CN219046609U - Structure thermal control integrated device based on modularized microsatellite - Google Patents

Abstract

The utility model discloses a structure thermal control integrated device based on a modularized microsatellite, which adopts a modularized design scheme, is flexible in configuration, is convenient to disassemble and install, and has the advantages of high integration level, volume weight saving and the like; based on the design of the first heat pipe on the heat dissipation motherboard module and the second heat pipe on the functional module and the communication of the bridge pipe, the heat of the functional module can be quickly conducted to the heat dissipation motherboard; the functional module ensures the mechanical property of the whole structure through the self frame structure, and is beneficial to heat dissipation; the functional module is connected with the circuit motherboard module through the plug connector and the plug interface assembly, so that the cable harness in the star can be effectively reduced, the interior of the star is tidier, and the weight of the whole star is also effectively reduced; each module is processed independently, so that the compact structure is improved, and the stable mechanical property is realized; the heat radiation efficiency is increased and the heat radiation and heat transfer effects are ensured by matching the other wall surfaces with the surfaces of the heat radiation motherboard modules.

Description

Structure thermal control integrated device based on modularized microsatellite

Technical Field

The utility model relates to the technical field of aerospace vehicles, in particular to a structure thermal control integrated device based on a modularized microsatellite.

Background

With the development of microelectronic technology in recent years, modern satellite technology is developing towards smaller volume, shorter period, lower cost, higher strength and higher flexibility.

The structural thermal control design of the satellite is an important link in the design of a satellite system, and the performance of the structural thermal control design plays a crucial role in the service life of the satellite. The main purpose of the satellite thermal control technology is to ensure that the thermal control subsystem achieves the overall required performance and index of the satellite, so that the structure, mechanism and equipment of the satellite are controlled within a certain range, and the normal operation of the satellite is ensured. The thermal control technology used by satellites which are transmitted at home and abroad mainly comprises an active thermal control technology and a passive thermal control technology. With the progress of the aerospace technology in China, the satellite thermal control technology gradually determines a thermal control scheme which takes passive thermal control as a main component and active thermal control as an auxiliary component. The main methods in passive thermal control are: a thermal control coating, a multi-layer heat insulation assembly, a heat pipe, a phase change material thermal control, an installation interface thermal resistance and the like; the measures of active thermal control mainly comprise: intelligent electric heaters, thermal control shutters, electrochromic thermal control coatings, contact thermal switches, and the like.

Because the satellite structure has small mass and small volume and the load power consumption is larger, the thermal control design is greatly restricted, and most satellites can only adopt a passive thermal control scheme. However, considering that the storage battery has a stricter requirement on the working temperature, some satellites use an active thermal control scheme for the storage battery to ensure the normal working of the battery.

Analysis is carried out from two aspects of the current satellite structure and thermal control design, and the two problems respectively exist:

1. from the design point of satellite structure subsystem, it needs to comprehensively consider the quality, rigidity and strength of the structure. The method reduces the proportion of the structural mass in the satellite mass, is beneficial to increasing the effective load of the satellite, improves the agility of the satellite and reduces the transmitting cost.

2. The satellite technology adopts a large number of highly integrated electronic components, the size of the satellite is smaller, and the generated heat flux is difficult to radiate into the environment rapidly, so that the local high temperature of a subsystem or equipment is easy to cause; because the weight of the satellite is reduced as much as possible, the thermal capacity of the satellite is small, the transient thermal load and the heat flow outside the space have great influence on the satellite, and the temperature level of the satellite can be greatly fluctuated;

3. the structural design and thermal design coupling degree of the satellite is not high, and the structural layout and design of the satellite are often carried out firstly, and then the thermal design is considered, so that the conditions of high design difficulty and resource waste are caused.

Therefore, it is necessary to design a practical thermal control integrated device based on a modularized microsatellite structure.

Disclosure of Invention

The utility model aims to provide a structure thermal control integrated device based on a modularized microsatellite, which solves the problems in the background technology.

In order to solve the technical problems, the utility model provides the following technical scheme:

the utility model provides a structure thermal control integrated device based on modularization microsatellite, includes heat dissipation mother board module, curb plate, functional module and circuit mother board module, the curb plate is two, and is connected through the bottom carrier plate, the rear side of heat dissipation mother board module fixed mounting curb plate, the front side of circuit mother board module fixed mounting curb plate, functional module is a plurality of pieces, and all becomes vertical parallel state fixed mounting in the upper surface of bottom carrier plate, the upper edge fixed mounting of curb plate has the upper cover plate, the lower edge fixed mounting of curb plate has the lower cover plate, the equal fixed mounting of outer wall surface and the outer wall surface of circuit mother board module of heat dissipation mother board module has folding solar wing.

According to the technical scheme, the heat dissipation motherboard module comprises an aluminum alloy plate body, a groove is formed in the upper surface of the aluminum alloy plate body, first heat pipes are uniformly embedded in the groove, square platforms are integrally formed at the end parts of the first heat pipes, and threaded holes are formed in the middle parts of the square platforms.

According to the technical scheme, the functional module comprises an alloy frame and a functional component, the alloy frame is of a frame structure, the functional component is embedded in an embedded opening of the alloy frame, a platform is integrally formed at the rear edge of the alloy frame, a power device is fixedly arranged on the outer wall surface of the platform, and a plug connector is fixedly arranged on the front edge wall surface of the alloy frame.

According to the technical scheme, the lower wall surface of the platform is provided with the caulking groove, the caulking groove is embedded with the second heat pipe, screw joints are arranged at two ends of the second heat pipe, the screw joints are communicated with the screw holes through the bridging pipes, and refrigerant media are filled in the second heat pipe and the first heat pipe.

According to the technical scheme, the circuit motherboard module is manufactured based on the alloy plate body, the main control circuit board is embedded in the circuit motherboard module, and the main control circuit board is connected with the plug connector through the plug connector assembly.

According to the technical scheme, a gap is reserved between the upper surface of the lower cover plate and the bottom carrier plate, the lower cover plate is of a honeycomb plate structure, and the ground satellite-borne antenna and the sensor are fixedly arranged on the lower surface of the lower cover plate.

According to the technical scheme, the upper cover plate is of a honeycomb plate structure, and the opposite space-borne antenna and the sensor are fixedly arranged on the upper surface of the upper cover plate.

According to the technical scheme, the side plate is of a honeycomb plate structure, and the side plate is fixedly provided with the satellite-borne detection antenna.

According to the technical scheme, the inner side surface of the heat dissipation motherboard module, the inner side surface of the side plate, the inner side surface of the circuit motherboard module, the inner side surface of the upper cover plate and the inner side surface of the lower cover plate are all subjected to black anodic oxidation treatment, and the surface of the alloy frame of the functional module is subjected to black anodic oxidation treatment.

According to the technical scheme, the outer side surface of the heat dissipation motherboard module, the outer side surface of the side plate, the outer side surface of the circuit motherboard module, the outer side surface of the upper cover plate and the outer side surface of the lower cover plate are sprayed with the thermal control white paint.

Compared with the prior art, the utility model has the following beneficial effects:

1) The modularized design scheme is adopted, the configuration is flexible, the disassembly and the installation are convenient, and each module realizes different functions by installing different functional circuits, so that the integrated level is high, the volume weight is saved, and the like;

2) Based on the design of the first heat pipe on the heat dissipation motherboard module and the second heat pipe on the functional module and the communication of the bridge pipe, the heat of the functional module can be quickly conducted to the heat dissipation motherboard;

3) The functional module ensures the mechanical property of the whole structure through the self frame structure, the functional component realizes different working purposes through different internal circuit functional designs, and the functional module and the functional component are matched to construct a good space structure, thereby being beneficial to heat dissipation;

4) The functional module is connected with the circuit motherboard module through the plug connector and the plug interface assembly, so that the cable harness in the star can be effectively reduced, the interior of the star is tidier, and the weight of the whole star is also effectively reduced;

5) Each module is processed independently, batch production is facilitated, and after the module is assembled according to the design, the compact structure is increased, and the module has stable mechanical properties;

6) The heat radiation efficiency is increased by matching the other wall surfaces with the surfaces of the heat radiation motherboard modules, and meanwhile, the inner surfaces are subjected to black anodic oxidation treatment, so that the heat radiation and heat transfer effects are ensured.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:

FIG. 1 is a schematic diagram of the explosive structure of the main body of the present utility model;

FIG. 2 is a schematic view of a combined three-dimensional structure of the present utility model;

FIG. 3 is a schematic perspective view of a heat dissipating motherboard module according to the present utility model;

fig. 4 is a schematic perspective view of a functional module of the present utility model.

In the figure: 1. the solar heat radiation module comprises a heat radiation mother board module, 11, an aluminum alloy plate body, 12, a first heat pipe, 13, a square table, 14, threaded holes, 2, a circuit mother board module, 3, a functional module, 31, an alloy frame, 32, a functional component, 33, a power device, 34, a plug connector, 35, a platform, 36, a second heat pipe, 4, a side plate, 5, an upper cover plate, 6, a lower cover plate, 7 and a folding solar wing.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, the present utility model provides the following technical solutions: the utility model provides a structure thermal control integrated device based on modularization microsatellite, includes heat dissipation mother board module 1, curb plate 4, functional module 3 and circuit template module 2, curb plate 4 is two, and is connected through the bottom carrier plate, the rear side of heat dissipation mother board module 1 fixed mounting curb plate 4, the front side of circuit template module 2 fixed mounting curb plate 4, functional module 3 is a plurality of pieces, and all becomes vertical parallel state fixed mounting in the upper surface of bottom carrier plate, the upper edge fixed mounting of curb plate 4 has upper cover plate 5, the lower limb fixed mounting of curb plate 4 has lower cover plate 6, the equal fixed mounting of outer wall surface of heat dissipation mother board module 1 and circuit template module 2 has folding solar wing 7.

The heat dissipation motherboard module 1, the functional module 3 and the circuit template module 2 are main body functional structures, the side plates 4 are matched with the bottom carrier plate to form a main body bearing installation structure, so that the internal functional module 3 is located at a preset installation position, the heat dissipation motherboard module 1 is connected with the functional module 3 to conduct effective heat transfer and heat radiation receiving, heat is conducted and dissipated, the functional module 3 is provided with different functions through different built-in functional components 32 and is installed in a vertical parallel arrangement mode, compact layout of space can be achieved, the upper cover plate 5 and the lower cover plate 6 are installed, an outer part installation foundation is further provided when the device is protected, the circuit template module 2 is installed through a system circuit of the circuit template module, functions of the whole system are scheduled, functions are achieved, the folding solar wings 7 are folded and unfolded in an on-orbit mode through the folding mode, and the satellite is provided with a stable power supply outside space.

Specifically, the heat dissipation motherboard module 1 comprises an aluminum alloy plate body 11, a groove is formed in the upper surface of the aluminum alloy plate body 11, first heat pipes 12 are uniformly embedded in the groove, square platforms 13 are integrally formed at the end parts of the first heat pipes 12, and threaded holes 14 are formed in the middle of the square platforms 13.

The aluminum alloy plate 11 is a carrier structure of a heat dissipation motherboard, the first heat pipe 12 is effectively installed in an array through the grooves, and the heat energy is uniformly distributed and conducted to the aluminum alloy plate 11 by the first heat pipe 12, so that the increase of the heat dissipation area and the uniformity of heat dissipation are realized, and the square table 13 and the threaded holes 14 are formed, so that the first heat pipe 12 is conveniently connected with other heat conduction structures.

Specifically, the functional module 3 includes an alloy frame 31 and a functional component 32, the alloy frame 31 is a frame structure, the functional component 32 is embedded in an embedded opening of the alloy frame 31, a platform 35 is integrally formed at a rear edge of the alloy frame 31, a power device 33 is fixedly mounted on an outer wall surface of the platform 35, and a plug connector 34 is fixedly mounted on a front edge wall surface of the alloy frame 31.

The alloy frame 31 is a combined installation foundation of the functional module 3, the functional component 32 is adjusted and set according to the size of the installed functional circuit and device, the alloy frame 31 provides an installation foundation for the power device 33 through the forming platform 35, the power device 33 is combined and installed through the functional setting of the power device, and the plug connector 34 is convenient to connect with the circuit template module 2.

Specifically, the lower wall surface of the platform 35 is provided with a caulking groove, the caulking groove is internally provided with a second heat pipe 36, two ends of the second heat pipe 36 are provided with screw joints, the screw joints are communicated with the screw holes 14 through bridging pipes, and refrigerant media are filled in the second heat pipe 36 and the first heat pipe 12.

The alloy frame 31 provides an installation space for the second heat pipe 36 by forming the caulking groove, the second heat pipe 36 is communicated with the first heat pipe 12 through the bridging pipe, and overall heat conduction is achieved, so that a heat conduction path is increased, and the heat conduction efficiency is increased due to refrigerant media filled in the first heat pipe 12 and the second heat pipe 36.

Specifically, the circuit template module 2 is manufactured based on an alloy plate body, a main control circuit board is embedded in the circuit template module 2, and the main control circuit board is connected with the plug connector 34 through an interface component.

The alloy plate body is used for bearing the main control circuit board for protection, heat is dissipated through contact, and the whole circuit is connected in a closed mode through connection of the plug interface assembly and the plug connector 34.

Specifically, a gap is reserved between the upper surface of the lower cover plate 6 and the bottom carrier plate, the lower cover plate 6 is of a honeycomb plate structure, and a ground satellite-borne antenna and a sensor are fixedly arranged on the lower surface of the lower cover plate 6.

Through leaving the clearance, the bolt assembly when making things convenient for subsequent structure installation, and honeycomb is more convenient to install, simultaneously to ground satellite-borne antenna and sensor, can realize the signal transmission to ground and the response of auxiliary satellite orbit state.

Specifically, the upper cover plate 5 is a honeycomb plate structure, and a space-borne antenna and a sensor are fixedly arranged on the upper surface of the upper cover plate 5.

The upper cover plate 5 provides an installation foundation for an external space-borne antenna and a sensor through a honeycomb structure of the upper cover plate, the space-borne antenna is convenient to transmit signals with other in-orbit satellites, and the sensor monitors the in-orbit attitude of the satellites.

Specifically, the side plate 4 is of a honeycomb plate structure, and the side plate 4 is fixedly provided with a satellite-borne detecting antenna.

The side plate 4 provides a convenient installation foundation for the satellite-borne detection antenna through the honeycomb plate structure of the side plate.

Specifically, the inner side surface of the motherboard module 1, the inner side surface of the side plate 4, the inner side surface of the circuit template module 2, the inner side surface of the upper cover plate 5 and the inner side surface of the lower cover plate 6 are all black anodized, and the surface of the alloy frame 31 of the functional module 3 is black anodized.

Through carrying out black anodic oxidation treatment for the whole can be better to the heat radiation absorb, thereby increase thermal conductivity efficiency.

Specifically, the outer side of the heat dissipation motherboard module 1, the outer side of the side plate 4, the outer side of the circuit template module 2, the outer side of the upper cover plate 5 and the outer side of the lower cover plate 6 are all coated with thermal control white paint.

The solar radiation energy is reduced to heat the star by spraying the thermal control white paint.

Working principle: during the use, customize functional module 3 based on the function demand, install according to setting up the demand after the customization and on the bottom carrier plate, constitute complete combination array mechanism, after the installation is carried out the whole combination, after launching to predetermined track, folding solar wing 7 expands, the work of internal element, the heat of production leads second heat pipe 36 through the alloy frame 31 of functional module 3, then leads first heat pipe 12 through second heat pipe 36, first heat pipe 12 evenly leads the heat to heat dissipation motherboard module 1, dispel the heat, simultaneously through the mode of thermal radiation, lead other outside subassemblies with the heat, realize the promotion of whole radiating efficiency.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (10)

1. The utility model provides a structure thermal control integrated device based on modularization microsatellite, includes heat dissipation mother board module (1), curb plate (4), functional module (3) and circuit mother board module (2), its characterized in that: the utility model discloses a circuit motherboard module, including circuit motherboard module (2), curb plate (4) are fixed mounting, curb plate (4) are two, and connect through the bottom support plate, the rear side of heat dissipation motherboard module (1) fixed mounting curb plate (4), the front side of circuit motherboard module (2) fixed mounting curb plate (4), functional module (3) are a plurality of, and all become vertical parallel state fixed mounting in the upper surface of bottom support plate, the upper edge fixed mounting of curb plate (4) has upper cover plate (5), the lower limb fixed mounting of curb plate (4) has lower apron (6), the outer wall of heat dissipation motherboard module (1) and the outer wall of circuit motherboard module (2) all fixed mounting have folding solar wing (7).

2. The modular microsatellite based structural thermal control integrated device of claim 1, wherein: the heat dissipation motherboard module (1) comprises an aluminum alloy plate body (11), wherein a groove is formed in the upper surface of the aluminum alloy plate body (11), first heat pipes (12) are uniformly embedded in the groove, square platforms (13) are integrally formed at the end parts of the first heat pipes (12), and threaded holes (14) are formed in the middle of each square platform (13).

3. The modular microsatellite based structural thermal control integrated device of claim 1, wherein: the functional module (3) comprises an alloy frame (31) and a functional component (32), wherein the alloy frame (31) is of a frame structure, the functional component (32) is embedded in an embedded opening of the alloy frame (31), a platform (35) is integrally formed at the rear edge of the alloy frame (31), a power device (33) is fixedly mounted on the outer wall surface of the platform (35), and a plug connector (34) is fixedly mounted on the front edge wall surface of the alloy frame (31).

4. A modular microsatellite based structural thermal control integrated device according to claim 3 wherein: the lower wall surface of the platform (35) is provided with a caulking groove, a second heat pipe (36) is embedded in the caulking groove, screw joints are arranged at two ends of the second heat pipe (36), the screw joints are communicated with the screw holes (14) through bridging pipes, and refrigerant media are filled in the second heat pipe (36) and the first heat pipe (12).

5. The modular microsatellite based structural thermal control integrated device of claim 1, wherein: the circuit motherboard module (2) is manufactured based on an alloy plate body, a main control circuit board is embedded in the circuit motherboard module (2), and the main control circuit board is connected with the plug connector (34) through the plug connector assembly.

6. The modular microsatellite based structural thermal control integrated device of claim 1, wherein: a gap is reserved between the upper surface of the lower cover plate (6) and the bottom carrier plate, the lower cover plate (6) is of a honeycomb plate structure, and a ground satellite-borne antenna and a sensor are fixedly arranged on the lower surface of the lower cover plate (6).

7. The modular microsatellite based structural thermal control integrated device of claim 1, wherein: the upper cover plate (5) is of a honeycomb plate structure, and a space-borne antenna and a sensor are fixedly arranged on the upper surface of the upper cover plate (5).

8. The modular microsatellite based structural thermal control integrated device of claim 1, wherein: the side plate (4) is of a honeycomb plate structure, and the side plate (4) is fixedly provided with a satellite-borne detection antenna.

9. A modular microsatellite based structural thermal control integrated device according to claim 3 wherein: the inner side surface of the heat dissipation motherboard module (1), the inner side surface of the side plate (4), the inner side surface of the circuit motherboard module (2), the inner side surface of the upper cover plate (5) and the inner side surface of the lower cover plate (6) are all subjected to black anodic oxidation treatment, and the surface of the alloy frame (31) of the functional module (3) is subjected to black anodic oxidation treatment.

10. The modular microsatellite based structural thermal control integrated device of claim 1, wherein: the outer side of the heat dissipation motherboard module (1), the outer side of the side plate (4), the outer side of the circuit motherboard module (2), the outer side of the upper cover plate (5) and the outer side of the lower cover plate (6) are all sprayed with thermal control white paint.

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