in the copper-dissolving structure so that the copper-dissolving structure is separated.
In other alternative embodiments, four, five or more independent copper-dissolving tanks may be formed in the copper-dissolving structure by providing three, four or more separators in the copper-dissolving structure. At this time, the addition amount of raw copper can be controlled more precisely, and the reaction rate in a single copper dissolution tank is also improved more in one step.
In the copper dissolving device provided in this embodiment, as shown in fig. 1, a first screen 51 is disposed on a side of the first copper dissolving tank 11 near the liquid inlet, a second screen 52 is disposed on a side of the second copper dissolving tank 12 near the liquid inlet, and a third screen 53 is disposed on a side of the third copper dissolving tank 13 near the liquid inlet. The volume of the raw material copper in the copper-dissolving structure can be reduced after the raw material copper reacts with the copper-dissolving medium, a large amount of fine particle raw material copper can block the liquid inlet, and the first screen plate 51, the second screen plate 52 and the third screen plate 53 which are arranged at the position close to the liquid inlet in the copper-dissolving structure realize the carrying of the fine particle raw material copper.
The copper dissolving device provided by the embodiment is provided with a plurality of filtering holes, wherein the filtering holes are round through holes, and the diameter of each round hole is 1mm. In other alternative embodiments, the diameter of the circular aperture may be selected to any value between 0.5mm and 3mm; of course, in other embodiments, the filter holes may also be square holes, and the side length of the square holes may be selected between 0.5mm and 3mm. Through setting up the filtration pore for when dissolving copper medium and raw materials copper through filtration pore and taking place the reaction, still can accept the raw materials copper that the diameter is greater than the filtration pore diameter.
Example 2
The present embodiment provides an electroplating production line, which comprises an electroplating structure 3 and the copper dissolving device in embodiment 1, wherein the auxiliary tank 2 is suitable for communicating with the electroplating structure 3.
In the electroplating production line provided in this embodiment, the fourth partition 64 is disposed between the auxiliary tank 2 and the electroplating structure 3 to separate the auxiliary tank 2 from the electroplating structure 3, and the fourth partition 64 is provided with a plurality of through holes. When the electroplating production line works, the electroplating liquid generated by the copper dissolving structure and the auxiliary tank 2 enters the electroplating structure 3 through the circulating holes.
The electroplating production line provided by the embodiment further comprises a conveying pipeline and a pump 7. When the self-circulation system is started, the pump 7 pumps liquid from the electroplating structure 3 and injects the liquid into the bottom of the copper-dissolving structure through the conveying pipeline; the pump 7 is arranged on the conveying channel, and the pump 7 is suitable for driving the medium in the electroplating structure 3 to flow into the copper dissolving structure.
The electroplating production line provided by the embodiment further comprises a detection piece and a control piece. The detecting piece is arranged in the electroplating structure 3 and used for detecting the first particle content concentration in the electroplating structure 3, the control piece is electrically connected with the detecting piece and the pump 7, and the control piece controls the pump 7 to be started or stopped according to the first particle content concentration detected by the detecting piece. In the electroplating production line provided by the embodiment, the detecting piece is further configured to detect the content concentration of the second particles in the electroplating structure 3, the control piece is further electrically connected with the starter of the electroplating structure 3, and the control piece controls the on-off of the pump 7 according to the content concentration of the second particles detected by the detecting piece.
Specifically, in this embodiment, the first particles are ferric ions, the second particles are copper ions, the detecting element is a metal sensor, and the control element is a PLC.
The working process of the electroplating structure in this embodiment is as follows: when the concentration of the first particles is too high, the self-circulation system is started, the pump 7 pumps the solution in the electroplating structure 3 to the bottom of the copper-dissolving structure again, and the solution reacts with the raw copper again to generate electroplating solution until the concentration meets the requirement; when the concentration of the second particles is too high, starting the starter of the electroplating structure 3, and operating the electroplating structure 3, wherein excessive second particles are plated on the cathode plate through electrolytic reaction; when the concentration of the second particles is too low, the starter of the electroplated structure 3 is turned off and the control system will indicate the need to add pure copper balls or pure copper particles.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the utility model.
Claims (12)
1. Copper-dissolving device suitable for being connected to an electroplated structure (3), characterized in that it comprises: copper dissolving structure sequentially arranged along flowing direction of copper dissolving medium
The auxiliary tank (2), auxiliary tank (2) are suitable for setting up between dissolving copper structure and electroplating structure (3), auxiliary tank (2) with dissolve and have circulation passageway (4) between the copper structure, auxiliary tank (2) are passed through circulation passageway (4) are in order to accept by dissolve copper medium that flows in the copper structure.
2. A copper dissolving device according to claim 1, wherein,
the copper-dissolving device further comprises a third partition plate (63), wherein the third partition plate (63) is arranged between the auxiliary tank (2) and the copper-dissolving structure to separate the copper-dissolving structure from the auxiliary tank (2), and the circulating channel (4) is arranged on the third partition plate (63).
3. Copper dissolving device according to claim 1, characterized in that the flow channel (4) is arranged at the side of the liquid inlet remote from the copper dissolving structure.
4. A copper dissolution apparatus according to any one of claims 1 to 3, characterized in that the copper dissolution structure comprises a first copper dissolution tank (11), a second copper dissolution tank (12) and a third copper dissolution tank (13) which are arranged in sequence along the flow direction of the copper dissolution medium, the third copper dissolution tank (13) being in communication with the auxiliary tank (2);
still include first baffle (61) and second baffle (62), first baffle (61) set up first dissolve copper tank (11) with between second dissolve copper tank (12), second baffle (62) set up second dissolve copper tank (12) with between third dissolve copper tank (13).
5. A copper dissolving device according to claim 4, wherein,
a screen plate is further arranged in any one of the copper dissolution tanks, and any one of the screen plates is arranged close to a liquid inlet of the copper dissolution tank.
6. A copper dissolving device according to claim 5, wherein,
the screen plate is provided with a plurality of filtering holes, and the filtering holes are square through holes or round through holes.
7. The copper dissolving device according to claim 6, wherein the side length of the filtering holes is 0.5mm-3mm; or (b)
The diameter of the filtering holes is 0.5mm-3mm.
8. An electroplating line, characterized by comprising an electroplating structure (3) and a copper dissolving device according to any one of claims 1-7, said auxiliary tank (2) being adapted to communicate with said electroplating structure (3).
9. The electroplating line as recited in claim 8, further comprising a fourth baffle plate (64) disposed between the auxiliary tank (2) and the electroplating structure (3) to separate the auxiliary tank (2) from the electroplating structure (3), the fourth baffle plate (64) having a plurality of flow holes.
10. The electroplating line as recited in claim 8, further comprising:
the conveying pipeline is communicated with the electroplating structure (3) and the copper dissolving structure;
and the pump (7) is arranged on the conveying pipeline, and the pump (7) is suitable for driving the medium in the electroplating structure (3) to circulate into the copper dissolving structure through the conveying pipeline.
11. The electroplating line as recited in claim 10, further comprising:
the detection piece is arranged in the electroplating structure (3) and is used for detecting the first particle content concentration in the electroplating structure (3);
the control piece is electrically connected with the detection piece and the pump (7), and the control piece controls the on-off of the pump (7) according to the first particle content concentration detected by the detection piece.
12. The electroplating line as claimed in claim 11, wherein,
the detecting element is further configured to detect a second particle content concentration within the electroplated structure (3);
the control piece is also electrically connected with the starter of the electroplating structure (3), and the control piece controls the opening and closing of the pump (7) according to the second particle content concentration detected by the detection piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220881249.8U CN219059194U (en) | 2022-04-14 | 2022-04-14 | Copper dissolving device and electroplating production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220881249.8U CN219059194U (en) | 2022-04-14 | 2022-04-14 | Copper dissolving device and electroplating production line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219059194U true CN219059194U (en) | 2023-05-23 |
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ID=86344753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220881249.8U Active CN219059194U (en) | 2022-04-14 | 2022-04-14 | Copper dissolving device and electroplating production line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219059194U (en) |
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2022
- 2022-04-14 CN CN202220881249.8U patent/CN219059194U/en active Active
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