CN219017612U

CN219017612U - Wafer finishing device

Info

Publication number: CN219017612U
Application number: CN202223337347.4U
Authority: CN
Inventors: 冯永增
Original assignee: Hebei Shishuo Microchip Technology Co ltd
Current assignee: Hebei Shishuo Microchip Technology Co ltd
Priority date: 2022-12-14
Filing date: 2022-12-14
Publication date: 2023-05-12
Anticipated expiration: 2032-12-14

Abstract

The application provides a wafer finishing device, which comprises a base body with a first mounting surface, wherein a first groove is formed in the first mounting surface; the support assembly is arranged on the first mounting surface, a plurality of wafers are arranged in the support assembly, and the wafers are arranged on the opening side of the first groove; the wafer edge is provided with a reference surface, and the reference surface is a plane formed by cutting the wafer edge; the axis direction of the wafer is a first direction; the wafer has a first state and a second state; the first roller is rotatably arranged in the first groove, and the extending direction of the rotating shaft of the first roller is a first direction; when the wafer is in the first state, the wafer is in contact with the outer wall of the first roller; when the wafer is in the second state, the wafer is separated from the first roller, and the reference surface is arranged on the opening side of the first groove; the first driving assembly is used for driving the wafer to switch between a first state and a second state; according to the scheme, manual adjustment of each wafer is avoided, the working efficiency is improved, and the labor cost is reduced.

Description

Wafer finishing device

Technical Field

The application relates to the technical field of semiconductor production and manufacturing, in particular to a wafer arranging device.

Background

The wafer is a carrier used for producing integrated circuits, is a commonly used semiconductor material, and each wafer comprises a reference surface which is long-sided and circular arc-shaped, and the positions of the reference surfaces are circular arc-shaped;

in the prior art, in order to keep consistency of the reference surface of the wafer, the wafer is placed in the storage device for manual adjustment, but the number of wafers is large, and the time spent for manual adjustment is long.

Disclosure of Invention

In view of the foregoing drawbacks and disadvantages of the prior art, the present application is directed to a wafer conditioning apparatus, comprising:

the base comprises a base body, wherein the top surface of the base body is provided with a first mounting surface, and a first groove is formed in the first mounting surface;

the supporting component is arranged on the first mounting surface, the wafer is arranged on the supporting component, and the wafer is arranged on the opening side of the first groove; the wafer edge is provided with a reference surface, and the reference surface is a plane formed by cutting the wafer edge; the axis direction of the wafer is a first direction; the wafer has a first state and a second state;

the first roller is rotatably arranged in the first groove, and the extending direction of the rotating shaft of the first roller is the first direction; when the wafer is in the first state, the wafer is in contact with the outer wall of the first roller; when the wafer is in the second state, the wafer is separated from the first roller, and the reference surface is arranged on the opening side of the first groove;

and the first driving assembly is used for driving the wafer to be switched between the first state and the second state.

According to the technical scheme provided by the embodiment of the application, the support component is internally provided with a first space, and a second opening is formed in the side, close to the base body, of the support component; the inner wall of the first space is provided with a plurality of arc-shaped grooves along the first direction, the wafer can be embedded into the arc-shaped grooves, and when the wafer is in the first state, a part of the wafer extends out of the second opening.

According to the technical scheme that this application embodiment provided, first recess is followed the both ends of first direction are equipped with first riser, first gyro wheel is located two between the first riser, its both ends with first gyro wheel rotatable coupling, two the first riser is used for limiting first gyro wheel is in first recess internal rotation.

According to the technical scheme provided by the embodiment of the application, in the first groove, second grooves are formed in two sides of the first roller along the second direction, an opening of each second groove faces to the side of the supporting component, and the second direction is perpendicular to the first direction; the support assembly is provided with a first protruding portion close to the side of the base body, and the first protruding portion can be embedded into the second groove.

According to the technical scheme provided by the embodiment of the application, the side, away from the base body, of the supporting component is provided with a first opening, and the first opening is used for taking and placing the wafer.

According to the technical scheme that this application embodiment provided, two first riser middle part is equipped with first through-hole, runs through two first through-hole is equipped with first regulation pole, the extending direction of first regulation pole is first direction, first gyro wheel cover in first regulation pole outer wall rotates first regulation pole can drive first gyro wheel is in first recess internal rotation.

According to the technical scheme that this application embodiment provided, first riser is kept away from first gyro wheel side is equipped with adjustment handle, adjustment handle with first regulation pole links to each other, rotates adjustment handle can drive first gyro wheel is in rotate in the first recess.

In summary, the present application provides a wafer alignment apparatus, including a base body, where the base body has a first mounting surface, the first mounting surface is provided with a support assembly capable of holding a plurality of wafers, the wafers disposed in the support assembly have a first state and a second state, the first mounting surface is further provided with a first groove, a rotatable first roller is disposed in the first groove, and the first driving assembly can drive the first roller to rotate along an axis thereof; when the wafer cleaning machine is used, the first driving assembly drives the first roller to rotate, when the wafer is in the first state, the wafer rotates along with the rotation of the first roller, when the wafer is in the second state, the wafer does not rotate along with the first roller, and when all the wafers in the supporting assembly are in the second state, the wafer cleaning machine finishes finishing; according to the scheme, manual adjustment of each wafer is avoided, the working efficiency is improved, and the labor cost is reduced.

Drawings

Fig. 1 is a schematic structural diagram of a wafer finishing apparatus according to an embodiment of the present application;

FIG. 2 is a schematic structural view of a support assembly according to an embodiment of the present disclosure;

FIG. 3 is a schematic view of a wafer structure according to an embodiment of the present disclosure;

the text labels in the figures are expressed as:

1. a base body; 11. a first mounting surface; 12. a second groove; 13. a fourth groove; 2. a wafer; 21. a reference surface; 3. a support assembly; 31. a first opening; 32. a second opening; 33. an arc-shaped groove; 34. a first boss; 4. a first roller; 5. a first vertical plate; 6. a first adjusting lever; 7. an adjusting handle.

Detailed Description

The present application is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting of the utility model. It should be noted that, for convenience of description, only the portions related to the utility model are shown in the drawings.

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

As mentioned in the background art, in order to solve the problems in the prior art, the present application provides a wafer finishing device, as shown in fig. 1, fig. 2 and fig. 3, including:

the base comprises a base body 1, wherein the top surface of the base body 1 is provided with a first mounting surface 11, and a first groove is formed in the first mounting surface 11; the first mounting surface 11 is provided with a third groove, the third groove is a large groove, a first groove is arranged in the middle of the bottom surface of the third groove, which is far away from the first mounting surface 11, the extending direction of the first groove is in a first direction, and the first groove is a cylindrical groove; the first direction is a horizontal direction; specifically, the base body 1 is of a rectangular structure, a fourth groove 13 is formed in the side, close to the ground, of the base body 1, the fourth groove 13 is a strip-shaped groove, and the extending direction of the fourth groove 13 is a horizontal direction.

The supporting component 3 is arranged on the first mounting surface 11, a plurality of wafers 2 are arranged on the supporting component 3, and the wafers 2 are arranged on the opening side of the first groove; the edge of the wafer 2 is provided with a reference surface 21, and the reference surface 21 is a plane formed by cutting the edge of the wafer 2; the axis direction of the wafer 2 is a first direction; the wafer 2 has a first state and a second state; wherein the wafer 2 is rotatable along the axis within the support assembly 3;

the first roller 4 is rotatably arranged in the first groove, and the extending direction of the rotating shaft of the first roller 4 is the first direction; when the wafer 2 is in the first state, the wafer 2 is in contact with the outer wall of the first roller 4; when the wafer 2 is in the second state, the wafer 2 is separated from the first roller 4, and the reference surface 21 is arranged on the opening side of the first groove; specifically, when the wafer 2 is in the first state, the reference surface 21 of the wafer 2 is far away from the first roller 4, the side, close to the base body 1, of the edge of the wafer 2 may contact the first roller 4, and the first roller 4 may drive the wafer 2 to rotate when rotating; when the wafer 2 is in the second state, the reference surface 21 of the wafer 2 is close to the first roller 4, a gap exists between the reference surface 21 of the wafer 2 and the first roller 4, and the wafer 2 is kept motionless when the first roller 4 rotates;

a first drive assembly for driving the wafer to switch between the first state and the second state; optionally, the first drive assembly is driven by human force; according to the scheme, manual adjustment of each wafer is avoided, the working efficiency is improved, and the labor cost is reduced.

Further, a first space is formed in the support assembly 3, and a second opening 32 is formed in the support assembly 3 near the base body 1; the inner wall of the first space is provided with a plurality of arc-shaped grooves 33 along the first direction, the wafer 2 can be embedded into the arc-shaped grooves 33, and when the wafer 2 is in the first state, a part of the wafer 2 extends out of the second opening 32; wherein the second opening 32 is an arc opening, and the outer diameter of the second opening 32 is smaller than the outer diameter of the wafer 2; in certain specific situations, the number of the arc-shaped grooves 33 is 25, that is, the supporting component 3 can hold 25 wafers 2; the second opening 32 is directed towards the first roller 4.

Further, two ends of the first groove along the first direction are provided with first vertical plates 5, the first roller 4 is arranged between the two first vertical plates 5, two ends of the first roller 4 are rotatably connected with the first roller 4, and the two first vertical plates 5 are used for limiting the first roller 4 to rotate in the first groove; the first groove is an arc-shaped groove, the first vertical plate 5 is a circular vertical plate, and the first vertical plate 5 is fixed on the base body 1; optionally, the first vertical plate 5 is welded and fixed to two ends of the first groove near the side of the base body 1, and may also be screwed and fixed.

Further, in the first groove, two sides of the first roller 4 along a second direction are provided with second grooves 12, an opening of each second groove 12 faces the support component 3, and the second direction is perpendicular to the first direction; the side, close to the base body 1, of the supporting component 3 is provided with a first protruding part 34, and the first protruding part 34 can be embedded into the second groove 12; the third groove bottom surface is close to the first groove side and is provided with a second vertical plate, the extending direction of the second vertical plate is vertical, the third groove side surface and the second vertical plate form the second groove 12, the second groove 12 is a strip-shaped groove, the second groove 12 is arranged on the bottom surface of the third groove, the extending direction of the second groove 12 is the first direction, and the first protruding portion 34 is a strip-shaped protrusion.

Further, a first opening 31 is provided on the side of the support assembly 3 away from the base body 1, and the first opening 31 is used for taking and placing the wafer 2; optionally, the first opening 31 is a strip-shaped opening, and the length of the first opening 31 may cover the width occupied by 25 wafers 2.

Further, a first through hole is formed in the middle of the two first vertical plates 5, a first adjusting rod 6 penetrates through the two first through holes, the extending direction of the first adjusting rod 6 is the first direction, the first roller 4 is sleeved on the outer wall of the first adjusting rod 6, and the first roller 4 can be driven to rotate in the first groove by rotating the first adjusting rod 6; the axis extending direction of the first through hole is the first direction, and the first adjusting rod 6 is a cylindrical thin rod.

Further, an adjusting handle 7 is arranged on the side, away from the first roller 4, of the first vertical plate 5, the adjusting handle 7 is connected with the first adjusting rod 6, and the first roller 4 can be driven to rotate in the first groove by rotating the adjusting handle 7; the adjusting handle 7 comprises a first vertical portion connected with the first adjusting rod 6, a first transverse portion is arranged on the side, away from the first adjusting rod 6, of the first vertical portion, and an operator holds the first transverse portion to drive the first adjusting rod 6 to move along the first direction.

Specific examples are set forth herein to illustrate the principles and embodiments of the present application, and the description of the examples above is only intended to assist in understanding the methods of the present application and their core ideas. The foregoing is merely a preferred embodiment of the present application, and it should be noted that, due to the limited nature of text, there is an objectively infinite number of specific structures, and that, to those skilled in the art, several improvements, modifications or changes can be made, and the above technical features can be combined in a suitable manner, without departing from the principles of the present utility model; such modifications, variations and combinations, or the direct application of the concepts and aspects of the utility model in other applications without modification, are intended to be within the scope of this application.

Claims

1. A wafer finishing device, the wafer having a reference surface, comprising:

the base comprises a base body (1), wherein the top surface of the base body (1) is provided with a first mounting surface (11), and a first groove is formed in the first mounting surface (11);

the supporting component (3), the supporting component (3) is arranged on the first mounting surface (11), a plurality of wafers (2) are arranged in the supporting component (3), and the wafers (2) are arranged on the opening side of the first groove; the edge of the wafer (2) is provided with a reference surface (21), and the reference surface (21) is a plane formed by cutting the edge of the wafer (2); the axis direction of the wafer (2) is a first direction; the wafer (2) has a first state and a second state;

the first roller (4) is rotatably arranged in the first groove, and the extending direction of the rotating shaft of the first roller (4) is the first direction; when the wafer (2) is in the first state, the wafer (2) is in contact with the outer wall of the first roller (4); when the wafer (2) is in the second state, the wafer (2) is separated from the first roller (4), and the reference surface (21) is arranged on the opening side of the first groove;

2. The wafer conditioning apparatus of claim 1 wherein: a first space is formed in the supporting component (3), and a second opening (32) is formed in the supporting component (3) close to the side of the base body (1); the inner wall of the first space is provided with a plurality of arc-shaped grooves (33) along the first direction, the wafer (2) can be embedded into the arc-shaped grooves (33), and when the wafer (2) is in the first state, a part of the wafer (2) extends out of the second opening (32).

3. The wafer conditioning apparatus of claim 1 wherein: the first grooves are provided with first vertical plates (5) at two ends along the first direction, the first rollers (4) are arranged between the two first vertical plates (5), two ends of each first roller are rotatably connected with the first rollers (4), and the two first vertical plates (5) are used for limiting the first rollers (4) to rotate in the first grooves.

4. The wafer conditioning apparatus of claim 1 wherein: in the first groove, second grooves (12) are formed in two sides of the first roller (4) along a second direction, an opening of the second groove (12) faces the support component (3), and the second direction is perpendicular to the first direction; the support assembly (3) is provided with a first protruding portion (34) close to the side of the base body (1), and the first protruding portion (34) can be embedded into the second groove (12).

5. The wafer conditioning apparatus of claim 1 wherein: the support assembly (3) is far away from the side of the base body (1) and is provided with a first opening (31), and the first opening (31) is used for taking and placing the wafer (2).

6. A wafer conditioning apparatus according to claim 3, wherein: the two first vertical plates (5) are provided with first through holes in the middle, first adjusting rods (6) penetrate through the two first through holes, the extending direction of the first adjusting rods (6) is the first direction, the first idler wheels (4) are sleeved on the outer walls of the first adjusting rods (6), and the first adjusting rods (6) are rotated to drive the first idler wheels (4) to rotate in the first grooves.

7. The wafer conditioning apparatus of claim 6 wherein: the first vertical plate (5) is far away from the first roller (4) side and is provided with an adjusting handle (7), the adjusting handle (7) is connected with the first adjusting rod (6), and the first roller (4) can be driven to rotate by rotating the adjusting handle (7) in the first groove.