CN219025209U

CN219025209U - Cleaning and drying integrated machine for semiconductor wafer

Info

Publication number: CN219025209U
Application number: CN202320114665.XU
Authority: CN
Inventors: 夏继良; 李继云; 王顺敏; 王清玉
Original assignee: Qingdao Ronghe Equipment Technology Co Ltd
Current assignee: Qingdao Ronghe Equipment Technology Co Ltd
Priority date: 2023-01-17
Filing date: 2023-01-17
Publication date: 2023-05-16
Anticipated expiration: 2033-01-17

Abstract

The utility model discloses a cleaning and drying integrated machine for a semiconductor wafer, and belongs to the technical field of ultrasonic cleaning and drying. The technical proposal is as follows: the device comprises a box body and a controller, wherein a conveying unit, a cleaning unit and a drying unit are arranged in the box body; the conveying unit comprises a synchronous wheel and a synchronous belt matched with the synchronous wheel, the synchronous wheel is fixedly arranged on the box body, the synchronous wheel comprises a driving wheel and a driven wheel, the driving wheel is connected with an output shaft of the motor, and a clamping mechanism is arranged on the synchronous belt; the cleaning unit comprises a water tank, the water tank is arranged at the lower part of the conveying unit, an ultrasonic generator is arranged at the bottom of the water tank, and one side of the water tank is connected with a water inlet pipeline; the drying unit comprises an air knife and a mounting frame, wherein the mounting frame is provided with a U-shaped opening, the air knife is arranged in the U-shaped opening, and an air inlet of the air knife is connected with a fan through a pipeline. The utility model combines the cleaning and drying of the wafer, and reduces the risk of secondary pollution of the wafer in the transferring process.

Description

Cleaning and drying integrated machine for semiconductor wafer

Technical Field

The utility model relates to the technical field of ultrasonic cleaning and drying, in particular to a cleaning and drying integrated machine for a semiconductor wafer.

Background

The semiconductor wafer is required to be cut, ground, polished, cleaned and other complex process procedures in the production process, the last cleaning process uses an ultrasonic cleaning technology to remove the residual impurities on the surface of the semiconductor wafer, which is an important process in the production process of the semiconductor wafer, the ultrasonic cleaning equipment and the drying equipment of the existing semiconductor wafer are in a separated state, the semiconductor wafer is required to be firstly subjected to the ultrasonic cleaning equipment in the production process, and then the product is manually transferred into the drying equipment, so that the production efficiency is low, and the risk of secondary pollution is caused in the manual transfer process.

Disclosure of Invention

The utility model aims to solve the technical problems that: the defect of the prior art is overcome, the cleaning and drying integrated machine for the semiconductor wafer is provided, the cleaning and drying of the wafer are completed together, and the risk of secondary pollution of the wafer in the transferring process is reduced.

The technical scheme of the utility model is as follows: the integrated cleaning and drying machine for the semiconductor wafers comprises a box body and a controller, wherein a conveying unit, a cleaning unit and a drying unit are arranged in the box body; the conveying unit comprises a synchronous wheel and a synchronous belt matched with the synchronous wheel, the synchronous wheel is fixedly arranged on the box body, the synchronous wheel comprises a driving wheel and a driven wheel, the driving wheel is connected with an output shaft of a motor, a clamping mechanism is arranged on the synchronous belt, and the motor is connected with a controller through telecommunication signals; the cleaning unit comprises a water tank, the water tank is arranged at the lower part of the conveying unit, the water tank is provided with a horizontal partition plate, the water tank is divided into a double-layer structure by the horizontal partition plate, a U-shaped sealing plug which is communicated with an upper layer and a lower layer is detachably arranged on the water tank, an ultrasonic generator is arranged on the upper layer of the water tank and is electrically connected with a controller, one side of the lower layer of the water tank is connected with a water outlet pipeline, one side of the upper layer of the water tank is connected with a water inlet pipeline, and the water inlet pipeline and the water outlet pipeline are mutually communicated; the drying unit comprises an air knife and a mounting frame, wherein the mounting frame is provided with a U-shaped opening, the air knife is arranged in the U-shaped opening, an air inlet of the air knife is connected with a fan through a pipeline, and the fan is connected with an electric signal of the controller.

Preferably, a water pump and a filter are arranged on the pipeline with the water outlet pipeline and the water inlet pipeline communicated with each other.

Preferably, a heater is further arranged in the U-shaped opening of the mounting frame, and the heater is in electric signal connection with the controller.

Preferably, the air inlet of the fan is provided with a filter screen, the wind output from the fan is filtered, the purity of the blown wind is ensured, and the pollution to wafers caused by unclean blowing in the drying process is avoided.

Preferably, the fixture includes dead lever, jack catch and adjusting bolt, and the top of dead lever is provided with the nut with the screw thread, and screw thread department is connected with looks adaptation, and the dead lever top passes the hold-in range to fix on the hold-in range with the nut, the lower extreme of dead lever is equipped with the jack catch, and the jack catch is U type structure, and the both sides of jack catch are corresponding to be provided with the fixed orifices, and adjusting bolt can dismantle and connect in the fixed orifices.

Compared with the prior art, the utility model has the following beneficial effects:

1. the conveying unit realizes automatic conveying of the wafers, realizes integrated cleaning and drying, and reduces the risk of secondary pollution of the wafers in the transferring process; 2. the air knife can adjust the air quantity and the air outlet angle to adapt to wafers with different specifications; 3. the setting of heater can be with cold wind change into hot-blast, better play the drying effect.

Drawings

Fig. 1 is a schematic structural view of the present utility model.

Fig. 2 is a perspective view of the present utility model.

Fig. 3 is a schematic structural view of the clamping mechanism of the present utility model.

In the figure, 1, a box body; 2. a synchronizing wheel; 3. a synchronous belt; 4. a clamping mechanism; 401. a fixed rod; 402. a claw; 403. an adjusting bolt; 5. a water tank; 6. an ultrasonic generator; 7. a water outlet pipeline; 71. a purifier; 8. an air knife; 9. a mounting frame; 10. a U-shaped opening; 11. a blower; 12. a heater; 13. a U-shaped sealing plug; 14. a water inlet pipeline; 15. a horizontal partition; 16. a wafer.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1

As shown in fig. 1 to 3, the present embodiment provides a cleaning and drying integrated machine for semiconductor wafers, comprising a box body 1 and a controller, wherein a conveying unit, a cleaning unit and a drying unit are arranged in the box body 1;

the conveying unit comprises a synchronizing wheel 2 and a synchronous belt 3 which is matched with the synchronizing wheel 2, the synchronizing wheel 2 is fixedly arranged on a box body 1, the synchronizing wheel 2 comprises a driving wheel and a driven wheel, the driving wheel is connected with an output shaft of a motor, a clamping mechanism 4 is arranged on the synchronous belt 3, the clamping mechanism 4 comprises a fixing rod 401, a claw 402 and an adjusting bolt 403, a screw cap which is matched with the screw thread is arranged at the top of the fixing rod 401, the top of the fixing rod 401 penetrates through the synchronous belt 3 and is fixed on the synchronous belt 3 by the screw cap, a claw 402 is fixedly arranged at the lower end of the fixing rod 401, the claw 402 is of a U-shaped structure, fixing holes are correspondingly formed in two sides of the claw 402, the adjusting bolt 403 is detachably connected in the fixing holes, the claw 402 can generate certain deformation for plastic materials, and the claw 402 can clamp a wafer 16 when the adjusting bolt 403 is fastened.

The cleaning unit comprises a water tank 5, the water tank 5 is arranged at the lower part of the conveying unit, the water tank 5 is provided with a horizontal partition plate 15, the water tank 5 is divided into a double-layer structure by the horizontal partition plate 15, a U-shaped sealing plug 13 communicated with an upper layer and a lower layer is detachably arranged on the water tank 5, an ultrasonic generator 6 is arranged on the upper layer of the water tank 5, the ultrasonic generator 6 is of a commercially available common structure, the ultrasonic generator 6 is not repeated, the ultrasonic generator 6 is electrically connected with a controller, one side of the lower layer of the water tank 5 is connected with a water outlet pipeline 7, one side of the upper layer of the water tank 5 is connected with a water inlet pipeline 14, the water inlet pipeline 14 is mutually communicated with a water outlet pipeline 14, a water pump and a filter are arranged on the pipelines mutually communicated with the water outlet pipeline 7, and the water in the water tank 5 is purified by the filter, and the cleanliness of the water is ensured;

the drying unit includes air knife 8 and mounting bracket 9, and air knife 8 is the common structure of market, and this is not repeated, and mounting bracket 9 is provided with U type opening 10, and air knife 8 sets up in U type opening 10, is provided with the direction that air knife knob is used for adjusting air knife 8 air outlet on the air knife, and air knife 8's air intake passes through the pipe connection fan 11, and the size of air-out volume can be adjusted to fan 11. The air intake of fan 11 is provided with the filter screen, still be provided with heater 12 in the U type opening 10 of mounting bracket 9, fan 11 and heater 12 all are connected with the controller signal of telecommunication, and heater 12 is the common structure on the market, can adopt the heater strip.

When the device is used, a semiconductor wafer is placed on the claw 402 of the clamping mechanism 4 of the synchronous belt 3 from the left side position of the synchronous belt 3, the adjusting bolt 403 is screwed, the controller controls the motor to rotate, and then drives the driving wheel to rotate, so that the wafer rotates anticlockwise along the synchronous belt 3, when the wafer passes over the water tank 5, the ultrasonic generator 6 is started to ultrasonically clean the wafer, the semiconductor wafer after cleaning passes through the air knife 8, the fan 11 sends external air to the air knife 8, the air is changed into hot air from cold air through the heating of the heater 12, the drying effect can be better achieved, moisture on the wafer is dried by the hot air, the wafer is taken off from the clamping mechanism 4, the cleaning and drying of the wafer are completed, then the next procedure is carried out, under normal conditions, the upper layer of the water tank 5 is provided with water for cleaning, the U-shaped sealing plug 13 is sealed, the lower layer of the water tank 5 cannot be cleaned, after a period of time is required to be cleaned, if the water in the water tank 5 becomes turbid, the U-shaped sealing plug 13 can be opened, the water flows into the lower layer of the water tank 5, then the U-shaped sealing plug is plugged, the water pump is opened under the control of the controller, the water pump and the water pump 71 is opened from the lower layer of the water tank 5, and the upper layer can be purified by circulating water through the upper layer of the water tank 5.

Although the present utility model has been described in detail by way of preferred embodiments with reference to the accompanying drawings, the present utility model is not limited thereto. Various equivalent modifications and substitutions for embodiments of the utility model may be made by those skilled in the art without departing from the spirit and scope of the utility model, and these modifications and substitutions are intended to be within the scope of the utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims

1. A cleaning and drying all-in-one machine for semiconductor wafers, characterized in that: comprises a box body (1) and a controller, wherein a conveying unit, a cleaning unit and a drying unit are arranged in the box body (1);

the conveying unit comprises a synchronizing wheel (2) and a synchronous belt (3) which is matched with the synchronizing wheel (2), the synchronizing wheel (2) is fixedly arranged on the box body (1), the synchronizing wheel (2) comprises a driving wheel and a driven wheel, the driving wheel is connected with an output shaft of a motor, a clamping mechanism (4) is arranged on the synchronous belt (3), and the motor is in electrical signal connection with a controller;

the cleaning unit comprises a water tank (5), the water tank (5) is arranged at the lower part of the conveying unit, the water tank (5) is provided with a horizontal partition plate (15), the water tank (5) is divided into a double-layer structure by the horizontal partition plate (15), a U-shaped sealing plug (13) communicated with an upper layer and a lower layer is detachably arranged on the water tank (5), an ultrasonic generator (6) is arranged on the upper layer of the water tank (5), the ultrasonic generator (6) is electrically connected with a controller, one side of the lower layer of the water tank (5) is connected with a water outlet pipeline (7), one side of the upper layer of the water tank (5) is connected with a water inlet pipeline (14), and the water inlet pipeline (14) and the water outlet pipeline are mutually communicated;

the drying unit comprises an air knife (8) and a mounting frame (9), wherein the mounting frame (9) is provided with a U-shaped opening (10), the air knife (8) is arranged in the U-shaped opening (10), an air inlet of the air knife (8) is connected with a fan (11) through a pipeline, and the fan (11) is connected with a controller through an electric signal.

2. A cleaning and drying all-in-one machine for semiconductor wafers as set forth in claim 1, wherein: the water pump and the filter are arranged on the pipeline which is communicated with the water outlet pipeline (7) and the water inlet pipeline (14).

3. A cleaning and drying all-in-one machine for semiconductor wafers as set forth in claim 1, wherein: a heater (12) is further arranged in the U-shaped opening (10) of the mounting frame (9), and the heater (12) is in electrical signal connection with the controller.

4. A cleaning and drying all-in-one machine for semiconductor wafers as set forth in claim 1, wherein: an air inlet of the fan (11) is provided with a filter screen.

5. A cleaning and drying all-in-one machine for semiconductor wafers as set forth in claim 1, wherein: clamping mechanism (4) are provided with the nut that is connected with the screw thread including dead lever (401), jack catch (402) and adjusting bolt (403), the top of dead lever (401), screw thread department is connected with looks adaptation, dead lever (401) top is passed hold-in range (3) to fix on hold-in range (3) with the nut, the lower extreme of dead lever (401) has set firmly jack catch (402), jack catch (402) are U type structure, the both sides of jack catch (402) are corresponding to be provided with the fixed orifices, adjusting bolt (403) can dismantle and connect in the fixed orifices.