CN219019369U - FPGA experiment box - Google Patents

FPGA experiment box Download PDF

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Publication number
CN219019369U
CN219019369U CN202223017613.5U CN202223017613U CN219019369U CN 219019369 U CN219019369 U CN 219019369U CN 202223017613 U CN202223017613 U CN 202223017613U CN 219019369 U CN219019369 U CN 219019369U
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fixedly connected
box
fpga
heat
box body
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CN202223017613.5U
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Chinese (zh)
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詹利森
袁国华
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Solid Core Semiconductor Technology Suzhou Co ltd
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Solid Core Semiconductor Technology Suzhou Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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Abstract

The utility model discloses an FPGA experiment box, which comprises a box body, wherein a water tank is fixedly connected to one side of the inner bottom wall of the box body, a circulating pipe is fixedly connected to one side of the outer surface of the water tank, a circulating pump is fixedly connected to the outer surface of the circulating pipe, and a semiconductor refrigerating sheet is fixedly connected to the middle part of the inner bottom wall of the box body. This FPGA experiment case, through the water tank, the circulating pipe, the circulating pump, semiconductor refrigeration piece, heat-conducting plate and heat dissipation wing's setting, the semiconductor refrigeration piece is cooled down to the circulating pipe after the circular telegram, utilize the low temperature of coolant liquid to cool down the processing to the FPGA circuit board, the circulating pump carries out circulation with the inside coolant liquid of water tank through the circulating pipe, carry out continuous cooling to the FPGA circuit board and handle, absorb heat through the heat-conducting plate, the heat dissipation wing gives off the heat in the air, accelerate the emission rate, strengthen heat dispersion, avoid the high temperature to lead to the part damage, thereby increase of service life.

Description

FPGA experiment box
Technical Field
The utility model relates to the technical field of FPGA boxes, in particular to an FPGA experiment box.
Background
FPGA (Field Programmable Gate Array) is a product of further development on the basis of programmable devices such as PAL, GAL, etc. The FPGA main board is arranged in an FPGA test box, so that a worker can carry the FPGA with him, and the worker can conveniently debug the FPGA chip or reprogram, modify and program the FPGA chip.
Through searching, in the chinese published patent application No. CN202021256184.5, an FPGA experimental box is disclosed, a fan set is disposed in the main body of the experimental box, and an airflow cavity and an airflow groove are disposed at the output end of the fan set to cool the FPGA circuit board.
Disclosure of Invention
The utility model mainly aims to provide an FPGA experiment box which can effectively solve the problems in the background technology.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
the FPGA experiment box comprises a box body, wherein a water tank is fixedly connected to one side of the inner bottom wall of the box body, a circulating pipe is fixedly connected to one side of the outer surface of the water tank, a circulating pump is fixedly connected to the outer surface of the circulating pipe, and a semiconductor refrigerating sheet is fixedly connected to the middle part of the inner bottom wall of the box body; the middle part fixedly connected with otter board of box lower surface, one side of box lower surface is through bolt swing joint has the heat conduction board, the lower surface fixedly connected with heat dissipation wing of heat conduction board, the middle part fixedly connected with first bracing piece of box medial surface, the surface rotation of first bracing piece is connected with the baffle, the through-hole has been seted up to the upper surface of baffle, the medial surface of box is close to the below fixedly connected with limiting plate of baffle.
In order to achieve the effect of enhancing the connection tightness of the top cover and the box body, as the FPGA experimental box provided by the utility model, the top of the back surface of the box body is fixedly connected with the first connecting block, the inner side surface of the first connecting block is rotationally connected with the second supporting rod, the two sides of the outer surface of the second supporting rod are fixedly connected with the second connecting blocks, the outer surface of each second connecting block is fixedly connected with the top cover, and the lower surface of each top cover is fixedly connected with the sealing ring.
In order to achieve the effect of enhancing the protection capability of the FPGA circuit board, as the FPGA experimental box provided by the utility model, the inner top wall of the top cover is fixedly connected with a spring, and one end of the spring is fixedly connected with a rubber pad.
In order to achieve the effect of being convenient for supporting the top cover, the FPGA experimental box is characterized in that the top of the inner side surface of the box body is rotatably connected with a first supporting arm, one end of the first supporting arm is rotatably connected with a second supporting arm, and one end of the second supporting arm is rotatably connected with the top cover.
In order to achieve the effect of being convenient for adjusting the horizontal position of the box body, as the FPGA experimental box provided by the utility model, studs are connected to four corners of the lower surface of the box body in a threaded manner, and one end of each stud is fixedly connected with a supporting leg.
In order to achieve the effect of being convenient for fixing the top cover, as the FPGA experiment box provided by the utility model, the top of the front surface of the box body is rotationally connected with the buckle, and the bottom of the front surface of the top cover is fixedly connected with the clamping block.
In order to achieve the effect of being convenient to carry and lift the box body, the FPGA experimental box is characterized in that a fixed block is fixedly connected to the middle of the front face of the box body, and a lifting handle is rotatably connected to the inner side face of the fixed block.
In order to achieve the effect of avoiding hand sliding, the FPGA experimental box is characterized in that an anti-skid sleeve is fixedly connected to the outer surface of the handle.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, through the arrangement of the water tank, the circulating pipe, the circulating pump, the semiconductor refrigerating sheet, the heat conducting plate and the heat radiating fin, the circulating pipe is cooled after the semiconductor refrigerating sheet is electrified, the FPGA circuit board is cooled by the low temperature of the cooling liquid, the circulating pump carries out circulating transportation on the cooling liquid in the water tank through the circulating pipe, the FPGA circuit board is subjected to continuous cooling treatment, the heat is absorbed through the heat conducting plate, the heat radiating fin radiates the heat into the air, the radiating speed is accelerated, the radiating performance is enhanced, the damage to parts caused by overhigh temperature is avoided, and the service life is prolonged.
2. According to the utility model, the sealing ring, the spring, the rubber pad, the first support arm and the second support arm are arranged, the sealing ring seals the joint of the top cover and the inner side surface of the box body, so that external dust is prevented from entering, the sealing performance of structural connection is improved, the waterproof sealing effect is enhanced, the rubber pad can protect the FPGA circuit board in the box body under the elastic action of the spring, damage is prevented, the service life is prolonged, when the top cover is opened, the first support arm and the second support arm play a role in supporting the top cover, after the top cover is closed, the top cover can be folded, the storage is convenient, and the convenience of use is improved.
Drawings
Fig. 1 is a schematic diagram of a front view structure of an FPGA experimental box according to embodiment 1 of the present utility model;
fig. 2 is a schematic diagram of a bottom view structure of an FPGA experimental box according to embodiment 1 of the present utility model;
FIG. 3 is a schematic diagram of an explosion structure inside an FPGA experimental box according to embodiment 1 of the present utility model;
fig. 4 is a schematic diagram of a top cover structure of an FPGA experimental box according to embodiment 1 of the present utility model;
fig. 5 is a schematic structural diagram of an anti-slip sleeve according to embodiment 2 of the present utility model.
In the figure: 1. a case; 2. a water tank; 3. a circulation pipe; 4. a circulation pump; 5. a semiconductor refrigeration sheet; 6. a screen plate; 7. a heat conductive plate; 8. radiating fins; 9. a first support bar; 10. a partition plate; 11. a through hole; 12. a limiting plate; 13. a first connection block; 14. a second support bar; 15. a second connection block; 16. a top cover; 17. a seal ring; 18. a spring; 19. a rubber pad; 20. a first support arm; 21. a second support arm; 22. a stud; 23. supporting feet; 24. a buckle; 25. a clamping block; 26. a fixed block; 27. a handle; 28. an anti-skid sleeve.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Example 1
As shown in fig. 1-4, an FPGA experiment box comprises a box body 1, wherein a water tank 2 is fixedly connected to one side of the inner bottom wall of the box body 1, a circulating pipe 3 is fixedly connected to one side of the outer surface of the water tank 2, a circulating pump 4 is fixedly connected to the outer surface of the circulating pipe 3, and a semiconductor refrigerating sheet 5 is fixedly connected to the middle part of the inner bottom wall of the box body 1;
in this embodiment, the middle part fixedly connected with otter board 6 of box 1 lower surface, one side of box 1 lower surface is through bolt swing joint heat conduction board 7, and the lower surface fixedly connected with heat dissipation wing 8 of heat conduction board 7, the middle part fixedly connected with first bracing piece 9 of box 1 medial surface, the surface rotation of first bracing piece 9 is connected with baffle 10, through-hole 11 has been seted up to the upper surface of baffle 10, and the medial surface of box 1 is close to the below fixedly connected with limiting plate 12 of baffle 10.
During specific use, through the setting of water tank 2, circulating pipe 3, circulating pump 4, semiconductor refrigeration piece 5, heat-conducting plate 7 and heat dissipation wing 8, the coolant liquid has been placed to the inside of water tank 2, baffle 10 rotates the top of connecting at limiting plate 12 through first bracing piece 9, a plurality of through-holes 11 have evenly been seted up on its surface, be convenient for install the FPGA circuit board, make things convenient for bottom wall cooling mechanism in box 1 to dispel the heat to the FPGA circuit board in the time, the semiconductor refrigeration piece 5 is after the circular pipe 3 cooling down, make the inside coolant liquid of circulating pipe 3 cool down rapidly, utilize the low temperature of coolant liquid to cool down the FPGA circuit board to handle, increase the cooling effect, circulating pump 4 carries out the circulation through the coolant liquid of circulating pipe 3 with the water tank 2, form a backward flow, can let circulating pipe 3 keep the ice-cold always, can carry out continuous cooling treatment to the FPGA circuit board, the radiating efficiency of FPGA circuit board has been improved greatly, 6 be convenient for semiconductor refrigeration piece 5 operation produces the heat and give off, prevent outside entering simultaneously, and absorb heat through heat-conducting plate 7, remove the wing through the heat dissipation 8, the high-speed is improved, the service life is avoided, the life is prolonged.
In this embodiment, the top of the back of the box 1 is fixedly connected with a first connecting block 13, the inner side surface of the first connecting block 13 is rotatably connected with a second supporting rod 14, two sides of the outer surface of the second supporting rod 14 are fixedly connected with a second connecting block 15, the outer surface of the second connecting block 15 is fixedly connected with a top cover 16, and the lower surface of the top cover 16 is fixedly connected with a sealing ring 17.
When the waterproof box is specifically used, through the arrangement of the top cover 16, the second connecting block 15 is rotationally connected to the inside of the first connecting block 13 through the second supporting rod 14, so that the top cover 16 is conveniently opened and closed, when the top cover 16 is closed, the sealing ring 17 seals the joint of the top cover 16 and the inner side face of the box body 1, external dust is prevented from entering, the sealing performance of structural connection is improved, and the waterproof sealing effect is enhanced.
In this embodiment, the inner top wall of the top cover 16 is fixedly connected with a spring 18, and one end of the spring 18 is fixedly connected with a rubber pad 19.
When the box is particularly used, through the arrangement of the rubber pad 19, when the top cover 16 is closed, the rubber pad 19 can protect the FPGA circuit board inside the box body 1 under the elastic action of the spring 18, so that the damage is prevented, and the service life is prolonged.
In this embodiment, the top of the inner side surface of the case 1 is rotatably connected with a first support arm 20, one end of the first support arm 20 is rotatably connected with a second support arm 21, and one end of the second support arm 21 is rotatably connected with the top cover 16.
When the folding type portable refrigerator is specifically used, through the arrangement of the first supporting arm 20 and the second supporting arm 21, the first supporting arm 20 and the second supporting arm are respectively connected with the refrigerator body 1 and the top cover 16 in a rotating mode, meanwhile, the first supporting arm and the second supporting arm are connected in a rotating mode, when the top cover 16 is opened, the top cover 16 is supported, after the top cover 16 is closed, the folding type portable refrigerator can be folded, and the using convenience is improved.
In this embodiment, studs 22 are screwed at four corners of the lower surface of the case 1, and one end of each stud 22 is fixedly connected with a supporting leg 23.
When the box body 1 is particularly used, the supporting legs 23 are connected to the lower surface of the box body 1 through the screw studs 22 in a threaded manner, and the heights of the supporting legs 23 can be adjusted by rotating the screw studs 22, so that the levelness of the box body 1 is adjusted, and the box body 1 is placed at a horizontal position.
In this embodiment, the top of the front face of the case 1 is rotatably connected with a buckle 24, and the bottom of the front face of the top cover 16 is fixedly connected with a clamping block 25.
When the device is specifically used, the clamping buckle 24 is clamped on the clamping block 25 through the arrangement of the clamping buckle 24 and the clamping block 25, the top cover 16 is limited and fixed, the top cover 16 is prevented from being opened at will, the use convenience is improved, and the device is convenient to open and close.
In this embodiment, a fixing block 26 is fixedly connected to the middle of the front face of the case 1, and a handle 27 is rotatably connected to the inner side face of the fixing block 26.
When the portable lifting device is particularly used, through the arrangement of the lifting handle 27, the lifting handle 27 can rotate through the fixing block 26, so that the portable lifting device is convenient to lift and carry, and the flexibility of movement is improved.
Working principle: the FPGA circuit board is installed through the through hole 11, the top cover 16 is closed when the FPGA circuit board is not used, the sealing ring 17 is prevented from entering external dust, the rubber pad 19 protects the FPGA circuit board under the elastic action of the spring 18, the buckle 24 is clamped on the clamping block 25, the top cover 16 is limited and fixed, the box body 1 is lifted and carried through the lifting handle 27, the height of the supporting legs 23 can be adjusted by the rotating studs 22, the box body 1 is placed at the horizontal position, when the top cover 16 is opened, the first supporting arm 20 and the second supporting arm 21 play a role of supporting the top cover 16, the circulating pipe 3 is cooled after the top cover 16 is opened, the low temperature of cooling liquid is utilized to cool the FPGA circuit board, the circulating pump 4 carries out circulating conveying on the cooling liquid in the water tank 2 through the circulating pipe 3, continuous cooling treatment is carried out on the FPGA circuit board, the heat generated by the operation of the semiconductor refrigerating sheet 5 is dispersed through the screen 6, the external dust is prevented from entering the box body, and the heat is absorbed through the heat conducting plate 7, the heat is dispersed into the air through the heat dissipation fin 8, and the heat dissipation performance is enhanced.
Example 2
As shown in fig. 5, the distinguishing features of this embodiment that distinguish embodiment 1 are: an anti-slip sleeve 28 is fixedly connected to the outer surface of the handle 27.
When the anti-skid cover 28 is specifically used, through the arrangement of the anti-skid cover 28, the friction force of the hands of a user is increased by the anti-skid cover 28, the phenomenon that the box body 1 falls down due to the fact that the box body 1 is slipped by hands when the box body 1 is lifted by the lifting handle 27 is avoided, and the use safety is increased.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (8)

1. The utility model provides an FPGA experiment case, includes box (1), its characterized in that: a water tank (2) is fixedly connected to one side of the inner bottom wall of the box body (1), a circulating pipe (3) is fixedly connected to one side of the outer surface of the water tank (2), a circulating pump (4) is fixedly connected to the outer surface of the circulating pipe (3), and a semiconductor refrigerating sheet (5) is fixedly connected to the middle part of the inner bottom wall of the box body (1);
the utility model discloses a heat-conducting box, including box (1), heat-conducting plate (7), heat dissipation fin (8), baffle (10) are connected with in the middle part fixedly connected with otter board (6) of box (1) lower surface, one side of box (1) lower surface is through bolt swing joint, the lower surface fixedly connected with heat dissipation fin (8) of heat-conducting plate (7), the middle part fixedly connected with first bracing piece (9) of box (1) medial surface, the surface rotation of first bracing piece (9) is connected with baffle (10), through-hole (11) have been seted up to the upper surface of baffle (10), the medial surface of box (1) is close to the below fixedly connected with limiting plate (12) of baffle (10).
2. An FPGA experiment box as claimed in claim 1, wherein: the top fixedly connected with first connecting block (13) at box (1) back, the medial surface of first connecting block (13) rotates and is connected with second bracing piece (14), the both sides of second bracing piece (14) surface are all fixedly connected with second connecting block (15), the surface fixedly connected with top cap (16) of second connecting block (15), the lower surface fixedly connected with sealing washer (17) of top cap (16).
3. An FPGA experiment box as claimed in claim 2, wherein: the inner top wall of the top cover (16) is fixedly connected with a spring (18), and one end of the spring (18) is fixedly connected with a rubber pad (19).
4. An FPGA experiment box as claimed in claim 2, wherein: the top of box (1) medial surface rotates and is connected with first support arm (20), the one end of first support arm (20) rotates and is connected with second support arm (21), the one end of second support arm (21) is rotation connection with top cap (16).
5. An FPGA experiment box as claimed in claim 1, wherein: studs (22) are connected to four corners of the lower surface of the box body (1) in a threaded mode, and supporting legs (23) are fixedly connected to one end of each stud (22).
6. An FPGA experiment box as claimed in claim 2, wherein: the top of the front face of the box body (1) is rotationally connected with a buckle (24), and the bottom of the front face of the top cover (16) is fixedly connected with a clamping block (25).
7. An FPGA experiment box as claimed in claim 1, wherein: the middle part on the front of the box body (1) is fixedly connected with a fixed block (26), and the inner side surface of the fixed block (26) is rotationally connected with a handle (27).
8. The FPGA of claim 7 wherein: the outer surface of the handle (27) is fixedly connected with an anti-slip sleeve (28).
CN202223017613.5U 2022-11-14 2022-11-14 FPGA experiment box Active CN219019369U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223017613.5U CN219019369U (en) 2022-11-14 2022-11-14 FPGA experiment box

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223017613.5U CN219019369U (en) 2022-11-14 2022-11-14 FPGA experiment box

Publications (1)

Publication Number Publication Date
CN219019369U true CN219019369U (en) 2023-05-12

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223017613.5U Active CN219019369U (en) 2022-11-14 2022-11-14 FPGA experiment box

Country Status (1)

Country Link
CN (1) CN219019369U (en)

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